Low-temperature heating circuit of chip, chip and electronic equipment
The heating unit is controlled by hardware circuits, which solves the problem that the chip cannot start independently in a low-temperature environment, and achieves low-cost self-start and operation.
Patent Information
- Application Number
- CN202422436665.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-10-09
AI Technical Summary
In the prior art, the chip cannot start independently under an environment below the minimum operating temperature, and the external controller controls the heating method is expensive.
The hardware circuit consisting of a temperature detection unit, a comparison unit and a switching unit is used to control the heating unit and do not rely on the processor to realize the chip's self-start and operation in a low-temperature environment.
The chip is automatically started and operated when it is below the minimum operating temperature, reducing costs and avoiding the high costs of external controllers.
Smart Images
Figure CN223180603U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip technology, and particularly relates to a low-temperature heating circuit for a chip, a chip, and an electronic device. Background Art
[0002] With the continuous development of electronic technology, as the core component of electronic products, the stability and reliability of the performance of chips have been increasingly emphasized. Ambient temperature is one of the important factors affecting chip performance. Different ambient temperatures will have varying degrees of influence on the working state, power consumption, speed, etc. of the chip.
[0003] In practical applications, it is inevitable to encounter the situation where the ambient temperature is lower than the lowest operating temperature of the chip. In order to enable the chip to be normally used in an environment below its lowest operating temperature, the chip temperature can be raised to its normal operating temperature range through self-heating means, so as to ensure the normal startup or operation of the chip.
[0004] In the related art, by the method of the processor of the chip to be heated controlling the heating itself, the heating can only be turned on before the temperature drops to the lowest operating temperature of the chip to be heated, and it cannot ensure that the chip starts from an environment lower than the lowest operating temperature; by the method of an external controller controlling the heating, it is necessary to ensure that the temperature of the external controller is higher than the lowest operating temperature of the chip to be heated to normally control the heating, and both the external controller and the lower operating temperature range will greatly increase the cost. Summary of the Utility Model
[0005] In view of the above problems, the embodiments of the present application provide a low-temperature heating circuit for a chip, a chip, and an electronic device to solve the above technical problems.
[0006] In the first aspect, the embodiments of the present application provide a low-temperature heating circuit for a chip. The circuit includes: a temperature detection unit for detecting the temperature of the chip and outputting a detection voltage; a comparison unit, whose first input terminal is connected to the temperature detection unit to receive the detection voltage, and whose second input terminal is used to receive a reference voltage; a heating unit for heating the chip; and a switch unit, whose control terminal is connected to the output terminal of the comparison unit for turning on or off the heating unit. By adopting the embodiments of the present application, the hardware circuit composed of the temperature detection unit, the comparison unit, and the switch unit controls the heating, without the need for the processor to participate in the control, enabling the chip to start and operate when the temperature is lower than the lowest operating temperature, and having a lower cost compared to the method of adding an external controller.
[0007] In the second aspect, the embodiments of the present application further provide a chip including the above low-temperature heating circuit.
[0008] In the third aspect, the embodiments of the present application further provide an electronic device including the above chip or low-temperature heating circuit.
[0009] The low-temperature heating circuit, chip and electronic device provided by the embodiment of the present application are controlled by a hardware circuit composed of a temperature detection unit, a comparison unit and a switch unit, without the participation of a processor in control, enabling the chip to start and operate when the temperature is lower than the lowest operating temperature, and having a lower cost compared to the method of adding an external controller.
[0010] These aspects or other aspects of the present application will be more clearly understood in the following description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0012] Figure 1 FIG. 1 shows a schematic diagram of a low-temperature heating circuit provided by an embodiment of the present application.
[0013] Figure 2 FIG. 2 shows a circuit schematic diagram of a low-temperature heating circuit provided by an embodiment of the present application.
[0014] Figure 3 FIG. 3 shows a schematic diagram of another low-temperature heating circuit provided by an embodiment of the present application.
[0015] Figure 4 FIG. 4 shows a circuit schematic diagram of another low-temperature heating circuit provided by an embodiment of the present application.
[0016] Figure 5 FIG. 5 shows a circuit schematic diagram of yet another low-temperature heating circuit provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0017] The following details the embodiments of the present application. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present application and should not be construed as limiting the present application.
[0018] In order to enable those skilled in the art to better understand the solutions of the present application, the following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of them. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of protection of the present application.
[0019] In the embodiments of the present application, it should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.
