Board card heat dissipation case

By setting up partitions and air supply devices in the chassis to optimize the airflow path, the problems of uneven heat dissipation and high noise of the board and card chassis are solved, and efficient and low noise uniform heat dissipation is achieved, reducing costs and safety hazards.

CN223180627UActive Publication Date: 2025-08-01UNIKINFO TECH CO LTD
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Patent Information

Application Number
CN202422491397.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-15
Publication Date
2025-08-01
Estimated Expiration
2034-10-15

AI Technical Summary

Technical Problem

The heat dissipation effect of existing board and card chassis is uneven, and relying on multiple fans causes high noise, vibration and safety risks, which is highly economical.

Method used

The partition inside the chassis divides it into a first chamber and a second chamber, and uses the air supply device and a wind shield assembly to optimize the air flow, and achieve uniform heat dissipation through a single flow impeller and air guide assembly to reduce noise and vibration.

Benefits of technology

It achieves uniform heat dissipation effect of the board, reduces noise and vibration, reduces equipment procurement costs, and improves overall safety and user experience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a board card heat dissipation case which comprises the components of a case which is internally provided with a partition board which divides the interior of the case into a first chamber and a second chamber, the interior of the first chamber is provided with a board card mounting area, and the side wall of the first chamber is provided with an air outlet; an air inlet is formed in the side wall of the second cavity, and an air guiding and supplying device is arranged in the second cavity. The air guiding and supplying device comprises a power assembly arranged on the machine box, a first air blocking assembly and a second air blocking assembly are arranged on the two sides of the power assembly respectively, and the first air blocking assembly is arranged at the bottom of the machine box and matched with the air inlet. The second wind shielding assembly is arranged on the partition plate. A preset air inlet channel is formed by the first side of the second air blocking assembly, the first air blocking assembly, the power assembly and the side wall of the second cavity. A preset air outlet channel communicating with the first cavity is formed by the second side of the second air blocking assembly, the first air blocking assembly, the power assembly and the bottom of the machine box. The device is good in heat dissipation effect, simple in structure, low in cost, small in noise and high in safety.
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Description

Technical Field

[0001] The present disclosure relates to the technical field of chassis heat dissipation, and particularly to a board card heat dissipation chassis. Background Art

[0002] In the prior art, the heat dissipation of board card chassis usually relies on setting multiple fans to drive air along the fan axis direction to take away heat. However, due to the low air pressure of the fans, the air volume is insufficient. When the distance between board cards in the chassis is small, the air flow introduced by the set fans is difficult to effectively cover each board card, thus affecting the heat dissipation effect. In addition, the installation of multiple fans will cause vibration and resonance problems, which have a negative impact on the electronic devices and fasteners in the chassis, and may bring potential safety hazards in the long term.

[0003] In addition, the use of multiple fans will cause the superposition of wind noise and resonance noise, increasing the chassis noise and affecting the use comfort. At the same time, the economic cost of multiple fans is relatively high, including equipment procurement, energy consumption and maintenance costs. These problems make the existing heat dissipation solutions insufficient in terms of economy and noise control, affecting the overall heat dissipation efficiency and user experience. Summary of the Utility Model

[0004] In view of this, the embodiments of the present disclosure provide a board card heat dissipation chassis, which at least partially solves the problems of uneven heat dissipation, poor heat dissipation effect, high cost, high noise, and high potential safety hazards existing in the prior art.

[0005] The embodiments of the present disclosure provide a board card heat dissipation chassis, including the following solutions:

[0006] A chassis, a partition is arranged inside the chassis, and the partition divides the interior of the chassis into a first chamber and a second chamber. A board card installation area is provided inside the first chamber, and an air outlet is opened on the side wall of the first chamber;

[0007] An air inlet is opened on the side wall of the second chamber away from the first chamber, and an air guiding and sending device is arranged inside the second chamber;

[0008] The air guiding and sending device includes a power component installed on the chassis. A first wind shielding component and a second wind shielding component are respectively arranged on both sides of the power component. The first wind shielding component is installed at the bottom of the chassis, and the air inlet is arranged in a matching manner with the first wind shielding component; the second wind shielding component is installed on the partition;

[0009] A preset air inlet channel is formed by the first side of the second wind shield assembly, the first wind shield assembly, the power assembly, and the side wall of the second chamber; a preset air outlet channel communicating with the first chamber is formed by the second side of the second wind shield assembly, the first wind shield assembly, the power assembly, and the bottom of the chassis, where the second side is the opposite side of the first side.

[0010] Optionally, the power assembly includes a motor and a cross-flow impeller installed on the power output end of the motor;

[0011] The motor is fixedly installed on the first inner wall of the chassis, and one end of the cross-flow impeller away from the motor is installed on the second inner wall of the chassis through a bearing assembly, and the second inner wall is arranged parallel to the first inner wall;

[0012] The longitudinal central axis of the cross-flow impeller is parallel to the side wall of the first chamber provided with an air outlet.

