Printed circuit board (PCB) processing and transporting device

By designing a PCB board processing and transportation device, using horizontal placement of PCB boards and combining an automated conveying mechanism, the problem of low production efficiency in the existing technology is solved, and efficient automated conveying and plating uniformity is achieved.

CN223175212UActive Publication Date: 2025-08-01HANGZHOU ZHUODING INTELLIGENT CONTROL TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421723202.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-20
Publication Date
2025-08-01
Estimated Expiration
2034-07-20

AI Technical Summary

Technical Problem

In the prior art, PCB boards have low production efficiency during electroplating treatment and are difficult to achieve automated conveying.

Method used

A PCB board processing and transportation device is designed, including a carrier, a lifting mechanism, a conveying mechanism and a transfer mechanism. By placing the PCB board horizontally and combining with an automated conveying mechanism, the number and efficiency of a single processing are improved.

Benefits of technology

It realizes the automatic conveying of PCB boards, improves the efficiency of electroplating processing, reduces the uneven thickness of the coating, and saves labor costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of PCB (printed circuit board) processing, in particular to a PCB processing and transporting device, which comprises a bearing part provided with a plurality of supporting components, the plurality of supporting components are arranged along the vertical direction, and each supporting component is used for supporting a PCB; the lifting mechanism is connected with the bearing part and used for driving the bearing part to move up and down; the first reaction box is hollow, is provided with an opening in the top surface and is used for accommodating liquid; the first conveying mechanism is arranged on the first side of the bearing part; the second conveying mechanism is arranged on the second side of the bearing part; the first transferring mechanism corresponds to the first conveying mechanism and is used for conveying the PCBs between the first conveying mechanism and the supporting assembly; and the second transferring mechanism corresponds to the second conveying mechanism and is used for conveying the PCB between the second conveying mechanism and the supporting assembly. The utility model relates to a PCB (Printed Circuit Board) processing and transporting device, aiming at solving the problem that the production efficiency is low when a PCB is electroplated in the prior art.
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Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, and more specifically, to a PCB board processing and transportation device. Background Art

[0002] A PCB (Printed Circuit Board), also known as a printed wiring board, is an important electronic component, a support for electronic components, and a carrier for electrical connections between electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board.

[0003] After graphic transfer processing, electroplating and etching are required. During this process, multiple PCB boards need to be fixed on a gantry crane, and under the movement of the gantry crane conveyor line, the PCB boards are driven to be processed in various water tanks or electroplating tanks, such as: degreasing, water washing, micro-etching, copper plating, pickling, tin plating, etc.

[0004] In the prior art, when transporting PCB boards through a gantry crane conveyor line, it is necessary to manually fix the PCB boards on the clips of the gantry crane conveyor line, and manual disassembly is also required after completion. Moreover, the number of PCB boards fixed by a single gantry crane conveyor line is small, which is not conducive to matching the automated conveyor line in the PCB board production workshop, resulting in low efficiency. Summary of the Utility Model

[0005] The main object of the present utility model is to propose a PCB board processing and transportation device, aiming to solve the problem of low production efficiency of PCB boards during electroplating treatment in the prior art.

[0006] To solve the above technical problems, a PCB board processing and transportation device is proposed, including: a carrier member provided with a plurality of support components, the plurality of support components are arranged in the vertical direction, and each support component is used to support a PCB board;

[0007] A lifting mechanism connected to the carrier member for driving the carrier member to move up and down;

[0008] A first reaction tank, which is hollow and has an open top surface for placing liquid;

[0009] A first conveying mechanism is arranged on the first side of the carrier member;

[0010] A second conveying mechanism is arranged on the second side of the carrier member;

[0011] A first transfer mechanism corresponding to the first conveying mechanism for transporting PCB boards between the first conveying mechanism and the support components;

[0012] The second transfer mechanism, corresponding to the second conveying mechanism, is used to transfer the PCB board between the second conveying mechanism and the support assembly.

[0013] In any of the above technical solutions, further, the lifting mechanism includes:

[0014] The first lifting mechanism, the second lifting mechanism, the third lifting mechanism, and the fourth lifting mechanism are all connected to the carrier;

[0015] The first lifting mechanism is symmetrically arranged relative to the second lifting mechanism and the third lifting mechanism;

[0016] The fourth lifting mechanism is symmetrically arranged relative to the second lifting mechanism and the third lifting mechanism.

