Cutting mechanism and cutting device using same

Abstract

The utility model relates to the field of crystal bar processing, in particular to a cutting mechanism and a cutting device using the same, the cutting mechanism comprises a rack, a cutting assembly, material carrying base tables and an adjusting assembly, the material carrying base tables are arranged on the two sides of the rack in the length direction, and the adjusting assembly is arranged between the two material carrying base tables. The adjusting assembly drives the material carrying base tables to move in the opposite directions or in the opposite directions. A placing table top and a positioning surface are arranged on the carrying base table, the placing table top abuts against the bottom of the crystal bar, and the positioning surface abuts against the side face of the crystal bar; the cutting assembly is movably arranged in the length direction of the rack; the cutting device comprises a cutting mechanism and a mechanical gripper, and the mechanical gripper can move towards the placing table top; the adjusting assembly is matched with the mechanical gripper so that the cut crystal bars can be separated and grabbed by the mechanical gripper one by one. The distance between the two material carrying base tables can be adjusted according to different sizes of crystal bars so as to clamp the crystal bars by controlling the opposite or opposite movement of the material carrying base tables through the adjusting assembly, and the cutting operation of the crystal bars of different sizes can be rapidly and accurately completed.

Description

Technical Field

[0001] The utility model relates to the field of crystal rod processing, in particular to a cutting mechanism and a cutting device using the mechanism. Background Art

[0002] In existing crystal ingot processing, the ingot must be transferred to a supporting platform, where it is secured and a cutting gap is reserved. A cutting wheel assembly moves along the cutting gap, splitting the ingot into halves for further processing. A common type of half-ingot processing equipment is the slicing assembly and integrated cutting and grinding machine, as exemplified by Chinese utility model patent publication number CN220840966U. However, this design lacks the ability to adjust the cutting gap, making it difficult to adapt to various ingot sizes. Furthermore, since the two halves are closely spaced after cutting, micro-movements can easily occur during the transfer and grasping of a half-ingot, affecting the subsequent grasping of the half-ingot and limiting the grasping space. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a cutting mechanism which can adapt to the processing of multi-sized crystal rods and improve the processing efficiency, and a cutting device using the mechanism.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a cutting mechanism, including a frame, a cutting assembly, a loading base and an adjustment assembly, a loading base is provided on both sides of the length direction of the frame, and an adjustment assembly is provided between the two loading bases, and the adjustment assembly drives the loading bases to move toward or away from each other; a placing table and a positioning surface are provided on the loading base, the placing table is against the bottom of the crystal rod, and the positioning surface is against the side of the crystal rod; the cutting assembly is movably arranged along the length direction of the frame.

[0005] Furthermore, the adjustment assembly includes a screw and a slider, the two ends of the screw are respectively provided with a first thread of a first rotation direction and a second thread opposite to the first rotation direction, and the two ends of the screw are respectively threadedly connected to the slider; the bottom of the two loading bases are respectively connected to a slider.

[0006] Furthermore, it also includes a pressing component, which is arranged above the loading base and presses toward the placement table to press the crystal rod onto the placement table.

[0007] Furthermore, the pressing assembly is arranged on a loading base.

[0008] Furthermore, a mounting seat is provided on the carrier base corresponding to the clamping assembly, and the clamping assembly is movably arranged in the mounting seat; the mounting seat has a positioning surface on one side facing the frame that abuts against the crystal rod.

[0009] Further, a positioning cylinder is provided on one of the material-carrying bases, and the driving end of the positioning cylinder is movable towards the positioning surface of the other material-carrying base.

[0010] Further, a plurality of cushion blocks are arranged at intervals on the placing table surface and the positioning surface; a plurality of placing grooves are arranged at intervals along the length direction of the placing table surface, and the length direction of the placing grooves is parallel to the moving direction of the material-carrying base; the cushion blocks are movable and adjustable along the placing grooves.

[0011] Further, the material-carrying base includes a positioning portion and a strengthening portion. The positioning portion faces the machine frame, the positioning portion is L-shaped, the horizontal portion of the positioning portion is the placing table surface, and the vertical portion of the positioning portion is the positioning surface; the strengthening portion is connected to the side of the positioning portion away from the machine frame; the strengthening portion includes a plurality of strengthening rib plates connected to the vertical portion of the positioning portion.

