Gas heating device, transmission system and processing equipment of semiconductor device

Abstract

The utility model provides a gas heating device, a gas transmission system and processing equipment of a semiconductor device. The gas heating device comprises an outer pipe used for providing a closed transmission channel for gas to be heated; the inner pipe is arranged on the inner side of the outer pipe, and at least one opening which extends in the gas flowing direction and is adjustable in size is formed in the inner pipe; the inner pipe is provided with an opening, the heating structure is arranged on the inner side of the inner pipe, a ventilation gap is kept between the heating structure and the inner wall of the inner pipe, and the inner pipe adjusts the sectional area of the ventilation gap by adjusting the size of the opening, so that the pressure of an air inlet and / or the temperature of an air outlet of the gas heating device are / is changed.

Description

Technical Field

[0001] The utility model relates to a gas heating device, a gas transmission system, and a processing device for semiconductor devices. Background Art

[0002] In the semiconductor manufacturing process, heating pipeline gas is crucial in semiconductor manufacturing. It not only ensures the purity and fluidity of the gas, but also guarantees the stability of the manufacturing process and the final quality of the product.

[0003] In the existing technology, the temperature of the gas is usually controlled by heating the gas transmission pipeline with a heating tape. However, this method not only has a slow gas heating speed, but also an inaccurate heating temperature.

[0004] In order to overcome the above-mentioned defects existing in the prior art, there is an urgent need in the art for a gas heating technology to adapt to different process requirements, thereby improving the efficiency of gas temperature regulation. Summary of the Utility Model

[0005] The following gives a brief overview of one or more aspects to provide a basic understanding of these aspects. This overview is not an exhaustive survey of all contemplated aspects, and is neither intended to identify key or decisive elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that follows.

[0006] In order to overcome the above-mentioned defects existing in the prior art, the utility model provides a gas heating device, a gas transmission system, and a processing device for semiconductor devices, which are used to adapt to different process requirements, thereby improving the efficiency of gas temperature regulation.

[0007] Specifically, the gas heating device provided by the first aspect of the utility model includes: an outer tube for providing a closed transmission channel for the gas to be heated; an inner tube disposed inside the outer tube, on which there is at least one opening extending along the gas flow direction and having an adjustable size; and a heating structure disposed inside the inner tube and maintaining a ventilation gap with the inner wall of the inner tube. Wherein, the inner tube adjusts the cross-sectional area of the ventilation gap by adjusting the size of the opening, thereby changing the inlet pressure and / or outlet temperature of the gas heating device.

[0008] Further, in some embodiments of the present utility model, the heating device further includes: a knob, the first end of which is connected to the outer tube, and the second end of which is threadedly connected to the inner tube, wherein the inner tube reduces the opening as the knob rotates in a preset first direction, so as to reduce the cross-sectional area of the ventilation gap, or the inner tube enlarges the opening as the knob rotates in a preset second direction, so as to increase the cross-sectional area of the ventilation gap.

[0009] Further, in some embodiments of the present utility model, the inner tube is composed of a plurality of components spliced together, wherein openings are respectively provided between the components, and at least one of the components is threadedly connected to a knob.

[0010] Further, in some embodiments of the present utility model, the heating structure is made of a heat-conducting material and is provided with at least one installation groove for inserting a heating rod.

[0011] Further, in some embodiments of the present utility model, the heating device further includes: a temperature sensor for collecting the temperature of the air outlet of the heating device, wherein the inner tube enlarges the opening to increase the cross-sectional area of the ventilation gap when the temperature of the air outlet is higher than the target temperature, or reduces the opening to decrease the cross-sectional area of the ventilation gap when the temperature of the air outlet is lower than the target temperature.

[0012] Further, in some embodiments of the present utility model, the heating device further includes: a pressure sensor for collecting the pressure of the air inlet of the heating device, wherein the inner tube enlarges the opening to increase the cross-sectional area of the ventilation gap when the pressure of the air inlet is greater than the target pressure, or reduces the opening to decrease the cross-sectional area of the ventilation gap when the pressure of the air inlet is less than the target pressure.

[0013] Further, in some embodiments of the present utility model, the heating device further includes: an over-temperature alarm connected to the temperature sensor for giving an over-temperature alarm when the temperature of the air outlet is higher than a preset temperature threshold.

[0014] In addition, the gas transmission system provided in the second aspect of the present utility model includes: the heating device according to any one of the first aspects of the present utility model; a housing for fixing the heating device, wherein the first end of the knob of the heating device is connected to the outer tube of the heating device via the housing; an input pipeline, the first end of which is connected to the gas tank of the semiconductor device processing equipment, and the second end of which is connected to the air inlet of the heating device; and an output pipeline, the first end of which is connected to the air outlet of the heating device, and the second end of which is connected to the process chamber of the semiconductor device processing equipment.

