Thin film frame IC product grabbing device

Abstract

The utility model provides a film frame integrated circuit (IC) product gripping device, which is arranged on a frame main body, an accommodating chamber is arranged in the frame main body, a bearing clip used for loading a film frame IC product to be tested is arranged in the accommodating chamber, and the film frame IC product gripping device comprises a power lifting mechanism, a bracket, a driving mechanism, a linear guide rail and a grabbing mechanism are arranged on a movable tray of the power lifting mechanism, a jig platform capable of bearing a film frame IC product to be detected is formed on the bracket, the driving mechanism is located at the end close to the power lifting mechanism, the linear guide rail is arranged in the middle of the bracket, and the grabbing mechanism is arranged on a movable part of the linear guide rail. And the motor is connected with a transmission part of the driving mechanism. According to the utility model, products in a single machine can be stably and efficiently grabbed one by one by a supply side so as to meet the current production requirements.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer product processing, and particularly relates to a gripping device for thin-film frame IC products. Background Art

[0002] In the process of processing and manufacturing crystal ring products, as an intermediate product in one of the semiconductor packaging manufacturing processes, thin-film frame IC products (crystal ring products) need to be supplied and recycled for testing and marking by a test marking sorter in the next process.

[0003] Currently, the existing gripping devices have complex structures and cannot perform product picking and sending operations accurately and efficiently, which is not convenient for the product gripping of the picking manipulator, resulting in an impact on the subsequent testing and marking processes of IC products and unable to meet the processing requirements of the on-site production line. Summary of the Utility Model

[0004] In view of this, the utility model aims to provide a gripping device for thin-film frame IC products to solve the problems that the existing gripping devices have complex structures, cannot perform product picking and sending operations accurately and efficiently, are not convenient for the product gripping of the picking manipulator, and result in an impact on the subsequent testing and marking processes of IC products.

[0005] To achieve the above object, the technical solution of the utility model is realized as follows:

[0006] The utility model provides a gripping device for thin-film frame IC products. The device is arranged on a frame body, and an accommodating chamber is arranged inside the frame body. An accommodating magazine for loading the thin-film frame IC products to be tested is placed inside the accommodating chamber. The device includes:

[0007] A power lifting mechanism. A bracket, a driving mechanism, a linear guide rail and a gripping mechanism are arranged on a moving tray of the power lifting mechanism. A jig platform for supporting the thin-film frame IC products to be tested is formed on the bracket. The driving mechanism is located at one end close to the power lifting mechanism. The linear guide rail is arranged at the middle position of the bracket. The gripping mechanism is arranged on the moving part of the linear guide rail and is connected with the transmission part of the driving mechanism;

[0008] Start the driving mechanism to drive the gripping mechanism to move linearly along the setting direction of the linear guide rail, and control the action of the gripping mechanism to grip the thin-film frame IC products to be tested placed in the accommodating magazine onto the jig platform.

[0009] Furthermore, the power lifting mechanism is fixed on the back plate of the frame body, the moving tray is fixedly installed on the moving part of the power lifting mechanism, and the moving tray moves up and down along with the moving part.

[0010] Further, the movable tray includes a substrate bracket and a pallet provided on the substrate bracket. The substrate bracket is fixedly connected to the moving part of the power lifting mechanism, and the bracket, the driving mechanism and the linear guide are provided on the pallet.

[0011] Further, the bracket includes two symmetrically arranged lifting units, and the linear guide is located between the two lifting units;

[0012] The lifting unit includes a support frame and a support plate provided on the support frame. The support frame is provided on the pallet, and guide strips are arranged at the outer edge of the support plate. The two guide strips are used to guide the film frame of the IC product to be measured.

[0013] Further, one end of the guide strip that first contacts the film frame is the guiding end, and the guiding end is inclined outward relative to the support plate and forms an inclination angle with other parts of the guide plate.

[0014] Further, a notch is formed in the top end surface of the guide strip, and a limiting block is installed in the notch to limit the film frame.

[0015] Further, limiting columns are arranged at the edges of one ends of the two support plates close to the power lifting device, and the limiting columns correspond to the notches formed on the film frame.

