Mould pressing device for chip processing

Abstract

The utility model discloses a mould pressing device for chip processing, which comprises a fixed seat, the top of the fixed seat is fixedly connected with a lower mould, the top of the lower mould is provided with a mould groove, the two sides of the center of the bottom of an inner cavity of the lower mould are fixedly connected with first springs, and the tops of the first springs are fixedly connected with reset plates. Supporting columns are fixedly connected to the two sides of the top of the reset plate correspondingly, and the tops of the supporting columns penetrate into an inner cavity of the mold groove to be fixedly connected with supporting pads. According to the utility model, through the first spring, the reset plate can be effectively pushed to move by using reset elasticity, so that the reset plate pushes the support column to move, the support column pushes the support pad to move, and a die-pressed chip in the inner cavity of the die groove can be effectively pushed out of the inner cavity of the die groove through the support pad; and a worker can conveniently take materials, so that the working efficiency of the equipment is improved, and the trouble of the worker is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, and specifically to a molding device for chip processing. Background Art

[0002] An electronic chip is a microelectronic device or component. Using a certain process, components such as transistors, resistors, capacitors, and inductors required in a circuit, as well as wirings, are interconnected and fabricated on a small piece or several small pieces of semiconductor wafers or dielectric substrates. During the processing of the chip, molding equipment is needed;

[0003] However, during the use of existing molding devices, the chip is usually placed in a mold groove opened on the surface of the lower mold. The upper mold is pushed downward by a hydraulic device to fit against the surface of the chip. Then, the staff injects epoxy resin from the injection port on the surface of the upper mold. After the epoxy resin solidifies, the molding work on the chip is completed. When the molding is finished, the electronic chip needs to be dug out from the mold groove. Since the electronic chip is small and thin, if the digging force is too large, it is easy to damage the electronic chip, which brings trouble to the staff. Therefore, we propose a molding device for chip processing to solve the above problems. Summary of the Utility Model

[0004] (I) Technical Problems to be Solved

[0005] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a molding device for chip processing, which achieves the function of facilitating material taking.

[0006] (II) Technical Solutions

[0007] To achieve the above purpose, the utility model provides the following technical solutions: a molding device for chip processing, including a fixed seat. The top of the fixed seat is fixedly connected with a lower mold. The top of the lower mold is provided with a mold groove. On both sides of the center of the bottom of the inner cavity of the lower mold, a first spring is fixedly connected. The top of the first spring is fixedly connected with a reset plate. On both sides of the top of the reset plate, a support column is fixedly connected, and the top of the support column penetrates through to the inner cavity of the mold groove and is fixedly connected with a support pad. The center of the bottom of the reset plate is fixedly connected with a limit column. A groove is opened on the left side of the limit column. On both sides of the fixed seat, a support plate is fixedly connected. The top of the support plate is fixedly connected with a bearing plate. The top of the bearing plate is fixedly connected with a cylinder, and the bottom of the cylinder penetrates through to the bottom of the bearing plate and is fixedly connected with an upper template.

[0008] As a preferred solution, a second spring is fixedly connected to the bottom of the left side of the inner cavity of the lower mold. The right side of the second spring is fixedly connected to a sliding plate. The right side of the sliding plate is fixedly connected to a plug rod. The right side of the plug rod is in a fitting connection with the left side of the limiting column. The left side of the sliding plate is fixedly connected to a pull rod.

[0009] Through the above technical solution, through the second spring, the reset elasticity can be effectively utilized to drive the sliding plate to move, so that the sliding plate drives the plug rod to move. By moving the plug rod, it is inserted into the inner cavity of the groove, which is convenient for limiting the limiting column and improving the stability of the molding.

[0010] As a preferred solution, a chute is opened at the left side of the bottom of the inner cavity of the lower mold. The bottom of the sliding plate is slidably connected to the inner cavity of the chute.

[0011] Through the above technical solution, through the chute, the stability of the sliding of the sliding plate is improved.

