Radiator and power conversion equipment

Abstract

The utility model discloses a radiator and power conversion equipment, the radiator comprises a substrate, a substrate radiating part and a heat pipe radiating unit, the substrate is provided with a first plate surface and a second plate surface, the first plate surface is used for exchanging heat with a power heating device, and the substrate radiating part is arranged on the second plate surface; the heat pipe radiating unit is provided with a heat pipe evaporation section, a heat pipe condensation section and heat pipe radiating fins; wherein the heat pipe evaporation section is used for exchanging heat with a substrate; the heat pipe condensation section is located on the side, corresponding to the second plate face, of the base plate, and the heat pipe cooling fins are sequentially arranged on the heat pipe condensation section at intervals. According to the radiator, through the radiating fin structure of two radiating ways, the overall radiating fin area is greatly increased, and the radiating performance of the radiator is greatly improved.

Description

Technical Field

[0001] This application relates to the technical field of equipment heat dissipation, and more specifically, to a radiator and a power conversion device. Background Art

[0002] In current power conversion devices, power semiconductor devices with high heat flux density often require radiators to dissipate heat. However, as the heat flux density of power semiconductor devices increases, the heat dissipation performance of radiators with existing structures has reached a bottleneck and can no longer meet higher heat dissipation requirements.

[0003] Therefore, how to improve the heat dissipation performance of radiators has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0004] In view of this, this application provides a radiator and a power conversion device to improve the heat dissipation performance of the radiator.

[0005] To achieve the above object, on the one hand, this application provides the following technical solutions:

[0006] A radiator, comprising:

[0007] A substrate having a first plate surface and a second plate surface arranged oppositely, and the first plate surface is used for heat exchange with a power heating device;

[0008] A substrate heat dissipation part arranged on the second plate surface;

[0009] A heat pipe heat dissipation unit having a heat pipe evaporation section, a heat pipe condensation section, and heat pipe heat dissipation fins; wherein, the heat pipe evaporation section is arranged on the substrate for heat exchange with the substrate; the heat pipe condensation section is located on one side of the substrate corresponding to the second plate surface, and the heat pipe heat dissipation fins are arranged on the heat pipe condensation section at intervals in sequence.

[0010] In some embodiments of this application, an embedding opening is provided on one side of the substrate corresponding to the first plate surface, and the heat pipe evaporation section is embedded in the embedding opening.

[0011] In some embodiments of this application, a fixing substrate for pressing and fixing the heat pipe evaporation section on the first plate surface is further provided on one side of the substrate corresponding to the first plate surface.

[0012] In some embodiments of this application, the heat pipe evaporation section and the heat pipe condensation section are connected by a heat pipe connection section, and the heat pipe connection section is configured as a bent structure so that the heat pipe condensation section and the heat pipe evaporation section are arranged at an angle;

[0013] Wherein, the heat pipe connection section is arranged on the outer end side of the substrate; alternatively, an avoidance groove is provided on the substrate, and the heat pipe connection section is bent and led out from the avoidance groove.

[0014] In some embodiments of the present application, the substrate heat dissipation part is a heat dissipation fin, and the heat dissipation fin is perpendicular to the second plate surface; and / or, the heat pipe heat dissipation fin is parallel to the second plate surface.

[0015] In some embodiments of the present application, the heat pipe heat dissipation unit includes a first heat pipe heat dissipation unit and / or a second heat pipe heat dissipation unit;

[0016] Wherein, the first heat pipe heat dissipation unit includes a first heat pipe evaporation section, a first heat pipe condensation section and a first heat pipe heat dissipation fin, and the first heat pipe condensation section and the first heat pipe heat dissipation fin thereon are arranged on the first side of the substrate fin group formed by the substrate heat dissipation part; the second heat pipe heat dissipation unit includes a second heat pipe evaporation section, a second heat pipe condensation section and a second heat pipe heat dissipation fin, and the second heat pipe condensation section and the second heat pipe heat dissipation fin thereon are arranged on the second side of the substrate fin group.

[0017] In some embodiments of the present application, the first side of the substrate fin group and the second side of the substrate fin group are configured as two opposite sides of the substrate fin group.

[0018] In some embodiments of the present application, the first heat pipe evaporation section and the second heat pipe evaporation section are configured as a split structure; alternatively, the first heat pipe evaporation section and the second heat pipe evaporation section are configured as an integral structure.

[0019] In some embodiments of the present application, the number of the heat pipe heat dissipation units is at least two; and adjacent heat pipe heat dissipation units share the heat pipe heat dissipation fins.