[0016] Further, the grasping mechanism includes a clamping jaw cylinder, a first clamping jaw and a second clamping jaw arranged at the action end of the clamping jaw cylinder, and the first clamping jaw and the second clamping jaw cooperate with each other;

[0017] The clamping jaw cylinder is fixed on the moving end of the linear guide through a clamping jaw substrate and is fixedly clamped on the transmission part of the driving mechanism through a pressing plate.

[0018] Further, a fixing plate is arranged at one end of the pallet away from the driving mechanism, and a first detection sensor for detecting the presence of a product is installed on the fixing plate.

[0019] Further, a fixing bracket is also arranged at one end of the pallet away from the driving mechanism, and a second detection sensor for detecting whether the product is in place accurately is installed on the fixing bracket.

[0020] Compared with the prior art, the film frame IC product grasping device of the present invention has the following beneficial effects:

[0021] A grasping device for thin-film frame IC products according to the present utility model can achieve stable and efficient one-by-one grasping of products in a single machine on the supply side through the cooperation of a power lifting mechanism, a driving mechanism, a linear guide rail, a grasping mechanism, etc., so as to meet the current production requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings forming a part of the present utility model are used to provide a further understanding of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0023] Figure 1 is a schematic structural diagram of a grasping device for thin-film frame IC products according to an embodiment of the present utility model;

[0024] Figure 2 is a front view of a grasping device for thin-film frame IC products according to an embodiment of the present utility model;

[0025] Figure 3 is a schematic diagram of partial detailed structure of a grasping device for thin-film frame IC products according to an embodiment of the present utility model;

[0026] Figure 4 is a schematic structural diagram of a bracket, a driving mechanism, a linear guide rail and a grasping mechanism according to an embodiment of the present utility model;

[0027] Figure 5 is a schematic structural diagram of the bracket according to an embodiment of the present utility model;

[0028] Figure 6 is a schematic structural diagram of the grasping device retracted into the frame main body according to an embodiment of the present utility model;

[0029] Figure 7 is a schematic diagram of partial detailed structure of the frame main body according to an embodiment of the present utility model.

[0030] Description of the reference numerals:

[0031] 1. Frame main body; 2. Power lifting mechanism; 201. Substrate bracket; 202. Support plate; 3. Bracket; 301. Support frame; 302. Support plate; 303. Guide strip; 304. Limit block; 305. Limit post; 4. Driving mechanism; 5. Linear guide rail; 6. Grasping mechanism; 601. Claw substrate; 602. Claw cylinder; 603. First claw; 604. Second claw; 7. First detection sensor; 8. Second detection sensor; 9. Thin-film frame. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other.

[0033] The present utility model will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0034] Please refer to the figure Figures 1 to 7 As shown, a grasping device for a thin-film frame IC product is provided inside a frame body. There is an accommodation chamber inside the frame body 1, and a loading magazine for loading the thin-film frame IC product to be tested is placed inside the accommodation chamber. It is characterized in that it includes:

[0035] A power lifting mechanism 2. A bracket 3, a driving mechanism 4, a linear guide rail 5, and a grasping mechanism 6 are arranged on the moving tray of the power lifting mechanism 2. A jig platform for supporting the thin-film frame IC product to be tested is formed on the bracket 3. The driving mechanism 4 is located at one end close to the power lifting mechanism 2. The linear guide rail 5 is arranged at the middle position of the bracket 3. The grasping mechanism 6 is arranged on the moving part of the linear guide rail 5 and is connected to the transmission part of the driving mechanism 4;

[0036] Start the driving mechanism 4 to drive the grasping mechanism 6 to move linearly along the setting direction of the linear guide rail 5, and control the grasping mechanism 6 to act to grasp the thin-film frame IC product to be tested placed in the accommodation chamber onto the jig platform.

[0037] Specifically, in this embodiment, the thin-film frame IC product is an intermediate product in one of the semiconductor packaging manufacturing processes. Based on this device, the supply and recovery of IC products to the test marking sorter in the next process are realized, the testing and marking of the products are effectively completed, and then it enters the next process, and the processing and manufacturing of 8-inch and 12-inch wafer ring products can be carried out.