[0017] In any of the above technical solutions, further, it further includes:

[0018] The first limiting mechanism is arranged on the first side of the carrier and is used to adjust the size of the opening on the first side of the carrier;

[0019] The second limiting mechanism is arranged on the second side of the carrier and is used to adjust the size of the opening on the second side of the carrier.

[0020] In any of the above technical solutions, further, the first limiting mechanism includes:

[0021] A plurality of blocking members, the plurality of blocking members are arranged in the vertical direction, each of the blocking members is correspondingly arranged with each of the support assemblies, each of the blocking members is hinged to the carrier, and each of the blocking members is provided with a guiding hole;

[0022] The winding rope, the winding rope is provided with a plurality of protrusions, and the plurality of protrusions of the winding rope are respectively arranged at the guiding holes corresponding to each of the blocking members;

[0023] The winding mechanism is arranged on the carrier and is connected to the winding rope;

[0024] The guiding member is arranged on the carrier and abuts against the winding rope.

[0025] In any of the above technical solutions, further, the first limiting mechanism further includes:

[0026] The spring is respectively connected to the winding rope and the carrier.

[0027] In any of the above technical solutions, further, both the first transfer mechanism and the second transfer mechanism include:

[0028] The adsorption mechanism is arranged on the first moving mechanism and is used to adsorb the PCB board;

[0029] The first moving mechanism is used to drive the adsorption mechanism to move in a first direction and is arranged on the second moving mechanism;

[0030] The second moving mechanism is used to drive the first moving mechanism to move in a second direction and is arranged on the third moving mechanism;

[0031] The third moving mechanism is used to drive the second moving mechanism to move up and down and is fixedly arranged relative to the first conveying mechanism.

[0032] In any of the above technical solutions, further, it further includes:

[0033] A second reaction tank, arranged corresponding to the first reaction tank, for placing liquid;

[0034] A plurality of pumping mechanisms, the plurality of pumping mechanisms are arranged in the vertical direction, and each of the pumping mechanisms is respectively communicated with the first reaction tank and the second reaction tank;

[0035] A plurality of connecting pipes, the plurality of connecting pipes are arranged in the vertical direction, and each of the connecting pipes is respectively communicated with the first reaction tank and the second reaction tank;

[0036] The connecting pipes and the pumping mechanisms are used to drive the liquid in the first reaction tank and the second reaction tank to circulate.

[0037] In any of the above technical solutions, further, it further includes:

[0038] A third reaction tank, which is hollow and has an open top surface, is arranged corresponding to the first reaction tank, for placing liquid;

[0039] A third conveying mechanism, the lifting mechanism is arranged on the third conveying mechanism, and the third conveying mechanism is used to drive the carrier to move between the first reaction tank and the third reaction tank.

[0040] The beneficial effects are as follows:

[0041] 1. For the PCB board processing and transportation device of the present utility model, through the arrangement of the carrier and the support assembly, a plurality of horizontally distributed PCB boards can be arranged in the carrier in the up and down direction, and processes such as electroplating, pickling, and water washing can be carried out in the form of horizontally arranging the PCB boards, which is convenient for increasing the number of single processing and improving the processing efficiency. At the same time, by placing the PCB boards horizontally, the phenomenon of uneven electroplating when the PCB boards are placed vertically can also be reduced;

[0042] 2. The arrangement of the first conveying mechanism and the second conveying mechanism facilitates the automatic docking with the conveyor line in the PCB board workshop. Moreover, the first transfer mechanism and the second transfer mechanism are provided to pick up and place the PCB board before and after processing, which is convenient for automatic production and saves labor.

[0043] 3. Through the arrangement of the four lifting mechanisms of the lifting mechanism, it is convenient to adaptively adjust the inclination of the bearing member in different directions, which is convenient for removing the residual water stains on the PCB board on the support component.

