Crystal grain sorting mechanism and splitting equipment

Abstract

The utility model provides a crystal grain sorting mechanism and splitting equipment, comprising: a turret assembly comprising a blanking driving structure and an adsorption structure, the blanking driving structure is in driving connection with the adsorption structure so as to enable the adsorption structure to move; crystal grains are placed on the material carrying assembly, the material carrying assembly is arranged corresponding to the moving path of the adsorption structure, and the adsorption structure and the material carrying assembly can relatively move in the vertical direction so that the adsorption structure can adsorb the crystal grains; the bearing assembly comprises a rotating structure, a first mounting part and at least two charging barrels, the rotating structure is in driving connection with the first mounting part, the charging barrels are detachably arranged on the first mounting part, and the charging barrels can rotate to the positions below the adsorption structures under the action of the rotating structure; and carrying the crystal grains on the adsorption structure. According to the crystal grain sorting mechanism, the crystal grain sorting efficiency can be improved.

Description

Technical Field

[0001] This application belongs to the technical field of die sorting, and more specifically, relates to a die sorting mechanism and a die splitting device. Background Art

[0002] After a wafer is split, multiple dies are generated, so it is necessary to sort and unload the dies. The traditional method is to unload the split dies onto a blue film or a UV film, and the wafer is adhered to the blue film or the UV film by an adhesion method. However, this method results in low die sorting efficiency. Summary of the Utility Model

[0003] This application aims to provide a die sorting mechanism that can efficiently sort dies.

[0004] The technical solution adopted in this application is a die sorting mechanism, including:

[0005] A turret assembly, including a blanking drive structure and an adsorption structure, the blanking drive structure is drivingly connected to the adsorption structure so that the adsorption structure can move;

[0006] A material loading component on which dies are placed, the material loading component is arranged corresponding to the movement path of the adsorption structure, and the adsorption structure and the material loading component can move relatively in the vertical direction so that the adsorption structure can adsorb the dies;

[0007] A carrying component, including a rotating structure, a first mounting member, and at least two cartridges, the rotating structure is drivingly connected to the first mounting member, the two cartridges are respectively detachably arranged on the first mounting member, and the cartridges can respectively rotate to the lower part of the adsorption structure under the action of the rotating structure to receive the dies on the adsorption structure.

[0008] In this application, the blanking drive structure of the turret assembly can drive the adsorption structure to move, and the adsorption structure and the material loading component can move relatively in the vertical direction so that the adsorption structure can adsorb the dies on the material loading component. The carrying component includes at least two cartridges, and the rotating structure of the carrying component can respectively drive the cartridges to rotate to the lower part of the adsorption structure through the first mounting member so that the cartridges can receive the dies on the adsorption structure. This method uses the cartridges to load the dies, enabling the cartridges to move by rotation. Compared with the method of using a support film for loading, it can prevent the dies from being thrown out. And there are at least two cartridges. By rotating and moving the cartridges, when one cartridge is receiving the dies on the adsorption structure, other cartridges can be unloaded or a cartridge without dies can be replaced, improving the die sorting efficiency.

[0009] Optionally, the material loading component includes:

[0010] Bracket;

[0011] A support film is disposed on the bracket, and a plurality of unsorted grains are placed on the support film; and

[0012] A blanking structure is disposed below the support film, and the blanking structure is used to lift the support film so that the adsorption structure can adsorb the grains on the support film.

[0013] Optionally, the material loading assembly further includes a displacement structure, and the displacement structure is drivingly connected to the bracket to drive the bracket to drive the support film to move along a first horizontal direction and a second horizontal direction, so that the grains on the support film can sequentially move to the adsorption area of the adsorption structure, wherein the first horizontal direction and the second horizontal direction are perpendicular to each other.

[0014] Optionally, when the adsorption structure rotates above the support film, the blanking structure exactly corresponds to the adsorption structure, and the support film can move relative to the blanking structure along the first horizontal direction and the second horizontal direction.