[0020] Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.
[0021] In the description of the embodiments of the present application, words such as "example" or "for example" are used to represent examples, explanations or descriptions. Any embodiment or design described as "example" or "for example" in the embodiments of the present application is not construed as being more preferred or having more advantages than another embodiment or design. The use of words such as "example" or "for example" is intended to present relative concepts in a clear manner.
[0022] In addition, "a plurality of" in the embodiments of the present application means two or more. In view of this, "a plurality of" in the embodiments of the present application can also be understood as "at least two". "At least one" can be understood as one or more, for example, understood as one, two or more. For example, including at least one means including one, two or more, and does not limit which ones are included. For example, including at least one of A, B, and C, then what can be included are A, B, C, A and B, A and C, B and C, or A, B, and C.
[0023] It should be noted that in the embodiments of the present application, "and / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / ", unless otherwise specified, generally represents an "or" relationship between the associated objects before and after.
[0024] It should be pointed out that "connection" in the embodiments of the present application can be understood as electrical connection, and the connection of two electrical components can be a direct or indirect connection between the two electrical components. For example, when A is connected to B, it can be either a direct connection between A and B or an indirect connection between A and B through one or more other electrical components.
[0025] In the embodiments of the present application, the first pole / first end of each transistor is one of the source and the drain, and the second pole / second end of each transistor is the other of the source and the drain. Since the source and the drain of a transistor can be symmetric in structure, there may be no difference in structure between its source and drain, that is to say, there may be no difference in structure between the first pole / first end and the second pole / second end of the transistor in the embodiments of the present application. Exemplarily, when the transistor is a P-type transistor, the first pole / first end of the transistor is the source, and the second pole / second end is the drain; Exemplarily, when the transistor is an N-type transistor, the first pole / first end of the transistor is the drain, and the second pole / second end is the source.
[0026] An embodiment of the present application provides a low-temperature heating circuit for a chip. As Figure 1 shown, the low-temperature heating circuit 100 may include a temperature detection unit 101, a comparison unit 102, a heating unit 103, and a switching unit 104. The temperature detection unit 101 is configured to detect the temperature of the chip and output a detection voltage Vtemp. The first input terminal of the comparison unit 102 is connected to the temperature detection unit 101 to receive the detection voltage Vtemp, and the second input terminal of the comparison unit 102 is configured to receive a reference voltage Vref. The heating unit 103 is configured to heat the chip. The control terminal of the switching unit 104 is connected to the output terminal of the comparison unit 102, and is configured to turn on or off the heating unit 103.
[0027] In some possible implementation manners, the temperature detection unit 101 may include a detection resistor, the detection resistor includes a non-linear thermistor, and the Curie point of the detection resistor is set to the start heating temperature. The comparison output of the comparison unit 102 flips when the temperature of the chip is lower than the start heating temperature Ts, so as to turn on the switching unit 104 and cause the heating unit 103 to start heating the chip. The resistance value of the non-linear thermistor will start to increase or decrease rapidly from a specific temperature (referred to as the "Curie point"). Specifically, if it is a non-linear positive temperature coefficient resistor, the resistance value starts to increase rapidly from the Curie point; if it is a non-linear negative temperature coefficient resistor, the resistance value starts to decrease rapidly from the Curie point.
[0028] In some possible implementations, the temperature detection unit 101 may adopt a thermistor biasing method to output a detection voltage, and the thermistor biasing method is to use a constant voltage source and a voltage divider circuit. Exemplarily, as Figure 2 shown, the temperature detection unit 101 may include: a biasing resistor R BIAS and a detection resistor R T . The first end of the biasing resistor R BIAS is connected to the power supply terminal V BIAS , the second end of the biasing resistor R BIAS is connected to the first end of the detection resistor R T .T The second end of which is connected to the ground terminal GND. The detection resistor R T The node L at the first end of outputs a detection voltage. If the detection resistor R T is a non-linear positive temperature coefficient thermistor, then the voltage division of the detection resistor R T increases with the increase of temperature and starts to increase rapidly at the Curie point, that is, the detection voltage Vtemp increases with the increase of temperature and increases rapidly at the Curie point; if the detection resistor R T is a non-linear negative temperature coefficient thermistor, then the voltage division of the detection resistor R T decreases with the increase of temperature and starts to decrease rapidly at the Curie point, that is, the detection voltage Vtemp decreases with the increase of temperature and decreases rapidly at the Curie point.