[0044] 4. At the same time, the first moving mechanism, the second moving mechanism and the third moving mechanism are provided, which is convenient for accurately placing one or more PCB boards on the same bearing component and improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0046] Figure 1 is a three-dimensional structural schematic diagram of a PCB board processing and transporting device of the present invention;

[0047] Figure 2 is Figure 1 a partial enlarged structural schematic diagram at A in

[0048] Figure 3 is a top view structural schematic diagram of a PCB board processing and transporting device of the present invention;

[0049] Figure 4 is a three-dimensional structural schematic diagram of the bearing member and the first limiting mechanism in a PCB board processing and transporting device of the present invention;

[0050] Figure 5 is Figure 4 a partial enlarged structural schematic diagram at B in

[0051] Figure 6 is a partial structural schematic diagram of the first transfer mechanism and the first conveying mechanism in a PCB board processing and transporting device of the present invention.

[0052] The reference numerals are explained as follows:

[0053] 1. Bearing member; 101. Support component;

[0054] 2. Lifting mechanism; 201. First lifting mechanism; 202. Second lifting mechanism; 203. Third lifting mechanism; 204. Fourth lifting mechanism;

[0055] 3. First reaction tank;

[0056] 4. First conveying mechanism;

[0057] 5. Second conveying mechanism;

[0058] 6. First transfer mechanism; 601. Adsorption mechanism; 602. First moving mechanism; 603. Second moving mechanism; 604. Third moving mechanism;

[0059] 7. Second transfer mechanism;

[0060] 8. First limiting mechanism; 801. Stopper; 802. Winding rope; 803. Protrusion; 804. Winding mechanism; 805. Guide; 806. Spring;

[0061] 9. Second limiting mechanism;

[0062] 10. Second reaction tank;

[0063] 11. Pumping mechanism;

[0064] 12. Connecting pipe;

[0065] 13. Third reaction tank;

[0066] 14. Third conveying mechanism;

[0067] 15. Fourth reaction tank. Detailed implementation manners

[0068] Next, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without creative efforts fall within the scope of protection of the present invention.

[0069] It should be noted that, as shown in the present application and the claims, unless the context clearly indicates an exception, words such as "a", "an", "one" and / or "the" are not specifically singular and may also include plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0070] If there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, then such directional indications are only used to explain the relative positional relationship, movement conditions, etc. between components in a certain specific posture (as shown in the attached drawings). If this specific posture changes, then the directional indications will also change accordingly.

[0071] In the present utility model, unless otherwise clearly specified and defined, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0072] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, then such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0073] The present utility model provides a PCB board processing and transportation device, which mainly places the PCB board horizontally through the settings of a bearing member and a support assembly to increase the number of single - processing and reduce the phenomenon of uneven plating thickness. And through the cooperation of a lifting mechanism, a conveying mechanism and a transfer mechanism, it can perform automated transportation during electroplating treatment to improve processing efficiency.

[0074] The following will detail a PCB board processing and transportation device of the present application through the following embodiments.

[0075] In this embodiment, as Figures 1 to 6 shown, the PCB board processing and transportation device includes: a bearing member 1, provided with a plurality of support assemblies 101. The plurality of support assemblies 101 are arranged in the vertical direction, and each support assembly 101 is used to support the PCB board;

[0076] The lifting mechanism 2 is connected to the carrier 1 and is used to drive the carrier 1 to move up and down;

[0077] The first reaction tank 3 is hollow and has an open top surface for placing liquid;

[0078] The first conveying mechanism 4 is arranged on the first side of the carrier 1;

[0079] The second conveying mechanism 5 is arranged on the second side of the carrier 1;

[0080] The first transfer mechanism 6 corresponds to the first conveying mechanism 4 and is used to convey the PCB between the first conveying mechanism 4 and the support assembly 101;

[0081] The second transfer mechanism 7 corresponds to the second conveying mechanism 5 and is used to convey the PCB between the second conveying mechanism 5 and the support assembly 101.

[0082] In this technical solution, the carrier 1 is a rectangular frame. The first side and the second side of the carrier 1 generally refer to the left and right sides. The left and right sides of the carrier 1 are provided with openings, and the transfer mechanism can pick up and place the PCB on the support assembly 101 inside the carrier 1 through the left and right sides of the carrier 1. The support assemblies 101 are uniformly arranged in twelve in the up and down direction. The support assembly 101 includes two strip-shaped support plates that are symmetric front and back, have a certain distance between the front and back, and are horizontally fixed left and right in the support member. The lifting mechanism 2 is fixed on the third conveying mechanism 14, and the lifting mechanism 2 is connected to the top surface of the carrier 1 and can drive the carrier 1 to move up and down.