[0015] Optionally, the turret assembly further includes a fixing member and a detection structure, and the blanking driving structure and the detection structure are respectively disposed on the fixing member;

[0016] The detection structure is located above the material loading assembly to detect the grains on the material loading assembly;

[0017] The blanking driving structure includes a rotation driving member, and the rotation driving member is drivingly connected to the adsorption structure through a second mounting member so that the adsorption structure can perform circular movement.

[0018] Optionally, the turret assembly includes two or more of the adsorption structures, the adsorption structures are respectively disposed on the second mounting member, and the adsorption structures are on the same circumference. When the rotation driving member drives the second mounting member to rotate, one of the adsorption structures can be located above the material loading assembly to adsorb grains, and at the same time, another adsorption structure can be located above the cartridge.

[0019] Optionally, a placement groove is provided on the first mounting member, and the cartridge is placed in the placement groove; and

[0020] A waste box is further provided on the first mounting member, and the waste box and the cartridge in the placement groove are on the same circumference;

[0021] A waste box is provided on one side of each placement groove.

[0022] Optionally, further includes:

[0023] The barrel tray assembly is arranged on one side of the bearing assembly, and a plurality of barrels are placed on the barrel assembly;

[0024] The transfer assembly includes a transfer driving structure and a clamping structure. The clamping structure is used to clamp or release the barrel, and the transfer driving structure is drivingly connected to the clamping structure so that the clamping structure transfers the barrel between the barrel tray assembly and the bearing assembly.

[0025] Optionally, the barrel tray assembly includes a base, and a plurality of limiting cavities are arranged on the base, and each limiting cavity respectively places the barrel;

[0026] The barrel tray assembly further includes a basket, which is placed on the base and is used to store the barrels filled with grains;

[0027] The transfer driving structure includes a cantilever beam and a transfer driving platform. The cantilever beam is arranged above the barrel tray assembly, the transfer driving platform is arranged on the cantilever beam, and the transfer driving platform is drivingly connected to the clamping structure so that the clamping structure can move along a horizontal first direction, a horizontal second direction and a vertical direction respectively.

[0028] A dicing device includes a laser mechanism and the grain sorting mechanism. The laser mechanism is located above the material loading assembly and is used to dice the wafer on the material loading assembly into a plurality of grains. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 It is a schematic structural diagram of a grain sorting mechanism provided by an embodiment of the present application;

[0031] Figure 2 It is a schematic structural diagram of a bearing assembly in a grain sorting mechanism provided by an embodiment of the present application;

[0032] Figure 3 It is a schematic structural diagram of a material loading assembly in a grain sorting mechanism provided by an embodiment of the present application;

[0033] Figure 4 It is a schematic structural diagram of a turret assembly in a grain sorting mechanism provided by an embodiment of the present application;

[0034] Figure 5 This is a schematic structural diagram of a cartridge tray assembly and a transfer assembly in a crystal sorting mechanism provided by an embodiment of the present application.

[0035] Reference numerals:

[0036] 100, turret assembly; 110, blanking drive structure; 120, adsorption structure; 130, second mounting member; 140, fixing member; 150, detection structure;

[0037] 200, material loading assembly; 210, bracket; 220, support film; 230, ejector structure; 240, displacement structure; 241, first displacement drive member; 242, second displacement drive member;

[0038] 300, bearing assembly; 310, rotating structure; 320, first mounting member; 321, placement groove; 330, cartridge; 340, waste box;

[0039] 400, cartridge tray assembly; 410, base; 411, limiting cavity; 420, basket;

[0040] 500, transfer assembly; 510, transfer drive structure; 511, cantilever; 512, transfer drive platform; 5121, first transfer drive member; 5122, second transfer drive member; 5123, third transfer drive member; 520, clamping structure. Specific embodiments

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0042] It should be noted that when an element structure is referred to as "fixed to" or "disposed on" another element structure, it can be directly on the other element structure or indirectly on the other element structure. When an element structure is referred to as "connected to" another element structure, it can be directly connected to the other element structure or indirectly connected to the other element structure.

[0043] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element structure to be referred must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present application.

[0044] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of some applications, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0045] Referring to Figure 1 , the die sorting mechanism includes a turret assembly 100, a material loading assembly 200, and a carrying assembly 300. Among them, a plurality of unsorted dies are placed on the material loading assembly 200. For example, the dies can be a plurality of dies generated after a wafer is cleaved. The turret assembly 100 is used to transfer the dies on the material loading assembly 200 to the carrying assembly 300 to achieve die sorting.