[0038] As Figure 7 shown, there are two independent accommodation chambers inside the frame body 1 provided in this application. One accommodation chamber is used as the supply side, and the other accommodation chamber is used as the recovery side. The grasping device provided in this application is installed in the accommodation chamber on the supply side. A loading magazine that can load the thin-film frame IC product to be tested is installed in this accommodation chamber (the loading magazine 5 has a bottom support at the bottom and a plurality of horizontal parts on the inner side for storing the thin-film frame IC product to be tested (that is, a wafer ring product formed by encapsulating several chips above the thin-film frame)). Then, a corresponding number of leadless device IC products on the thin-film frame are placed into the loading magazine. With the help of the grasping device installed in the chamber, the IC products in the loading magazine are grasped. After the leadless device IC products on the thin-film frame to be tested are taken and sent, the opening and closing drawer on the supply side will automatically open, and prompt the operator to take away the empty loading magazine and load the loading magazine loaded with the thin-film frame IC product to be tested.

[0039] An opening communicating with the accommodating chamber is provided at the top of the frame body 1 to meet the space for the grasping device and the up-and-down lifting, so as to realize the transfer operation of the IC product from inside the chamber to outside the chamber and from outside the chamber to inside the chamber, and further complete the supply of the IC product.

[0040] In this embodiment, through the power lifting device arranged in the Z direction, the grasping mechanism 6 capable of reciprocating along the Y direction is driven to be able to reciprocate at a specified position in the Z direction. The grasping mechanism 6 reciprocating along the Y direction is driven by the driving mechanism 4 to control the movement of the grasping mechanism 6 on the linear guide rail 5, so as to realize the one-by-one grasping of the products to be measured in the supply-side loading magazine to the specified position, which is convenient for the product grasping device of the machine platform.

[0041] The thin-film frame IC product grasping device described in this application can realize the stable and efficient one-by-one grasping of the products in the single machine on the supply side through the cooperation of the power lifting mechanism 2, the driving mechanism 4, the linear guide rail 5, the grasping mechanism 6, etc., so as to meet the current production requirements.

[0042] In some embodiments, such as Figure 1 and Figure 2 shown, the power lifting mechanism 2 is fixed on the back plate of the frame body 1, and the moving tray is fixedly installed on the moving part of the power lifting mechanism 2, and the moving tray moves up and down with the moving part.

[0043] Specifically, in this embodiment, through the power lifting mechanism 2 arranged in the Z direction, the grasping mechanism 6 capable of reciprocating along the Y direction can sequentially grasp the leadless device IC products on the thin-film frame to be measured loaded in the loading magazine on the supply side in the equipment onto the fixture platform formed on the first bracket 3, which is convenient for the subsequent picking and placing mechanism to take away.

[0044] Furthermore, the power lifting device described in this application adopts the lifting method of cooperating with a motor, a pulley, a belt, and a lead screw module, and can also be realized by the direct connection of a motor module + a guide rail, or a linear motor + a guide rail platform. Further, the power lifting device of this application is composed of a power source motor, a pulley, a belt, a driven wheel, and a lead screw module. The power source motor drives the Z-direction moving tray to move in the Z direction through the pulley, the belt, and the driven wheel, and further drives the Y-direction grasping mechanism 6 to move up and down. Among them, the moving tray is fixedly arranged on the moving part of the lead screw module. The moving tray includes a substrate bracket 201 and a tray 202 arranged on the substrate bracket 201. The substrate bracket 201 is fixedly connected to the moving part of the lead screw module. The linear guide rail 5, the bracket 3, and the driving mechanism 4 are correspondingly arranged on the tray 202.

[0045] The power lifting device in this embodiment enables the reciprocating grasping mechanism 6 moving in the Y direction to perform reciprocating motion at a specified position in the Z direction. This power lifting device can stay at any position within a specified range, which can be set arbitrarily according to requirements when dealing with magazines of different specifications and sizes, greatly improving compatibility, flexibility, and efficiency.

[0046] In some embodiments, such as Figure 4 and Figure 5 shown, the bracket 3 includes two symmetrically arranged lifting units, and the linear guide rail 5 is located between the two lifting units. The lifting unit includes a support frame 301 and a support plate 302 arranged on the support frame 301. The support frame 301 is arranged on the support plate 202. Guide strips 303 are arranged at the outer edge of the support plate 302, and the two guide strips 303 are used to guide the film frame 9;

[0047] The top end face of the guide strip 303 is also provided with a notch, and a limit block 304 is installed in the notch to limit the film frame 9.

