Magnetic moving carrier for semiconductor element

Abstract

The utility model discloses a semiconductor element magnetic moving carrier, which comprises a semiconductor element bearing disc and a U-shaped placing plate, the top of the semiconductor element bearing disc is uniformly provided with accommodating grooves, the two ends of the interior of the semiconductor element bearing disc are both provided with guide sliding grooves, the interior of each guide sliding groove is slidably provided with a guide sliding block, and the guide sliding blocks are arranged on the U-shaped placing plate. A discharging push plate is installed on the inner side of the guide sliding block, and installation through holes are evenly formed in the bottom of the semiconductor element bearing disc. According to the utility model, the U-shaped placing plate, the protective baffle, the first magnetic attraction block and the second magnetic attraction block are installed, when the semiconductor element storage device is used, a semiconductor element can be placed in the U-shaped placing plate, and the first magnetic attraction block and the second magnetic attraction block are magnetically attracted together through the magnetism of the first magnetic attraction block and the second magnetic attraction block, so that the U-shaped placing plate can be quickly stored and fixed in the storage groove; therefore, the semiconductor element can be quickly accommodated in the semiconductor element bearing disc.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor element processing equipment, and particularly relates to a magnetic moving carrier for semiconductor elements. Background Art

[0002] Semiconductor elements are electronic devices with conductivity between good conductors and insulators, and use the special electrical properties of semiconductor materials to complete specific functions. When producing semiconductor elements, it is often necessary to place semiconductor elements through a moving carrier to facilitate moving them to a designated position for processing.

[0003] For example, in the utility model: "Semiconductor Element Moving Carrier", the publication number is: "CN203300619U". This patent fixes multiple mounting blocks respectively and correspondingly in multiple mounting recesses of a main body, and each upper surface of the mounting block is provided with an element placement recess for correspondingly placing a semiconductor element. Different specifications of the mounting blocks can share the same main body, effectively reducing the preparation cost and storage management problems of the semiconductor element moving carrier. However, during the implementation of this patent, after placing the moving carrier inside the recess, it is necessary to fix the moving carrier through multiple sets of positioning bead elements, etc. The fixing process of semiconductor elements is relatively inconvenient, and after moving the semiconductor elements to the designated position, it is not easy to quickly take them out from inside the carrier, and the device is relatively inconvenient to use. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a magnetic moving carrier for semiconductor elements to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A magnetic moving carrier for semiconductor elements, including a semiconductor element bearing plate and a U-shaped placement plate. The top of the semiconductor element bearing plate is evenly provided with storage grooves, and both ends inside the semiconductor element bearing plate are provided with guiding sliding grooves. Guiding sliders are slidably installed inside the guiding sliding grooves, and a discharging push plate is installed on the inner side of the guiding sliders. The bottom of the semiconductor element bearing plate is evenly provided with mounting through holes, and the mounting through holes are all communicated with the storage grooves. Discharging push rods are evenly installed on the top of the discharging push plate. The discharging push rods all pass through the mounting through holes and extend into the storage grooves, and U-shaped placement plates are installed on the tops of the discharging push rods. Second magnetic attraction blocks are installed on the bottoms of the U-shaped placement plates.

[0006] Preferably, first magnetic attraction blocks are installed on the bottoms of the storage grooves.

[0007] Preferably, protective baffles are installed on both sides of the U-shaped placement plate.

[0008] Preferably, reset springs are installed at both ends of the top of the discharge push plate, and the ends of the reset springs away from the discharge push plate are connected to the semiconductor element carrier plate.

[0009] Preferably, round holes are provided at one end of each U-shaped placement plate, push rods are installed inside the round holes, push plates are installed at the ends of the push rods close to the U-shaped placement plates, and connecting plates are installed at the ends of the push rods away from the push plates.

[0010] Preferably, telescopic springs are sleeved on the outer sides of the push rods, one ends of the telescopic springs are connected to the U-shaped placement plates, and the ends of the telescopic springs away from the U-shaped placement plates are connected to the connecting plates.