[0015] In addition, the processing equipment for semiconductor devices provided by the third aspect of the present utility model includes: a gas box for at least providing a process gas to be heated; a gas transmission system as described in the second aspect of the present utility model for heating the process gas and transmitting it to a process chamber at the rear end; and the process chamber for accommodating a wafer and performing a thin film deposition process on it. Description of the Drawings

[0016] After reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings, the above features and advantages of the present utility model can be better understood. In the drawings, the components are not necessarily drawn to scale, and components with similar relevant characteristics or features may have the same or similar reference numerals.

[0017] Figure 1 The schematic structural diagram of a gas transmission system provided by some embodiments of the present utility model is shown.

[0018] Figure 2 The schematic structural diagram of a gas heating device provided by some embodiments of the present utility model is shown.

[0019] Figure 3 The schematic gas flow path diagram of a gas heating device provided by some embodiments of the present utility model is shown.

[0020] Figure 4 The schematic principle diagram of a gas heating device provided by some embodiments of the present utility model is shown.

[0021] Reference Numerals:

[0022] 10 Heating device

[0023] 11 Outer tube

[0024] 12 Inner tube

[0025] 13 Heating structure

[0026] 131 Mounting groove

[0027] 14 Ventilation gap

[0028] 15 Inlet

[0029] 16 Outlet

[0030] 17 Knob

[0031] 20 Outer housing

[0032] 30 Input pipeline

[0033] 40 Output pipeline Detailed Description of the Embodiments

[0034] The following specific embodiments illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. Although the description of the present utility model will be introduced in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this implementation manner. On the contrary, the purpose of introducing the utility model in conjunction with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of the present utility model. In order to provide a deep understanding of the present utility model, many specific details will be included in the following description. The present utility model can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of the present utility model, some specific details will be omitted in the description.

[0035] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0036] In addition, the "upper", "lower", "left", "right", "top", "bottom", "horizontal", and "vertical" used in the following description should be understood as the orientations shown in this paragraph and the relevant drawings. This relative term is only for the convenience of description and does not mean that the device described needs to be manufactured or operated in a specific orientation, so it should not be understood as a limitation to the present utility model.

[0037] It can be understood that although terms such as "first", "second", and "third" can be used here to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first component, region, layer, and / or part discussed below can be called the second component, region, layer, and / or part without departing from some embodiments of the present utility model.

[0038] As mentioned above, in the semiconductor manufacturing process, the heating pipeline gas is crucial in semiconductor manufacturing. It not only ensures the purity and fluidity of the gas, but also ensures the stability of the manufacturing process and the final quality of the product.

[0039] In the existing technology, the temperature of the gas is usually controlled by heating with a heating tape. However, this method not only has a slow gas heating speed, but also an inaccurate heating temperature.

[0040] To overcome the above-mentioned defects existing in the prior art, the present utility model provides a gas heating device, a gas transmission system, and a processing apparatus for semiconductor devices, which are used to adapt to different process requirements, thereby improving the efficiency of gas temperature regulation.

[0041] In some non-limiting embodiments, the heating device provided in the first aspect of the present utility model can be configured in the gas transmission system provided in the second aspect of the present utility model. The gas transmission system provided in the second aspect of the present utility model can be configured in the processing apparatus for semiconductor devices provided in the third aspect of the present utility model. Specifically, the processing apparatus for semiconductor devices provided in the third aspect of the present utility model includes: a gas box for at least providing a process gas to be heated; a gas transmission system for heating the process gas and transmitting it to a process chamber at the rear end; and a process chamber for accommodating a wafer and performing a thin film deposition process on it.

[0042] Please refer to Figure 1 , Figure 1 which shows a schematic structural diagram of a gas transmission system provided according to some embodiments of the present utility model.

[0043] As Figure 1 shown, the gas transmission system includes a heating device 10, an outer housing 20, an input pipeline 30, and an output pipeline 40.

[0044] Specifically, the outer housing 20 is used to fix the heating device 10. Among them, the first end of the knob 17 of the heating device 10 is connected to the outer tube 11 of the heating device 10 via the outer housing 20. The input pipeline 30, whose first end is connected to the gas box of the semiconductor device processing equipment, and whose second end is connected to the inlet 15 of the heating device 10; and the output pipeline 40, whose first end is connected to the outlet 16 of the heating device 10, and whose second end is connected to the process chamber of the semiconductor device processing equipment.

[0045] Please refer to Figure 2 , Figure 2 which shows a schematic structural diagram of the gas heating device 10 provided according to some embodiments of the present utility model.