[0083] The first reaction tank 3 is rectangular, fixed on the ground, has an open top surface, is arranged below the lifting mechanism 2. The first reaction tank 3 and the support assembly 101 are respectively provided with positive and negative connectors for electroplating to electroplate the PCB on the carrier assembly. The first conveying mechanism 4 and the second conveying mechanism 5 are roller conveyors arranged on the left and right sides of the carrier 1. The first transfer mechanism 6 is fixed at one end of the first conveying mechanism 4 close to the carrier 1, and the second transfer mechanism 7 is fixed at one end of the second conveying mechanism 5 close to the carrier 1. During use, the first transfer mechanism 6 places the PCB conveyed by the first conveying mechanism 4 on each support assembly 101 respectively. Then the lifting mechanism 2 lowers the carrier 1 into the first reaction tank 3 for electroplating for a period of time. Then the lifting mechanism 2 drives the carrier 1 to move up. Finally, the electroplated PCB is placed on the second conveying mechanism 5 through the second transfer mechanism 7. During the process of the first transfer mechanism 6 and the second transfer mechanism 7 picking up and placing the PCB, the height of the carrier 1 is adaptively adjusted synchronously through the lifting mechanism 2.

[0084] In some technical solutions, the conveying rollers of the first conveying mechanism 4 and the second conveying mechanism 5 are arranged in a form of one thick and one thin section.

[0085] In some other technical solutions, a number of through holes are provided on the front and rear sides of the carrier 1, so that the liquid in the first reaction tank 3 can move to between the respective support components 101 through the front and rear sides of the carrier 1.

[0086] In this embodiment, the lifting mechanism 2 includes:

[0087] A first lifting mechanism 201, a second lifting mechanism 202, a third lifting mechanism 203, and a fourth lifting mechanism 204, all of which are connected to the carrier 1;

[0088] The first lifting mechanism 201 is symmetrically arranged relative to the second lifting mechanism 202 and the third lifting mechanism 203;

[0089] The fourth lifting mechanism 204 is symmetrically arranged relative to the second lifting mechanism 202 and the third lifting mechanism 203.

[0090] In this technical solution, the first lifting mechanism 201, the second lifting mechanism 202, the third lifting mechanism 203, and the fourth lifting mechanism 204 all include a driving motor, a winding wheel, and a flexible rope. The driving motor is fixed on the slider of the third conveying mechanism 14, the winding wheel is fixed on the rotating shaft of the driving motor, one end of the flexible rope is wound and fixed on the winding wheel, and the other end is fixed on the top surface of the carrier 1. The first lifting mechanism 201 and the second lifting mechanism 202 are symmetric left and right, with the first lifting mechanism 201 on the left and the second lifting mechanism 202 on the right; the first lifting mechanism 201 and the third lifting mechanism 203 are symmetric front and back, with the first lifting mechanism 201 in the front and the third lifting mechanism 203 in the back; the third lifting mechanism 203 and the fourth lifting mechanism 204 are symmetric left and right, with the third lifting mechanism 203 on the left and the fourth lifting mechanism 204 on the right; the second lifting mechanism 202 and the fourth lifting mechanism 204 are symmetric front and back, with the second lifting mechanism 202 in the front and the fourth lifting mechanism 204 in the back.

[0091] Through the control of the winding and unwinding differences of the first lifting mechanism 201, the second lifting mechanism 202, the third lifting mechanism 203, and the fourth lifting mechanism 204, the carrier 1 can be tilted forward, left, right, or backward relative to the first reaction tank 3; by synchronously controlling the first lifting mechanism 201, the second lifting mechanism 202, the third lifting mechanism 203, and the fourth lifting mechanism 204, the carrier 1 can move vertically up and down.

[0092] In this embodiment, it further includes:

[0093] A first limiting mechanism 8, which is arranged on the first side of the carrier 1 and is used to adjust the size of the opening on the first side of the carrier 1;

[0094] A second limiting mechanism 9, which is arranged on the second side of the carrier 1 and is used to adjust the size of the opening on the second side of the carrier 1.