[0011] Preferably, handles are installed at the tops of both ends of the semiconductor element carrier plate, and finger grooves are provided on the inner sides of the handles.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] 1. The semiconductor element magnetic moving carrier is equipped with a U-shaped placement plate, a protective baffle, a first magnetic attraction block and a second magnetic attraction block. When in use, the semiconductor element can be placed inside the U-shaped placement plate, and the first magnetic attraction block and the second magnetic attraction block are magnetically attracted together, so that the U-shaped placement plate can be quickly received and fixed inside the receiving groove, and the semiconductor element can be quickly received inside the semiconductor element carrier plate;

[0014] 2. The semiconductor element magnetic moving carrier is equipped with a discharge push rod and a discharge push plate. After the device is moved to a designated position, the staff can push the discharge push plate upward, and the discharge push plate drives the U-shaped placement plate to move together through the discharge push rod, so that the first magnetic attraction block and the second magnetic attraction block can be separated, and the U-shaped placement plate can be pushed out of the receiving groove, and the semiconductor element can be taken out from inside the semiconductor element carrier plate;

[0015] 3. The semiconductor element magnetic moving carrier is equipped with a connecting plate, a telescopic spring, a push plate and a push rod. The staff can push the connecting plate, and the connecting plate drives the push plate to move through the push rod, and the semiconductor element can be pushed out of the U-shaped placement plate through the push plate, so as to facilitate the taking out of the semiconductor element. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the main sectional view schematic diagram of the present utility model;

[0017] Figure 2 is the side view schematic diagram of the U-shaped placement plate of the present utility model;

[0018] Figure 3 is the present utility model Figure 1 The enlarged view of the structure at A in.

[0019] In the figure: 1. Semiconductor component carrier; 2. Guide chute; 3. Handle; 4. U-shaped placement plate; 5. Storage groove; 6. Discharge push rod; 7. Guide slider; 8. Mounting through hole; 9. Return spring; 10. Discharge push plate; 11. Protection baffle; 12. First magnetic block; 13. Second magnetic block; 14. Connecting plate; 15. Telescopic spring; 16. Round hole; 17. Push plate; 18. Push rod. Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figures 1 - 3 , an embodiment provided by the present invention: a magnetic moving carrier for semiconductor components, including a semiconductor component carrier 1 and a U-shaped placement plate 4. Storage grooves 5 are evenly arranged on the top of the semiconductor component carrier 1, and guide chutes 2 are arranged at both ends inside the semiconductor component carrier 1. Guide sliders 7 are slidably installed inside the guide chutes 2, and a discharge push plate 10 is installed inside the guide sliders 7. Mounting through holes 8 are evenly arranged at the bottom of the semiconductor component carrier 1, and the mounting through holes 8 are all communicated with the storage grooves 5. Discharge push rods 6 are evenly installed on the top of the discharge push plate 10. The discharge push rods 6 all pass through the mounting through holes 8 and extend into the storage grooves 5, and U-shaped placement plates 4 are installed on the tops of the discharge push rods 6. Return springs 9 are installed at both ends on the top of the discharge push plate 10, and the ends of the return springs 9 away from the discharge push plate 10 are all connected to the semiconductor component carrier 1. The elastic action of the return spring 9 pushes the discharge push plate 10 to move downward and reset. The discharge push plate 10 drives the U-shaped placement plate 4 to move together through the discharge push rod 6, and the U-shaped placement plate 4 can be received into the storage groove 5. Second magnetic blocks 13 are installed at the bottoms of the U-shaped placement plates 4, and protection baffles 11 are installed on both sides of the U-shaped placement plates 4. The semiconductor components are limited by the protection baffles 11, and the semiconductor components can be prevented from falling from both sides of the U-shaped placement plate 4. Handles 3 are installed on the tops of both ends of the semiconductor component carrier 1, and finger grooves are arranged inside the handles 3, which is convenient for the staff to move the semiconductor component carrier 1.

[0022] As Figures 1 - 3As shown, first magnetic blocks 12 are installed at the bottoms inside the storage grooves 5. Place the semiconductor components inside the U-shaped placement plate 4. Due to the magnetism of the first magnetic blocks 12 and the second magnetic blocks 13, they are magnetically attracted together, enabling the U-shaped placement plate 4 to be quickly stored and fixed inside the storage groove 5, and thus quickly storing the semiconductor components inside the semiconductor component carrier 1.

[0023] As Figure 1 shown, round holes 16 are provided at one ends of the U-shaped placement plates 4, and push rods 18 are installed inside the round holes 16. Push plates 17 are installed at the ends of the push rods 18 close to the U-shaped placement plates 4, and connecting plates 14 are installed at the ends of the push rods 18 far from the push plates 17. Telescopic springs 15 are sleeved outside the push rods 18. One ends of the telescopic springs 15 are connected to the U-shaped placement plates 4, and the other ends of the telescopic springs 15 far from the U-shaped placement plates 4 are connected to the connecting plates 14. Workers can push the connecting plates 14. The connecting plates 14 drive the push plates 17 to move through the push rods 18, and the semiconductor components can be pushed out of the U-shaped placement plates 4 through the push plates 17, facilitating the removal of the semiconductor components. When stopping pushing the connecting plates 14, the elastic force of the telescopic springs 15 makes them push the connecting plates 14 to move back to their original positions.

