Cleaning equipment

Abstract

The utility model relates to cleaning equipment. The cleaning equipment comprises an acid pickling tank assembly, the acid pickling tank assembly comprises a first acid pickling tank, a second acid pickling tank and a third acid pickling tank which are sequentially arranged, and the second acid pickling tank is configured to be communicated with any one of the first acid pickling tank and the third acid pickling tank; the liquid supplementing tank assembly comprises a first liquid supplementing tank and a second liquid supplementing tank which are separated from each other, the first liquid supplementing tank is configured to be communicated with the first pickling tank, and the second liquid supplementing tank is configured to be communicated with the third pickling tank. The cleaning equipment can avoid the structural redundancy of the rinsing bath in the pickling bath assembly, improves the pickling effect and pickling efficiency, and remarkably improves the processing efficiency of silicon wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing equipment, and particularly to a cleaning device. Background Art

[0002] A silicon wafer (or "silicon chip") is one of the most basic materials in the semiconductor industry production. It is a high-purity thin sheet made of single-crystalline silicon or polycrystalline silicon. Silicon wafers are usually circular, with diameters ranging from a few millimeters to several hundred millimeters, and the thickness is usually between 0.2 mm and 1.5 mm. Silicon wafers have good electrical and optical properties and are widely used in many fields such as integrated circuits, solar cells, communication equipment, etc.

[0003] The cleaning process is a crucial link in the manufacturing process of silicon wafers. During the manufacturing and processing of silicon wafers, the surface of the silicon wafer is easily contaminated by various impurities and residues, such as grease, oxides, dust, etc. These impurities will reduce the electrical and optical properties of the silicon wafer. Therefore, it is necessary to use a specific cleaning device to clean the silicon wafer to ensure the smoothness and flatness of the silicon wafer surface and improve the stability of the silicon wafer performance.

[0004] Existing cleaning devices generally include an alkali cleaning tank assembly, an acid cleaning tank assembly, a water washing tank, a dehydration tank, etc. Among them, the acid cleaning tank assembly usually adopts a structure of "acid cleaning tank + water washing tank + acid cleaning tank". Since a water washing tank is also arranged downstream of the acid cleaning tank assembly, which can effectively remove the residual acid cleaning solution on the surface of the silicon wafer, the utilization rate of the water washing tank arranged in the acid cleaning tank assembly is not high, reducing the processing efficiency of the silicon wafer.

[0005] Therefore, a new technical solution is needed in this field to solve the above problems. Summary of the Utility Model

[0006] In order to solve or to some extent improve the technical problem that the utilization rate of the water washing tank in the existing cleaning device is not high, which affects the processing efficiency of the silicon wafer, the utility model provides a cleaning device. The cleaning device includes: an acid cleaning tank assembly, the acid cleaning tank assembly includes a first acid cleaning tank, a second acid cleaning tank and a third acid cleaning tank arranged in sequence, wherein the second acid cleaning tank is configured to be connected to any one of the first acid cleaning tank and the third acid cleaning tank; and a liquid replenishing tank assembly, the liquid replenishing tank assembly includes a first liquid replenishing tank and a second liquid replenishing tank spaced apart from each other, wherein the first liquid replenishing tank is configured to be connectable to the first acid cleaning tank, and the second liquid replenishing tank is configured to be connectable to the third acid cleaning tank.

[0007] Those skilled in the art can understand that the cleaning device of the present utility model includes a pickling tank assembly and a liquid replenishing tank assembly. Among them, the pickling tank assembly includes a first pickling tank, a second pickling tank, and a third pickling tank arranged in sequence. The second pickling tank is connected to any one of the first pickling tank and the third pickling tank. The liquid replenishing tank assembly includes a first liquid replenishing tank and a second liquid replenishing tank spaced apart from each other. The first liquid replenishing tank is configured to be connected to the first pickling tank, and the second liquid replenishing tank is configured to be connected to the third pickling tank. Through the above settings, the cleaning device of the present utility model can adjust the original structure of "pickling tank + water washing tank + pickling tank" to the structure of "pickling tank + pickling tank + pickling tank", avoiding the structural redundancy of the water washing tank in the pickling tank assembly, improving the pickling effect and pickling efficiency, and then significantly improving the processing efficiency of silicon wafers. In addition, the first liquid replenishing tank and the second liquid replenishing tank can be used to replenish the first pickling tank, the second pickling tank, and the third pickling tank, which can also reduce the component cost and improve the utilization rate of the liquid replenishing tank assembly.