[0020] Compared with the content of the background art introduction, the above radiator includes a substrate, a substrate heat dissipation part, and a heat pipe heat dissipation unit. Among them, the substrate has a first plate surface and a second plate surface arranged oppositely. The first plate surface is used for heat exchange with the power generating device, and the substrate heat dissipation part is arranged on the second plate surface. The heat pipe heat dissipation unit has a heat pipe evaporation section, a heat pipe condensation section, and heat pipe heat dissipation fins. Among them, the heat pipe evaporation section is arranged on the substrate for heat exchange with the substrate; the heat pipe condensation section is located on one side of the substrate corresponding to the second plate surface, and the heat pipe heat dissipation fins are arranged on the heat pipe condensation section in a sequentially spaced manner. In the actual application process of this radiator, heat exchange is carried out between the first plate surface and the corresponding power generating device on the power conversion device, so that the heat of the power generating device can be transferred to the substrate. On the one hand, the substrate dissipates heat through the substrate heat dissipation part arranged on the second plate surface, thus realizing one heat dissipation path. On the other hand, the heat pipe evaporation section of the heat pipe heat dissipation unit can absorb the heat of the substrate, the absorbed heat is transferred to the heat pipe condensation section, and then the heat pipe heat dissipation fins on the heat pipe condensation section carry out condensation heat dissipation, which can realize another heat dissipation path. Therefore, by adopting the above radiator, the heat pipe heat dissipation fins are directly arranged on the heat pipe condensation section, effectively reducing the heat transfer path, which helps to enhance the heat exchange efficiency of the heat pipe, and a more efficient heat dissipation effect can be achieved by using the heat pipe phase change heat dissipation principle; in addition, the substrate has a heat dissipation fin structure with two heat dissipation paths, greatly increasing the total heat dissipation fin area and greatly improving the heat dissipation performance of the radiator.

[0021] On the other hand, the present application also provides a power conversion device, including a housing. A heat dissipation partition is arranged in the housing, and the heat dissipation partition divides the inner cavity of the housing into a first cavity and a second cavity. A power generating device is arranged in the first cavity, and a radiator is arranged in the second cavity. The radiator is installed on the heat dissipation partition for heat exchange with the power generating device. Among them, the radiator is the radiator described in any of the above solutions. Since the foregoing radiator has the above technical effects, the power conversion device having this radiator should also have the corresponding technical effects.

[0022] In some embodiments of the present application, a heat dissipation fan is further arranged in the second cavity. The second cavity has an air inlet and an air outlet. The heat dissipation fan is arranged on the air flow path formed by the air inlet and the air outlet. The heat dissipation fan is arranged close to the air inlet, and the air inlet surface of the heat dissipation fan faces the air inlet.

[0023] In some embodiments of the present application, the air inlet is arranged on one of the circumferential side walls of the second cavity corresponding to the heat dissipation partition and perpendicular thereto, and the air outlet is arranged on at least one of the remaining circumferential side walls of the second cavity corresponding to the heat dissipation partition and perpendicular thereto.

[0024] In some embodiments of the present application, the heat dissipation channels formed by two adjacent substrate heat dissipation parts on the radiator are the first heat dissipation channels, and the heat dissipation channels formed by two adjacent heat pipe heat dissipation fins are the second heat dissipation channels. Both the first heat dissipation channels and the second heat dissipation channels are configured to be arranged along the air outlet direction of the heat dissipation fan.

[0025] In some embodiments of the present application, the first heat dissipation channels and the second heat dissipation channels are arranged in sequence or in parallel in the air outlet direction of the heat dissipation fan.

[0026] In some embodiments of the present application, the air inlet is arranged on the chamber wall of the second cavity corresponding to the heat dissipation partition; the air outlet is arranged on at least one of the circumferential side walls of the second cavity corresponding to the heat dissipation partition perpendicular to it.

[0027] In some embodiments of the present application, the heat dissipation channels formed by two adjacent substrate heat dissipation parts on the radiator are the first heat dissipation channels, and the heat dissipation channels formed by two adjacent heat pipe heat dissipation fins are the second heat dissipation channels, and the first heat dissipation channels and the second heat dissipation channels are configured to be two mutually connected heat dissipation channels;

[0028] Wherein, the air outlet surface of the heat dissipation fan faces the first heat dissipation channels.

[0029] In some embodiments of the present application, a magnetic device is further arranged in the second cavity, and the heat dissipation fan, the radiator and the magnetic device are arranged in sequence along the air flow path formed by the air inlet and the air outlet. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts..

