Ultrathin printed circuit board for Mini LED

Abstract

The utility model belongs to the technical field of light-emitting diodes, in particular to an ultrathin printed circuit board for Mini LEDs, which comprises a circuit board main body and further comprises welding plates embedded on the circuit board main body in an array mode, and lamp bead bodies are installed on the welding plates. The heat dissipation part comprises a frame and heat dissipation fans installed on the frame at equal intervals, and the frame is fixedly connected to one side of the bottom of the circuit board body; and the heat conduction mechanism comprises a heat dissipation plate embedded in the circuit board main body. According to the utility model, the heat conduction mechanism is arranged on the circuit board main body, the heat conduction mechanism mainly comprises the heat conduction sheet and the heat dissipation plate, heat can be conducted out, the heat dissipation part is arranged on one side of the circuit board main body, and the heat dissipation part can generate wind power to take away the heat at the heat conduction mechanism, so that the heat is prevented from being gathered near the circuit board main body; therefore, the problem of poor heat dissipation effect of the LED printed circuit board at the present stage is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of light-emitting diodes, in particular to an ultra-thin printed circuit board for Mini LEDs. Background Technique

[0002] The light-emitting diode is abbreviated as LED and is made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc. It is a semiconductor component. Initially, it was mostly used as an indicator light, display light-emitting diode board, etc. With the emergence of white light LEDs, it is also used for lighting. There is a printed circuit board inside the LED. When the printed circuit board is used, the LED lamp body components need to be soldered to the solder pads on the circuit board.

[0003] After retrieval, the patent number CN202322466815.6 discloses an LED printed circuit board. This solution can remove excess solder paste by cleaning components such as the outer ring, avoiding waste. Another example is a Mini-LED printed circuit board disclosed in the patent number CN202123036698.7, which has the characteristics of high pad accuracy, simple production process, and high yield. However, both printed circuit boards in these two solutions have a drawback, that is, there is no heat dissipation mechanism on the printed circuit board. When the LED printed circuit board is in use, due to the working relationship of the circuit and the lamp beads, high temperature is easily generated. If heat cannot be dissipated in time, it will affect the components and then affect the service life of the LED. Therefore, the utility model proposes an ultra-thin printed circuit board for Mini LEDs to solve this problem. Summary of the Utility Model

[0004] (I) Technical Problem to be Solved

[0005] Aiming at the deficiencies of the prior art, the utility model provides an ultra-thin printed circuit board for Mini LEDs. By setting a heat conduction mechanism on the circuit board body, heat can be exported, and a heat dissipation component is installed on one side of the circuit board body. The heat dissipation component can generate a wind force effect, and then take away the heat at the heat conduction mechanism, avoiding heat accumulation near the circuit board body, forming heat dissipation of the components, and solving the problem of poor heat dissipation effect of the current LED printed circuit board.

[0006] (II) Technical Solution

[0007] The utility model specifically adopts the following technical solutions to achieve the above purposes:

[0008] An ultra-thin printed circuit board for Mini LED, including a circuit board body, further comprising: welding pads, which are arrayed and embedded on the circuit board body, and lamp bead bodies are installed on the welding pads; a heat dissipation component, including a frame and heat dissipation fans installed on the frame at equal intervals, and the frame is fixedly connected to one side of the bottom of the circuit board body; a heat conduction mechanism, including heat dissipation plates embedded on the circuit board body, there are multiple heat dissipation plates, and the multiple heat dissipation plates are arranged at equal intervals, and heat dissipation channels are formed between adjacent two heat dissipation plates, and the extending direction of the heat dissipation channels is the same as the air outlet direction of the heat dissipation fans.

[0009] Further, strip-shaped cavity grooves are formed on the circuit board body at equal intervals, and a groove is formed on one side of the strip-shaped cavity grooves on the upper surface of the circuit board body. The heat dissipation plates are embedded at the strip-shaped cavity grooves of the circuit board body, and the heat conduction sheets integrally formed at the tops of the heat dissipation plates are adapted to the grooves.

[0010] Further, heat dissipation holes are formed on the heat dissipation plates at equal intervals along the extending direction of the heat dissipation plates.

[0011] Further, heat dissipation protrusions arranged horizontally are fixedly connected to both sides of the heat dissipation plates, and heat dissipation silicone grease is coated on both the heat dissipation plates and the heat dissipation protrusions.

[0012] Further, reinforcing plates are formed by folding on both sides of the frame, and the frame is fixed to the circuit board body and external components through the reinforcing plates arranged on both sides thereof.

[0013] Further, a support pad is fixedly connected to the other side of the bottom of the circuit board body.