[0012] As a preferred solution, support frames are fixedly connected to both sides of the top of the fixed seat. The top of the support frame is fixedly connected to a shell. An electric push rod is fixedly connected to one side of the inner cavity of the shell. One side of the electric push rod is fixedly connected to a push plate. One side of the push plate is fixedly connected to a limiting block, and one side of the limiting block penetrates to the outside of the shell and is fixedly connected to a rubber pad.

[0013] Through the above technical solution, through the electric push rod, it is convenient to push the push plate to move, so that the push plate pushes the limiting block to move. By moving the limiting block, the rubber pad is driven to move above the support pad, which is convenient for shielding the pushed-out chip and preventing the chip from being jolted by the reset elasticity of the first spring, thus avoiding impact damage and effectively protecting the chip.

[0014] As a preferred solution, fixing columns are fixedly connected to the four sides of the bottom of the fixed seat, and anti-slip pads are fixedly connected to the bottoms of the fixing columns.

[0015] Through the above technical solution, through the fixing columns, it is convenient to support the device.

[0016] As a preferred solution, slide rails are fixedly connected to both sides of the inner cavity of the lower mold. Both sides of the reset plate are slidably connected to the inner cavity of the slide rails.

[0017] Through the above technical solution, through the slide rails, the stability of the sliding of the reset plate is improved.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the present utility model provides a molding device for chip processing, which has the following beneficial effects.

[0020] 1. The utility model can effectively utilize the reset elasticity of the first spring to push the reset plate to move, so that the reset plate pushes the support column to move, and the support column pushes the support pad to move. The support pad can effectively push the molded chip in the inner cavity of the mold groove out of the inner cavity of the mold groove, facilitating the staff to take the material, thereby improving the working efficiency of the device and solving the trouble of the staff.

[0021] 2. The utility model can effectively utilize the reset elasticity of the second spring to drive the slide plate to move, so that the slide plate drives the insertion rod to move. The insertion rod moves and is inserted into the inner cavity of the groove, facilitating the limitation of the limit column and improving the stability of the molding. Through the electric push rod, it is convenient to push the push plate to move, so that the push plate pushes the limit block to move, and the limit block drives the rubber pad to move above the support pad, facilitating the shielding of the pushed-out chip and preventing the chip from jolting under the influence of the reset elasticity of the first spring, thus avoiding impact damage and effectively protecting the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic structural diagram of the utility model;

[0023] Figure 2 is a top view of the fixed seat structure of the utility model;

[0024] Figure 3 is a cross-sectional view of the lower mold structure of the utility model.

[0025] In the figure: 1. Fixed seat; 2. Mold groove; 3. Pull rod; 4. Cylinder; 5. Bearing plate; 6. Upper template; 7. Support pad; 8. Support column; 9. Shell; 10. Limit block; 11. Rubber pad; 12. Support frame; 13. Lower mold; 14. Support plate; 15. Push plate; 16. Electric push rod; 17. Groove; 18. Limit column; 19. First spring; 20. Insertion rod; 21. Slide plate; 22. Chute; 23. Second spring; 24. Reset plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0027] Please refer to Figures 1-3, the utility model: a pressing device for chip processing, comprising a fixed seat 1, a lower mold 13 is fixedly connected to the top of the fixed seat 1, a mold groove 2 is opened at the top of the lower mold 13, both sides of the center of the bottom of the inner cavity of the lower mold 13 are fixedly connected with a first spring 19, the top of the first spring 19 is fixedly connected with a reset plate 24, both sides of the top of the reset plate 24 are fixedly connected with support columns 8, and the top of the support column 8 penetrates into the inner cavity of the mold groove 2 and is fixedly connected with a support pad 7. The center of the bottom of the reset plate 24 is fixedly connected with a limit column 18, a groove 17 is opened on the left side of the limit column 18, both sides of the fixed seat 1 are fixedly connected with support plates 14, a bearing plate 5 is fixedly connected to the top of the support plate 14, a cylinder 4 is fixedly connected to the top of the bearing plate 5, and the bottom of the cylinder 4 penetrates to the bottom of the bearing plate 5 and is fixedly connected with an upper template 6.

