Semiconductor heat dissipation wireless AP device

Abstract

The utility model relates to a semiconductor heat radiation wireless AP device, comprising an AP main body comprising a heat exchange top plate; the heat dissipation mechanism comprises a heat exchange base, a heat exchange base, a Tesla valve and a semiconductor chilling plate; the heat exchange base comprises a communicating hole; the Tesla valve is arranged in the heat exchange base and comprises a first Tesla side plate, a second Tesla side plate, a middle piece and a valve groove; and the semiconductor chilling plate is arranged in the heat exchange base. According to the utility model, the heat exchange top plate, the heat exchange pedestal, the semiconductor chilling plate, the heat exchange base, the Tesla valve and other parts are arranged, and the semiconductor chilling plate is matched with the heat exchange top plate, so that the semiconductor chilling plate can directly refrigerate and cool the AP main body, and meanwhile, the heating end above the semiconductor chilling plate emits heat, so that the heat exchange efficiency is improved. Heat is dissipated through the heat exchange base, the heat exchange base and the Tesla valve, and the heat dissipation effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of AP devices, and particularly relates to a semiconductor heat dissipation wireless AP device. Background Art

[0002] A wireless repeater is simply called a wireless AP. In an environment with a vast space, the coverage range of a wireless signal is more important than bandwidth and speed. Undoubtedly, using a repeater to expand the coverage range of a base station is a better choice.

[0003] In order to meet the actual needs, the existing wireless AP devices have a relatively high power, which causes a large amount of heat to be dissipated when the wireless AP devices are working. Most of the existing heat dissipation structures adopt passive heat dissipation, such as dissipating heat through metal heat dissipation fins. This method has a slow heat dissipation speed and cannot meet the actual needs.

[0004] Therefore, on this basis, a fan is set up for active heat dissipation. When the fan dissipates heat, it will be affected by the ambient temperature. When the ambient temperature is relatively high, the heat dissipation effect is poor. Moreover, the fan will also generate heat and noise during operation, affecting the heat dissipation effect and resulting in insufficient heat dissipation effect. Therefore, a semiconductor heat dissipation wireless AP device is proposed to solve the above-mentioned problems. Summary of the Utility Model

[0005] Based on the above description, the utility model provides a semiconductor heat dissipation wireless AP device to solve the problem of insufficient heat dissipation effect during heat dissipation by the fan and the heat dissipation fins.

[0006] The technical solution of the utility model to solve the above technical problems is as follows: A semiconductor heat dissipation wireless AP device, comprising: an AP main body, the AP main body includes a heat exchange top plate, a heat dissipation mechanism is arranged on the top of the AP main body, and includes a heat exchange base, a heat exchange base plate, a Tesla valve and a semiconductor refrigeration sheet. The heat exchange base is arranged at the top end of the AP main body, the heat exchange base plate is arranged at the top end of the heat exchange base, and includes a communication hole. The Tesla valve is arranged inside the heat exchange base plate and includes a first Tesla side plate, a second Tesla side plate, an intermediate member and a valve groove. The semiconductor refrigeration sheet is arranged inside the heat exchange base and is in contact with the heat exchange top plate.

[0007] On the basis of the above technical solution, the utility model can be further improved as follows.

[0008] Further, the AP main body includes a device main body, the upper surface of the device main body is provided with threaded blind holes and a heat exchange top plate, and the threaded blind holes are symmetrically distributed along the outer circle of the device main body.

[0009] Further, the heat exchange top plate is disposed at the center of the upper surface of the equipment main body. The heat exchange top plate is a metal heat exchange plate, and the heat exchange top plate extends into the interior of the equipment main body.

[0010] Further, the heat exchange base includes a base block. A base connecting plate is disposed on the outer surface of the base block. A positioning hole is disposed on the upper surface of the base connecting plate, and the positioning hole and the threaded blind hole are in one-to-one correspondence.

[0011] Further, a top plate mounting groove is disposed on the lower surface of the base block. A semiconductor mounting groove is disposed on the upper surface of the top plate mounting groove, and the size of the semiconductor mounting groove is smaller than the size of the top plate mounting groove.

[0012] Further, the heat exchange base includes a metal base. A positioning mounting groove is disposed on the upper surface of the metal base. A communication hole is disposed at the inner bottom wall of the positioning mounting groove, and the communication holes are equidistantly distributed.

[0013] Further, an air inlet groove is disposed on the lower surface of the metal base. The air inlet groove communicates with the communication hole. A positioning groove is disposed at the inner top wall of the air inlet groove. A fixed hollow cylinder is disposed on the outer surface of the metal base, and the fixed hollow cylinder and the positioning hole are in one-to-one correspondence.