[0014] Further, the lamp bead bodies are connected in series between the heat dissipation fans.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the utility model provides an ultra-thin printed circuit board for Mini LED, which has the following beneficial effects:

[0017] In this utility model, by arranging heat conduction mechanisms at equidistant intervals on the main circuit board body, the heat conduction mechanisms are composed of heat conduction sheets, heat dissipation plates, heat dissipation protrusions, etc., and heat dissipation channels are formed between adjacent two heat dissipation plates. Moreover, a heat dissipation component is installed on one side of the bottom of the main circuit board body, and the heat dissipation component is composed of a frame and a heat dissipation fan assembled on the frame. The air outlet direction of the heat dissipation fan is the same as the extension direction of the heat dissipation channel. During operation, the heat conduction mechanism can conduct the heat on the main circuit board body through the heat conduction sheet and the heat dissipation plate, gathering near the heat dissipation channel. And when the heat dissipation fan operates, it can take away the heat at the heat dissipation channel, thereby forming a rapid heat dissipation effect for the main circuit board body, which can prevent the temperature of the circuits and the lamp bead bodies on the main circuit board body from being too high, thus affecting the normal use of the LED, ensuring the working state of the Mini LED, and prolonging its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a structural schematic diagram of this utility model;

[0019] Figure 2 is a cross-sectional view of the main circuit board body in this utility model;

[0020] Figure 3 is a structural schematic diagram of the heat conduction mechanism in this utility model;

[0021] Figure 4 is a structural schematic diagram of the heat dissipation component in this utility model;

[0022] Figure 5 is a bottom perspective view of this utility model.

[0023] In the figures: 1, main circuit board body; 2, welding pad; 3, lamp bead body; 4, heat dissipation component; 401, frame; 402, reinforcement plate; 403, heat dissipation fan; 5, heat conduction mechanism; 501, heat conduction sheet; 502, heat dissipation plate; 503, heat dissipation hole; 504, heat dissipation protrusion; 6, support pad; 7, strip-shaped cavity groove; 8, groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] Next, the technical solutions in the embodiments of this utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, rather than all of the embodiments. Based on the embodiments in this utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this utility model.

[0025] Embodiment

[0026] As Figure 1 , Figure 2 , Figure 3 , Figure 4And Figure 5 As shown in the figure, a Mini LED ultra-thin printed circuit board proposed by an embodiment of the present utility model includes a circuit board main body 1, and further includes: welding pads 2, which are arrayed and embedded on the circuit board main body 1, and lamp bead bodies 3 are installed on the welding pads 2; a heat dissipation component 4, including a frame 401 and heat dissipation fans 403 installed at equal distances on the frame 401, and the frame 401 is fixedly connected to one side of the bottom of the circuit board main body 1; a heat conduction mechanism 5, including heat dissipation plates 502 embedded on the circuit board main body 1, there are multiple heat dissipation plates 502, and the multiple heat dissipation plates 502 are arranged at equal distances, and heat dissipation channels are formed between adjacent two heat dissipation plates 502, and the extending direction of the heat dissipation channels is the same as the air outlet direction of the heat dissipation fans 403.

[0027] It should be noted that the circuit board main body 1 is the main part of the Mini LED printed circuit board. By arranging the arrayed welding pads 2 on the circuit board main body 1, it is used for the installation of the lamp bead bodies 3. By installing the heat dissipation component 4 on one side of the circuit board main body 1, the heat dissipation component 4 is mainly composed of a frame 401 and heat dissipation fans 403. The frame 401 is used for the installation of the heat dissipation fans 403. When the heat dissipation fans 403 work, they can generate a wind force effect, and then take away the heat near the circuit board main body 1 through the wind force effect. By arranging the equally spaced heat conduction mechanism 5 on the circuit board main body 1, it can play a role in heat conduction. The main part of the heat conduction mechanism 5 is the heat dissipation plate 502, and the heat dissipation plate 502 can achieve the effect of heat transfer, and then take away the heat on the circuit board main body 1. The heat dissipation plates 502 are arranged at equal distances, and a heat dissipation passband is formed between adjacent two heat dissipation plates 502. The extending direction of the heat dissipation channels is the same as the air outlet direction of the heat dissipation fans 403. When the heat dissipation fans 403 work, they can blow the wind force effect towards the heat dissipation channels, and then quickly take away the heat near the heat dissipation plates 502, achieving the purpose of rapid heat dissipation.

[0028] As Figure 2 And Figure 3 As shown in the figure, in some embodiments, strip-shaped cavity grooves 7 are arranged at equal distances on the circuit board main body 1, and a groove 8 is opened on one side of the upper surface of the circuit board main body 1 where the strip-shaped cavity grooves 7 are located. The heat dissipation plates 502 are embedded at the strip-shaped cavity grooves 7 of the circuit board main body 1, and the heat conduction sheets 501 integrally formed at the tops of the heat dissipation plates 502 are adapted to the grooves 8.