[0048] Specifically, in this embodiment, two symmetrically arranged lifting units are arranged at intervals. Among them, the lifting unit is composed of a support frame 301, a support plate 302, and a guide strip 303. The support plate 302 is arranged on the support frame 301, and the guide strip 303 is arranged at the edge of the support plate 302. The inner wall of the guide strip 303 is provided with a groove, and the grooves on the two guide strips 303 form a placement space for placing the film frame 9. The top end faces of the two guide strips 303 are also provided with notches, and the limit block 304 is arranged at the notch through a fastening bolt. A gap for the film frame 9 to pass through is reserved between the limit block 304 and the groove. In addition, in order to better limit the film frame 9, limit posts 305 are arranged at the edge of one end of the two support plates 302 close to the power lifting device. The two limit posts 305 (pins) correspond to two notches opened on the film frame 9 to accurately position the film frame 9 and make the film frame IC product placed on the bracket 3 more stable.

[0049] In some embodiments, such as Figure 5 shown, the end of the guide strip 303 that first contacts the film frame 9 is the guiding end, and the guiding end is inclined outward relative to the support plate 302 and forms an inclined angle with other parts of the guide plate.

[0050] Specifically, in this embodiment, the ends of the two guide strips 303 that first contact the film frame 9 are the guiding ends. The guiding ends are inclined outward relative to the support plate 302 and form an inclined angle with other parts of the guide plate. By inclining the guiding ends of the two guide strips 303 outward relative to the support plate 302, it is convenient for the film frame 9 and the IC product discharged from the loaded magazine to accurately pass through the guiding space left between the two guide strips 303, achieving the effect of smoothly entering the bracket 3.

[0051] In some embodiments, as Figure 4 shown, the grasping mechanism 6 includes a jaw cylinder 602, and a first jaw 603 and a second jaw 604 disposed at the moving end of the jaw cylinder 602, and the first jaw 603 and the second jaw 604 cooperate with each other;

[0052] The jaw cylinder 602 is fixed on the moving end of the linear guide 5 through a jaw substrate 601, and is fixedly clamped on the transmission part of the driving mechanism 4 through a pressing plate.

[0053] Specifically, in this embodiment, specifically, as Figure 3 and Figure 4 shown, a guide rail substrate is provided on the pallet 202 of the power lifting mechanism 2, and a guide rail is provided thereon. A moving support of the guide rail is connected with a jaw substrate 601, on which a jaw cylinder 602 is provided. A first jaw 603 and a second jaw 604 which cooperate with each other are arranged at the moving end of the jaw cylinder 602. The opening and closing of the upper and lower jaws are controlled by the jaw cylinder 602; one side of the jaw substrate 601 is integrally connected with a belt of a Y-direction power source placed on the pallet 202 through a belt pressing plate. The Y-direction power source is composed of a motor, a motor bracket, a tensioning bolt, a tensioning bracket, a pulley, a belt, a driven wheel, a driven wheel bracket, and a driven wheel rotating shaft, and drives the upper and lower jaws to perform reciprocating motion along the Y direction.

[0054] It should be noted that the jaws in the grasping mechanism 6 performing reciprocating motion along the Y direction can adopt the current jaw and jaw cylinder 602 method, or can also adopt an opening and closing mechanism powered by a common cylinder or a motor, as long as the jaws can perform the grasping action, and no further elaboration will be made here.

[0055] In some embodiments, as Figure 1 shown, a fixing plate is provided at one end of the pallet 202 away from the driving mechanism 4, and a first detection sensor 7 for detecting whether a product exists is installed on the fixing plate.

[0056] Specifically, in this embodiment, a first detection sensor 7 is provided at the front end of the pallet 202 to confirm whether there is a product to be tested in the loading magazine, so as to ensure accurate material taking along the jaws; if it is found that there is an empty phenomenon in the loading magazine, it will be directly skipped, and grasping will only be performed at the position where the product to be tested exists, so as to improve the efficiency.

[0057] In some embodiments, a fixing bracket is further provided at one end of the pallet 202 away from the driving mechanism 4, and a second detection sensor 8 for detecting whether the product is in place accurately is installed on the fixing bracket.