[0095] In this technical solution, the first limiting mechanism 8 is arranged on the left side of the carrier 1, and the second limiting mechanism 9 is arranged on the right side of the carrier 1. By setting the first limiting mechanism 8 and the second limiting mechanism 9, the passing width in the front-rear direction on both the left and right sides of the carrier 1 can be adjusted, so that when the PCB is buoyed by the liquid in the first reaction tank 3, it will not slide outside the carrier 1, and the PCB can be released when the transfer mechanism picks up and places the PCB board.

[0096] In this embodiment, the first limiting mechanism 8 includes:

[0097] A plurality of stoppers 801, the plurality of stoppers 801 are arranged in the vertical direction, each stopper 801 is correspondingly arranged with each support assembly 101, each stopper 801 is hinged to the carrier 1, and each stopper 801 is provided with a guide hole;

[0098] A winding rope 802, the winding rope 802 is provided with a plurality of protrusions 803, and the plurality of protrusions 803 of the winding rope 802 are respectively arranged at the guide holes corresponding to each stopper 801;

[0099] A winding mechanism 804, arranged on the carrier 1 and connected to the winding rope 802;

[0100] A guide member 805, arranged on the carrier 1 and abutted against the winding rope 802.

[0101] In this technical solution, the stopper 801 is rotatably arranged on the left front side of the carrier 1 through a horizontally left-right pin shaft. When the stopper 801 is in the front-rear horizontal state, the front end of the stopper 801 extends to the front side of the carrier 1, and the rear end of the stopper 801 extends to the left side surface of the carrier 1. The weight of the front end of the stopper 801 is greater than the weight of the rear end of the stopper 801, so that the stopper 801 has the potential energy of automatically rotating downward at the front end when not affected by the winding rope 802. The winding mechanism 804 includes a motor and a rotating wheel, the rotating wheel is fixed on the motor rotating shaft, the top end of the winding rope 802 is wound and fixed on the rotating wheel of the winding mechanism 804, the guide member 805 is a guide wheel arranged on the left front side of the top surface of the carrier 1, and the guide member 805 makes the part of the winding rope 802 extending downward tend to be vertically arranged. The protrusion 803 is a hard convex block uniformly fixed on the winding rope 802, a vertically penetrating and front-rear extending strip-shaped guide hole is provided at the front end part of each stopper 801, the winding rope 802 passes through the guide holes of each stopper 801, and the top surfaces of the respective protrusions 803 are respectively abutted against the bottom surfaces of each stopper 801.

[0102] The description is made when the stopper 801 is in the front-back horizontal position. At this time, the left side surface of the carrier 1 is blocked by the rear ends of the respective stoppers 801. At this time, the PCB board is restricted within the carrier 1. By unwinding and rewinding the winding rope 802 through the winding mechanism 804, the winding rope 802 rotates downward under the action of the gravity at the front ends of the respective stoppers 801, so that the distance that the stopper 801 extends to the left side surface of the carrier 1 becomes shorter, and a gap appears between the adjacent stoppers 801. At this time, the transfer mechanism can pick up and place the PCB board; after the picking-up and placing action is completed, the winding mechanism 804 is activated to drive the winding rope 802 to wind a certain length, so that each stopper 801 becomes horizontal under the action of the respective protrusions 803, and can extend to the left side surface of the carrier 1 again to block the PCB board.

[0103] In some technical solutions, the second limiting mechanism 9 has the same structure as the first limiting mechanism 8 and is arranged symmetrically left and right.

[0104] In other technical solutions, a structure that is the same as and symmetrically arranged front and back with respect to the winding rope 802, the guide member 805, and several stoppers 801 is provided at the left rear side of the carrier 1. The incident angles of the front and back two winding ropes 802 to the winding mechanism 804 are different, so that the winding mechanism 804 can wind or unwind the front and back two winding ropes 802 synchronously.

[0105] In this embodiment, the first limiting mechanism 8 further includes:

[0106] Springs 806, which are respectively connected to the winding rope 802 and the carrier 1.

[0107] In this technical solution, the springs 806 are vertically fixed at the bottom of the carrier 1, and the top ends of the springs 806 are fixedly connected to the winding rope 802 or the lowermost protrusion 803. The arrangement of the springs 806 enables the part of the winding rope 802 between the guide member 805 and the springs 806 to be in a tensioned state, and can also promote the rotation of the stopper 801.