[0029] In some possible embodiments, the heating unit 103 may include a heating resistor. As shown in Figure 2 The heating unit 103 is connected in series with the switching unit 104 between the power supply terminal VCC and the ground terminal GND. When the switching unit 104 is turned on, the heating unit 103 is turned on; when the switching unit 104 is turned off, the heating unit 103 is turned off. In some implementations, the heating resistor includes a positive temperature coefficient resistor, and the resistance value of the positive temperature coefficient resistor increases with the increase of temperature. Thus, as the temperature of the chip increases, the power of the heating resistor can be reduced to adjust the heating temperature.
[0030] In some possible embodiments, as shown in Figure 2 The low-temperature heating circuit 100 may further include a hysteresis unit 105. The hysteresis unit 105 and the comparison unit 102 form a hysteresis comparator, and the hysteresis comparator has: a first voltage threshold V corresponding to the start heating temperature Ts th1 and a second voltage threshold V corresponding to the stop heating temperature Te th2 and the stop heating temperature Te is greater than the start heating temperature Ts. In a specific implementation, the difference between the stop heating temperature Te and the start heating temperature Ts can be set according to the application scenario.
[0031] Under the action of the hysteresis unit 105, the working process of the low-temperature heating circuit 100 can be: the temperature detection unit 101 detects the temperature of the chip and outputs a detection voltage. The comparison output of the comparison unit 102 flips when it detects that the temperature of the chip is lower than the start heating temperature Ts, and the switching unit 104 turns on the heating unit 103, and the heating unit 103 starts to heat the chip; the comparison output of the comparison unit 102 flips again when the temperature of the chip is higher than the stop heating temperature Te, and the switching unit 104 turns off the heating unit 103, and the heating unit 103 stops heating the chip.
[0032] Exemplarily, the starting heating temperature Ts can be -40°C, and the stopping heating temperature Te can be -35°C. When the temperature detection unit 101 detects that the temperature of the chip is lower than -40°C (e.g., -43°C), the comparison output of the comparison unit 102 flips, and the switch unit 104 conducts to turn on the heating unit 103, and the heating unit 103 starts to heat the chip. As the temperature of the heated chip rises, without the hysteresis unit 105, when the temperature of the chip is heated to -40°C, the comparison output of the comparison unit 102 flips again, the switch unit 104 disconnects to turn off the heating unit 103, and the heating unit 103 stops heating the chip. After stopping heating, the temperature of the chip may be lower than -40°C again, resulting in repeated turning on and off of the heating in a short period. Under the action of the hysteresis unit 105, when the temperature of the chip is heated to -35°C, the comparison output of the comparison unit 102 flips again, so that the heating unit 103 stops heating the chip when the temperature of the chip is heated to -35°C, and can avoid repeated turning on and off of the heating in a short period.
[0033] In some possible implementation manners, as Figure 2 shown, the low-temperature heating circuit 100 may include a hysteresis unit 105, the heating unit 103 may include a heating resistor, and the heating resistor may include a non-linear positive temperature coefficient resistor. The Curie point of the heating unit 103 is greater than the starting heating temperature Ts and less than the stopping heating temperature Te. The heating temperature reaches equilibrium near the Curie point of the heating unit 103 (this temperature is called the equilibrium temperature). Specifically, when the temperature is lower than the Curie point of the heating unit 103, the impedance of the heating unit 103 is relatively small, and its thermal power is relatively high; when the heating unit 103 heats and the temperature rises, when the temperature is near the Curie point of the heating unit 103, the impedance of the heating unit 103 is relatively large, and its thermal power is relatively low. The chip can be quickly heated to its equilibrium temperature.
[0034] Exemplarily, when the chip is directly powered on in a -55°C environment, since -55°C is lower than the Curie point -40°C of the detection resistor, the switch unit 104 is in a conducting state under the drive of the comparison unit 102. The heating unit 103 is below the equilibrium temperature point of -38°C, and its thermal power is relatively high, and the chip can be quickly heated to its equilibrium temperature. When the temperature of the chip is heated to the equilibrium temperature of -38°C, this temperature is lower than the stopping heating temperature of -35°C under the action of the hysteresis unit 105, and the comparison unit 102 drives the switch unit 104 to remain conducting, and the heating unit 103 continuously heats so that the temperature of the chip is basically balanced at -38°C. When the temperature of the chip becomes higher than the stopping heating temperature of -35°C, for example, when the chip enters the room from the outside and the ambient temperature of the chip rises, the detection voltage Vtemp of the temperature detection unit 101 causes the comparison output of the comparison unit 102 to flip again, and the comparison unit 102 drives the switch unit 104 to disconnect, and the heating unit 103 stops heating.