[0012] A cutting device includes the cutting mechanism and the mechanical gripper described in any one of the above, and the mechanical gripper is movable towards the placing table surface; the adjustment assembly cooperates with the mechanical gripper to separate the sawn crystal bars and grab them one by one by the mechanical gripper.

[0013] Further, the cutting assembly includes a mounting frame, a cutting wheel system and a cutting wire saw. The cutting wheel system is mounted on the mounting frame, the cutting wire saw is wound around the cutting wheel system, and the distance between two adjacent segments of the cutting wire saw along the cutting direction is greater than the length of the crystal bar; during cutting, only one segment of the cutting wire saw enters and cuts the crystal bar.

[0014] The beneficial effects of the present utility model are as follows: By controlling the movement of the adjusting component towards or away from each other of the material-carrying base, the distance between the two material-carrying bases can be adjusted according to different crystal bar sizes to clamp the crystal bar; when the crystal bar is placed, its bottom abuts against the placement surface of the material-carrying base, and its side abuts against the positioning surface of the material-carrying base, and the crystal bar is clamped by the positioning surfaces of the two material-carrying bases; during processing, after the crystal bar is placed on the material-carrying base, the distance between the two material-carrying bases is adjusted by the adjusting component to clamp and fix the crystal bar, and then the crystal bar is cut into two half bars by the movement of the cutting component; when the cutting device is working, the crystal bar is transferred to the placement surface by the mechanical gripper, and then the distance between the two material-carrying bases is adjusted by the adjusting component, so that the positioning surface of the material-carrying base can clamp the crystal bar; then the crystal bar on the material-carrying base is cut by the cutting component; after the crystal bar is cut into two half bars, by readjusting the distance between the two material-carrying bases by the adjusting component, the two half bars are separated, the cutting component first resets along the cutting direction, the cutting device is designed more compactly, and then the mechanical gripper grabs the half bars for blanking. The separation of the two half bars can ensure that the mechanical gripper can grab them one by one and transfer them to the next processing station, quickly and accurately completing the cutting operation of crystal bars of different sizes; after the crystal bar is cut, the distance between the two half bars is very small, and during the cutting process, the cutting area is continuously sprayed, and a water film will be formed between the two half bars. Separating the half bars first and then grabbing them with the mechanical gripper can avoid affecting the other when grabbing one, causing slight movement and affecting the subsequent grabbing effect, ensuring there is enough grabbing space; in addition, for the two half bars formed after the crystal bar is cut, by readjusting the interval between the two material-carrying bases by the adjusting component, when the pressing component is arranged, the silicon bar is pressed by the pressing component; after the adjustment is completed, the pressing component is loosened and reset, waiting for the mechanical gripper to grab the crystal bar. In this way, through the setting of the pressing component, the risk of the two cut half bars colliding can be effectively eliminated due to the non-parallelism between the spacer block and the end face of the crystal bar (the surface of the crystal bar may be non-parallel due to the previous process), and the non-parallelism between the clamping center line of the mechanical gripper and the length direction line of the crystal bar. Description of the Drawings

[0015] Figure 1 Schematic structural diagram of the cutting device in the specific embodiment of the present utility model when combined with the processing components of other processes;

[0016] Figure 2 Schematic structural diagram of the cutting mechanism in the specific embodiment of the present utility model;

[0017] Figure 3 Schematic structural diagram of the material-carrying base of the cutting mechanism in the specific embodiment of the present utility model;

[0018] Figure 4 Front view of the material-carrying base of the cutting mechanism in the specific embodiment of the present utility model.

[0019] Description of reference numerals:

[0020] 1. Cutting mechanism; 11. Frame; 12. Cutting assembly; 121. Mounting frame; 122. Cutting wheel system; 123. Cutting wire saw;

[0021] 13. Material loading base; 131. Positioning part; 1311. Placing tabletop; 1312. Positioning surface; 132. Reinforcing part; 133. Mounting seat; 134. Positioning cylinder; 135. Spacer block; 136. Placing groove;

[0022] 14. Adjusting assembly; 15. Pressing assembly;

[0023] 2. Cutting device; 21. Mechanical gripper; 3. Crystal bar. Specific implementation mode

[0024] To describe in detail the technical content, achieved purpose and effects of the present utility model, the following is described in conjunction with the implementation modes and with reference to the accompanying drawings.

