IGBT (Insulated Gate Bipolar Translator) type power converter water-cooling heat dissipation device

Abstract

The utility model relates to the technical field of IGBT type power converters and heat dissipation devices, and discloses an IGBT type power converter water-cooling heat dissipation device which comprises a water-cooling heat dissipation device, the top of the water-cooling heat dissipation device is fixedly connected with an IGBT power module, the top of the water-cooling heat dissipation device is provided with an NTC temperature measurement resistor, the NTC temperature measurement resistor is located below the IGBT power module, and the NTC temperature measurement resistor is located below the IGBT power module. A laminated busbar is installed on the side face of the water-cooled radiator, and a supporting capacitor is installed below the laminated busbar. According to the water-cooling heat dissipation device of the IGBT type power supply converter, the NTC temperature measurement resistor is pre-embedded at the position where the IGBT power module is installed, so that the NTC temperature measurement resistor can directly measure the shell temperature of the IGBT power module, and the problem that the shell temperature of part of IGBT power modules cannot be directly measured due to insulation treatment of installation holes is solved; and the NTC temperature measurement resistor is directly pre-embedded in the heat source area of the IGBT power module, so that the temperature measurement accuracy is prevented from being influenced by temperature gradient distribution on the shell and the radiator of the IGBT power module, and the effect of improving the temperature measurement accuracy is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of IGBT type power converters and heat dissipation devices, and specifically relates to a water-cooled heat dissipation device for an IGBT type power converter. Background Art

[0002] Large-capacity power electronic devices have switching losses during the switching process and conduction losses in the on-state. These losses are ultimately radiated or conducted to the outside in the form of heat. Therefore, power devices need to be installed on radiators with excellent thermal conductivity to ensure that the heat losses generated during the operation of the devices can be quickly transferred and the power devices will not be damaged due to heat accumulation.

[0003] In addition, in the field of power electronics, IGBT type power converters are generally designed in a modular structure, which mainly includes power devices, radiators, laminated busbars, and capacitors. The design of the laminated busbar is often highly related to the height of the radiator. When the radiator is changed from liquid cooling to air cooling, it is necessary to redesign the laminated busbar, resulting in an increase in module cost.

[0004] Therefore, the present application provides a water-cooled heat dissipation device for an IGBT type power converter, which is a liquid-cooled heat dissipation device designed to address the heat dissipation problem of power devices. The design of the laminated busbar is independent of the thickness dimension of the radiator, greatly improving the reusability of components and significantly reducing costs during mass production. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a water-cooled heat dissipation device for an IGBT type power converter to solve the problems raised in the above background art.

[0006] To solve the above technical problems, the utility model provides the following technical solution: A water-cooled heat dissipation device for an IGBT type power converter, including a water-cooled radiator, an IGBT power module is fixedly connected to the top of the water-cooled radiator, an NTC temperature measuring resistor is installed on the top of the water-cooled radiator, and the NTC temperature measuring resistor is located below the IGBT power module;

[0007] A laminated busbar is installed on the side of the water-cooled radiator, and a support capacitor is installed below the laminated busbar;

[0008] The laminated busbar takes the capacitor terminals of the IGBT type power converter and the IGBT power module as the reference planes, and determines the shape and size of the installation substrate of the IGBT power converter based on the height of the capacitor and the thickness of the water-cooled radiator.

[0009] Preferably, the water-cooled radiator includes an aluminum plate and a circulating copper tube embedded on the surface of the aluminum plate, and both ends of the circulating copper tube extend out of the aluminum plate and are connected to an external cooling water circuit.

[0010] Preferably, the circulating copper tube is a copper tube with a diameter of 14 mm, and the circulating copper tube is arranged in a circular bending manner.

[0011] Preferably, the number of the IGBT power modules is four, and the four IGBT power modules are fixed tightly to the surface of the water-cooled radiator via thermal grease.

[0012] Preferably, the number of the NTC temperature measuring resistors corresponds to the number of the IGBT power modules, and the pins of the NTC temperature measuring resistors are led to the bottom of the water-cooled radiator.