[0013] Optionally, the first wind shield assembly includes a first straight-section baffle and an arc-section baffle connected to each other;

[0014] The connection part of the first straight-section baffle and the arc-section baffle is flush with the horizontal center of the cross-flow impeller;

[0015] The arc-section baffle is fixedly installed on the bottom of the chassis, and the virtual circle where the inner side of the arc-section baffle is located and the virtual circle where the outer side of the cross-flow impeller is located form concentric circles.

[0016] Optionally, the height of the first straight-section baffle is H1, the radius of the cross-flow impeller is R, and 1 / 4R ≤ H1 ≤ 2 / 3R;

[0017] The inner arc length of the arc-section baffle is 1 / 4 of the circumference of the virtual circle where its inner side is located.

[0018] Optionally, the distance between the first straight-section baffle and the cross-flow impeller is △1, the distance between the arc-section baffle and the cross-flow impeller is △2, and R / 11 ≤ △1 ≤ R / 6, R / 11 ≤ △2 ≤ R / 6.

[0019] Optionally, the second wind shield assembly includes a second straight-section baffle, a slope-section baffle, and a third straight-section baffle connected in sequence;

[0020] The two ends of the second straight-section baffle are respectively fixedly connected to the first inner wall and the second inner wall of the chassis; the height center of the second straight-section baffle is not higher than the horizontal center of the cross-flow impeller, and the longitudinal axis of the second straight-section baffle is parallel to the longitudinal axis of the cross-flow impeller;

[0021] The baffle of the slope section is inclined away from the cross-flow impeller, and the included angle between the baffle of the slope section and the baffle of the second straight section is an obtuse angle;

[0022] The baffle of the third straight section is fixedly installed on the side wall of the partition away from the first chamber, and the bottom of the baffle of the third straight section is flush with the bottom of the partition;

[0023] The horizontal point of the top of the baffle of the second straight section corresponding to the cross-flow impeller is the first point, the horizontal point of the connection between the baffle of the first straight section and the baffle of the arc section corresponding to the cross-flow impeller is the second point, and the area between the second point and the first point forms the target air inlet area;

[0024] The horizontal point of the connection between the baffle of the second straight section and the baffle of the slope section corresponding to the cross-flow impeller is the third point, the horizontal point of the end of the baffle of the arc section away from the baffle of the first straight section corresponding to the cross-flow impeller is the fourth point, and the area between the third point and the fourth point forms the target air supply area;

[0025] The area between the fourth point and the second point forms the target high-pressure area.

[0026] Optionally, the distance between the baffle of the second straight section and the cross-flow impeller is △\(3\), \(R / 11\leqslant\triangle3\leqslant R / 6\);

[0027] The distance from the top of the baffle of the second straight section to the horizontal center of the cross-flow impeller is \(H2\), \(1 / 4R\leqslant H2\leqslant1 / 2R\).

[0028] Optionally, the inclination angle of the baffle of the slope section relative to the bottom plate of the chassis is \(\alpha\), \(15^{\circ}\leqslant\alpha\leqslant25^{\circ}\);

[0029] The distance from the connection between the baffle of the slope section and the baffle of the third straight section to the partition is \(L1\), the distance from the baffle of the third straight section to the partition is \(L2\), \(12\leqslant L2 / L1\leqslant16\);

[0030] The distance from the baffle of the third straight section to the bottom plate of the chassis is \(H3\), the distance from the horizontal center of the cross-flow impeller to the bottom plate of the chassis is \(H4\), \(3\leqslant H3 / H4\leqslant5\).

[0031] Optionally, a carrier is arranged below the board installation area, a wind guiding component is installed below the carrier, and the opening of the wind guiding component faces the preset air outlet channel;

[0032] The wind guiding component includes a plurality of wind guiding plates arranged in sequence, and a directional guiding single channel communicating with the board installation area is formed between every two wind guiding plates;

[0033] The distances of some of the air guiding plates from the bottom plate of the chassis decrease in sequence, and the lowest bottom side of the air guiding plate farthest from the partition is fixedly attached to the bottom plate of the chassis;

[0034] The air guiding plate is a multi-stage bent plate-like structure or a concave arc plate-like structure.

[0035] Optionally, some of the air guiding plates are evenly arranged;

[0036] When the air guiding plate is a multi-stage bent plate-like structure, the air guiding plate includes a windward straight section, a transition section, and a connection section that are connected in sequence. The connection section is fixedly connected to the carrier; the transition section is arc-shaped; the windward straight section is arranged parallel to the bottom plate of the chassis.