[0029] It should be noted that by opening the strip-shaped cavity grooves 7 on the circuit board main body 1, it is used for the assembly of the heat dissipation plates 502. By arranging the grooves 8 at the strip-shaped cavity grooves 7 of the circuit board main body 1, the adaptation assembly of the heat conduction sheets 501 can be realized, and the heat on the circuit board main body 1 can be absorbed and taken away through the heat conduction sheets 501 and the heat dissipation plates 502, and then it is convenient for the heat of the circuit board main body 1 to dissipate.

[0030] As Figure 3As shown, in some embodiments, heat dissipation holes 503 are provided at equal intervals along the extending direction of the heat dissipation plate 502 on the heat dissipation plate 502.

[0031] It should be noted that the setting of the heat dissipation holes 503 facilitates the dissipation of heat on the heat dissipation plate 502, achieving the purpose of accelerating heat dissipation.

[0032] As Figure 3 shown, in some embodiments, heat dissipation protrusions 504 are fixedly connected to both sides of the heat dissipation plate 502 in a horizontal direction, and heat dissipation silicone grease is coated on both the heat dissipation plate 502 and the heat dissipation protrusions 504.

[0033] It should be noted that the setting of the heat dissipation protrusions 504 can increase the heat dissipation area of the heat dissipation plate 502, thereby accelerating heat dissipation. By coating heat dissipation silicone grease on both the heat dissipation plate 502 and the heat dissipation protrusions 504, it is convenient for heat to dissipate.

[0034] As Figure 1 and Figure 4 shown, in some embodiments, reinforcement plates 402 are formed by folding on both sides of the frame 401, and the frame 401 is fixed to the circuit board main body 1 and external components through the reinforcement plates 402 provided on both sides thereof.

[0035] It should be noted that the setting of the reinforcement plates 402 facilitates the installation and fixation of the frame 401 on external components.

[0036] As Figure 1 shown, in some embodiments, a support pad 6 is fixedly connected to the other side of the bottom of the circuit board main body 1 to support the circuit board main body 1.

[0037] As Figure 1 and Figure 4 shown, in some embodiments, the lamp bead body 3 is connected in series with the heat dissipation fan 403.

[0038] It should be noted that the series connection between the two enables them to work simultaneously. When the lamp bead body 3 works, the heat dissipation fan 403 also works accordingly to dissipate heat from it in real time.

[0039] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An ultra-thin printed circuit board for Mini LED, comprising a circuit board body (1), characterized in that, It further includes: Welding pads (2) are arrayed and embedded on the circuit board body (1), and lamp bead bodies (3) are installed on the welding pads (2); A heat dissipation component (4), including a frame (401) and heat dissipation fans (403) installed at equal distances on the frame (401), and the frame (401) is fixedly connected to one side of the bottom of the circuit board body (1); A heat conduction mechanism (5), including heat dissipation plates (502) embedded on the circuit board body (1), there are multiple heat dissipation plates (502), the multiple heat dissipation plates (502) are arranged at equal distances, and heat dissipation channels are formed between adjacent two heat dissipation plates (502), and the extending direction of the heat dissipation channels is the same as the air outlet direction of the heat dissipation fan (403).

2. The ultra-thin printed circuit board for Mini LED according to claim 1, wherein: Strip-shaped cavity grooves (7) are equidistantly distributed on the circuit board body (1), and a groove (8) is formed on one side of the strip-shaped cavity groove (7) on the upper surface of the circuit board body (1), the heat dissipation plate (502) is embedded at the strip-shaped cavity groove (7) of the circuit board body (1), and the heat conduction sheet (501) integrally formed at the top of the heat dissipation plate (502) is adapted to the groove (8).

3. The ultra-thin printed circuit board for Mini LED according to claim 1, wherein: Heat dissipation holes (503) are equidistantly distributed on the heat dissipation plate (502) along the extending direction of the heat dissipation plate (502).

4. The ultra-thin printed circuit board for Mini LED according to claim 1, wherein: Both sides of the heat dissipation plate (502) are fixedly connected with horizontally arranged heat dissipation protrusions (504), and heat dissipation silicone grease is coated on both the heat dissipation plate (502) and the heat dissipation protrusions (504).

5. The ultra-thin printed circuit board for Mini LED according to claim 1, wherein: Reinforcement plates (402) are formed by folding on both sides of the frame (401), and the frame (401) is fixed to the circuit board body (1) and external components through the reinforcement plates (402) arranged on both sides thereof.

6. The ultra-thin printed circuit board for Mini LED according to claim 1, wherein: A support pad (6) is fixedly connected to the other side of the bottom of the circuit board body (1).

7. The ultra-thin printed circuit board for Mini LED according to claim 1, wherein: The lamp bead body (3) is connected in series with the heat dissipation fan (403).

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