[0014] Further, the Tesla valve includes a first Tesla side plate, a second Tesla side plate, and an intermediate member. The intermediate member is disposed between the first Tesla side plate and the second Tesla side plate. The Tesla valve is disposed inside the positioning mounting groove, and the intermediate member is a U-shaped metal plate.

[0015] Further, valve grooves are disposed on the opposite sides of the first Tesla side plate and the second Tesla side plate and on both sides of the intermediate member. Connecting holes are disposed on the surfaces of the first Tesla side plate, the second Tesla side plate, and the intermediate member. A positioning blind hole and a positioning convex block are respectively disposed on the opposite surfaces of the first Tesla side plate and the second Tesla side plate. Positioning blind holes and positioning convex blocks are respectively disposed on both side walls of the valve groove, and the positioning convex block extends into the adjacent positioning blind hole.

[0016] Further, the semiconductor refrigeration sheet is disposed inside the semiconductor mounting groove. The heat exchange top plate is disposed inside the top plate mounting groove. The heat exchange top plate is in contact with the refrigerating end of the semiconductor refrigeration sheet, and the heating end of the semiconductor refrigeration sheet is in contact with the inner top wall of the semiconductor mounting groove.

[0017] Compared with the prior art, the technical solution of the present application has the following beneficial technical effects:

[0018] 1. The utility model cools the AP main body by directly cooling with a semiconductor refrigeration sheet through the cooperation of a heat exchange top plate, a heat exchange base, a semiconductor refrigeration sheet, a heat exchange base and a Tesla valve. At the same time, the heating end above the semiconductor refrigeration sheet generates heat, and the heat is dissipated through the heat exchange base, the heat exchange base and the Tesla valve, achieving a heat dissipation effect.

[0019] 2. By setting the heat exchange base and the Tesla valve, the effect of accelerating the upward flow of hot air is achieved. The air below the heat exchange base is heated by the heat exchange base to become hot air, and the hot air is accelerated by the Tesla valve during the upward flow process, making the hot air discharge more quickly. After the hot air is discharged, the air on both sides of the heat exchange base is sucked in under the action of air pressure for heat exchange operation, enabling the heat dissipation mechanism to fully perform heat dissipation operation. Brief Description of the Drawings

[0020] Figure 1 It is a schematic structural diagram of a semiconductor heat dissipation wireless AP device provided by an embodiment of the utility model;

[0021] Figure 2 It is a structural sectional view of the heat dissipation mechanism in an embodiment of the utility model;

[0022] Figure 3 It is Figure 2 a schematic structural diagram of another perspective;

[0023] Figure 4 It is a schematic structural diagram of the AP main body in an embodiment of the utility model;

[0024] Figure 5 It is a schematic structural diagram of the heat exchange base in an embodiment of the utility model;

[0025] Figure 6 It is Figure 5 a schematic structural diagram of another perspective;

[0026] Figure 7 It is a schematic structural diagram of the heat exchange base in an embodiment of the utility model;

[0027] Figure 8 It is Figure 7 a schematic structural diagram of another perspective;

[0028] Figure 9 It is a schematic structural diagram of the Tesla valve in an embodiment of the utility model;

[0029] Figure 10 It is a schematic structural diagram of another perspective of the first Tesla side plate in the figure;

[0030] Figure 11It is a schematic structural diagram of another perspective of the second Tesla side plate in the figure;

[0031] Figure 12 It is a schematic structural diagram of another perspective of the middleware in the figure;

[0032] In the accompanying drawings, the list of components represented by each reference numeral is as follows:

[0033] 1. AP main body; 11. Equipment main body; 12. Threaded blind hole; 13. Heat exchange top plate; 2. Heat exchange base; 21. Base block; 22. Base connection plate; 23. Positioning hole; 24. Semiconductor installation groove; 25. Top plate installation groove; 3. Heat exchange base; 31. Metal base; 32. Positioning installation groove; 33. Communication hole; 34. Air inlet groove; 35. Positioning groove; 36. Fixed hollow cylinder; 4. Tesla valve; 41. First Tesla side plate; 42. Second Tesla side plate; 43. Middleware; 44. Positioning blind hole; 45. Positioning convex block; 46. Connection hole; 47. Valve groove; 5. Semiconductor refrigeration sheet. Detailed implementation manners

[0034] To facilitate the understanding of this application, the following will describe this application more comprehensively with reference to the relevant accompanying drawings. Embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application in this specification are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0036] It can be understood that spatial relationship terms such as "under", "below", "lower", "beneath", "above", "upper", etc. can be used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, spatial relationship terms also include different orientations of the device during use and operation. For example, if the device in the drawing is flipped, the element or feature described as "under other elements" or "beneath it" or "under it" will be oriented "above" other elements or features. Therefore, the exemplary terms "under" and "below" can include both the upper and lower orientations. In addition, the device can also include other orientations (such as rotating 90 degrees or other orientations), and the spatial description terms used herein are accordingly interpreted.