[0046] Specifically, referring to Figure 4 , the turret assembly 100 includes a blanking drive structure 110 and an adsorption structure 120. The blanking drive structure 110 is drivingly connected to the adsorption structure 120 so that the adsorption structure 120 can move.

[0047] The material loading assembly 200 is arranged corresponding to the movement path of the adsorption structure 120, and the adsorption structure 120 and the material loading assembly 200 can move relative to each other in the vertical direction so that the adsorption structure 120 can adsorb the dies.

[0048] For example, the blanking drive structure 110 drives the adsorption structure 120 to move above the material loading assembly 200, and then the adsorption structure 120 and the material loading assembly 200 move relative to each other in the vertical direction to facilitate the adsorption structure 120 to adsorb the dies on the material loading assembly 200. After the adsorption structure 120 adsorbs the dies, the adsorption structure 120 can move to the carrying assembly 300 under the action of the blanking drive structure 110 and unload the dies onto the carrying assembly 300.

[0049] Furthermore, referring to Figure 2 , the carrying assembly 300 includes a rotating structure 310, a first mounting member 320, and at least two cartridges 330. The rotating structure 310 is drivingly connected to the first mounting member 320, and the cartridges 330 are respectively detachably arranged on the first mounting member 320, and the cartridges 330 can rotate to the lower part of the adsorption structure 120 under the action of the rotating structure 310 to receive the dies on the adsorption structure 120.

[0050] For example, the rotating structure 310 can drive the cartridge 330 to move along the circumferential direction through the first mounting member 320, and enable one of the cartridges 330 to rotate to correspond to the moving path of the adsorption structure 120. In this way, when the adsorption structure 120 moves under the action of the blanking driving structure 110, the adsorption structure 120 can move above the cartridge 330 corresponding to the moving path of the adsorption structure 120, and then the crystal grains can be blanked into the cartridge 330. At the same time, the other cartridges 330 on the first mounting member 320 can perform blanking or replace the cartridges 330 without crystal grains.

[0051] In this application, the blanking driving structure 110 of the turret assembly 100 can drive the adsorption structure 120 to move, and the adsorption structure 120 and the carrier assembly 200 can move relative to each other in the vertical direction, so that the adsorption structure 120 can adsorb the crystal grains on the carrier assembly 200. The carrying assembly 300 includes at least two cartridges 330, and the rotating structure 310 of the carrying assembly 300 can drive the cartridges 330 to rotate below the adsorption structure 120 through the first mounting member 320 respectively, so that the cartridges 330 can receive the crystal grains on the adsorption structure 120. This method uses the cartridges 330 to load the crystal grains, so that the cartridges 330 can move in a rotating manner, which can avoid the crystal grains being thrown out compared with the method of using the support film 220 for loading. And there are at least two cartridges 330. By the way of rotating and moving the cartridges 330, when one of the cartridges 330 receives the crystal grains on the adsorption structure 120, blanking can be performed on the other cartridges 330 or the cartridges 330 without crystal grains can be replaced, improving the efficiency of crystal grain sorting.

[0052] Refer to Figure 3 , the carrier assembly 200 may include a bracket 210, a support film 220 and a blanking structure 230. Among them, the support film 220 is arranged on the bracket 210, and a plurality of unsorted crystal grains are placed on the support film 220. The blanking structure 230 is arranged below the support film 220, and the blanking structure 230 is used to lift the support film 220 so that the adsorption structure 120 can adsorb the crystal grains on the support film 220.

[0053] Specifically, when the adsorption structure 120 moves above the support film 220, the blanking structure 230 located below the support film 220 lifts the support film 220, so that the crystal grains on the support film 220 can be adsorbed by the adsorption structure 120.

[0054] For example, in some embodiments, the bracket 210 may be a ring structure, and the support film 220 is disposed within the bracket 210 of the ring structure. The four sides of the support film 220 are fixed by the bracket 210. Since the support film 220 has ductility and elasticity, the ejector structure 230 can act on the support film 220 to lift the support film 220 to a certain height. At this time, the dies bonded to the support film 220 can also be lifted to a certain height. Among them, the support film 220 may be a blue film or a UV film, etc.