[0008] In a preferred technical solution of the above cleaning device, the first liquid replenishing tank is respectively connected to the first pickling tank and the second pickling tank through a three-way valve. Connecting the first liquid replenishing tank to the first pickling tank and the second pickling tank respectively through a three-way valve can simplify the pipeline design and reduce the component cost.

[0009] In a preferred technical solution of the above cleaning device, the second liquid replenishing tank is respectively connected to the second pickling tank and the third pickling tank through a three-way valve. Connecting the second liquid replenishing tank to the second pickling tank and the third pickling tank respectively through a three-way valve can simplify the pipeline design and reduce the component cost.

[0010] In a preferred technical solution of the above cleaning device, the pickling solution in the first pickling tank, the second pickling tank, and the third pickling tank is one or more of hydrofluoric acid, hydrochloric acid, sulfuric acid, and nitric acid. Through the above settings, the types of pickling solutions can be enriched to meet the pickling needs of silicon wafers under different working conditions.

[0011] In a preferred technical solution of the above cleaning device, the types of pickling solutions in the first pickling tank, the second pickling tank, and the third pickling tank are the same. Through the above settings, the uniformity and consistency of the removal of contaminants on the surface of the silicon wafer can be ensured, which helps to control the reaction process, avoid damaging the silicon wafer by using different types of pickling solutions, and improve the stability of silicon wafer processing. In addition, using the same type of pickling solution can also reduce the operation difficulty, optimize the inventory management, and reduce the procurement cost.

[0012] In the preferred technical solution of the above cleaning equipment, the concentrations of the pickling solutions in the first pickling tank, the second pickling tank, and the third pickling tank are C1, C2, and C3 respectively, where C1 ≤ C2 ≤ C3. Through the above settings, the pickling effect can be ensured, stubborn pollutants can be removed, and the pickling process can be kept stable and controllable.

[0013] In the preferred technical solution of the above cleaning equipment, controllers are provided in both the first replenishing tank and the second replenishing tank to accurately control the replenishing amount.

[0014] In the preferred technical solution of the above cleaning equipment, the cleaning equipment further includes an alkali cleaning tank assembly, which is arranged upstream of the pickling tank assembly. The alkali cleaning tank assembly includes a plurality of alkali cleaning tanks arranged in sequence, and a first water washing tank is provided between the plurality of alkali cleaning tanks and the pickling tank assembly. The setting of the plurality of alkali cleaning tanks can effectively perform alkali cleaning on the silicon wafers. In addition, the setting of the first water washing tank between the plurality of alkali cleaning tanks and the pickling tank assembly can effectively remove the residual alkali cleaning solution on the surface of the silicon wafers and ensure the pickling effect of the silicon wafers in the pickling tank assembly.

[0015] In the preferred technical solution of the above cleaning equipment, at least one second water washing tank is provided between the plurality of alkali cleaning tanks. The setting of the second water washing tank can timely remove the alkali cleaning solution and other pollutants on the surface of the silicon wafers, prevent affecting the subsequent processes, ensure the continuity of the cleaning process, and improve the cleaning efficiency.