[0037] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediate element. In the following embodiments, "connection", if there is a transmission of electrical signals or data between the connected circuits, modules, units, etc., should be understood as "electrical connection", "communication connection", etc.

[0038] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprises / include" or "has" etc. specify the presence of the stated features, wholes, steps, operations, components, parts or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0039] Please refer to Figure 1 and Figure 4 , a semiconductor heat dissipation wireless AP device, comprising:

[0040] The AP main body 1, which includes a heat exchange top plate 13;

[0041] The AP main body 1 includes a device main body 11, on the upper surface of the device main body 11, there are provided blind threaded holes 12 and a heat exchange top plate 13. The blind threaded holes 12 are symmetrically distributed along the outer circle of the device main body 11. The heat exchange top plate 13 is arranged at the center of the upper surface of the device main body 11. The heat exchange top plate 13 is a metal heat exchange plate, and the heat exchange top plate 13 extends into the interior of the device main body 11;

[0042] Based on the above, the device main body 11 is an existing wireless AP device, that is, the prior art. Therefore, the internal structure thereof is not described herein in detail. The blind threaded holes 12 enable the heat dissipation mechanism to be fixed on the upper surface of the AP main body 1 by screws. The setting of the heat exchange top plate 13 enables the semiconductor refrigeration sheet 5 to directly perform heat exchange operations with the AP main body 1.

[0043] Such as Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 shown, a heat exchange base 2, which is arranged at the top of the AP main body 1;

[0044] The heat exchange base 2 includes a base block 21. A base connecting plate 22 is provided on the outer surface of the base block 21. A positioning hole 23 is provided on the upper surface of the base connecting plate 22. The positioning hole 23 and the threaded blind hole 12 are in a one-to-one correspondence. A top plate mounting groove 25 is provided on the lower surface of the base block 21. A semiconductor mounting groove 24 is provided on the upper surface of the top plate mounting groove 25. The size of the semiconductor mounting groove 24 is smaller than that of the top plate mounting groove 25.

[0045] Based on the above, the base block 21 is fixed on the upper surface of the AP main body 1 through screws and the base connecting plate 22. The semiconductor refrigeration sheet 5 can be installed inside the semiconductor mounting groove 24, and the top plate 13 extends into the top plate mounting groove 25. At this time, the top plate 13 is in contact with the lower surface of the semiconductor refrigeration sheet 5, that is, the refrigeration end of the semiconductor refrigeration sheet 5 is in contact with the top plate 13, thereby realizing the effect of cooling the AP main body 1 through the top plate 13.

[0046] As Figure 1 、 Figure 2 、 Figure 3 、 Figure 7 And Figure 8 As shown, a heat exchange base 3 is provided at the top of the heat exchange base 2 and includes a communication hole 33.

[0047] The heat exchange base 3 includes a metal base 31. A positioning installation groove 32 is provided on the upper surface of the metal base 31. A communication hole 33 is provided at the bottom wall of the positioning installation groove 32. The communication holes 33 are equidistantly distributed. An air intake groove 34 is provided on the lower surface of the metal base 31. The air intake groove 34 communicates with the communication hole 33. A positioning groove 35 is provided at the top wall of the air intake groove 34. A fixed hollow cylinder 36 is provided on the outer surface of the metal base 31. The fixed hollow cylinder 36 and the positioning hole 23 are in a one-to-one correspondence.

[0048] Based on the above, the setting of the positioning installation groove 32 provides an installation space for the Tesla valve 4, so that the Tesla valve 4 can be fixed inside the positioning installation groove 32 through screws. The setting of the communication hole 33 enables the air intake groove 34, the communication hole 33 and the external space to communicate with the Tesla valve 4, that is, the external air can flow through the air intake groove 34 and the communication hole 33 and then enter the inside of the Tesla valve 4. The setting of the positioning groove 35 makes the connection between the heat exchange base 3 and the heat exchange base 2 more stable. The setting of the fixed hollow cylinder 36 enables the heat exchange base 3 to be connected to the heat exchange base 2 and the AP main body 1 through screws.