[0037] In the board card heat dissipation chassis disclosed in this application, by arranging a partition inside the chassis, the chassis is divided into a first chamber and a second chamber, which can effectively organize the air flow. Through the preset air inlet channel formed by the air inlet, the partition, and the air inlet and outlet device, it is ensured that the temperature of the continuously introduced air flow is within the preset temperature range; through the matching setting of the first wind blocking component, the second wind blocking component, and the air inlet and outlet device, the air flow can be effectively guided and optimized, and at the same time, the noise problem caused by the air flow impact can be reduced; through the preset air outlet channel formed by the second wind blocking component, the air inlet and outlet device, and the bottom plate of the chassis, the air flow path can be optimized, the fluidity of the air delivered to the first chamber can be enhanced, it is ensured that the air can flow through each board card, and the heat generated by each board card can be effectively taken away, realizing uniform heat dissipation and greatly improving the heat dissipation effect; through the setting of a single air inlet and outlet device, both the introduction of the air flow and the rapid delivery to the first chamber can be realized, and at the same time, the noise and vibration problems can be effectively reduced.

[0038] The above description is only an overview of the technical solution of the present disclosure. In order to understand the technical means of the present disclosure more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features, and advantages of the present disclosure more obvious and understandable, the following specific preferred embodiments are given and described in detail in conjunction with the drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0040] Figure 1 It is a three-dimensional schematic diagram of a board card heat dissipation chassis provided for an embodiment of the present disclosure.

[0041] Figure 2 For Figure 1Schematic diagram of the internal settings.

[0042] Figure 3 is Figure 1 Schematic diagram of the internal air flow when in the first working state.

[0043] Figure 4 is Figure 1 Schematic diagram of the internal air flow when in the second working state.

[0044] Figure 5 Schematic diagram of the structure of the first windshield assembly provided by the present disclosure.

[0045] Explanation of reference numerals:

[0046] 111, top plate; 112, first side plate; 113, second side plate; 114, third side plate; 1141, air inlet; 115, bottom plate; 116, fourth side plate; 117, air outlet; 120, partition; 131, first chamber; 132, second chamber; 200, power assembly; 210, cross-flow impeller; 220, motor; 300, first windshield assembly; 310, first straight-section baffle; 320, arc-section baffle; 330, rib plate; 400, second windshield assembly; 410, second straight-section baffle; 420, ramp-section baffle; 430, third straight-section baffle; 500, preset air inlet channel; 600, preset air outlet channel; 700, carrier; 800, air guiding assembly; 810, first air guiding plate; 820, second air guiding plate; 830, third air guiding plate; 840, fourth air guiding plate. Detailed implementation manners

[0047] The present disclosure will be further described in detail below in conjunction with the drawings and implementation manners. It can be understood that the specific implementation manners described herein are only used to explain the relevant content and do not limit the present disclosure. Additionally, it should be noted that for the sake of convenience of description, only the parts related to the present disclosure are shown in the drawings.

[0048] It should be noted that, without conflict, the implementation manners and the features in the implementation manners in the present disclosure can be combined with each other. The technical solutions of the present disclosure will be described in detail below with reference to the drawings and in conjunction with the implementation manners.

[0049] Unless otherwise specified, the exemplary implementation manners / embodiments shown will be understood to provide exemplary features of various details of some ways that can implement the technical concept of the present disclosure in practice. Therefore, unless otherwise specified, without departing from the technical concept of the present disclosure, the features of various implementation manners / embodiments can be additionally combined, separated, interchanged, and / or rearranged.

[0050] In the drawings, the use of hatching and / or shading is generally employed to make the boundaries between adjacent components clear. Thus, unless stated otherwise, the presence or absence of hatching or shading does not convey or imply any preference or requirement for the specific material, material properties, dimensions, proportions, commonality between the components shown, and / or any other characteristics, attributes, properties, etc. of the components. Additionally, in the drawings, for clarity and / or descriptive purposes, the dimensions and relative dimensions of components may be exaggerated. When an exemplary embodiment can be implemented differently, the specific process order may be performed in a different order than that described. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to that described. Further, the same reference numerals denote the same components.

[0051] When a component is referred to as being "on" or "above" another component, "connected to" or "coupled to" another component, the component can be directly on the other component, directly connected to or directly coupled to the other component, or there may be intervening components. However, when a component is referred to as being "directly on" another component, "directly connected to" or "directly coupled to" another component, there are no intervening components. For this reason, the term "connected" can refer to a physical connection, an electrical connection, etc., and can have or not have intervening components.