[0013] Preferably, the bottom of the laminated busbar is level with the top of the IGBT power module, and a hanging plate for mounting a power converter is provided on the side of the laminated busbar.

[0014] Preferably, the number of the support capacitors is 12, and all the support capacitors are equidistantly distributed in a rectangular shape.

[0015] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0016] First, the utility model pre-embeds the NTC temperature measuring resistor at the location where the IGBT power module is installed, so that the NTC temperature measuring resistor can directly measure the shell temperature of the IGBT power module, avoiding the problem that some IGBT power modules cannot directly measure the shell temperature of the IGBT power module because the mounting holes are insulated. Moreover, the NTC temperature measuring resistor is directly pre-embedded in the heat source area of the IGBT power module, avoiding the temperature gradient distribution on the IGBT power module shell and the radiator, thereby affecting the accuracy of temperature measurement, thereby achieving the effect of improving the accuracy of temperature measurement.

[0017] Second, the utility model changes the installation reference of the laminated busbar and takes the surface where the conductive terminals of the capacitor and IGBT power module are located as the installation reference. Its appearance and installation dimensions are independent of the height of the capacitor and the thickness of the radiator, which greatly adapts to applications under various cooling conditions, saves the mold cost of the laminated busbar, and improves versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the utility model;

[0019] Figure 2 This is a bottom view of the structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the circulating copper tube of the utility model;

[0021] Figure 4 This is a schematic diagram of the explosion installation of the NTC temperature measurement electrical structure of the utility model.

[0022] Among them: 1. Water-cooled radiator; 101. Circulating copper tube; 2. IGBT power module; 3. NTC temperature measuring resistor; 4. Laminated busbar; 5. Support capacitor. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] See also Figures 1-4 A water-cooling heat dissipation device for an IGBT power converter includes a water-cooling radiator 1, an IGBT power module 2 is fixedly connected to the top of the water-cooling radiator 1, and an NTC temperature measuring resistor 3 is installed on the top of the water-cooling radiator 1, and the NTC temperature measuring resistor 3 is located below the IGBT power module 2;

[0025] A laminated busbar 4 is installed on the side of the water-cooled radiator 1, and a supporting capacitor 5 is installed below the laminated busbar 4;

[0026] The laminated busbar 4 uses the capacitor terminals of the IGBT power converter and the IGBT power module 2 as reference surfaces, and the shape and size of the IGBT power converter mounting substrate are determined by the height of the capacitor and the thickness of the water-cooled radiator 1;

[0027] Specifically, it includes a water-cooled radiator 1, four NTC temperature measuring resistors 3, four IGBT power modules 2, a laminated busbar 4 and twelve supporting capacitors 5;

[0028] Water cooling radiator 1 Figure 3 and Figure 4 As shown, a circulating copper tube 101 is embedded in the surface of the aluminum plate. The circulating copper tube 101 is a 14 mm diameter copper tube. Its water inlet and outlet extend to the outside of the water-cooled radiator 1, which is convenient for connection with the external cooling water circuit. An NTC temperature measuring resistor 3 is pre-buried below the installation position of the IGBT power module 2 inside the water-cooled radiator 1 to measure the temperature of the IGBT power module 2.

[0029] like Figure 2 As shown, four IGBT power modules 2 are fixed tightly to the surface of the water-cooled radiator 1 via thermal grease, and the leads of the NTC temperature measuring resistor 3 are led out from the back of the water-cooled radiator 1 to facilitate wiring operations. Because the NTC temperature measuring resistor 3 is directly installed below the IGBT power module 2, it is convenient to directly measure the temperature of the IGBT power module 2;

[0030] The design of the laminated busbar 4 uses the capacitor terminals and the IGBT power module 2 terminals as reference planes, and determines the shape and size of the IGBT power converter mounting substrate based on the capacitor height and the thickness of the water-cooled radiator 1. This avoids the awkward situation where the laminated busbar 4 must be redesigned when the radiator needs to be thickened when switching from water cooling to air cooling, or when the capacitance of the supporting capacitor 5 is adjusted, causing the capacitor height to change. This improves the reuse rate of the laminated busbar 4.