[0016] In the preferred technical solution of the above cleaning equipment, the cleaning equipment further includes: a dehydration tank, which is arranged downstream of the pickling tank assembly, and a third water washing tank is provided between the dehydration tank and the pickling tank assembly. The setting of the dehydration tank can thoroughly dry the cleaned silicon wafers to remove the residual moisture on the surface of the silicon wafers and ensure the quality and performance of the silicon wafers in the subsequent processes (such as photolithography, etching, etc.). In addition, the setting of the third water washing tank between the dehydration tank and the pickling tank assembly can effectively remove the residual pickling solution on the surface of the silicon wafers and ensure the cleanliness of the silicon wafers. Description of the Drawings

[0017] The following describes the preferred embodiments of the present invention with reference to the drawings, in which:

[0018] Figure 1 is a schematic structural diagram of the first embodiment of the cleaning equipment of the present invention;

[0019] Figure 2 is a schematic structural diagram of the second embodiment of the cleaning equipment of the present invention.

[0020] List of Reference Numerals:

[0021] 100, Cleaning Equipment; 110, Alkaline Cleaning Tank Assembly; 111, Alkaline Cleaning Tank; 112, Second Water Washing Tank; 120, First Water Washing Tank; 130, Acid Pickling Tank Assembly; 131, First Acid Pickling Tank; 132, Second Acid Pickling Tank; 133, Third Acid Pickling Tank; 134, Three-way Valve; 140, Liquid Supplement Tank Assembly; 141, First Liquid Supplement Tank; 142, Second Liquid Supplement Tank; 143, Controller; 150, Third Water Washing Tank; 160, Dehydration Tank. Detailed Embodiment

[0022] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0023] It should be noted that in the description of the present invention, the terms indicating directions or positional relationships such as "upper", "lower", "left", "right", "front", "rear", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of the present invention.

[0024] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "setting", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and can also be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0025] In order to solve or to a certain extent improve the technical problem in the prior art that the utilization rate of the water washing tank in the cleaning equipment is not high, which affects the processing efficiency of silicon wafers, the present invention provides a cleaning equipment 100. The cleaning equipment 100 includes: an acid pickling tank assembly 130, the acid pickling tank assembly 130 includes a first acid pickling tank 131, a second acid pickling tank 132 and a third acid pickling tank 133 arranged in sequence, wherein the second acid pickling tank 132 is configured to be connected to any one of the first acid pickling tank 131 and the third acid pickling tank 133; and a liquid supplement tank assembly 140, the liquid supplement tank assembly 140 includes a first liquid supplement tank 141 and a second liquid supplement tank 142 spaced apart from each other, wherein the first liquid supplement tank 141 is configured to be connectable to the first acid pickling tank 131, and the second liquid supplement tank 142 is configured to be connectable to the third acid pickling tank 133.

[0026] Figure 1 is a schematic structural diagram of the first embodiment of the cleaning equipment of the present invention. As Figure 1As shown, in one or more embodiments, the cleaning device 100 of the present utility model includes a pickling tank assembly 130 and a liquid replenishing tank assembly 140. Among them, the pickling tank assembly 130 includes a first pickling tank 131, a second pickling tank 132, and a third pickling tank 133 arranged in sequence. The second pickling tank 132 is communicated with the first pickling tank 131. The liquid replenishing tank assembly 140 includes a first liquid replenishing tank 141 and a second liquid replenishing tank 142 spaced apart from each other. Among them, the first liquid replenishing tank 141 is connected to the first pickling tank 131, and the second liquid replenishing tank 142 is connected to the third pickling tank 133. Therefore, the cleaning device 100 of the present utility model can adjust the original structure of "pickling tank + water washing tank + pickling tank" to the structure of "pickling tank + pickling tank + pickling tank", avoid the structural redundancy of the water washing tank in the pickling tank assembly 130, improve the pickling effect and pickling efficiency, and significantly improve the processing efficiency of silicon wafers. In addition, by using the first liquid replenishing tank 141 to replenish the first pickling tank 131 and the second pickling tank 132 at the same time, the component cost can be reduced and the utilization rate of the liquid replenishing tank assembly 140 can be improved.