[0049] As Figure 1 、 Figure 2 、 Figure 3 、 Figure 9 、 Figure 10 、Figure 11 and Figure 12 As shown in Figure 12 , the Tesla valve 4 is disposed inside the heat exchange base 3 and includes a first Tesla side plate 41, a second Tesla side plate 42, a middle member 43, and a valve groove 47;

[0050] The Tesla valve 4 includes a first Tesla side plate 41, a second Tesla side plate 42, and a middle member 43. The middle member 43 is disposed between the first Tesla side plate 41 and the second Tesla side plate 42. The Tesla valve 4 is disposed inside the positioning and mounting groove 32. The middle member 43 is a U-shaped metal plate;

[0051] Valve grooves 47 are provided on opposite sides of the first Tesla side plate 41 and the second Tesla side plate 42 and on both sides of the middle member 43. Connecting holes 46 are provided on the surfaces of the first Tesla side plate 41, the second Tesla side plate 42, and the middle member 43. Positioning blind holes 44 and positioning protrusions 45 are respectively provided on the surfaces of opposite sides of the first Tesla side plate 41 and the second Tesla side plate 42. Positioning blind holes 44 and positioning protrusions 45 are respectively provided on both side walls of the valve groove 47. The positioning protrusion 45 extends into the adjacent positioning blind hole 44;

[0052] The semiconductor refrigeration sheet 5 is disposed inside the heat exchange base 2 and is in contact with the heat exchange top plate 13. The semiconductor refrigeration sheet 5 is disposed inside the semiconductor mounting groove 24. The heat exchange top plate 13 is disposed inside the top plate mounting groove 25. The heat exchange top plate 13 is in contact with the refrigerating end of the semiconductor refrigeration sheet 5. The heating end of the semiconductor refrigeration sheet 5 is in contact with the inner top wall of the semiconductor mounting groove 24;

[0053] Based on the above, the refrigerating end of the semiconductor refrigeration sheet 5 is disposed at the lower end of the semiconductor refrigeration sheet 5. When the semiconductor refrigeration sheet 5 works, heat is generated at the upper end and refrigeration is performed at the lower end. The refrigerating end cools the AP main body 1 through the heat exchange top plate 13. The heat dissipated by the heating end is transferred to the heat exchange base 3 and the Tesla valve 4 through the heat exchange base 2. In this process, the heat exchange base 3 and the Tesla valve 4 play the role of heat exchange with the external air. The setting of the Tesla valve 4 can accelerate the hot air, so that the hot air between the heat exchange base 3 and the heat exchange base 2 can be discharged through the Tesla valve 4 faster. After being discharged, the external air can enter again, increasing the heat dissipation effect by accelerating the air flow. The setting of the positioning blind holes 44 and the positioning protrusions 45 makes the adjacent first Tesla side plate 41, second Tesla side plate 42, and middle member 43 more stable when installed inside the mounting groove 32.

[0054] In actual use of this embodiment, by energizing the semiconductor refrigeration chip 5, the refrigerating end of the semiconductor refrigeration chip 5 located below is made to refrigerate, and the AP main body 1 is cooled by the heat exchange top plate 13 in contact with the refrigerating end;

[0055] At the same time, the heating end of the semiconductor refrigeration chip 5 located above starts to generate heat. At this time, the heat generated by the heating end is transferred to the heat exchange base 2, the heat exchange bottom base 3 and the Tesla valve 4. At this time, the heat exchange bottom base 3 and the Tesla valve 4 exchange heat with the external air at the same time, which achieves the effect of preliminary heat dissipation;

[0056] In the above process, the air between the heat exchange bottom base 3 and the heat exchange base 2 is heated into hot air. When the hot air rises, it is accelerated by the Tesla valve 4, so that the hot air can be discharged faster. While discharging the hot air, the external normal-temperature air enters between the heat exchange bottom base 3 and the heat exchange base 2;

[0057] This semiconductor heat dissipation wireless AP device is provided with a semiconductor refrigeration chip 5 and a heat exchange top plate 13, so that the AP main body 1 is directly cooled by the refrigerating end of the semiconductor refrigeration chip 5. In this process, the heat generated by the heating end of the semiconductor refrigeration chip 5 is dissipated by the heat exchange base 2, the heat exchange bottom base 3 and the Tesla valve 4, and the characteristic that the Tesla valve 4 can accelerate the unidirectional air flow is fully utilized to make the hot air be discharged faster, so as to increase the heat dissipation effect. Compared with the traditional heat dissipation method using a fan, this AP device can not only cool the AP main body 1 faster, but also make the heat dissipation process of the semiconductor refrigeration chip 5 faster.