[0052] For descriptive purposes, the present disclosure may use spatial relative terms such as "under", "below", "beneath", "lower", "above", "upper", "on", "over", "higher", and "side (e.g., as in "sidewall")" to describe the relationship of one component to another (other) component as shown in the drawings. In addition to the orientations depicted in the drawings, the spatial relative terms are also intended to encompass different orientations of the device during use, operation, and / or manufacture. For example, if the device in the drawings is flipped, a component described as being "under" or "beneath" another component or feature will then be positioned "above" the other component or feature. Thus, the exemplary term "under" can encompass both "above" and "below" orientations. Additionally, the device may be otherwise positioned (e.g., rotated 90 degrees or at other orientations), and accordingly, the spatial relative descriptors used herein are to be interpreted.

[0053] The terms used herein are for the purpose of describing specific embodiments and are not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, the singular forms "one (kind, person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise" and / or "include" and their variations are used in this specification, the features, integral bodies, steps, operations, parts, assemblies and / or their groups stated are explained, but the presence or addition of one or more other features, integral bodies, steps, operations, parts, assemblies and / or their groups is not excluded. It should also be noted that, as used herein, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, so that they are used to explain the inherent deviations of the measured values, calculated values and / or the values provided that will be recognized by those of ordinary skill in the art.

[0054] Reference Figure 1 and Figure 2 The present application discloses a board heat dissipation chassis, comprising: a chassis, an interior of which is provided with a partition 120, the partition 120 divides the interior of the chassis into a first chamber 131 and a second chamber 132; the interior of the first chamber 131 has a board installation area for installing boards, and the side wall of the first chamber 131 is provided with an air outlet 117. In this embodiment, the air outlet 117 is preferably opened on the top plate 111. Furthermore, the top plate 111, the first side plate 112, the second side plate 113, and the fourth side plate 116 form the air outlet 117 to ensure that the introduced air flow is in full contact with the boards, and the derived air flow can fully and quickly take away the heat of the boards, thereby achieving heat dissipation and cooling of the boards.

[0055] An air inlet 1141 is provided on the side wall of the second chamber 132 away from the first chamber 131. Specifically, the air inlet 1141 is preferably arranged on the third side panel 114, which neither affects the aesthetics of the top nor keeps a long distance from the air outlet 117, thereby preventing the exhaust air flow from being introduced as a new air flow and ensuring that the temperature of the introduced new air flow is room temperature.

[0056] An air supply device is provided inside the second chamber 132 for delivering the cooling air flow introduced from the air inlet 1141 to the first chamber 131 for cooling and dissipating the heat of the board.

[0057] The induced draft and supply air device includes a power assembly 200 installed in the chassis. The power assembly 200 includes a motor 220 and a cross-flow impeller 210 installed at the power output end of the motor 220. Among them, the motor 220 is fixedly installed on the first inner wall of the chassis, and one end of the cross-flow impeller 210 away from the motor 220 is installed on the second inner wall of the chassis through a bearing assembly. In this embodiment, the second inner wall is parallel to the first inner wall. That is, in this embodiment, the motor 220 is preferably installed on the inner wall of the first side plate 112, and one end of the cross-flow impeller 210 away from the motor 220 is installed on the inner wall of the second side plate 113.

[0058] The longitudinal central axis of the cross-flow impeller 210 is parallel to the side wall of the first chamber 131 provided with the air outlet 117, that is, the cross-flow impeller 210 is perpendicular to the first side plate 112 and the second side plate 113; driven by the motor 220, the cross-flow impeller 210 rotates clockwise.

[0059] On both sides of the power assembly 200, a first wind shield assembly 300 and a second wind shield assembly 400 are respectively provided. The first wind shield assembly 300 is installed at the bottom of the chassis, and the second wind shield assembly 400 is installed on the partition 120; the first side of the second wind shield assembly 400, the first wind shield assembly 300, the power assembly 200, and the side wall of the second chamber 132 form a preset air inlet channel 500. After the motor 220 is started, that is, under the rotation of the cross-flow impeller 210, air will be continuously sucked into the cross-flow impeller 210 from the air inlet 1141, forming an air inlet eddy current along the preset air inlet channel 500.

[0060] The second side of the second wind shield assembly 400, the first wind shield assembly 300, the power assembly 200, and the bottom of the chassis form a preset air outlet channel 600 communicating with the first chamber 131. That is, the air sucked by the rotating cross-flow impeller 210 will be compressed and accelerated along the axial direction. When the air passes through the cross-flow impeller 210, the centrifugal force makes the air move along the tangent direction of the cross-flow impeller 210; due to the blocking settings of the first wind shield assembly 300 and the second wind shield assembly 400, it is ensured that under the rotation and centrifugal force of the cross-flow impeller 210, the air is compressed and accelerated along the direction of the preset air outlet channel 600, and can quickly and highly pressured enter the first chamber 131. Then, under the continuous rotation of the cross-flow impeller 210, a continuous stream of air will be transported to the first chamber 131 through the preset air outlet channel 600. After flowing upward, it takes away the heat of the circuit board and finally quickly discharges from the air outlet 117 provided at the top, realizing efficient and rapid heat dissipation.