[0031] Through the above technical solution, the NTC temperature measuring resistor 3 is pre-buried in the location where the IGBT power module 2 is installed, so that the NTC temperature measuring resistor 3 can directly measure the shell temperature of the IGBT power module 2, avoiding the problem that some IGBT power modules 2 cannot directly measure the shell temperature of the IGBT power module 2 because the mounting holes are insulated. Moreover, the NTC temperature measuring resistor 3 is directly pre-buried in the heat source area of the IGBT power module 2, avoiding the temperature gradient distribution on the IGBT power module 2 shell and the water-cooled radiator 1, thereby avoiding affecting the accuracy of temperature measurement, thereby achieving the effect of improving the accuracy of temperature measurement;

[0032] By changing the installation reference base of the laminated busbar 4 and taking the surface where the conductive terminals of the capacitor and the IGBT power module 2 are located as the installation base, its appearance and installation dimensions are independent of the height of the capacitor and the thickness of the water-cooled radiator 1, which greatly adapts to applications under various cooling conditions, saves the mold cost of the laminated busbar 4, and improves versatility.

[0033] Specifically, the circulating copper pipe 101 is arranged in a circular bending manner.

[0034] Through the above technical solution, the shape of the circulating copper tube 101 is set to increase the length of the circulating copper tube 101, thereby achieving the effect of increasing the heat dissipation area.

[0035] Specifically, the bottom of the laminated busbar 4 is level with the top of the IGBT power module 2 , and a hanging plate for mounting the power converter is provided on the side of the laminated busbar 4 .

[0036] Through the above technical solution, the reference surface of the traditional laminated busbar 4 design is changed, and the mounting terminals of the IGBT power module 2 and the mounting terminals of the capacitor are coplanar as a reference benchmark design. Its appearance and installation dimensions are independent of the height of the capacitor and the thickness of the water-cooled radiator 1, which greatly adapts to applications under various cooling conditions, saves the mold cost of the laminated busbar 4, and improves versatility.

[0037] Specifically, the number of the supporting capacitors 5 is 12, and all the supporting capacitors 5 are distributed equidistantly in a rectangular shape.

[0038] Through the above technical solution, the distribution pattern of the supporting capacitors 5 is designed, the purpose of which is to make the bottom of the laminated busbar 4 bear the force evenly, so that the supporting capacitors 5 can play a supporting role.

[0039] During use, by pre-burying the NTC temperature measuring resistor 3 at the position where the IGBT power module 2 is installed, the NTC temperature measuring resistor 3 can directly measure the case temperature of the IGBT power module 2, avoiding the problem that the case temperature of some IGBT power modules 2 cannot be directly measured due to the insulation treatment of the installation holes. Moreover, the NTC temperature measuring resistor 3 is directly pre-buried in the heat source area of the IGBT power module 2, avoiding the temperature gradient distribution on the housing of the IGBT power module 2 and the water-cooled radiator 1, thereby affecting the accuracy of temperature measurement, and achieving the effect of improving the temperature measurement accuracy;

[0040] By changing the installation reference datum of the laminated busbar 4, with the plane where the capacitor and the conductive terminals of the IGBT power module 2 are located as the installation reference, its shape and installation dimensions are independent of the height of the capacitor and the thickness dimension of the water-cooled radiator 1, greatly adapting to applications under various cooling conditions, saving the mold cost of the laminated busbar 4, and improving the versatility;

[0041] In terms of measuring the working temperature of the IGBT:

[0042] In existing solutions, the NTC temperature measuring resistor 3 is mostly crimped on the installation hole of the IGBT to measure the working temperature of the IGBT. When there is an insulating coating on the installation hole of the IGBT, there are great risks in this installation method, there is heat loss in the heat transfer loop, and it is not easy to accurately measure the case temperature of the IGBT.