[0025] Please refer to Figures 1 to 4 , a cutting mechanism 1, comprising a frame 11, a cutting assembly 12, a material loading base 13 and an adjusting assembly 14. The material loading bases 13 are arranged on both sides of the frame 11 in the length direction. An adjusting assembly 14 is arranged between the two material loading bases 13, and the adjusting assembly 14 drives the material loading bases 13 to move towards or away from each other; a placing tabletop 1311 and a positioning surface 1312 are arranged on the material loading base 13. The placing tabletop 1311 abuts against the bottom of the crystal bar 3, and the positioning surface 1312 abuts against the side surface of the crystal bar 3; the cutting assembly 12 is arranged to move along the length direction of the frame 11.

[0026] As can be seen from the above description, the beneficial effects of the present utility model are as follows: By controlling the movement of the material loading bases 13 towards or away from each other through the adjusting assembly 14, the distance between the two material loading bases 13 can be adjusted according to the size of different crystal bars 3 to clamp the crystal bar 3; when the crystal bar 3 is placed, its bottom abuts against the placing tabletop 1311 of the material loading base 13, and its side surface abuts against the positioning surface 1312 of the material loading base 13, and the crystal bar 3 is clamped by the positioning surfaces 1312 of the two material loading bases 13; during processing, after the crystal bar 3 is placed on the material loading base 13, the distance between the two material loading bases 13 is adjusted through the adjusting assembly 14 to clamp and fix the crystal bar 3, and then the crystal bar 3 is cut into two half bars by the movement of the cutting assembly 12.

[0027] Further, the adjusting assembly 14 includes a lead screw and sliders. The two ends of the lead screw are respectively provided with a first thread with a first rotation direction and a second thread with a rotation direction opposite to the first rotation direction. The two ends of the lead screw are respectively threadedly connected with sliders; the bottoms of the two material loading bases 13 are respectively connected with a slider.

[0028] As described above, the adjustment component 14 uses a lead screw with a first thread and a second thread and the cooperation of corresponding sliders to realize the opposite or away movement of the material-loading base 13.

[0029] Furthermore, it further includes a pressing component 15. The pressing component 15 is arranged above the material-loading base 13, and the pressing component 15 presses towards the placement table surface 1311 so that the ingot 3 is pressed tightly on the placement table surface 1311.

[0030] As described above, it can be seen that through the setting of the pressing component 15, during the processing, the pressing component 15 can press the ingot 3 so that its bottom is tightly pressed and fixed with the placement table surface 1311, avoiding shaking and offset during the cutting operation.

[0031] Furthermore, the pressing component 15 is arranged on the material-loading base 13.

[0032] As described above, specifically, the pressing component 15 is arranged on the material-loading base 13 and is integrally designed with the material-loading base 13.

[0033] Furthermore, an installation seat 133 is provided on the material-loading base 13 corresponding to the pressing component 15. The pressing component 15 is arranged in the installation seat 133 in a liftable manner; the side of the installation seat 133 facing the frame 11 and the positioning surface 1312 abut against the ingot 3.

[0034] As described above, the pressing component 15 presses the ingot 3 by lifting in the installation seat 133; at the same time, the installation seat 133 also serves as a structure abutting against the ingot 3 to assist the positioning surface 1312 of the material-loading base 13 to limit and fix the ingot 3.

[0035] Furthermore, a positioning cylinder 134 is provided on one of the material-loading bases 13, and the driving end of the positioning cylinder 134 can move towards the positioning surface 1312 of the other material-loading base 13.

[0036] As described above, the positioning cylinder 134 is used to further clamp the ingot 3 between the two material-loading bases 13. When in use, the distance between the material-loading bases 13 can be roughly adjusted first through the adjustment component 14, and then finely adjusted through the positioning cylinder 134.

[0037] Furthermore, a plurality of pads 135 are arranged at intervals on the placement table surface 1311 and the positioning surface 1312; a plurality of placement grooves 136 are arranged at intervals along the length direction of the placement table surface 1311, and the length direction of the placement grooves 136 is parallel to the moving direction of the material-loading base 13; the pads 135 can be moved and adjusted along the placement grooves 136.