[0035] In some possible embodiments, such as Figure 2 shown, the control terminal of the switching unit 104 may also be connected to the chip to turn on the switching unit 104 through the chip. When the comparison unit 102 controls the switching unit 104 to disconnect, the temperature of the chip is higher than the minimum operating temperature, and the chip can operate normally. When the chip can operate normally, the chip can control the switching unit 104 to turn on and continue to heat the chip. Exemplarily, the switching unit 104 may be connected to ports such as the General Purpose Input Output (GPIO) of the chip to receive the control signal of the chip.
[0036] Figure 3 shows a schematic diagram of another low-temperature heating circuit provided by an embodiment of the present application. As shown in Figure 3 shown, the low-temperature heating circuit 300 may include a temperature detection unit 301, a comparison unit 302, a heating unit 303, a switching unit 304, and a feedback unit 306. The temperature detection unit 301 is configured to detect the temperature of the chip and output a detection voltage Vtemp. The first input terminal of the comparison unit 302 is connected to the temperature detection unit 301 to receive the detection voltage Vtemp, and the second input terminal of the comparison unit 302 is configured to receive a reference voltage Vref. The heating unit 303 is configured to heat the chip. The control terminal of the switching unit 304 is connected to the output terminal of the comparison unit 302 and is configured to turn on or off the heating unit 303. The comparison unit 302 may be an operational amplifier, and the feedback unit 306 and the comparison unit 302 form an amplifier circuit to amplify the detection voltage Vtemp. The switching unit 304 is connected between the output terminal of the comparison unit 302 and the heating unit 304 to use the amplified detection voltage Vtemp as the power supply of the heating unit 304.
[0037] In the embodiments of the present application, the temperature detection unit 301 may include a detection resistor, the detection resistor is a thermistor, and the detection resistor has a negative temperature coefficient. Specifically, the detection resistor may be a negative temperature coefficient resistor so that the detection voltage Vtemp has a negative temperature coefficient. As a possible embodiment, as shown in Figure 4 shown, the temperature detection unit 301 may include a bias resistor R BIAS and a detection resistor R T . The bias resistor R BIAS is connected in series with the detection resistor R T between the power supply terminal V BIAS and the ground terminal GND. The first terminal of the bias resistor R BIAS is connected to the power supply terminal V BIAS , the second terminal of the bias resistor R BIAS is connected to the first terminal of the detection resistor R T , and the first terminal of the detection resistor R TThe second end of the detection resistor R is connected to the ground terminal GND. T The first end of the node L outputs the detection voltage Vtemp. The detection resistor R T For a negative temperature coefficient resistor, as the temperature decreases, the detection resistor R T The resistance value of the detection resistor R T As the temperature rises, the detection resistor R T The resistance of the detection resistor R T The divided voltage decreases, and the detection voltage Vtemp decreases.
[0038] Furthermore, when the chip temperature is lower than the starting heating temperature, the detection voltage Vtemp is greater than the reference voltage Vref, the comparison output of the comparison unit 302 is flipped, the switch unit 304 is turned on, and the output of the comparison unit 302 supplies power to the heating unit 303. As the heating unit 303 heats up, the temperature of the chip rises, and the detection resistor R T The resistance value decreases, the detection voltage Vtemp decreases, and the output voltage of the comparison unit 302 (i.e. the amplified detection voltage Vtemp, expressed as Vout) decreases, so that the heating power is reduced, and the temperature can be quickly increased when the temperature is low, and the heating speed is adjusted with the temperature.
[0039] In some possible implementations, such as Figure 4 As shown, the low temperature heating circuit 300 may further include a hysteresis unit 305. The hysteresis unit 305 and the comparison unit 302 constitute a hysteresis comparator, which has a first voltage threshold V corresponding to the starting heating temperature Ts. th1 , and the second voltage threshold V corresponding to the heating stop temperature Te th2 , and the stopping heating temperature Te is greater than the starting heating temperature Ts. In a specific implementation, the difference between the stopping heating temperature Te and the starting heating temperature Ts can be set according to the application scenario.