[0043] This solution provides a method of pre-burying the NTC temperature measuring resistor 3 on the water-cooled radiator 1, which well solves the measurement method of the IGBT case temperature when there is an insulating coating on the IGBT installation hole.

[0044] In terms of the design of the laminated busbar 4 of the IGBT power converter:

[0045] Existing design solutions all use the lower end of the capacitor and the back surface of the radiator as the reference datum to design the laminated busbar 4, resulting in a height difference between the wiring terminals of the IGBT power module 2 and the wiring terminals of the capacitor. The design of the laminated busbar 4 must be bent to compensate for the height difference of the installation surface, which increases the manufacturing difficulty of the laminated busbar 4 and it is difficult to increase the current-carrying capacity. When it is necessary to change the cooling method of the IGBT power converter and increase the capacitance, it will inevitably affect the shape of the laminated busbar 4, resulting in the need to re-design the laminated busbar 4, or design the support substrate of the IGBT power converter into a special shape, which is not conducive to improving the power density.

[0046] The present invention changes the reference surface for the design of the traditional laminated busbar 4, designs with the installation terminals of the IGBT power module 2 and the installation terminals of the capacitor coplanar as the reference datum, and then designs the support substrate of the IGBT power converter into a special shape to improve the reuse rate of the laminated busbar 4 in turn.

[0047] When there is a need to change the cooling method of the IGBT power converter and increase the capacitance, most requirements can be met only by modifying the support substrate of the IGBT power converter, which greatly improves the reuse rate of the laminated busbar 4 and reduces the mold expenditure and the types of outsourced materials.

[0048] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An IGBT type power converter water cooling and heat dissipation device, comprising a water cooling radiator (1), characterized in that: The top of the water-cooled radiator (1) is fixedly connected to an IGBT power module (2). An NTC temperature-measuring resistor (3) is installed on the top of the water-cooled radiator (1), and the NTC temperature-measuring resistor (3) is located below the IGBT power module (2). A laminated busbar (4) is installed on the side of the water-cooled radiator (1), and a support capacitor (5) is installed below the laminated busbar (4). The laminated busbar (4) uses the capacitor terminals of the IGBT type power converter and the IGBT power module (2) as the reference planes, and determines the shape and size of the IGBT power converter mounting substrate based on the height of the capacitor and the thickness of the water-cooled radiator (1).

2. The water-cooled heat dissipation device for an IGBT type power converter according to claim 1, wherein: The water-cooled radiator (1) is composed of an aluminum plate and a circulating copper pipe (101) embedded in the surface of the aluminum plate. Both ends of the circulating copper pipe (101) extend out of the aluminum plate and are connected to an external cooling water circuit.

3. The water-cooled heat dissipation device for an IGBT type power converter according to claim 2, wherein: The circulating copper pipe (101) is a copper pipe with a diameter of 14 mm, and the circulating copper pipe (101) is arranged in a circulating and bending manner.

4. The water-cooled heat dissipation device for an IGBT type power converter according to claim 1, characterized in that: The number of the IGBT power modules (2) is four, and the four IGBT power modules (2) are fixed on the surface of the water-cooled radiator (1) by thermal conductive grease in close contact.

5. The water-cooled heat dissipation device for an IGBT type power converter according to claim 1, wherein: The number of the NTC temperature-measuring resistors (3) corresponds to the number of the IGBT power modules (2), and the leads of the NTC temperature-measuring resistors (3) are led to the bottom of the water-cooled radiator (1).

6. The water-cooled heat dissipation device for an IGBT type power converter according to claim 1, wherein: The bottom of the laminated busbar (4) is level with the top of the IGBT power module (2), and a hanging plate for installing a power converter is provided on the side of the laminated busbar (4).

7. An IGBT type power converter water-cooled heat dissipation device according to claim 1, characterized in that: The number of the support capacitors (5) is 12, and all the support capacitors (5) are evenly distributed at equal intervals in a rectangle.

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