[0108] In some technical solutions, the springs 806 are replaced with elastic members such as elastic ropes.

[0109] In this embodiment, both the first transfer mechanism 6 and the second transfer mechanism 7 include:

[0110] An adsorption mechanism 601, which is arranged on the first moving mechanism 602 and is used for adsorbing the PCB board;

[0111] The first moving mechanism 602, which is used for driving the adsorption mechanism 601 to move along the first direction and is arranged on the second moving mechanism 603;

[0112] The second moving mechanism 603, which is used for driving the first moving mechanism 602 to move along the second direction and is arranged on the third moving mechanism 604;

[0113] The third moving mechanism 604 is used to drive the second moving mechanism 603 to move up and down and is fixedly arranged relative to the first conveying mechanism 4.

[0114] In this technical solution, the third moving mechanism 604 is a vertically arranged lead screw slider moving mechanism, the second moving mechanism 603 is a front-back horizontally arranged lead screw slider moving mechanism, the first moving mechanism 602 is a slider moving mechanism driven by a cylinder, and the first moving mechanism 602 is horizontally arranged in the left-right direction. The adsorption mechanism 601 is a plurality of suction cups connected to the air source through solenoid valves and is uniformly fixed under the slider of the first moving mechanism 602.

[0115] In this embodiment, it further includes:

[0116] The second reaction tank 10 is arranged corresponding to the first reaction tank 3 and is used for placing liquid; [[ID=IO]]

[0117] A plurality of pumping mechanisms 11 are arranged in the vertical direction, and each pumping mechanism 11 is respectively communicated with the first reaction tank 3 and the second reaction tank 10;

[0118] A plurality of connecting pipes 12 are arranged in the vertical direction, and each connecting pipe 12 is respectively communicated with the first reaction tank 3 and the second reaction tank 10;

[0119] The connecting pipes 12 and the pumping mechanisms 11 are used to drive the liquid in the first reaction tank 3 and the second reaction tank 10 to circulate.

[0120] In this technical solution, the second reaction tank 10 is arranged at the rear side of the first reaction tank 3. The pumping mechanism 11 includes a water pump and a water pipe. Both the pumping mechanism 11 and the connecting pipe 12 are arranged in four. Four first through holes are provided on the left side surface of the first reaction tank 3 and the second reaction tank 10, and the four pumping mechanisms 11 are respectively communicated with the four first through holes on the left side surface of the first reaction tank 3 and the second reaction tank 10; four second through holes are provided on the right side surface of the first reaction tank 3 and the second reaction tank 10, and the four pumping mechanisms 11 are respectively communicated with the four second through holes on the right side surface of the first reaction tank 3 and the second reaction tank 10. Through the action of the pumping mechanism 11 and the connecting pipe 12, the liquid in the first reaction tank 3 and the second reaction tank 10 can be driven to circulate, which can promote each PCB board to be in uniform contact with the liquid and reduce the difference degree of the coating thickness.

[0121] In this embodiment, it further includes:

[0122] The third reaction tank 13 is hollow and has an open top surface, and is arranged corresponding to the first reaction tank 3 and is used for placing liquid;

[0123] The third conveying mechanism 14, the lifting mechanism 2 is arranged on the third conveying mechanism 14, and the third conveying mechanism 14 is used to drive the carrier 1 to move between the first reaction tank 3 and the third reaction tank 13.

[0124] In this technical solution, the third conveying mechanism 14 is a screw-slider moving mechanism that is horizontally arranged left and right and fixed on the upper sides of the first reaction tank 3 and the third reaction tank 13. The third reaction tank 13 is fixed on the right side of the first reaction tank 3. Different liquids are respectively arranged in the first reaction tank 3 and the third reaction tank 13. For example, an electroplating solution used for electroplating copper is placed in the first reaction tank 3, and a pickling solution is placed in the third reaction tank 13.

[0125] In some technical solutions, a fourth reaction tank 15 is further provided, and a structure identical to the pumping mechanism 11 and the connecting pipe 12 is provided between the fourth reaction tank 15 and the third reaction tank 13.

[0126] In still some other technical solutions, the lifting mechanism 2 is arranged on the third conveying mechanism 14 through a screw-slider moving mechanism arranged horizontally front and back, so as to facilitate the adaptive adjustment of the position of the carrier 1 in the front and back directions.