[0040] Under the action of the hysteresis unit 305, the working process of the low-temperature heating circuit 300 can be: the temperature detection unit 301 detects the temperature of the chip and outputs the detection voltage, the comparison output of the comparison unit 302 flips when it detects that the temperature of the chip is lower than the start heating temperature Ts, the switch unit 304 turns on the heating unit 303, and the heating unit 303 starts to heat the chip; the comparison output of the comparison unit 302 flips again when the temperature of the chip is higher than the stop heating temperature Te, the switch unit 304 turns on the heating unit 303, and the heating unit 303 stops heating the chip.
[0041] Exemplarily, the starting heating temperature Ts can be -40°C, and the stopping heating temperature Te can be -35°C. When the temperature detection unit 301 detects that the temperature of the chip is lower than -40°C (for example, -43°C), the comparison output of the comparison unit 302 flips, and the switch unit 304 conducts to turn on the heating unit 303, and the heating unit 303 starts to heat the chip. Under the action of the hysteresis unit 305, when the temperature of the chip is heated to -35°C, the comparison output of the comparison unit 302 flips again, so that the heating unit 303 stops heating the chip when the temperature of the chip is heated to -35°C, which can avoid repeatedly turning on and off the heating in a short time.
[0042] In some possible implementation manners, in order to improve the driving ability of the comparison unit 302, as Figure 4 shown, the low-temperature heating circuit 300 may further include a transistor 307. The control end of the transistor 307 is connected to the output end of the comparison unit 302. The other two ends of the transistor 307 are connected between the power supply terminal VCC and the first end of the switch unit 304. The second end of the switch unit 304 is connected to the heating unit 303, and the first end of the switch unit 304 is further connected to the feedback unit 306. The current-limiting driving ability is improved through the transistor 307.
[0043] In some possible implementation manners, as Figure 4 shown, the feedback unit 306 may include a first feedback resistor R1 and a second feedback resistor R2. Specifically, the first feedback resistor R1 is connected between the hysteresis unit 305 and the first input end of the comparison unit, and the second feedback resistor R2 is connected between the first input end of the comparison unit and the first end of the switch unit 304.
[0044] In some possible implementation manners, as Figure 4 shown, the control end of the switch unit 304 may further be connected to the chip to conduct the switch unit 304 through the chip. When the comparison unit 302 controls the switch unit 304 to disconnect, the temperature of the chip is higher than the minimum operating temperature, and the chip can operate normally. When the chip can operate normally, the chip can control the switch unit 304 to conduct and continue to heat the chip. Exemplarily, the switch unit 304 may be connected to ports such as the General Purpose Input Output (GPIO) of the chip to receive the control signal of the chip.
[0045] Figure 5 shows a schematic diagram of another low-temperature heating circuit according to an embodiment of the present application, as Figure 5As shown, the low-temperature heating circuit 500 includes a temperature detection unit 501, a comparison unit 502, a heating unit 503, a first switch unit 5041, a second switch unit 5042, and a pull-up resistor unit 506. The temperature detection unit 501 is used to detect the temperature of the chip and output a detection voltage Vtemp. The first input terminal of the comparison unit 502 is connected to the temperature detection unit 501 to receive the detection voltage Vtemp, and the second input terminal of the comparison unit 502 is used to receive a reference voltage Vref. The heating unit 503 is used to heat the chip.
[0046] The first switch unit 5041 is connected between the chip power supply terminal and the power port of the chip, and the control terminal of the first switch unit 5041 is connected to the output terminal of the comparison unit 502. When the temperature detection unit 501 detects that the temperature of the chip is lower than the start heating temperature, the comparison output of the comparison unit 502 flips, and the first switch unit 5041 disconnects. At this time, the chip power supply terminal and the power port of the chip are disconnected, and the chip is in a non-operating state. When the temperature detection unit 501 detects that the temperature of the chip is higher than the start heating temperature, the comparison output of the comparison unit 502 flips again, and the first switch unit 5041 conducts. At this time, the chip power supply terminal and the power port of the chip are conducted, and the chip is in an operating state. In a specific application, one or more chip power supply terminals may be included. Refer to Figure 5 As shown, it may include a chip core power supply terminal VCOREIN and a chip power supply terminal VDDIN, and the first switch unit 5041 may include switches S1 and S2.