[0061] Among them, the second side is the opposite side of the first side. In this embodiment, the first side of the second wind shield assembly 400 is the upper side.

[0062] Further, a carrier 700 is provided below the board installation area, and an air guiding component 800 is installed below the carrier 700. The opening of the air guiding component 800 is arranged towards the preset air outlet channel 600. Through the arrangement of the air guiding component 800, the air flow conveyed from the preset air outlet channel 600 can be quickly guided to the board installation area, further improving the effectiveness of the flow direction.

[0063] Refer to Figure 3 and Figure 4 , the first wind shielding component 300 includes a first straight segment baffle 310 and an arc segment baffle 320 which are connected to each other. Among them, the connection part of the first straight segment baffle 310 and the arc segment baffle 320 is preferably flush with the horizontal center of the cross-flow impeller 210.

[0064] The bottom of the arc segment baffle 320 is fixedly installed on the bottom of the chassis, and the virtual circle where the inner side of the arc segment baffle 320 is located and the virtual circle where the outer side of the cross-flow impeller 210 is located form concentric circles, forming a smooth blocking area, ensuring that the air thrown out from the tangent direction of the cross-flow impeller 210 to the inner side of the first wind shielding component 300 is isolated from the air inhaled through the air inlet 1141, ensuring the temperature of the air inhaled through the air inlet 1141, and further ensuring the effective heat dissipation of the board.

[0065] Further, the height of the first straight segment baffle 310 is H1, and the radius of the cross-flow impeller 210 is R, where 1 / 4R ≤ H1 ≤ 2 / 3R. By restricting the size of the first straight segment baffle 310 in the height direction, it neither affects the cross-flow impeller 210's inhalation of the air entering through the air inlet 1141, nor can it ensure the isolation of the inhaled air from the continuously introduced air, that is, ensuring that the two do not mix.

[0066] The inner arc length of the arc segment baffle 320 is preferably 1 / 4 of the circumference of the virtual circle where its inner side is located, forming a semi-circular block.

[0067] The distance between the first straight segment baffle 310 and the cross-flow impeller 210 is △1, and the distance between the arc segment baffle 320 and the cross-flow impeller 210 is △2, where R / 11 ≤ △1 ≤ R / 6, R / 11 ≤ △2 ≤ R / 6. Through the setting of this extremely small gap, it neither affects the rotation of the cross-flow impeller 210 nor can it form a block on the right side of the cross-flow impeller 210.

[0068] The second wind shielding component 400 includes a second straight segment baffle 410, a ramp segment baffle 420, and a third straight segment baffle 430 which are connected in sequence. The two ends of the second straight segment baffle 410 are respectively fixedly connected to the first inner wall and the second inner wall of the chassis, that is, the two ends of the second straight segment baffle 410 are respectively fixedly connected to the first side plate 112 and the second side plate 113.

[0069] The height center of the second straight-section baffle 410 is set not higher than the horizontal center of the cross-flow impeller 210, and the longitudinal axis of the second straight-section baffle 410 is parallel to the longitudinal axis of the cross-flow impeller 210, forming a vertical block on the left side.

[0070] The ramp-section baffle 420 is inclined away from the cross-flow impeller 210, and the angle between the ramp-section baffle 420 and the second straight-section baffle 410 is an obtuse angle. The ramp-section baffle 420 arranged in this way can play a role in transition and guidance.

[0071] The third straight-section baffle 430 is fixedly installed on the side wall of the partition plate 120 away from the first chamber 131, and the bottom of the third straight-section baffle 430 is flush with the bottom of the partition plate 120, ensuring that the air flow enters the first chamber 131 unobstructed and smoothly.

[0072] In this embodiment, the horizontal point of the top of the second straight-section baffle 410 corresponding to the cross-flow impeller 210 is the first point, the horizontal point of the connection between the first straight-section baffle 310 and the arc-section baffle 320 corresponding to the cross-flow impeller 210 is the second point, and the area between the second point and the first point constitutes the target air inlet area; the horizontal point of the connection between the second straight-section baffle 410 and the ramp-section baffle 420 corresponding to the cross-flow impeller 210 is the third point, the horizontal point of the end of the arc-section baffle 320 away from the first straight-section baffle 310 corresponding to the cross-flow impeller 210 is the fourth point, and the area between the third point and the fourth point constitutes the target air supply area; the area between the fourth point and the second point constitutes the target high-pressure area.