[0055] Furthermore, the material carrier assembly 200 may further include a displacement structure 240. The displacement structure 240 is drivingly connected to the bracket 210 to drive the bracket 210 to drive the support film 220 to move in a first horizontal direction and a second horizontal direction, so that the dies on the support film 220 can sequentially move to the adsorption area of the adsorption structure 120, where the first horizontal direction and the second horizontal direction are perpendicular to each other.

[0056] It can be understood that in some embodiments, when there are more dies on the support film 220 and the adsorption area of the adsorption structure 120 is small, for example, the adsorption structure 120 can only adsorb one die at a time. At this time, the displacement structure 240 can drive the bracket 210 to drive the support film 220 to move in the first horizontal direction and the second horizontal direction, so that the dies on the support film 220 can sequentially move to the adsorption area of the adsorption structure 120, and then the ejector structure 230 lifts the support film 220.

[0057] Furthermore, in some embodiments, when the adsorption structure 120 rotates above the support film 220, the ejector structure 230 exactly corresponds to the adsorption structure 120, and the support film 220 can move relative to the ejector structure 230 in the first horizontal direction and the second horizontal direction.

[0058] Specifically, the adsorption structure 120 rotates the adsorption area above the support film 220 under the action of the blanking drive structure 110. At this time, the adsorption structure 120 exactly corresponds to the ejector structure 230. Then, the displacement structure 240 drives the support film 220 to move through the bracket 210, so that the corresponding die on the support film 220 moves to the adsorption area of the adsorption structure 120. Then, the ejector structure 230 lifts the die located in the adsorption area through the support film 220 to be adsorbed by the adsorption structure 120. Among them, the ejector structure 230 may include a ejector rod for lifting the support film 220.

[0059] In some embodiments, the displacement structure 240 may include a first displacement driver 241 and a second displacement driver 242. The first displacement driver 241 and the second displacement driver 242 are respectively connected to the bracket 210. The first displacement driver 241 can drive the bracket 210 to move in a first horizontal direction, and the second displacement driver 242 can drive the bracket 210 to move in a second horizontal direction. The first displacement driver 241 can drive the bracket 210 to move in the first horizontal direction via the second displacement driver 242. The first displacement driver 241 and the second displacement driver 242 may be lead screw motors.

[0060] See Figure 4 The turret assembly 100 may further include a fixing member 140 and a detection structure 150. The unloading drive structure 110 and the detection structure 150 are respectively disposed on the fixing member 140, and the detection structure 150 is located above the carrier assembly 200 to detect the die on the carrier assembly 200. For example, the detection assembly can detect the position and / or quality of the die.

[0061] In some embodiments, when the adsorption structure 120 moves to the adsorption position under the action of the unloading driving structure 110, the detection structure 150 can detect the position of the grains on the support film 220, and the displacement structure 240 can drive the corresponding grains on the support film 220 to move to the adsorption area of the adsorption structure 120 according to the detection results of the detection structure 150, and then enable the adsorption structure 120 to adsorb the grains through the top material structure 230.

[0062] Alternatively, in some embodiments, the fixing member 140 may be a gantry, and the loading assembly 200 may be located below the gantry's suspension beam 511. The unloading drive structure 110 and the detection structure 150 may be disposed on the gantry's suspension beam 511.

[0063] Optionally, in some embodiments, the unloading drive structure 110 may include a rotary drive member, which is driven and connected to the adsorption structure 120 via the second mounting member 130 so that the adsorption structure 120 can move in a circular motion.

[0064] In addition, since the adsorption structure 120 transfers the grains by rotating, the multiple barrels 330 are also switched between the grain receiving area and the barrel 330 replacement area by rotating, which can further improve the efficiency of grain sorting.

[0065] Further, see Figure 4, in some embodiments, in order to improve the efficiency of die sorting, the turret assembly 100 may include two or more adsorption structures 120. The adsorption structures 120 are respectively disposed on the second mounting member 130, and a plurality of adsorption structures 120 are on the same circumference. And when one of the adsorption structures 120 is located above the loading assembly 200 to adsorb the dies, another adsorption structure 120 is located above the cartridge 330.