[0038] As described above, the spacer 135 on the placement table 1311 and the positioning surface 1312 is used to buffer against the ingot 3, avoiding direct friction and abrasion between the ingot 3 and the material carrier base 13; and the placement groove 136 provided on the placement table 1311 can adjust the position of the spacer 135 in the placement groove 136 according to the size of the ingot 3 for adaptation.

[0039] Further, the material carrier base 13 includes a positioning portion 131 and a strengthening portion 132. The positioning portion 131 faces the frame 11. The positioning portion 131 is L-shaped. The horizontal portion of the positioning portion 131 is the placement table 1311, and the vertical portion of the positioning portion 131 is the positioning surface 1312; the strengthening portion 132 is connected to the side of the positioning portion 131 away from the frame 11; the strengthening portion 132 includes a plurality of strengthening rib plates connected to the vertical portion of the positioning portion 131.

[0040] As described above, the L-shaped positioning portion 131 is used as the structure for receiving, clamping and positioning the ingot 3 on the material carrier base 13, and the strengthening rib plates of the strengthening portion 132 provided on the back side of the positioning portion 131 are used to enhance the structural strength of the material carrier base 13 when clamping the ingot 3 during the opposite movement; compared with the form of connecting a fixed block to the back side of the positioning portion 131, the strengthening rib plates can reduce processing consumables and ensure the support strength.

[0041] Please refer to Figures 1 to 4 , a cutting device 2, including the cutting mechanism 1 and the mechanical gripper 21 described in any one of the above. The mechanical gripper 21 is movable towards the placement table 1311; the adjustment assembly 14 cooperates with the mechanical gripper 21 to separate the cut ingot 3 and be grabbed one by one by the mechanical gripper 21.

[0042] As described above, when the cutting device 2 works, the mechanical gripper 21 transfers the ingot 3 to the placement table 1311, and then the adjustment assembly 14 adjusts the distance between the two material carrier bases 13 so that the positioning surfaces 1312 of the material carrier bases 13 can clamp the ingot 3; then the cutting assembly 12 performs a cutting operation on the ingot 3 on the material carrier base 13; the cut ingot 3 forms two half ingots. By readjusting the distance between the two material carrier bases 13 by the adjustment assembly 14, the two half ingots are separated. The cutting assembly 12 first resets along the cutting direction, and the cutting device 2 is more compactly designed. Then the mechanical gripper 21 grabs the half ingots for blanking. The separation of the two half ingots can ensure that the mechanical gripper 21 can grab one by one and transfer to the next processing station, quickly and accurately completing the cutting operation of ingots 3 of different sizes.

[0043] After the ingot 3 is cut, the distance between the two half ingots is very small, and during the cutting process, the cutting area is continuously sprayed, and a water film will form between the two half ingots. Separating the half ingots first and then grasping them with the mechanical gripper 21 can avoid affecting the other when grasping one of them, causing slight movement and affecting the subsequent grasping effect, ensuring sufficient grasping space. In addition, for the two half ingots formed after the ingot 3 is cut, the interval between the two loading bases 13 is adjusted by the adjustment assembly 14, and when the pressing assembly 15 is arranged, the silicon ingot is also pressed by the pressing assembly 15. After the adjustment is completed, the pressing assembly 15 is loosened and reset, waiting for the mechanical gripper 21 to grasp the ingot. In this way, through the setting of the pressing assembly 15, the risk of the two cut half ingots colliding due to the non-parallelism between the spacer block and the end face of the ingot 3 (the surface of the ingot 3 may be non-parallel due to the previous process), and the non-parallelism between the clamping center line of the mechanical gripper 21 and the length direction line of the ingot 3 can be effectively eliminated.

[0044] Further, the cutting assembly 12 includes a mounting frame 121, a cutting wheel system 122, and a cutting wire saw 123. The cutting wheel system 122 is mounted on the mounting frame 121, the cutting wire saw 123 is wound around the cutting wheel system 122, and the distance between two adjacent segments of the cutting wire saw 123 along the cutting direction is greater than the length of the ingot 3. During cutting, only one segment of the cutting wire saw 123 enters and cuts the ingot 3.