[0073] The target air flow (i.e., the air at room temperature) entering from the target air inlet area will be sucked into the rotating cross-flow impeller 210. Under the action of centrifugal force, the air flow sucked into the cross-flow impeller 210 will be thrown out along the tangent direction of the impeller. However, due to the block of the first wind-blocking assembly 300, a high-pressure air flow will be formed in the target high-pressure area, and then enter the cross-flow impeller 210 under the action of rotation, and finally be thrown out in the target air supply area, that is, through the second wind-blocking assembly 400, ensuring that the air flow thrown out under the action of rotation and centrifugal force all enters the first chamber 131 along the preset air inlet channel 500.

[0074] The distance between the second straight-section baffle 410 and the cross-flow impeller 210 is △3, and R / 11 ≤ △3 ≤ R / 6. Through the setting of this extremely small gap, it does not affect the rotation of the cross-flow impeller 210, and can form a block and guidance on the left side of the cross-flow impeller 210.

[0075] The distance from the top of the second straight-section baffle 410 to the horizontal center of the cross-flow impeller 210 is H2, where 1 / 4R ≤ H2 ≤ 1 / 2R. By restricting the dimension of the second straight-section baffle 410 in the height direction, it does not affect the air intake of the cross-flow impeller 210 for the air entering from the air inlet 1141, and can ensure the isolation of the inhaled air from the continuously introduced air, that is, ensure that the two do not mix.

[0076] The inclination angle of the ramp-section baffle 420 relative to the bottom plate 115 is α, where 15° ≤ α ≤ 25°. By setting this inclination angle, it can not only ensure the space of the preset air inlet channel 500, but also effectively guide the ejected air flow.

[0077] Furthermore, the distance from the connection of the ramp-section baffle 420 and the third straight-section baffle 430 to the partition 120 is L1, and the distance from the third straight-section baffle 430 to the partition 120 is L2, where 12 ≤ L2 / L1 ≤ 16.

[0078] The distance from the third straight-section baffle 430 to the bottom plate 115 of the chassis is H3, and the distance from the horizontal center of the cross-flow impeller 210 to the bottom plate 115 of the chassis is H4, where 3 ≤ H3 / H4 ≤ 5.

[0079] The air guiding assembly 800 includes a number of air guiding plates arranged in sequence. A directional guiding single channel communicating with the board card installation area is formed between every two air guiding plates; the distances of the number of air guiding plates from the bottom plate 115 of the chassis decrease in sequence, and the lowest bottom side of the air guiding plate farthest from the partition 120 is fixedly attached to the bottom plate 115 of the chassis.

[0080] In this embodiment, the air guiding plate is preferably a multi-stage bent plate structure or a concave arc plate structure.

[0081] Specifically, the air guiding assembly 800 includes a first air guiding plate 810, a second air guiding plate 820, a third air guiding plate 830, and a fourth air guiding plate 840 arranged in sequence from right to left. The lowest bottom side of the fourth air guiding plate 840 is fixedly attached to the bottom plate 115 of the chassis, and the distances of the first air guiding plate 810, the second air guiding plate 820, and the third air guiding plate 830 from the bottom plate 115 of the chassis decrease in sequence.

[0082] In this embodiment, the number of air guiding plates is preferably evenly arranged.

[0083] When the air guiding plate is a multi-stage bent plate structure, the air guiding plate includes a windward straight section, a transition section, and a connection section connected in sequence. The connection section is fixedly connected to the carrier 700; the transition section is arc-shaped; the windward straight section is parallel to the bottom plate 115 of the chassis, effectively reducing the resistance and improving the air guiding effect.

[0084] Further, the air inlet includes a plurality of through holes, and the opening ratio of the plurality of through holes is not less than 25%; in this embodiment, the plurality of through holes are preferably located in the area between the horizontal plane where the top of the first straight segment baffle is located and the top plate of the chassis to ensure the rapid and effective introduction of air.

[0085] Further referring to Figure 5 , the first wind shield assembly 300 further includes rib plates 330. There are a plurality of rib plates 330, and the plurality of rib plates 330 are evenly arranged and are used to support the first straight segment baffle 310 and the arc segment baffle 320 to improve the overall stability.

[0086] At the beginning, the area around the cross-flow impeller is at normal pressure; when the cross-flow impeller starts to rotate, the air inlet is at normal pressure. Under the rotation effect, air from the air inlet will be continuously sucked in (that is, a cold air source for heat dissipation and cooling is continuously introduced from the air inlet). Since the gap between the first straight segment baffle and the cross-flow impeller is very small, the air thrown out from the impeller tangentially to the area between the arc segment baffle and the cross-flow impeller will continuously accumulate, and the pressure in this area will continuously increase, forming a target high-pressure area. That is, a side block is formed through the first wind shield assembly, and a high-pressure area with a pressure greater than the internal pressure of the impeller is formed between the first wind shield assembly and the impeller. The internal pressure of the cross-flow impeller decreases, forming a low-pressure area. Under the continuous rotation and centrifugal action of the cross-flow fan, the air in the target high-pressure area will be squeezed into the low-pressure area inside the cross-flow impeller and then discharged from the target air outlet area, forming a high-pressure air mass in the air outlet area, and then flowing into the board installation area along the preset air inlet channel and the air guide assembly in a directional manner, thereby taking away heat.