[0058] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor heat dissipation wireless AP device, characterized in that Comprising: An AP main body (1), which includes a heat exchange top plate (13); A heat dissipation mechanism, which is arranged on the top of the AP main body (1) and includes a heat exchange base (2), a heat exchange base (3), a Tesla valve (4) and a semiconductor refrigeration sheet (5), wherein, The heat exchange base (2) is arranged at the top end of the AP main body (1); The heat exchange base (3) is arranged at the top end of the heat exchange base (2) and includes a communication hole (33); The Tesla valve (4) is arranged inside the heat exchange base (3) and includes a first Tesla side plate (41), a second Tesla side plate (42), a middle piece (43) and a valve groove (47); The semiconductor refrigeration sheet (5) is arranged inside the heat exchange base (2) and is in contact with the heat exchange top plate (13).

2. The semiconductor heat dissipation wireless AP device according to claim 1, characterized in that The AP main body (1) includes an equipment main body (11), and the upper surface of the equipment main body (11) is provided with threaded blind holes (12) and a heat exchange top plate (13), and the threaded blind holes (12) are symmetrically distributed along the outer circle of the equipment main body (11).

3. The semiconductor heat dissipation wireless AP device according to claim 2, wherein The heat exchange top plate (13) is arranged at the center of the upper surface of the equipment main body (11), the heat exchange top plate (13) is a metal heat exchange plate, and the heat exchange top plate (13) extends into the equipment main body (11).

4. The semiconductor heat dissipation wireless AP device according to claim 2, characterized in that, The heat exchange base (2) includes a base block (21), the outer surface of the base block (21) is provided with a base connecting plate (22), the upper surface of the base connecting plate (22) is provided with positioning holes (23), and the positioning holes (23) and the threaded blind holes (12) are in a one-to-one correspondence relationship.

5. The semiconductor heat dissipation wireless AP device according to claim 4, wherein The lower surface of the base block (21) is provided with a top plate installation groove (25), the upper surface of the top plate installation groove (25) is provided with a semiconductor installation groove (24), and the size of the semiconductor installation groove (24) is smaller than the size of the top plate installation groove (25).

6. The semiconductor heat dissipation wireless AP device according to claim 4, wherein The heat exchange base (3) includes a metal base (31), the upper surface of the metal base (31) is provided with a positioning installation groove (32), a communication hole (33) is arranged at the bottom wall of the positioning installation groove (32), and the communication holes (33) are equidistantly distributed.

7. The semiconductor heat dissipation wireless AP device according to claim 6, characterized in that, The lower surface of the metal base (31) is provided with an air inlet groove (34), the air inlet groove (34) is communicated with the communication hole (33), a positioning groove (35) is arranged at the top wall of the air inlet groove (34), and the outer surface of the metal base (31) is provided with a fixed hollow cylinder (36), and the fixed hollow cylinder (36) and the positioning hole (23) are in a one-to-one correspondence relationship.

8. The semiconductor heat dissipation wireless AP device according to claim 6, characterized in that The Tesla valve (4) includes a first Tesla side plate (41), a second Tesla side plate (42) and a middle piece (43), the middle piece (43) is arranged between the first Tesla side plate (41) and the second Tesla side plate (42), the Tesla valve (4) is arranged inside the positioning installation groove (32), and the middle piece (43) is a U-shaped metal plate.

9. The semiconductor heat dissipation wireless AP device according to claim 8, characterized in that, Valve grooves (47) are provided on both opposite sides of the first Tesla side plate (41) and the second Tesla side plate (42) and on both sides of the middle piece (43). Connecting holes (46) are provided on the surfaces of the first Tesla side plate (41), the second Tesla side plate (42), and the middle piece (43). Positioning blind holes (44) and positioning bumps (45) are respectively provided on the surfaces of the opposite sides of the first Tesla side plate (41) and the second Tesla side plate (42). Positioning blind holes (44) and positioning bumps (45) are respectively provided on both side walls of the valve groove (47), and the positioning bump (45) extends into the interior of the adjacent positioning blind hole (44).

10. The semiconductor heat dissipation wireless AP device according to claim 5, characterized in that, The semiconductor refrigeration sheet (5) is arranged inside the semiconductor installation groove (24), the heat exchange top plate (13) is arranged inside the top plate installation groove (25), the heat exchange top plate (13) is in contact with the refrigerating end of the semiconductor refrigeration sheet (5), and the heating end of the semiconductor refrigeration sheet (5) is in contact with the inner top wall of the semiconductor installation groove (24).

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