[0047] The second switch unit 5042 is connected between the heating unit 503 and the power supply terminal, and the control terminal of the second switch unit 5042 is connected to the chip. The pull-up resistor unit 506 is connected to the control terminal of the second switch unit 5042. When the first switch unit 5041 disconnects, at this time the chip power supply terminal and the power port of the chip are disconnected, and the chip is in a non-operating state. The pull-up resistor unit 506 conducts the second switch unit 5042, and the heating unit 503 starts to heat the chip. When the first switch unit conducts, the chip is in an operating state, and the chip disconnects the second switch unit 5042, and the heating unit 503 stops heating the chip. The second switch unit 5042 may be connected to ports such as the General Purpose Input Output (GPIO) of the chip to receive control signals from the chip.
[0048] In some possible embodiments, the temperature detection unit 501 may include a detection resistor, the detection resistor includes a non-linear thermistor, and the Curie point of the detection resistor is set as the starting heating temperature. The resistance value of the non-linear thermistor will rapidly increase or decrease starting from a specific temperature (referred to as the "Curie point"). Specifically, if it is a non-linear positive temperature coefficient resistor, the resistance value will rapidly increase starting from the Curie point; if it is a non-linear negative temperature coefficient resistor, the resistance value will rapidly decrease starting from the Curie point. The comparison output of the comparison unit 502 flips when the temperature of the chip is lower than the starting heating temperature Ts, so as to disconnect the first switch unit 5041. At this time, the chip power supply terminal is disconnected from the power port of the chip, and the chip is in a non-operating state. Further, when the first switch unit 5041 is disconnected, the pull-up resistor unit 506 turns on the second switch unit 5042.
[0049] In some possible implementations, the temperature detection unit 501 may adopt a thermistor biasing method to output a detection voltage. The thermistor biasing method uses a constant voltage source and a voltage divider circuit. Exemplarily, as Figure 5 shown, the temperature detection unit 501 may include: a biasing resistor R BIAS and a detection resistor R T . The first end of the biasing resistor R BIAS is connected to the power supply terminal V BIAS , the second end of the biasing resistor R BIAS is connected to the first end of the detection resistor R T , and the second end of the detection resistor R T is connected to the ground terminal GND. The node L at the first end of the detection resistor R T outputs the detection voltage. If the detection resistor R T is a non-linear positive temperature coefficient thermistor, the voltage division of the detection resistor R T increases with the increase of temperature and starts to rapidly increase at the Curie point, that is, the detection voltage Vtemp increases with the increase of temperature and rapidly increases at the Curie point; if the detection resistor R T is a non-linear negative temperature coefficient thermistor, the voltage division of the detection resistor R T decreases with the increase of temperature and starts to rapidly decrease at the Curie point, that is, the detection voltage Vtemp decreases with the increase of temperature and rapidly decreases at the Curie point.
[0050] In some possible embodiments, the heating unit 503 may include a heating resistor. Refer to Figure 5As shown, the heating unit 503 is connected in series with the second switch unit 5042 between the power supply terminal VCCIN and the ground terminal GND. One end of the pull-up resistor unit 506 is connected to the power supply terminal VCCIN, and the other end is connected to the control terminal of the second switch unit 5042. When the second switch unit 5042 does not receive the control signal from the chip, the pull-up resistor unit 506 turns on the second switch unit 5042 to activate the heating unit 503; when the second switch unit 5042 receives the disconnection signal from the chip, the second switch unit 5042 disconnects to deactivate the heating unit 503. In some implementations, the heating resistor includes a positive temperature coefficient resistor, and the resistance value of the positive temperature coefficient resistor increases as the temperature rises. Thus, as the temperature of the chip increases, the power of the heating resistor can be reduced to adjust the heating temperature.
[0051] In some possible implementation manners, as Figure 5 shown, the low-temperature heating circuit 500 may further include a hysteresis unit 505. The hysteresis unit 505 and the comparison unit 502 form a hysteresis comparator, and the hysteresis comparator has: a first voltage threshold V th1 corresponding to the start heating temperature Ts, and a second voltage threshold V th2 corresponding to the stop heating temperature Te, and the stop heating temperature Te is greater than the start heating temperature Ts. In a specific implementation, the difference between the stop heating temperature Te and the start heating temperature Ts can be set according to the application scenario.