[0024] Working principle:

[0025] During use, workers can first push the discharge push plate 10 upward. The discharge push plate 10 compresses the return spring 9, and the discharge push plate 10 drives the discharge push rod 6 to move together. The discharge push rod 6 drives the U-shaped placement plate 4 to move upward, and the U-shaped placement plate 4 can be pushed out of the storage groove 5.

[0026] Workers can place multiple groups of semiconductor components inside different U-shaped placement plates 4 respectively, and then release the discharge push plate 10. At this time, the elastic force of the return spring 9 makes it push the discharge push plate 10 to move downward and return to its original position. The discharge push plate 10 drives the U-shaped placement plate 4 to move together through the discharge push rod 6, and the U-shaped placement plate 4 can be stored in the storage groove 5.

[0027] Moreover, the U-shaped placement plate 4 drives the second magnetic blocks 13 to move together. Due to the magnetism of the first magnetic blocks 12 and the second magnetic blocks 13, they are magnetically attracted together, enabling the U-shaped placement plate 4 to be quickly stored and fixed inside the storage groove 5, and thus quickly storing the semiconductor components inside the semiconductor component carrier 1.

[0028] After moving the semiconductor components to the designated positions, workers can push the discharge push plate 10 upward. The discharge push plate 10 drives the U-shaped placement plate 4 to move together through the discharge push rod 6, enabling the first magnetic blocks 12 to be separated from the second magnetic blocks 13, and the U-shaped placement plate 4 can be pushed out of the storage groove 5.

[0029] Then, the staff can push the connecting plate 14, and the connecting plate 14 drives the pushing plate 17 to move through the push rod 18, and the semiconductor element can be pushed out from the inside of the U-shaped placement plate 4 through the pushing plate 17, so as to facilitate the removal of the semiconductor element.

[0030] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A magnetic moving vehicle for semiconductor components, comprising a semiconductor component carrier plate (1) and a U-shaped placement plate (4), characterized in that: The top of the semiconductor component carrier (1) is evenly provided with receiving grooves (5), and both ends inside the semiconductor component carrier (1) are provided with guiding chutes (2). Guiding sliders (7) are slidably installed inside the guiding chutes (2), and a discharge push plate (10) is installed on the inner side of the guiding sliders (7). The bottom of the semiconductor component carrier (1) is evenly provided with mounting through holes (8), and the mounting through holes (8) are all communicated with the receiving grooves (5). Discharge push rods (6) are evenly installed on the top of the discharge push plate (10). The discharge push rods (6) all pass through the mounting through holes (8) and extend into the interior of the receiving grooves (5), and U-shaped placement plates (4) are installed on the tops of the discharge push rods (6). Second magnetic attraction blocks (13) are installed on the bottoms of the U-shaped placement plates (4).

2. The magnetic moving vehicle of a semiconductor component according to claim 1, wherein: First magnetic attraction blocks (12) are installed on the bottoms inside the receiving grooves (5).

3. A magnetic moving vehicle for a semiconductor component according to claim 1, characterized in that: Protective baffles (11) are installed on both sides of the U-shaped placement plates (4).

4. A magnetic mobile vehicle for a semiconductor element according to claim 1, characterized in that: Reset springs (9) are installed at both ends of the top of the discharge push plate (10), and the ends of the reset springs (9) away from the discharge push plate (10) are all connected to the semiconductor component carrier (1).

5. A magnetic moving vehicle for a semiconductor component according to claim 1, wherein: Round holes (16) are provided at one end of each of the U-shaped placement plates (4), and push rods (18) are installed inside the round holes (16). Push plates (17) are installed at the ends of the push rods (18) close to the U-shaped placement plates (4), and connecting plates (14) are installed at the ends of the push rods (18) away from the push plates (17).

6. The magnetic mobile vehicle for a semiconductor element according to claim 5, wherein: Elastic telescopic springs (15) are sleeved on the outer sides of the push rods (18). One ends of the elastic telescopic springs (15) are all connected to the U-shaped placement plates (4), and the ends of the elastic telescopic springs (15) away from the U-shaped placement plates (4) are all connected to the connecting plates (14).

7. A magnetic mobile vehicle for a semiconductor component according to claim 1, characterized in that: Carrying handles (3) are installed on the tops of both ends of the semiconductor component carrier (1), and finger grooves are provided on the inner sides of the carrying handles (3).

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