[0028] Through the above technical solution, through the first spring 19, the reset elastic force can be effectively utilized to push the reset plate 24 to move, so that the reset plate 24 pushes the support column 8 to move, and through the support column 8, the support pad 7 is pushed to move. Through the support pad 7, the chip molded in the inner cavity of the mold groove 2 can be effectively pushed out of the inner cavity of the mold groove 2, which is convenient for the staff to take the material, thereby improving the working efficiency of the device and solving the trouble of the staff.

[0029] Specifically, a second spring 23 is fixedly connected to the bottom on the left side of the inner cavity of the lower die 13. The right side of the second spring 23 is fixedly connected to a slide plate 21. The right side of the slide plate 21 is fixedly connected to a plug rod 20. The right side of the plug rod 20 is in fitting connection with the left side of the limit post 18. A pull rod 3 is fixedly connected to the left side of the slide plate 21. A chute 22 is formed in the left side of the bottom of the inner cavity of the lower die 13. The bottom of the slide plate 21 is slidably connected to the inner cavity of the chute 22. Both sides of the top of the fixed seat 1 are fixedly connected with support frames 12. The top of the support frames 12 is fixedly connected with a housing 9. One side of the inner cavity of the housing 9 is fixedly connected with an electric push rod 16. One side of the electric push rod 16 is fixedly connected with a push plate 15. One side of the push plate 15 is fixedly connected with a limit block 10. And one side of the limit block 10 penetrates to the outside of the housing 9 and is fixedly connected with a rubber pad 11. Fixed columns are fixedly connected to the four corners of the bottom of the fixed seat 1. And the bottoms of the fixed columns are fixedly connected with anti-slip pads. Slide rails are fixedly connected to both sides of the inner cavity of the lower die 13. Both sides of the reset plate 24 are slidably connected to the inner cavities of the slide rails. Through the second spring 23, the reset elasticity can be effectively utilized to drive the slide plate 21 to move, so that the slide plate 21 drives the plug rod 20 to move. By moving the plug rod 20, it is inserted into the inner cavity of the groove 17, which is convenient for limiting the limit post 18 and improves the stability of the die pressing. Through the electric push rod 16, it is convenient to push the push plate 15 to move, so that the push plate 15 pushes the limit block 10 to move. By moving the limit block 10, the rubber pad 11 is driven to move above the support pad 7, which is convenient for shielding the pushed-out chip and preventing the chip from being jolted by the reset elasticity of the first spring 19, thus causing impact damage, and effectively protecting the chip.

[0030] The working principle of the present invention is as follows: first, the user presses the support pad 7, and the support pad 7 facilitates the support column 8 to shrink and move, and the support column 8 drives the reset plate 24 to shrink and move, and the reset plate 24 drives the limit column 18 to shrink and move, and the limit column 18 slides on the surface of the insertion rod 20. When the limit column 18 drives the groove 17 to slide parallel to the insertion rod 20, the limiting pressure of the insertion rod 20 is eliminated, and the limiting pressure of the second spring 23 is also eliminated. The second spring 23 can effectively utilize the reset elasticity to drive the slide plate 21 to move, so that the slide plate 21 drives the insertion rod 20 to move, and the insertion rod 20 moves and is inserted into the inner cavity of the groove 17. It is convenient to limit the limiting column 18, which improves the stability of chip molding. At this time, the side of the support pad 7 is in contact with the inner wall of the inner cavity opening of the mold groove 2, so that the surface of the support pad 7 is parallel to the bottom of the mold groove 2. The user places the chip on the surface of the mold groove 2, and then starts the cylinder 4 through the external controller. The cylinder 4 is used to push the upper template 6 to move, so that the upper template 6 moves to fit the surface of the chip. Then the user injects epoxy resin from the injection port on the surface of the upper template 6. After the epoxy resin solidifies, the molding of the chip is completed. Then the user starts and resets the cylinder 4, and the cylinder 4 drives the upper template 6 to separate from the surface of the lower mold 13. Then, the user starts the electric push rod 16 through the external controller, and the electric push rod 16 is used to push the push plate 15 to move, so that the push plate 15 pushes the limit block 10 to move, and the limit block 10 moves to drive the rubber pad 11 to move above the support pad 7, so as to block the pushed-out chip and prevent the chip from being shaken by the reset elasticity of the first spring 19, thereby causing impact damage, effectively protecting the chip, and then the user pulls the pull rod 3, and the pull rod 3 pulls the slide plate 21 to retract and move, and the slide plate 21 drives the insertion rod 20 and the second spring 23 to retract and move, and after the insertion rod 20 is separated from the inner cavity of the groove 17 , the limiting pressure of the limiting column 18 is eliminated, and the limiting pressure of the first spring 19 is also eliminated. Through the first spring 19, the reset elasticity can be effectively utilized to push the reset plate 24 to move, so that the reset plate 24 pushes the support column 8 to move, and the support column 8 pushes the support pad 7 to move. The chip molded in the inner cavity of the mold groove 2 can be effectively pushed out of the inner cavity of the mold groove 2 through the support pad 7. At this time, the top of the chip is in contact with the bottom of the rubber pad 11, and then the staff starts the reset of the electric push rod 16, and the electric push rod 16 drives the rubber pad 11 to reset to its original position. When the rubber pad 11 is separated from the surface of the chip, the user can take the chip away.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the protection scope of the present utility model. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present utility model can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present utility model.