[0052] Under the action of the hysteresis unit 505, the working process of the low-temperature heating circuit 500 can be as follows: the temperature detection unit 501 detects the temperature of the chip and outputs a detection voltage. The comparison output of the comparison unit 502 toggles when it detects that the temperature of the chip is lower than the start heating temperature Ts. The first switch unit 5041 disconnects, and the pull-up resistor unit 506 turns on the second switch unit 5042 to activate the heating unit 503, and the heating unit 503 starts to heat the chip; the comparison output of the comparison unit 502 toggles again when the temperature of the chip is higher than the stop heating temperature Te. The first switch unit 5041 conducts, and the chip is in the working stage. The chip can disconnect the second switch unit 5042 to deactivate the heating unit 503, and the heating unit 503 stops heating the chip.
[0053] Exemplarily, the starting heating temperature Ts can be -40°C, and the stopping heating temperature Te can be -35°C. When the temperature detection unit 501 detects that the temperature of the chip is lower than -40°C (for example, -43°C), the comparison output of the comparison unit 502 flips, the first switch unit 5041 disconnects, and the chip is in a non-operating state. The pull-up resistor unit 506 turns on the second switch unit 5042, and the heating unit 503 is turned on. The heating unit 503 starts to heat the chip. As the chip is heated, its temperature rises. Under the action of the hysteresis unit 505, when the temperature of the chip is heated to -35°C, the comparison output of the comparison unit 502 flips again, the first switch unit 5041 conducts, and the chip is in an operating state. The chip can disconnect the second switch unit 5042, so that the heating unit 503 stops heating the chip when the temperature of the chip is heated to -35°C, which can avoid repeatedly turning on and off the heating in a short period of time.
[0054] In some possible implementation manners, as Figure 5 shown, the low-temperature heating circuit 500 may include a hysteresis unit 505. The heating unit 503 may include a heating resistor, and the heating resistor may include a non-linear positive temperature coefficient resistor. The Curie point of the heating unit 503 is greater than the starting heating temperature Ts and less than the stopping heating temperature Te. The heating temperature reaches equilibrium near the Curie point of the heating unit 503 (this temperature is called the equilibrium temperature). Specifically, when the temperature is lower than the Curie point of the heating unit 503, the impedance of the heating unit 503 is relatively small, and its thermal power is relatively high; when the heating unit 503 heats up the temperature, when the temperature is near the Curie point of the heating unit 503, the impedance of the heating unit 503 is relatively large, and its thermal power is relatively low. The chip can be quickly heated to its equilibrium temperature.
[0055] Exemplarily, when the chip is directly powered on in an environment of -55°C, since -55°C is lower than the Curie point of -40°C of the detection resistor, the first switch unit 5041 is disconnected under the drive of the comparison unit 502, and the chip is in a non-operating state. The pull-up resistor unit 506 conducts the second switch unit 5042, turning on the heating unit 503, and the heating unit 503 starts to heat the chip. When the heating unit 503 is below the equilibrium temperature point of -38°C, its thermal power is relatively high, and it can quickly heat the chip to its equilibrium temperature. When the chip temperature is heated to the equilibrium temperature of -38°C, this temperature is lower than the stop heating temperature of -35°C under the action of the hysteresis unit 505. The comparison unit 502 drives the first switch unit 5041 to remain disconnected, and the heating unit 503 continues to heat, making the chip temperature basically balanced at -38°C. When the chip temperature becomes higher than the stop heating temperature of -35°C, for example, when entering the room from the outside causes the ambient temperature of the chip to rise, the detection voltage Vtemp of the temperature detection unit 501 causes the comparison output of the comparison unit 502 to flip again. The comparison unit 502 drives the first switch unit 5041 to conduct, and the chip is in an operating state. The chip can disconnect the second switch unit 5042, and the heating unit 503 stops heating.
[0056] An embodiment of the present application further provides a chip, which includes the above-mentioned low-temperature heating circuit. A chip is also called an integrated circuit (IC). This chip can be, but is not limited to, a SOC (System on Chip) chip or a SIP (system in package) chip. The heating of this chip is controlled by a hardware circuit composed of a temperature detection unit, a comparison unit, and a switch unit, without the participation of a processor in control, enabling the chip to start and operate when the temperature is lower than the lowest operating temperature, and having a lower cost compared to the method of adding an external controller.