[0027] As Figure 1 shown, in one or more embodiments, the first liquid replenishing tank 141 is respectively connected to the first pickling tank 131 and the second pickling tank 132 through a three-way valve 134. Specifically, the three-way valve 134 has an inlet, a first outlet, and a second outlet (not marked in the figure) spaced apart from each other. Among them, the inlet is connected to the first liquid replenishing tank 141, the first outlet is connected to the first pickling tank 131, and the second outlet is connected to the second pickling tank 132. The setting of the three-way valve 134 can simplify the pipeline and reduce the component cost. It should be noted that the connection method and connection position between the pipeline and the first pickling tank 131 and the second pickling tank 132 can be adjusted according to actual needs. Alternatively, the first liquid replenishing tank 141 can also be directly connected to the first pickling tank 131 and the second pickling tank 132 respectively by using appropriate pipelines. In one or more embodiments, a controller 143 is provided in the first liquid replenishing tank 141. The controller 143 forms a communication connection with a control valve (not marked in the figure) on the pipeline, so as to control the on-off between the first liquid replenishing tank 141 and the first pickling tank 131 and the second pickling tank 132 through the controller 143, thereby accurately controlling the concentration of the pickling solution in the first pickling tank 131 and the second pickling tank 132.

[0028] As Figure 1 shown, in one or more embodiments, the second liquid replenishing tank 142 is directly connected to the third pickling tank 133 through a pipeline. A controller 143 is also provided in the second liquid replenishing tank 142. The controller 143 forms a communication connection with a control valve on the pipeline, so as to control the on-off between the second liquid replenishing tank 142 and the third pickling tank 133 through the controller 143, thereby accurately controlling the concentration of the pickling solution in the third pickling tank 133.

[0029] In one or more embodiments, the pickling solutions in the first pickling tank 131, the second pickling tank 132, and the third pickling tank 133 are one or more of hydrofluoric acid, hydrochloric acid, sulfuric acid, and nitric acid. For example, the pickling solution can be a mixture of hydrofluoric acid and hydrochloric acid. Through the above arrangement, the types of pickling solutions can be enriched to meet the pickling requirements of silicon wafers under different working conditions.

[0030] In one or more embodiments, the types of pickling solutions in the first pickling tank 131, the second pickling tank 132, and the third pickling tank 133 are the same. For example, the pickling solutions in the first pickling tank 131, the second pickling tank 132, and the third pickling tank 133 are all mixtures of hydrofluoric acid and hydrochloric acid. In this way, the uniformity and consistency of the removal of surface contaminants of the silicon wafers can be ensured, which helps to control the reaction process, avoid damaging the silicon wafers by using different types of pickling solutions, and improve the stability of silicon wafer processing. In addition, by using the same type of pickling solution, the operation difficulty can be reduced, the inventory management can be optimized, and the procurement cost can be reduced.

[0031] In one or more embodiments, the concentrations of the pickling solutions in the first pickling tank 131, the second pickling tank 132, and the third pickling tank 133 are C1, C2, and C3 respectively, where C1 ≤ C2 ≤ C3. By setting the concentrations of the pickling solutions in the first pickling tank 131, the second pickling tank 132, and the third pickling tank 133 to be the same or gradually increasing, the pickling effect can be ensured, stubborn contaminants can be effectively removed, and the pickling process can be ensured to be stable and controllable. It should be noted that the specific values of C1, C2, and C3 can be adjusted according to the type of pickling solution and the actual requirements of pickling.

[0032] As Figure 1 shown, in one or more embodiments, the cleaning device 100 of the present utility model further includes an alkali cleaning tank assembly 110. The alkali cleaning tank assembly 110 is arranged upstream of the pickling tank assembly 130. The alkali cleaning tank assembly 110 includes a plurality of alkali cleaning tanks 111 arranged in sequence. Each alkali cleaning tank 111 contains an alkali cleaning solution with a suitable concentration. The alkali cleaning solution can be, but is not limited to, ammonium hydroxide, sodium hydroxide, alkaline hydrogen peroxide cleaning solution, etc. The types of alkali cleaning solutions in each alkali cleaning tank 111 can be the same or different. In addition, the concentration of the alkali cleaning solution in each alkali cleaning tank 111 can be adjusted according to actual needs. The arrangement of the plurality of alkali cleaning tanks 111 can effectively perform alkali cleaning on the silicon wafers. It should be noted that the number of alkali cleaning tanks 111 can be 6, 7, 8, or other suitable numbers.