[0066] It can be understood that the relative positions of the plurality of adsorption structures 120 on the second mounting member 130 can be determined according to the relative positions between the loading assembly 200 and the carrying assembly 300.

[0067] For example, in some embodiments, when the loading assembly 200 and the carrying assembly 300 are disposed along the horizontal second direction, and there are two adsorption structures 120, the two adsorption structures 120 can also be disposed along the horizontal second direction on the second mounting member 130. When one adsorption structure 120 is located above the loading assembly 200, exactly another adsorption structure 120 is above the cartridge 330. In this way, the rotation driving member can switch the two adsorption structures 120 every 180° rotation, improving the sorting efficiency.

[0068] In some embodiments, when there are four, six or more adsorption structures 120 (generally an even number), the plurality of adsorption structures 120 can be equally spaced on the second mounting member 130 on the same circumference.

[0069] In addition, the rotation driving member can be a rotating platform. For example, a turret motor.

[0070] The second mounting member 130 can be a radiation structure coaxially connected to the rotation axis of the rotation driving member. For example, the second mounting member 130 includes a main body portion connected to the rotation axis and a mounting portion radiating from the main body portion corresponding to each adsorption structure 120.

[0071] Refer to Figure 2 , a placement groove 321 can be provided on the first mounting member 320 of the carrying assembly 300, and the cartridge 330 is placed in the placement groove 321.

[0072] For example, the cartridge 330 can be placed in the placement groove 321, and then the cartridge 330 is rotated to below the adsorption structure 120 by the rotation structure 310 to receive the dies. Since there are at least two cartridges 330, when one of the cartridges 330 is receiving the dies, if another cartridge 330 is full of the received dies, the full cartridge 330 can be replaced. The placement groove 321 facilitates the replacement of the cartridge 330.

[0073] Further, the relative positions of the plurality of cartridges 330 on the first mounting member 320 can be determined according to the relative positions between the turret assembly 100 and the positions for replacing the cartridges 330 for discharging materials.

[0074] For example, in some embodiments, when the positions for replacing the cartridges 330 for discharging materials of the turret assembly 100 and the cartridges 330 are arranged along the horizontal second direction, and there are two cartridges 330, the two cartridges 330 can also be arranged along the horizontal second direction on the first mounting member 320. When one cartridge 330 is located below the adsorption structure 120 of the turret assembly 100, exactly another cartridge 330 is located at the position for replacing the cartridges for discharging materials. In this way, the rotating structure 310 can switch the two cartridges 330 once every 180° rotation, improving the efficiency.

[0075] In some embodiments, when there are four, six or more cartridges 330 (generally an even number), the plurality of cartridges 330 can be equally spaced on the first mounting member 320 and located on the same circumference.

[0076] Further, the carrier assembly 300 may further include a waste box 340. The waste box 340 is arranged on the first mounting member 320, and the waste box 340 and the cartridges 330 in the placement grooves 321 are on the same circumference.

[0077] Specifically, when the crystal grains adsorbed by the adsorption structure 120 are defective products, the rotating structure 310 can rotate the first mounting member 320, and then rotate the waste box 340 below the adsorption structure 120 to receive the crystal grains on the adsorption structure 120.

[0078] Furthermore, a waste box 340 is respectively arranged on one side of each placement groove 321. That is, a waste box 340 is arranged on one side of each cartridge 330. In this way, when the crystal grains on the adsorption structure 120 are defective products, the rotating structure 310 only needs to rotate a small distance to move the waste box 340 below the adsorption structure 120, and then move the cartridge 330 back below the adsorption structure 120 after receiving the defective products. This method can improve the efficiency of crystal grain sorting.

[0079] Refer to Figure 1 and Figure 5 In some embodiments, the crystal grain sorting mechanism may further include a cartridge tray assembly 400. The cartridge tray assembly 400 is arranged on one side of the carrier assembly 300, and a plurality of cartridges 330 are placed on the cartridge tray assembly 400.