[0045] As can be seen from the above description, during the cutting operation, the cutting wire saw 123 is driven to move by the rotation of the cutting wheel system 122, and the ingot 3 is cut during the movement of the mounting frame 121. Through the design of the lengths of two adjacent segments of the cutting wire saw 123 and the length of the ingot 3, it can be avoided that during the cutting operation, due to one adjacent segment of the cutting wire saw cutting through the ingot 3 first and leaving the ingot 3 while the other segment of the cutting wire saw is still between the two ingots 3. When the other segment of the cutting wire saw leaves the ingot 3, due to the cutting process of the ingot 3, the distance between the two ingots 3 is very small, and during the cutting process, the cutting area is continuously sprayed, and a water film will form between the two ingots 3. Eventually, when the end segment of the cutting wire saw still in the ingot 3 leaves the ingot 3, it will bounce and scratch the cut ingot 3.

[0046] Example 1:

[0047] As Figures 1 to 4As shown in the figure, the cutting mechanism 1 of this embodiment includes a frame 11, a cutting assembly 12, a material-loading base 13, an adjustment assembly 14, and a pressing assembly 15. Material-loading bases 13 are provided on both sides of the frame 11 in the length direction. An adjustment assembly 14 is provided between the two material-loading bases 13, and the adjustment assembly 14 drives the material-loading bases 13 to move towards or away from each other; a placement table surface 1311 and a positioning surface 1312 are provided on the material-loading base 13. The placement table surface 1311 abuts against the bottom of the ingot 3, and the positioning surface 1312 abuts against the side surface of the ingot 3; the cutting assembly 12 is movably arranged along the length direction of the frame 11; the pressing assembly 15 is arranged above the material-loading base 13, and the pressing assembly 15 presses towards the placement table surface 1311 to press the ingot 3 tightly on the placement table surface 1311.

[0048] In this embodiment, the adjustment assembly 14 includes a lead screw and sliders. First threads with a first helix direction and second threads with a helix direction opposite to the first helix direction are respectively provided at both ends of the lead screw, and the two ends of the lead screw are respectively threadedly connected with sliders; the bottoms of the two material-loading bases 13 are respectively connected to a slider. By controlling the rotation of the lead screw through a driving device, the sliders engaged with the corresponding first threads and second threads move towards or away from each other, and the sliders simultaneously drive the corresponding material-loading bases 13 to move.

[0049] Optionally, the adjustment assembly 14 can also adopt the form of being pushed by a cylinder to adjust the distance between the two material-loading bases 13.

[0050] In this embodiment, the pressing assembly 15 is fixedly arranged on the material-loading base 13. Specifically, an installation seat 133 is provided on the material-loading base 13, and an installation space for the lifting of the pressing assembly 15 is provided inside the installation seat 133. The pressing assembly 15 includes a cylinder, a connecting rod, and a pressing head. The driving end of the cylinder drives the connecting rod to move up and down, and the pressing head at the end of the connecting rod away from the cylinder protrudes towards the other material-loading base 13 to press and fix the ingot 3 on the placement table surface 1311 of the material-loading base 13. One side of the installation seat 133 abuts against the side surface of the placed ingot 3 together with the positioning surface 1312 of the material-loading base 13.

[0051] After the above-mentioned pressing assembly 15 presses and fixes the top of the ingot 3 after the ingot 3 is placed on the material-loading base 13 and clamped and fixed by adjusting the adjustment assembly 14.

[0052] Optionally, the pressing assembly 15 can also be arranged on the frame 11, and a support is extended from the bottom of the frame 11 towards the height position of the material-loading base 13 or a support is extended from the top of the frame 11 towards the height position of the material-loading base 13 to press the ingot 3 on the material-loading base 13 up and down.

[0053] A positioning cylinder 134 that can move toward the positioning surface 1312 of another loading base 13 can be added to the loading base 13 as an auxiliary positioning structure, and cooperates with the adjustment component 14 to respectively realize coarse adjustment and fine adjustment of the distance between the two loading bases 13.