[0033] As Figure 1As shown, in one or more embodiments, a first water washing tank 120 is provided between a plurality of alkali washing tanks 111 and an acid washing tank assembly 130. Deionized water or other suitable cleaning liquid is provided in the first water washing tank 120 to effectively remove the residual alkali washing liquid on the surface of the silicon wafer, ensuring a good acid washing effect of the silicon wafer in the subsequent acid washing tank assembly 130.

[0034] As Figure 1 shown, in one or more embodiments, at least one second water washing tank 112 is provided between a plurality of alkali washing tanks 111. For example, 2 second water washing tanks 112 are provided between 6 alkali washing tanks 111. Additionally, these 2 second water washing tanks 112 can be evenly arranged between the 6 alkali washing tanks 111. That is, the alkali washing tanks 111 and the second water washing tanks 112 are arranged in the pattern of "alkali washing tank 111 - alkali washing tank 111 - second water washing tank 112 - alkali washing tank 111 - alkali washing tank 111 - second water washing tank 112 - alkali washing tank 111 - alkali washing tank 111". Deionized water or other suitable cleaning liquid is provided in the second water washing tank 112. The provision of the second water washing tank 112 can timely remove the alkali washing liquid and other contaminants on the surface of the silicon wafer, prevent impacts on subsequent processes, ensure the continuity of the cleaning process, and improve the cleaning efficiency. Alternatively, the number and arrangement position of the second water washing tanks 112 can also be adjusted according to actual needs.

[0035] As Figure 1 shown, in one or more embodiments, the cleaning device 100 of the present utility model further includes a dehydration tank 160. The dehydration tank 160 is arranged downstream of the acid washing tank assembly 130, and a third water washing tank 150 is provided between the dehydration tank 160 and the acid washing tank assembly 130. Deionized water or other suitable cleaning liquid is provided in the third water washing tank 150. The provision of the third water washing tank 150 can effectively remove the residual acid washing liquid on the surface of the silicon wafer, ensuring the cleanliness of the silicon wafer. The dehydration tank 160 can perform a thorough drying process on the washed silicon wafer using a suitable drying method (such as nitrogen blowing or hollow drying, etc.) to remove the residual moisture on the surface of the silicon wafer, ensuring the quality and performance of the silicon wafer in subsequent processes (such as lithography, etching, etc.).

[0036] Figure 2 is a schematic structural diagram of the second embodiment of the cleaning device of the present utility model. As Figure 2As shown, in one or more embodiments, the cleaning device 100 of the present utility model includes a pickling tank assembly 130 and a liquid replenishing tank assembly 140. Among them, the pickling tank assembly 130 includes a first pickling tank 131, a second pickling tank 132, and a third pickling tank 133 arranged in sequence. The second pickling tank 132 communicates with the third pickling tank 133. The liquid replenishing tank assembly 140 includes a first liquid replenishing tank 141 and a second liquid replenishing tank 142 spaced apart from each other. Among them, the first liquid replenishing tank 141 is connected to the first pickling tank 131, and the second liquid replenishing tank 142 is connected to the third pickling tank 133. The cleaning device 100 of the present utility model can adjust the original structure of "pickling tank + water washing tank + pickling tank" to the structure of "pickling tank + pickling tank + pickling tank", avoiding the structural redundancy of the water washing tank in the pickling tank assembly 130, improving the pickling effect and pickling efficiency, and significantly increasing the processing efficiency of silicon wafers. In addition, by using the second liquid replenishing tank 142 to replenish the second pickling tank 132 and the third pickling tank 133 at the same time, the component cost can also be reduced, and the utilization rate of the liquid replenishing tank assembly 140 can be improved.

[0037] As Figure 2 shown, in one or more embodiments, the first liquid replenishing tank 141 is directly connected to the first pickling tank 131 through a pipeline. A controller 143 is also provided in the first liquid replenishing tank 141. The controller 143 forms a communication connection with the control valve on the pipeline so as to control the on-off between the first liquid replenishing tank 141 and the first pickling tank 131 through the controller 143, thereby accurately controlling the concentration of the pickling solution in the first pickling tank 131.