[0087] Since the gap between the second straight segment baffle and the cross-flow impeller is very small, the air thrown out by the cross-flow impeller in the area of the second straight segment baffle is blocked by the second straight segment baffle and, under the action of the continuous air flow in the upper part, forms an air flow that enters the preset air outlet channel through the target air supply area under the rotation of the impeller. At the same time, under the block of the ramp segment baffle and the guiding action of the third straight segment baffle, the air flow thrown out from the impeller tangentially can be quickly introduced into the first chamber (that is, the board installation area to be cooled on the left side) through the preset air outlet channel, realizing the heat dissipation of the board. Due to the rotation of the fan and the continuous maintenance of the pressure difference, a continuous supply of cold air will be provided for the left chamber. Under the action of the thrust, the conveyed cold air will carry the heat in the left chamber and output from the top of the left chamber, realizing the heat dissipation and cooling of the boards inside the first chamber.

[0088] The board card heat dissipation chassis disclosed in this application divides the chassis into a first chamber and a second chamber by arranging a partition inside the chassis, which can effectively organize the air flow. Through the preset air inlet channel formed by the air inlet, the partition and the air supply and exhaust device, it is ensured that the temperature of the continuously introduced air flow is within the preset temperature range; through the matching setting of the first wind blocking component, the second wind blocking component and the air supply and exhaust device, the air flow can be effectively guided and optimized, and at the same time, the noise problem caused by air flow impact can be reduced; through the preset air outlet channel formed by the second wind blocking component, the air supply and exhaust device and the chassis bottom plate, the air flow path can be optimized, the fluidity of the air delivered to the first chamber can be enhanced, and it is ensured that the air can flow through each board card, effectively taking away the heat generated by each board card and realizing uniform heat dissipation, greatly improving the heat dissipation effect; through the setting of a single air supply and exhaust device, the introduction of the air flow and the rapid delivery to the first chamber can be realized, and at the same time, the noise and vibration problems can be effectively reduced.

[0089] Compared with the prior art that requires installing multiple fans, the air supply and exhaust device designed in this application can obtain better heat dissipation effect when only using a single device, effectively reducing the equipment procurement cost. The optimized air duct and air flow design greatly improves the overall heat dissipation efficiency, reduces energy consumption, and brings long-term economic benefits. It will not cause structural or safety hazards due to vibration and resonance during long-term use, effectively improving the overall safety of the chassis; the overall structure is simple, the heat dissipation effect is high, and daily maintenance and cleaning are more convenient, effectively improving the user experience.

[0090] In the description of this specification, the description with reference to terms such as "one embodiment / way", "some embodiments / ways", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment / way or example are included in at least one embodiment / way or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment / way or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments / ways or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments / ways or examples described in this specification and the features of different embodiments / ways or examples.

[0091] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of this application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0092] Those skilled in the art should understand that the above embodiments are merely for clearly illustrating the present disclosure and are not intended to limit the scope of the present disclosure. For those skilled in the art, other changes or modifications can be made based on the above disclosure, and these changes or modifications are still within the scope of the present disclosure.

Claims

1. A board card heat dissipation chassis, characterized in that, Comprising: A chassis, inside which a partition is provided. The partition divides the interior of the chassis into a first chamber and a second chamber. The first chamber has a board card installation area inside, and an air outlet is provided on the side wall of the first chamber; An air inlet is provided on the side wall of the second chamber away from the first chamber, and an air induction and supply device is provided inside the second chamber; The air induction and supply device includes a power component installed in the chassis. On both sides of the power component, a first wind blocking component and a second wind blocking component are respectively provided. The first wind blocking component is installed at the bottom of the chassis, and the air inlet is matched with the first wind blocking component; the second wind blocking component is installed on the partition; A preset air inlet channel is formed by the first side of the second wind blocking component, the first wind blocking component, the power component, and the side wall of the second chamber; a preset air outlet channel communicating with the first chamber is formed by the second side of the second wind blocking component, the first wind blocking component, the power component, and the bottom of the chassis, where the second side is the opposite side of the first side.