Claims

1. A molding device for chip processing, comprising a fixed seat (1), characterized in that: At the top of the fixed seat (1), a lower mold (13) is fixedly connected. A mold groove (2) is formed at the top of the lower mold (13). On both sides of the center of the bottom of the inner cavity of the lower mold (13), a first spring (19) is fixedly connected. The top of the first spring (19) is fixedly connected with a reset plate (24). On both sides of the top of the reset plate (24), a support column (8) is fixedly connected. The top of the support column (8) penetrates into the inner cavity of the mold groove (2) and is fixedly connected with a support pad (7). At the center of the bottom of the reset plate (24), a limit column (18) is fixedly connected. A groove (17) is formed on the left side of the limit column (18). On both sides of the fixed seat (1), a support plate (14) is fixedly connected. The top of the support plate (14) is fixedly connected with a bearing plate (5). The top of the bearing plate (5) is fixedly connected with a cylinder (4). The bottom of the cylinder (4) penetrates to the bottom of the bearing plate (5) and is fixedly connected with an upper template (6).

2. The molding device for chip processing according to claim 1, wherein: At the bottom of the left side of the inner cavity of the lower mold (13), a second spring (23) is fixedly connected. The right side of the second spring (23) is fixedly connected with a slide plate (21). The right side of the slide plate (21) is fixedly connected with an insertion rod (20). The right side of the insertion rod (20) is in close contact with the left side of the limit column (18). The left side of the slide plate (21) is fixedly connected with a pull rod (3).

3. A molding device for chip processing according to claim 2, characterized in that: A chute (22) is formed at the bottom of the left side of the inner cavity of the lower mold (13). The bottom of the slide plate (21) is slidably connected to the inner cavity of the chute (22).

4. A molding device for chip processing according to claim 1, characterized in that: On both sides of the top of the fixed seat (1), a support frame (12) is fixedly connected. The top of the support frame (12) is fixedly connected with a housing (9). On one side of the inner cavity of the housing (9), an electric push rod (16) is fixedly connected. The side of the electric push rod (16) is fixedly connected with a push plate (15). The side of the push plate (15) is fixedly connected with a limit block (10). The side of the limit block (10) penetrates to the outside of the housing (9) and is fixedly connected with a rubber pad (11).

5. A molding device for chip processing according to claim 1, characterized in that: Around the bottom of the fixed seat (1), fixed columns are fixedly connected. The bottoms of the fixed columns are fixedly connected with anti-slip pads.

6. A molding device for chip processing according to claim 1, characterized in that: On both sides of the inner cavity of the lower mold (13), slide rails are fixedly connected. On both sides of the reset plate (24), they are slidably connected to the inner cavities of the slide rails.

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