[0046] As Figure 2 shown, the gas heating device 10 includes an outer tube 11, an inner tube 12, and a heating structure 13. Specifically, the outer tube 11 is used to provide a closed transmission channel for the gas to be heated. The inner tube 12 is arranged inside the outer tube 11, and at least one opening extending along the gas flow direction and with adjustable size is provided thereon.

[0047] Please refer to Figure 3 , Figure 3 which shows a schematic diagram of the gas flow path of the gas heating device 10 provided according to some embodiments of the present utility model.

[0048] As Figure 3 shown, the heating structure 13 is disposed inside the inner tube 12 and maintains a ventilation gap 14 with the inner wall of the inner tube 12. After the gas to be heated is input into the heating device 10 via the input pipeline 30, the gas to be heated is heated via this gap. The inner tube 12 adjusts the cross-sectional area of the ventilation gap 14 by adjusting the size of the opening, thereby changing the pressure of the air inlet 15 and / or the temperature of the air outlet 16 of the gas heating device 10.

[0049] Please continue to refer to Figure 2 , in some non-limiting embodiments, the heating device 10 further includes a knob 17. Its first end is connected to the outer tube 11, and its second end is threadedly connected to the inner tube 12. The knob 17 is provided with adjustment scales and can be adjusted according to the required temperature and flow resistance. Specifically, the formula for controlling the flow resistance can be expressed as:

[0050]

[0051] where Q is the gas flow rate, M is the gas mass, V is the gas volume, ΔT is the gas temperature change, P is the gas pressure, and A is the gas flow cross-sectional area.

[0052] Further, in some embodiments, the inner tube 12 shrinks the opening as the knob 17 rotates in a preset first direction to reduce the cross-sectional area of the ventilation gap 14, or the inner tube 12 expands the opening as the knob 17 rotates in a preset second direction to increase the cross-sectional area of the ventilation gap 14.

[0053] Further, in some non-limiting embodiments, the inner tube 12 is composed of multiple components spliced together, and openings are respectively provided between the components, and at least one component is threadedly connected to a knob 17. Specifically, the inner tube can be two semi-tubes with a symmetrical structure, so as to symmetrically adjust the cross-sectional area of the ventilation gap 14 to make the gas heating more uniform and improve the quality of the subsequent process.

[0054] Optionally, the inner tube 12 can also be an integral structure, with a single opening provided on one side, or composed of more than three components spliced into an inner tube, and openings are respectively provided between every two components, so as to adapt to different process requirements and improve the efficiency of gas temperature adjustment.

[0055] Further, in some non-limiting embodiments, the heating structure 13 is made of a heat-conducting material and is provided with at least one installation groove 131 for inserting a heating rod.

[0056] Please refer to Figure 4 1 Figure 4 which shows a schematic diagram of the principle of the gas heating device 10 provided according to some embodiments of the present invention.

[0057] AsFigure 4 As shown, in some non-limiting embodiments, the heating device 10 further includes a temperature sensor for collecting the temperature of the air outlet 16 of the heating device 10. When the temperature of the air outlet 16 is higher than the target temperature, the inner tube 12 expands the opening to increase the cross-sectional area of the ventilation gap 14, or when the temperature of the air outlet 16 is lower than the target temperature, the opening is reduced to decrease the cross-sectional area of the ventilation gap 14. Here, the target temperature can be a fixed value (for example: 200 °C), or it can be a certain range (for example: 100 °C to 200 °C).

[0058] Furthermore, in some non-limiting embodiments, the heating device 10 further includes a pressure sensor for collecting the pressure of the air inlet 15 of the heating device 10. When the pressure of the air inlet 15 is greater than the target pressure, the inner tube 12 expands the opening to increase the cross-sectional area of the ventilation gap 14, or when the pressure of the air inlet 15 is less than the target pressure, the opening is reduced to decrease the cross-sectional area of the ventilation gap 14. Here, the target pressure can be a fixed value or a certain range.

[0059] Furthermore, in some non-limiting embodiments, the heating device 10 further includes an over-temperature alarm. The over-temperature alarm is connected to the temperature sensor and is used to give an over-temperature alarm when the temperature of the air outlet 16 is higher than a preset temperature threshold. For example: set 200 °C, and when it is heated to 230 °C, the over-temperature alarm will feedback an alarm signal.

[0060] The working principle of the above gas transmission system will be described below in conjunction with some embodiments of the gas transmission method. Those skilled in the art can understand that these embodiments of the gas transmission method are only some non-limiting implementation manners provided by the present invention, aiming to clearly show the main concept of the present invention and provide some specific solutions convenient for the public to implement, rather than being used to limit all functions or all working modes of the gas transmission system. Similarly, the gas transmission system is also only some non-limiting implementation manners provided by the present invention, and does not limit the execution subject or execution order of each step in these gas transmission methods.