[0058] Specifically, in this embodiment, a second detection sensor 8 is provided at the front end of the pallet 202, which is used to detect whether the product of the to-be-tested crystal ring has been grasped at the designated position on the fixture platform. When it is grasped at the designated position, the clamping jaws are opened under the control of the clamping jaw cylinder 602 and continue to move along the Y direction until they stop at the designated position after avoiding the product of the to-be-tested crystal ring, facilitating the subsequent pick-and-place device to pick up the product of the to-be-tested crystal ring.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered by the scope of the claims and the description of the present invention.

[0060] The above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A gripping device for thin-film frame IC products, the device is arranged inside a frame body (1), a receiving chamber is arranged inside the frame body (1), and a loading magazine for loading the thin-film frame IC products to be tested is placed inside the receiving chamber, characterized in that, Including: A power lifting mechanism (2), on the moving tray of the power lifting mechanism (2), there are provided a bracket (3), a driving mechanism (4), a linear guide rail (5) and a grasping mechanism (6). On the bracket (3), a jig platform is formed for supporting the thin film frame IC product to be tested. The driving mechanism (4) is located at one end close to the power lifting mechanism (2). The linear guide rail (5) is arranged at the middle position of the bracket (3). The grasping mechanism (6) is arranged on the moving part of the linear guide rail (5) and is connected to the transmission part of the driving mechanism (4); Start the driving mechanism (4) to drive the grasping mechanism (6) to move linearly along the setting direction of the linear guide rail (5), and control the grasping mechanism (6) to act to grasp the thin film frame IC product placed in the loading magazine onto the jig platform.

2. The grasping device for a thin film frame IC product according to claim 1, characterized in that: The power lifting mechanism (2) is fixed on the back plate of the frame body (1), the moving tray is fixedly installed on the moving part of the power lifting mechanism (2), and the moving tray moves up and down along with the moving part.

3. The grasping device for a thin film frame IC product according to claim 2, characterized in that: The moving tray includes a substrate bracket (201) and a support plate (202) arranged on the substrate bracket (201). The substrate bracket (201) is fixedly connected to the moving part of the power lifting mechanism (2). The bracket (3), the driving mechanism (4) and the linear guide rail (5) are arranged on the support plate (202).

4. The grasping device for a thin film frame IC product according to claim 3, characterized in that: The bracket (3) includes two symmetrically arranged lifting units, and the linear guide rail (5) is located between the two lifting units; Each lifting unit includes a support frame (301) and a support plate (302) arranged on the support frame (301). The support frame (301) is arranged on the support plate (202). On the outer edge part of the support plate (302), there are provided guide strips (303), and the two guide strips (303) are used for guiding the thin film frame (9) of the thin film frame IC product to be tested.

5. The grasping device for a thin film frame IC product according to claim 4, characterized in that: The end of the guide strip (303) that first contacts the thin film frame (9) is the guiding end, and the guiding end is inclined outward relative to the support plate (302) and forms an inclined angle with other parts of the guide plate.

6. The grasping device for a thin film frame IC product according to claim 4, characterized in that: On the top end face of the guide strip (303), there is also provided a notch, and a limiting block (304) is installed in the notch for limiting the thin film frame (9).

7. The grasping device for a thin film frame IC product according to claim 4, characterized in that: Limit posts (305) are provided at the edges of one ends of the two support plates (302) close to the power lifting device, and the limit posts (305) correspond to the notches formed in the film frame (9).

8. A film frame IC product gripping device according to claim 1, wherein: The gripping mechanism (6) includes a jaw cylinder (602), and a first jaw (603) and a second jaw (604) provided at the action end of the jaw cylinder (602), and the first jaw (603) and the second jaw (604) cooperate with each other; The jaw cylinder (602) is fixed on the moving end of the linear guide rail (5) through a jaw substrate (601), and is fixedly clamped on the transmission part of the driving mechanism (4) through a pressing plate.

9. A film frame IC product gripping device according to claim 3, wherein: A fixing plate is provided at one end of the pallet (202) away from the driving mechanism (4), and a first detection sensor (7) for detecting the presence of a product is installed on the fixing plate.

10. A film frame IC product gripping device according to claim 3, wherein: A fixed bracket is further provided at one end of the pallet (202) away from the driving mechanism (4), and a second detection sensor (8) for detecting whether the product is in place accurately is installed on the fixed bracket.

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