[0054] Multiple spacers 135 are spaced apart on the placement table 1311 and the positioning surface 1312. Multiple placement slots 136 are spaced apart along the length of the placement table 1311, with the length of each slot 136 parallel to the direction of movement of the carrier base 13. The spacers 135 are movable and adjustable along the slots 136. These spacers 135 provide cushioning for the placement of the crystal ingot 3 while preventing scratches and other damage from direct contact between the crystal ingot 3 and the carrier base 13. Designed to match the size of the crystal ingot 3, the spacers 135 can be adjusted within the slots 136 to ensure a stable placement.

[0055] The carrier base 13 includes a positioning portion 131 and a reinforcement portion 132. The positioning portion 131 faces the frame 11 and is L-shaped. The horizontal portion of the positioning portion 131 serves as a placement table 1311, and the vertical portion of the positioning portion 131 serves as a positioning surface 1312. The reinforcement portion 132 is connected to the side of the positioning portion 131 away from the frame 11. The reinforcement portion 132 includes multiple reinforcement ribs connected to the vertical portion of the positioning portion 131. The horizontal and vertical portions of the L-shaped positioning portion 131 serve as the tooling structure for receiving the bottom and clamping the side of the crystal ingot 3, respectively. The reinforcement ribs of the reinforcement portion 132 on the side of the positioning portion 131 away from the frame 11 ensure structural strength while reducing consumables.

[0056] Example 2

[0057] like Figures 1 to 4 As shown, the cutting device 2 of this embodiment includes the cutting mechanism 1 and the mechanical gripper 21 described in the first embodiment, and the mechanical gripper 21 is movable toward the placement table 1311; the adjustment component 14 cooperates with the mechanical gripper 21 to separate the cut crystal rod 3 and grasp them one by one by the mechanical gripper 21; the mechanical gripper 21 serves as a structure for grasping and transferring the crystal rod 3, and it cooperates with the adjustment component 14 to separate the crystal rod 3 on the loading base 13 after cutting to facilitate the grasping of the mechanical gripper 21.

[0058] The cutting assembly 12 includes a mounting bracket 121, a cutting wheel system 122, and a cutting wire saw 123. The cutting wheel system 122 is mounted on the mounting bracket 121, and the cutting wire saw 123 is wound around the cutting wheel system 122. The distance between two adjacent segments of the cutting wire saw 123 along the cutting direction is greater than the length of the ingot 3. The mounting bracket 121 of the cutting assembly 12 is movably matched with the machine frame 11. During the cutting operation, it is moved along the length direction of the machine frame 11 by a driving device to approach the ingot 3 that has been fixed on the loading base 13, and the ingot 3 is cut through the cooperation of the cutting wheel system 122 and the cutting wire saw 123. With the design of the length of the wire saw part at two adjacent ends of the cutting wire saw 123 being matched with the length of the ingot 3, the cutting wire saw 123 can avoid scratching the ingot 3 by a segment of the wire saw that has not left after the operation is completed.

[0059] In summary, the cutting mechanism provided by the present utility model and the cutting device using this mechanism can adjust the distance between two material loading bases to clamp a crystal bar according to different crystal bar sizes by controlling the moving of the material loading bases towards or away from each other through the adjustment component; when the crystal bar is placed, its bottom abuts against the placing surface of the material loading base, and its side abuts against the positioning surface of the material loading base, and the crystal bar is clamped by the positioning surfaces of the two material loading bases; during processing, after the crystal bar is placed on the material loading base, the distance between the two material loading bases is adjusted through the adjustment component to clamp and fix the crystal bar, and then the crystal bar is cut into two half bars by the movement of the cutting component; when the cutting device works, the crystal bar is transferred to the placing surface by a mechanical gripper, and then the distance between the two material loading bases is adjusted through the adjustment component so that the positioning surfaces of the material loading bases can clamp the crystal bar; then the cutting component performs a cutting operation on the crystal bar on the material loading base; the cut crystal bar forms two half bars, and by readjusting the distance between the two material loading bases through the adjustment component, the two half bars are separated, the cutting component first resets along the cutting direction, the cutting device is more compactly designed, and then the mechanical gripper grabs the half bars for blanking. The separation of the two half bars can ensure that the mechanical gripper can grab them one by one and transfer them to the next processing station, quickly and accurately completing the cutting operation of crystal bars of different sizes; after the crystal bar is cut, the distance between the two half bars is very small, and during the cutting process, the cutting area is continuously sprayed, and a water film will be formed between the two half bars. Separating the half bars first and then grabbing them with a mechanical gripper can avoid affecting the other when grabbing one, causing slight movement and affecting the subsequent grabbing effect, ensuring sufficient grabbing space; in addition, for the two half bars formed by the cut crystal bar, when there is a pressing component arranged, the silicon bar is also pressed by the pressing component by readjusting the interval between the two material loading bases through the adjustment component; after the adjustment is completed, the pressing component is loosened and reset, waiting for the mechanical gripper to grab the crystal bar. Thus, through the setting of the pressing component, the risk of the two cut half bars colliding caused by the non-parallelism between the spacer block and the end face of the crystal bar (the surface of the crystal bar may be non-parallel due to previous processes) and the non-parallelism between the clamping center line of the mechanical gripper and the length direction line of the crystal bar can be effectively eliminated.