[0061] In some non-limiting embodiments, the gas transmission method includes the following steps: obtaining the target temperature of the air outlet 16 of the heating device 10 and detecting the actual temperature of the air outlet 16. In response to the actual temperature being higher than the target temperature, expanding the opening of the inner tube 12 of the heating device 10 to increase the cross-sectional area of the ventilation gap 14 between the inner tube 12 and the heating structure 13 of the heating device 10. In response to the actual temperature being lower than the target temperature, reducing the opening to decrease the cross-sectional area of the ventilation gap 14.

[0062] In addition, in some non-limiting embodiments, the transmission method further includes the following steps: obtaining the target pressure of the air inlet 15 of the heating device 10 and detecting the actual pressure of the air inlet 15. In response to the actual pressure being greater than the target pressure, expand the opening to increase the cross-sectional area of the ventilation gap 14. In response to the actual pressure being less than the target pressure, narrow the opening to decrease the cross-sectional area of the ventilation gap 14.

[0063] In summary, the gas heating device, the gas transmission system, and the processing equipment for semiconductor devices provided by the present utility model can be used to adapt to different process requirements, thereby improving the efficiency of gas temperature regulation.

[0064] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions not illustrated and described herein but understood by those skilled in the art.

[0065] The foregoing description of the disclosure has been provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A gas heating device, characterized in that, Comprising: An outer tube for providing a closed transmission channel for the gas to be heated; An inner tube disposed inside the outer tube, having at least one opening extending along the gas flow direction and adjustable in size; and A heating structure disposed inside the inner tube and maintaining a ventilation gap with the inner wall of the inner tube. Wherein, the inner tube adjusts the cross-sectional area of the ventilation gap by adjusting the size of the opening, thereby changing the inlet pressure and / or outlet temperature of the gas heating device.

2. The heating device according to claim 1, wherein, Further comprising: A knob, whose first end is connected to the outer tube and whose second end is threadedly connected to the inner tube. Wherein, the inner tube reduces the opening as the knob rotates in a preset first direction, so as to reduce the cross-sectional area of the ventilation gap, or The inner tube enlarges the opening as the knob rotates in a preset second direction, so as to increase the cross-sectional area of the ventilation gap.

3. The heating device according to claim 2, characterized in that, The inner tube is composed of multiple components spliced together. Wherein, the openings are respectively provided between the components, and at least one component is threadedly connected to one knob.

4. The heating device according to claim 1, characterized in that, The heating structure is made of a heat-conducting material and is provided with at least one installation groove for inserting a heating rod.

5. The heating device according to claim 1, characterized in that, Further comprising: A temperature sensor for collecting the outlet temperature of the heating device. Wherein, the inner tube enlarges the opening when the outlet temperature is higher than the target temperature, so as to increase the cross-sectional area of the ventilation gap, or reduces the opening when the outlet temperature is lower than the target temperature, so as to reduce the cross-sectional area of the ventilation gap.

6. The heating device according to claim 1 or 5, characterized in that, Further comprising: A pressure sensor for collecting the inlet pressure of the heating device. Wherein, the inner tube enlarges the opening when the inlet pressure is greater than the target pressure, so as to increase the cross-sectional area of the ventilation gap, or reduces the opening when the inlet pressure is less than the target pressure, so as to reduce the cross-sectional area of the ventilation gap.

7. The heating device according to claim 5, characterized in that, Further comprising: An over-temperature alarm connected to the temperature sensor for performing over-temperature alarm when the outlet temperature is higher than a preset temperature threshold.

8. A gas transmission system, characterized in that, Comprising: The heating device according to any one of claims 1 to siete; A housing for fixing the heating device. Wherein, the first end of the knob of the heating device is connected to the outer tube of the heating device via the housing; An input pipeline, whose first end is connected to the gas box of the semiconductor device processing equipment and whose second end is connected to the inlet of the heating device; and An output pipeline, whose first end is connected to the outlet of the heating device and whose second end is connected to the process chamber of the semiconductor device processing equipment.

9. A processing device for a semiconductor device, characterized in that, Comprising: A gas box at least for providing the process gas to be heated; The gas transmission system according to claim 8 for heating the process gas and transporting it to the subsequent process chamber; and The process chamber for accommodating the wafer and performing a thin film deposition process on it. It should be noted that in the translation of claim numbers, "siete" is a misspelling in the original text, and it should be "7" in English. This translation is based on the text you provided, and for the accuracy of patent content, it is recommended to further review and verify in combination with the original Chinese text.

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