[0127] The various embodiments of the present disclosure have been described above. The above description is exemplary and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art in the technical field without departing from the scope and spirit of the described embodiments. The selection of the terms used herein is intended to best explain the principles of the embodiments, the practical application or the improvement of the technology in the market, or to enable other ordinary technical personnel in the technical field to understand the disclosed embodiments.

Claims

1. A PCB board processing and transportation device, characterized in that, Including: A carrier (1) is provided with a plurality of support components (101). The plurality of support components (101) are arranged in the vertical direction, and each support component (101) is used to support a PCB board. A lifting mechanism (2) is connected to the carrier (1) and is used to drive the carrier (1) to move up and down. A first reaction tank (3) is hollow and has an open top surface for placing liquid. A first conveying mechanism (4) is arranged on the first side of the carrier (1). A second conveying mechanism (5) is arranged on the second side of the carrier (1). A first transfer mechanism (6) corresponds to the first conveying mechanism (4) and is used to transfer the PCB board between the first conveying mechanism (4) and the support component (101). A second transfer mechanism (7) corresponds to the second conveying mechanism (5) and is used to transfer the PCB board between the second conveying mechanism (5) and the support component (101). Both the first transfer mechanism (6) and the second transfer mechanism (7) include: An adsorption mechanism (601) is arranged on a first moving mechanism (602) and is used to adsorb the PCB board. The first moving mechanism (602) is used to drive the adsorption mechanism (601) to move in a first direction and is arranged on a second moving mechanism (603). The second moving mechanism (603) is used to drive the first moving mechanism (602) to move in a second direction and is arranged on a third moving mechanism (604). The third moving mechanism (604) is used to drive the second moving mechanism (603) to move up and down and is fixedly arranged relative to the first conveying mechanism (4).

2. The PCB board processing and transportation device according to claim 1, wherein, It further includes: A first limiting mechanism (8) is arranged on the first side of the carrier (1) and is used to adjust the size of the opening on the first side of the carrier (1). A second limiting mechanism (9) is arranged on the second side of the carrier (1) and is used to adjust the size of the opening on the second side of the carrier (1).

3. The PCB board processing and transportation device according to claim 2, wherein The first limiting mechanism (8) includes: A plurality of blocking members (801). The plurality of blocking members (801) are arranged in the vertical direction. Each blocking member (801) is respectively arranged corresponding to each support component (101). Each blocking member (801) is hinged to the carrier (1), and each blocking member (801) is provided with a guiding hole. A winding rope (802) is provided with a plurality of protrusions (803). The plurality of protrusions (803) of the winding rope (802) are respectively arranged at the guiding holes corresponding to each blocking member (801). A winding mechanism (804) is arranged on the carrier (1) and is connected to the winding rope (802). A guiding member (805) is arranged on the carrier (1) and abuts against the winding rope (802).

4. The PCB board processing and transportation device according to claim 3, wherein, The first limiting mechanism (8) further includes: A spring (806) is respectively connected to the winding rope (802) and the carrier (1).

5. The PCB board processing and transportation device according to claim 1, wherein It further includes: A second reaction tank (10) is arranged corresponding to the first reaction tank (3) for placing liquid. A plurality of pumping mechanisms (11), the plurality of pumping mechanisms (11) are arranged in the vertical direction, and each of the pumping mechanisms (11) is respectively communicated with the first reaction tank (3) and the second reaction tank (10); A plurality of connecting pipes (12), the plurality of connecting pipes (12) are arranged in the vertical direction, and each of the connecting pipes (12) is respectively communicated with the first reaction tank (3) and the second reaction tank (10); The connecting pipes (12) and the pumping mechanisms (11) are used to drive the liquid in the first reaction tank (3) and the second reaction tank (10) to circulate.

6. The PCB board processing and transportation device according to claim 1 or 5, characterized in that, It further includes: A third reaction tank (13), which is hollow and has an open top surface, is arranged corresponding to the first reaction tank (3) for placing liquid; A third conveying mechanism (14), the lifting mechanism (2) is arranged on the third conveying mechanism (14), and the third conveying mechanism (14) is used to drive the carrier (1) to move between the first reaction tank (3) and the third reaction tank (13).