[0060] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in the relevant technical fields, shall be equally included in the patent protection scope of the present utility model.

Claims

1. A cutting mechanism, characterized in that, It includes a frame, a cutting component, a material loading base platform and an adjustment component. Material loading base platforms are provided on both sides of the frame in the length direction. An adjustment component is provided between the two material loading base platforms, and the adjustment component drives the material loading base platforms to move towards or away from each other; a placement table surface and a positioning surface are provided on the material loading base platform. The placement table surface abuts against the bottom of the ingot, and the positioning surface abuts against the side surface of the ingot; the cutting component is movably arranged along the length direction of the frame.

2. The cutting mechanism according to claim 1, characterized in that, The adjustment component includes a lead screw and sliders. First threads with a first helix direction and second threads with a helix direction opposite to the first helix direction are respectively provided at both ends of the lead screw. The two ends of the lead screw are respectively threadedly connected with sliders; the bottoms of the two material loading base platforms are respectively connected to a slider.

3. The cutting mechanism according to claim 1, characterized in that, It further includes a pressing component. The pressing component is arranged above the material loading base platform, and the pressing component presses towards the placement table surface to press the ingot tightly on the placement table surface.

4. The cutting mechanism according to claim 3, characterized in that, The pressing component is arranged on the material loading base platform.

5. The cutting mechanism according to claim 4, characterized in that, An installation seat is provided on the material loading base platform corresponding to the pressing component. The pressing component is arranged in the installation seat in a liftable manner; the side of the installation seat facing the frame and the positioning surface abut against the ingot.

6. The cutting mechanism according to claim 1, characterized in that, A positioning cylinder is provided on one of the material loading base platforms, and the driving end of the positioning cylinder is movable towards the positioning surface of the other material loading base platform.

7. The cutting mechanism according to claim 1, characterized in that, A plurality of cushion blocks are arranged at intervals on the placement table surface and the positioning surface; a plurality of placement grooves are arranged at intervals along the length direction of the placement table surface, and the length direction of the placement grooves is parallel to the moving direction of the material loading base platform; the cushion blocks can be movably adjusted along the placement grooves.

8. The cutting mechanism according to claim 1, characterized in that, The material loading base platform includes a positioning part and a strengthening part. The positioning part faces the frame, the positioning part is L-shaped, the horizontal part of the positioning part is the placement table surface, and the vertical part of the positioning part is the positioning surface; the strengthening part is connected to the side of the positioning part away from the frame; the strengthening part includes a plurality of strengthening rib plates connected to the vertical part of the positioning part.

9. A cutting device, characterized in that, It includes the cutting mechanism and the mechanical gripper according to any one of claims 1 to 8 above. The mechanical gripper is movable towards the placement table surface; the adjustment component cooperates with the mechanical gripper to separate the cut ingots and be grabbed one by one by the mechanical gripper.

10. The cutting device according to claim 9, characterized in that, The cutting component includes an installation frame, a cutting wheel system and a cutting wire saw. The cutting wheel system is installed on the installation frame, the cutting wire saw is wound around the cutting wheel system, and the distance between two adjacent segments of the cutting wire saw along the cutting direction is greater than the length of the ingot; during cutting, only one segment of the wire saw enters and cuts the ingot.

Images