[0080] Specifically, during the grain sorting process, the empty cartridge 330 on the cartridge tray assembly 400 can be transferred to the placement groove 321 on the first mounting member 320 to receive the grains on the adsorption structure 120. At the same time, the cartridge 330 filled with grains on the placement groove 321 can also be transferred to the cartridge tray assembly 400. This method facilitates the replacement of the cartridge 330.

[0081] Furthermore, the grain sorting mechanism may further include a transfer assembly 500 for transferring the cartridge 330 between the cartridge tray assembly 400 and the carrier assembly 300.

[0082] For example, the transfer assembly 500 can transfer the cartridge 330 filled with grains on the first mounting member 320 to the cartridge tray assembly 400, and transfer the cartridge 330 on the cartridge tray assembly 400 to the placement groove 321 of the first mounting member 320.

[0083] Specifically, the transfer assembly 500 may include a transfer driving structure 510 and a clamping structure 520. The clamping structure 520 is used to clamp or release the cartridge 330. The transfer driving structure 510 is drivingly connected to the clamping structure 520 to enable the clamping structure 520 to transfer the cartridge 330 between the cartridge tray assembly 400 and the carrier assembly 300.

[0084] In some embodiments, the transfer driving structure 510 may include a cantilever 511 and a transfer driving platform 512. The cantilever 511 is disposed above the cartridge tray assembly 400, and the transfer driving platform 512 is disposed on the cantilever. The transfer driving platform 512 is drivingly connected to the clamping structure 520 to enable the clamping structure 520 to move along the horizontal first direction, the horizontal second direction, and the vertical direction respectively, so that the clamping structure 520 can transfer the cartridge 330 between the cartridge tray assembly 400 and the carrier assembly 300.

[0085] Among them, the transfer driving structure 510 may include a gantry, and the cantilever is a part of the gantry.

[0086] The transfer driving platform 512 may include a first transfer driving member 5121, a second transfer driving member 5122, and a third transfer driving member 5123. The first transfer driving member 5121 drives the clamping structure 520 to move along the horizontal first direction, the second transfer driving member 5122 drives the clamping structure 520 to move along the horizontal second direction, and the third transfer driving member 5123 drives the clamping structure 520 to move along the vertical direction. Among them, the first transfer driving member 5121 and the second transfer driving member 5122 may adopt screw motors. The third transfer driving member 5123 may be a cylinder.

[0087] Refer to Figure 5, the barrel tray assembly 400 may include a base 410, on which a plurality of limiting cavities 411 are provided, and each limiting cavity 411 is respectively provided with a barrel 330.

[0088] Specifically, the transfer assembly 500 can transfer the barrel 330 between the base 410 and the first mounting member 320.

[0089] Further, the barrel tray assembly 400 may further include a basket 420, which is placed on the base 410 and is used to store the barrels 330 filled with wafers.

[0090] It can be understood that in some embodiments, when the barrel 330 on the first mounting member 320 is filled with wafers, the transfer assembly 500 can transfer the barrel 330 to the basket 420, and the blanking of the barrel 330 can be realized through the basket 420.

[0091] When the barrel 330 on the first mounting member 320 is not filled with wafers and the turret assembly 100 needs to transfer wafers of different specifications from the loading assembly 200, at this time, the transfer assembly 500 can transfer the unfilled barrel 330 into the limiting cavity 411 of the base 410, and when sorting wafers of the same specification again later, transfer the barrel 330 to the first mounting member 320.

[0092] That is to say, in the above manner, when the basket 420 is provided on the base 410, the basket 420 stores the barrels 330 filled with wafers, which is convenient for the blanking of the barrels 330, and the limiting cavities 411 on the base 410 store the unfilled barrels 330, playing a role of transfer, so as to continue to blank wafers of the same specification into the corresponding unfilled barrels 330 later.

[0093] In addition, the present application also provides a dicing device, including a laser mechanism and the wafer sorting mechanism in the above embodiments. The laser mechanism is located above the loading assembly 200 and is used to dice the wafer on the loading assembly 200 into a plurality of wafers.