2. The board card heat dissipation chassis according to claim 1, wherein, The power component includes a motor and a cross-flow impeller installed at the power output end of the motor; The motor is fixedly installed on the first inner wall of the chassis, and one end of the cross-flow impeller away from the motor is installed on the second inner wall of the chassis through a bearing component. The second inner wall is parallel to the first inner wall; The longitudinal central axis of the cross-flow impeller is parallel to the side wall of the first chamber provided with the air outlet.

3. The board card heat dissipation chassis according to claim 2, wherein The first wind blocking component includes a first straight section baffle and an arc section baffle connected to each other; The connection part of the first straight section baffle and the arc section baffle is flush with the horizontal center of the cross-flow impeller; The arc section baffle is fixedly installed at the bottom of the chassis, and the virtual circle where the inner side of the arc section baffle is located and the virtual circle where the outer side of the cross-flow impeller is located form concentric circles.

4. The board card heat dissipation chassis according to claim 3, characterized in that, The height of the first straight section baffle is H1, the radius of the cross-flow impeller is R, and 1 / 4R ≤ H1 ≤ 2 / 3R; The inner arc length of the arc section baffle is 1 / 4 of the circumference of the virtual circle where its inner side is located.

5. The board card heat dissipation chassis according to claim 4, characterized in that The distance between the first straight section baffle and the cross-flow impeller is △1, and the distance between the arc section baffle and the cross-flow impeller is △2. R / 11 ≤ △1 ≤ R / 6, R / 11 ≤ △2 ≤ R / 6.

6. The board card heat dissipation chassis according to claim 5, wherein, The second wind blocking component includes a second straight section baffle, a slope section baffle, and a third straight section baffle connected in sequence; Both ends of the second straight section baffle are fixedly connected to the first inner wall and the second inner wall of the chassis respectively; the height center of the second straight section baffle is not higher than the horizontal center of the cross-flow impeller, and the longitudinal axis of the second straight section baffle is parallel to the longitudinal axis of the cross-flow impeller; The slope section baffle is inclined away from the cross-flow impeller, and the included angle between the slope section baffle and the second straight section baffle is an obtuse angle; The third straight section baffle is fixedly installed on the side wall of the partition away from the first chamber, and the bottom of the third straight section baffle is flush with the bottom of the partition; The top of the second straight-section baffle corresponds to the horizontal point of the cross-flow impeller as the first point. The connection between the first straight-section baffle and the arc-section baffle corresponds to the horizontal point of the cross-flow impeller as the second point. The area between the second point and the first point forms the target air inlet area; The connection between the second straight-section baffle and the ramp-section baffle corresponds to the horizontal point of the cross-flow impeller as the third point. The end of the arc-section baffle far from the first straight-section baffle corresponds to the horizontal point of the cross-flow impeller as the fourth point. The area between the third point and the fourth point forms the target air supply area; The area between the fourth point and the second point forms the target high-pressure area.

7. The board card heat dissipation chassis according to claim 6, wherein The distance between the second straight-section baffle and the cross-flow impeller is △3, and R / 11 ≤ △3 ≤ R / 6; The distance from the top of the second straight-section baffle to the horizontal center of the cross-flow impeller is H2, and 1 / 4R ≤ H2 ≤ 1 / 2R.

8. The board card heat dissipation chassis according to claim 7, characterized in that, The inclination angle of the ramp-section baffle relative to the bottom plate of the chassis is α, and 15° ≤ α ≤ 25°; The distance from the connection between the ramp-section baffle and the third straight-section baffle to the partition is L1, and the distance from the third straight-section baffle to the partition is L2, and 12 ≤ L2 / L1 ≤ 16; The distance from the third straight-section baffle to the bottom plate of the chassis is H3, and the distance from the horizontal center of the cross-flow impeller to the bottom plate of the chassis is H4, and 3 ≤ H3 / H4 ≤ 5.

9. The board card heat dissipation chassis according to any one of claims 1-8, characterized in that, A carrier is provided below the board installation area. A wind guiding component is installed below the carrier. The opening of the wind guiding component is arranged towards the preset air outlet channel; The wind guiding component includes a number of wind guiding plates arranged in sequence. A directional flow guiding single channel communicating with the board installation area is formed between every two wind guiding plates; The distances of a number of the wind guiding plates from the bottom plate of the chassis decrease in sequence, and the lowest bottom side of the wind guiding plate farthest from the partition is fixedly attached to the bottom plate of the chassis; The wind guiding plate is a multi-stage bent plate structure or a concave arc plate structure.

10. The board card heat dissipation chassis according to claim 9, characterized in that, A number of the wind guiding plates are evenly arranged; When the wind guiding plate is a multi-stage bent plate structure, the wind guiding plate includes a windward straight section, a transition section, and a connection section connected in sequence. The connection section is fixedly connected to the carrier; the transition section is arc-shaped; the windward straight section is arranged parallel to the bottom plate of the chassis.