[0038] As Figure 2 shown, in one or more embodiments, the second liquid replenishing tank 142 is connected to the second pickling tank 132 and the third pickling tank 133 respectively through a three-way valve 134. Specifically, the three-way valve 134 has an inlet, a first outlet, and a second outlet (not marked in the figure) spaced apart from each other. Among them, the inlet is connected to the second liquid replenishing tank 142, the first outlet is connected to the second pickling tank 132, and the second outlet is connected to the third pickling tank 133. The setting of the three-way valve 134 can simplify the pipeline and reduce the component cost. Alternatively, the second liquid replenishing tank 142 can also be directly connected to the second pickling tank 132 and the third pickling tank 133 respectively by using appropriate pipelines. In one or more embodiments, a controller 143 (not shown in the figure) is provided in the second liquid replenishing tank 142. The controller 143 forms a communication connection with the control valve (not shown in the figure) on the pipeline so as to control the on-off between the second liquid replenishing tank 142 and the second pickling tank 132 and the third pickling tank 133 through the controller 143, thereby accurately controlling the concentration of the pickling solution in the second pickling tank 132 and the third pickling tank 133.

[0039] It should be noted that the parts not mentioned in the second embodiment can be configured to be the same as those in the first embodiment, and will not be elaborated here.

[0040] So far, the technical solution of the present utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easily understood by those skilled in the art that the protection scope of the present utility model is obviously not limited to these specific embodiments. Without departing from the principle of the present utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of the present utility model.

Claims

1. A cleaning device, characterized in that, The cleaning equipment includes: Pickling tank assembly, the pickling tank assembly includes a first pickling tank, a second pickling tank and a third pickling tank arranged in sequence, wherein the second pickling tank is configured to communicate with any one of the first pickling tank and the third pickling tank; and Liquid replenishing tank assembly, the liquid replenishing tank assembly includes a first liquid replenishing tank and a second liquid replenishing tank spaced apart from each other, wherein the first liquid replenishing tank is configured to be communicable with the first pickling tank, and the second liquid replenishing tank is configured to be communicable with the third pickling tank.

2. The cleaning device according to claim 1, wherein The first liquid replenishing tank is connected to the first pickling tank and the second pickling tank respectively through a three-way valve.

3. The cleaning device according to claim 1, wherein, The second liquid replenishing tank is connected to the second pickling tank and the third pickling tank respectively through a three-way valve.

4. The cleaning device according to claim 1, wherein The pickling solution in the first pickling tank, the second pickling tank and the third pickling tank is one or more of hydrofluoric acid, hydrochloric acid, sulfuric acid and nitric acid.

5. The cleaning device according to claim 4, characterized in that, The types of the pickling solutions in the first pickling tank, the second pickling tank and the third pickling tank are the same.

6. The cleaning device according to claim 5, characterized in that, The concentrations of the pickling solutions in the first pickling tank, the second pickling tank and the third pickling tank are C1, C2 and C3 respectively, wherein C1≤C2≤C3.

7. The cleaning device according to claim 1, wherein, Controllers are provided in both the first liquid replenishing tank and the second liquid replenishing tank.

8. The cleaning device according to claim 1, characterized in that The cleaning equipment further includes: Alkaline cleaning tank assembly, the alkaline cleaning tank assembly is arranged upstream of the pickling tank assembly, which includes a plurality of alkaline cleaning tanks arranged in sequence, and A first water washing tank is provided between the plurality of alkaline cleaning tanks and the pickling tank assembly.

9. The cleaning device according to claim 8, wherein, At least one second water washing tank is provided between the plurality of alkaline cleaning tanks.

10. The cleaning device according to claim 1, wherein, The cleaning equipment further includes: Dehydration tank, the dehydration tank is arranged downstream of the pickling tank assembly, and A third water washing tank is provided between the dehydration tank and the pickling tank assembly.

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