[0094] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A grain sorting mechanism, characterized in that, Comprising: A turret assembly, including a blanking driving structure and an adsorption structure, the blanking driving structure being drivingly connected to the adsorption structure so that the adsorption structure can move; A material loading assembly on which wafers are placed, the material loading assembly being arranged corresponding to the movement path of the adsorption structure, and the adsorption structure and the material loading assembly can move relative to each other in the vertical direction so that the adsorption structure can adsorb the wafers; And A bearing assembly, including a rotating structure, a first mounting member and at least two cartridges, the rotating structure being drivingly connected to the first mounting member, the two cartridges being respectively detachably arranged on the first mounting member, and the cartridges can be respectively rotated to the lower part of the adsorption structure under the action of the rotating structure to receive the wafers on the adsorption structure.

2. The grain sorting mechanism according to claim 1, wherein, The material loading assembly includes: A bracket; A support film arranged on the bracket, a plurality of unsorted wafers being placed on the support film; and A top material structure arranged under the support film, the top material structure being used to jack up the support film so that the adsorption structure can adsorb the wafers on the support film.

3. The grain sorting mechanism according to claim 2, wherein The material loading assembly further includes a displacement structure, the displacement structure being drivingly connected to the bracket to drive the bracket to drive the support film to move along a first horizontal direction and a second horizontal direction so that the wafers on the support film can sequentially move to the adsorption area of the adsorption structure, wherein the first horizontal direction and the second horizontal direction are perpendicular to each other.

4. The grain sorting mechanism according to claim 3, characterized in that, When the adsorption structure rotates to the upper part of the support film, the top material structure just corresponds to the adsorption structure, and the support film can move along the first horizontal direction and the second horizontal direction relative to the top material structure.

5. The grain sorting mechanism according to any one of claims 1 to 4, characterized in that, The turret assembly further includes a fixing member and a detection structure, the blanking driving structure and the detection structure being respectively arranged on the fixing member; The detection structure is located above the material loading assembly to detect the wafers on the material loading assembly; The blanking driving structure includes a rotation driving member, the rotation driving member being drivingly connected to the adsorption structure through a second mounting member so that the adsorption structure can perform circular movement.

6. The grain sorting mechanism according to claim 5, wherein, The turret assembly includes two or more of the adsorption structures, the adsorption structures being respectively arranged on the second mounting member and on the same circumference, when the rotation driving member drives the second mounting member to rotate, one of the adsorption structures can be located above the material loading assembly to adsorb the wafers, and at the same time, another adsorption structure can be located above the cartridge.

7. The grain sorting mechanism according to any one of claims 1 to 4, characterized in that, A placement groove is arranged on the first mounting member, and the cartridge is placed in the placement groove; and A waste box is further arranged on the first mounting member, the waste box and the cartridge in the placement groove being on the same circumference; A waste box is respectively arranged on one side of each placement groove.

8. The grain sorting mechanism according to claim 7, wherein, Further comprising: A cartridge disc assembly arranged on one side of the bearing assembly, a plurality of the cartridges being placed on the cartridge assembly; The transfer component includes a transfer driving structure and a clamping structure. The clamping structure is used to clamp or release the cartridge, and the transfer driving structure is drivingly connected to the clamping structure to enable the clamping structure to transfer the cartridge between the cartridge tray assembly and the loading assembly.

9. The grain sorting mechanism according to claim 8, characterized in that, The cartridge tray assembly includes a base, and a plurality of limiting cavities are provided on the base, and each of the limiting cavities is respectively provided with the cartridge; The cartridge tray assembly further includes a basket, the basket is placed on the base, and the basket is used to store the cartridges filled with grains; The transfer driving structure includes a cantilever beam and a transfer driving platform. The cantilever beam is arranged above the cartridge tray assembly, the transfer driving platform is arranged on the cantilever beam, and the transfer driving platform is drivingly connected to the clamping structure to enable the clamping structure to move along a horizontal first direction, a horizontal second direction and a vertical direction respectively.

10. A splitting device, characterized in that: It includes a laser mechanism and the grain sorting mechanism according to any one of claims 1 to 9. The laser mechanism is located above the loading component and is used to split the wafers on the loading component into a plurality of grains.

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