[0057] An embodiment of the present application further provides an electronic device, which includes a device body and a chip as described above disposed in the device body. The electronic device may be, but is not limited to, a weighing scale, a body fat scale, a nutrition scale, an infrared electronic thermometer, a pulse oximeter, a body composition analyzer, a mobile power supply, a wireless charger, a fast charger, a vehicle charger, an adapter, a display, a USB (Universal Serial Bus) expansion dock, a stylus, true wireless earphones, a car center console screen, a car, a smart wearable device, a mobile terminal, a smart home device. The smart wearable device includes, but is not limited to, a smart watch, a smart bracelet, a cervical massager. The mobile terminal includes, but is not limited to, a smart phone, a laptop, a tablet computer, a POS (point of sales terminal) machine. The smart home device includes, but is not limited to, a smart socket, a smart rice cooker, a smart sweeper, a smart light. The heating of the electronic device is controlled by a hardware circuit composed of a temperature detection unit, a comparison unit, and a switch unit, without the need for a processor to participate in the control, enabling the chip to start and operate when the temperature is lower than the lowest operating temperature, and having a lower cost compared to the method of adding an external controller.
[0058] The above are only the preferred embodiments of the present application, and do not impose any formal limitations on the present application. Although the present application has been disclosed above with preferred embodiments, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the technical content disclosed above without departing from the technical solution of the present application. However, as long as it does not depart from the technical solution content of the present application, any brief modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present application still fall within the scope of the technical solution of the present application.
Claims
1. A low-temperature heating circuit for a chip, characterized in that, The circuit includes: a temperature detection unit for detecting the temperature of the chip and outputting a detection voltage; a comparison unit, the first input terminal of the comparison unit is connected to the temperature detection unit to receive the detection voltage, and the second input terminal of the comparison unit is used to receive a reference voltage; a heating unit for heating the chip; a switch unit, the control terminal of the switch unit is connected to the output terminal of the comparison unit, and is used to turn on or off the heating unit.
2. The circuit according to claim 1, characterized in that, The circuit further includes a hysteresis unit, and the hysteresis unit and the comparison unit form a hysteresis comparator; The hysteresis comparator has: a first voltage threshold corresponding to the start heating temperature, and a second voltage threshold corresponding to the stop heating temperature, and the stop heating temperature is greater than the start heating temperature.
3. The circuit according to claim 1 or 2, characterized in that, The temperature detection unit includes a detection resistor, the detection resistor includes a non-linear thermistor, and the Curie point of the detection resistor is set as the start heating temperature; The comparison output of the comparison unit flips when the temperature of the chip is lower than the start heating temperature, so as to turn on the switch unit, and the heating unit starts to heat the chip.
4. The circuit according to claim 1 or 2, characterized in that, The temperature detection unit includes a detection resistor, the detection resistor is a thermistor, and the detection resistor has a negative temperature coefficient; The circuit further includes a feedback unit, and the feedback unit and the comparison unit form an amplifier circuit to amplify the detection voltage; The switch unit controls the conduction of the path between the output terminal of the comparison unit and the heating unit, so as to use the amplified detection voltage as the power supply of the heating unit.
5. The circuit according to claim 4, characterized in that, The circuit further includes: a transistor, its control terminal is connected to the output terminal of the comparison unit, and its other two ends are connected between the power supply terminal and the first end of the switch unit; wherein, the second end of the switch unit is connected to the heating unit, and the first end of the switch unit is also connected to the feedback unit.
6. The circuit according to claim 1 or 2, characterized in that, The switch unit includes: a first switch unit connected between the chip power supply terminal and the power port of the chip, and the control terminal of the first switch unit is connected to the output terminal of the comparison unit; a second switch unit connected between the heating unit and the power supply terminal, and the control terminal of the second switch unit is connected to the chip; a pull-up resistor unit connected to the control terminal of the second switch unit; wherein, when the first switch unit is disconnected, the power supply supplies power to the control terminal of the second switch unit through the pull-up resistor unit to turn on the second switch unit; when the first switch unit is turned on, the chip disconnects the second switch unit.
7. The circuit according to claim 1 or 2, wherein The heating unit includes a heating resistor, and the heating resistor is a positive temperature coefficient thermistor.
8. The circuit according to claim 7, wherein The heating resistor is a non-linear positive temperature coefficient thermistor, and the Curie point of the heating resistor is greater than the start heating temperature and less than the stop heating temperature.
9. The circuit according to claim 1 or 2, characterized in that, The control terminal of the switch unit is also connected to the chip to turn on the switch unit through the chip.
10. A chip, characterized in that, including the circuit according to any one of claims 1 to 9 above.
11. An electronic device, characterized in that, including a device body and the circuit according to any one of claims 1 to 9 above provided on the device body, or the chip according to claim 10.