[0031] Figure 1 It is the first structural schematic diagram of the radiator provided by the embodiment of the present application;

[0032] Figure 2 For Figure 1 The A-A cross-sectional structural schematic diagram of;

[0033] Figure 3 It is the second structural schematic diagram of the radiator provided by the embodiment of the present application;

[0034] Figure 4 It is the third structural schematic diagram of the radiator provided by the embodiment of the present application;

[0035] Figure 5 The fourth structural schematic diagram of the radiator provided by the embodiment of the present application;

[0036] Figure 6 The fifth structural schematic diagram of the radiator provided by the embodiment of the present application;

[0037] Figure 7 The structural schematic diagram of the radiator provided by the embodiment of the present application adopting two heat pipe heat dissipation units connected in series;

[0038] Figure 8 The sectional structural schematic diagram of the first power conversion device provided by the embodiment of the present application;

[0039] Figure 9 is Figure 8 The structural schematic diagram of the right side view of;

[0040] Figure 10 The sectional structural schematic diagram of the second power conversion device provided by the embodiment of the present application;

[0041] Figure 11 is Figure 10 The structural schematic diagram of the right side view of;

[0042] Figure 12 The sectional structural schematic diagram of the third power conversion device provided by the embodiment of the present application;

[0043] Figure 13 The axonometric structural schematic diagram of the first perspective of the substrate of the radiator provided by the embodiment of the present application provided with a plurality of heat pipe heat dissipation units;

[0044] Figure 14 The axonometric structural schematic diagram of the second perspective of the substrate of the radiator provided by the embodiment of the present application provided with a plurality of heat pipe heat dissipation units.

[0045] Among them, Figures 1-14 in:

[0046] 1 - First cavity;

[0047] 11 - Power heating device;

[0048] 2 - Second cavity;

[0049] 21 - Radiator;

[0050] 210 - Fixed substrate;

[0051] 211 - Substrate;

[0052] 2111 - First plate surface;

[0053] 2112 - Second plate surface;

[0054] 2113 - Avoidance slot;

[0055] 212 - Heat pipe cooling unit;

[0056] 2121 - First heat pipe cooling unit;

[0057] 21211 - First heat pipe evaporation section;

[0058] 21212 - First heat pipe connection section;

[0059] 21213 - First heat pipe condensation section;

[0060] 2122 - Second heat pipe cooling unit;

[0061] 21221 - Second heat pipe evaporation section;

[0062] 21222 - Second heat pipe connection section;

[0063] 21223 - Second heat pipe condensation section;

[0064] 21201 - Heat pipe evaporation section;

[0065] 21202 - Heat pipe connection section;

[0066] 21203 - Heat pipe condensation section;

[0067] 213 - Substrate heat dissipation part;

[0068] 2131 - First side;

[0069] 2132 - Second side;

[0070] 214 - First heat pipe cooling fin;

[0071] 215 - Second heat pipe cooling fin;

[0072] 216 - Heat pipe cooling fin;

[0073] 22 - Air inlet;

[0074] 23 - Air outlet;

[0075] 231 - First sub - air outlet;

[0076] 232 - Second sub - air outlet;

[0077] 233 - Third sub - air outlet;

[0078] 234 - Fourth sub - air outlet; [[ID=7,5]]

[0079] 235 - Fifth sub - air outlet;

[0080] 236 - The sixth sub - air outlet;

[0081] 237 - The seventh sub - air outlet;

[0082] 24 - Heat dissipation partition;

[0083] 25 - Magnetic device;

[0084] 26 - Heat dissipation fan. Detailed implementation mode

[0085] The core of this application is to provide a radiator and a power conversion device to improve the heat dissipation performance of the radiator.

[0086] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0087] Refer to Figure 1 and Figure 2 As shown in the embodiments of one aspect of this application, a radiator is provided, including a substrate 211, a substrate heat dissipation part 213, and a heat pipe heat dissipation unit 212.

[0088] Among them, when the radiator is applied to a power conversion device, as shown in Figure 8 , the substrate 211 is mainly used for heat exchange with the power - generating heat - emitting device 11 in the power conversion device. Specifically, the substrate 211 has a first plate surface 2111 and a second plate surface 2112 arranged oppositely. The first plate surface 2111 is used for heat exchange with the power - generating heat - emitting device 11. The radiator is arranged on one side of the heat dissipation partition 24 of the power conversion device, and the power - generating heat - emitting device 11 is arranged on the other side of the heat dissipation partition 24. The heat exchange method between the first plate surface 2111 of the radiator and the power - generating heat - emitting device 11 can be direct - contact heat exchange, indirect - contact heat exchange through bonding with thermal conductive silicone, or other non - contact indirect heat exchange. The specific structural form is not limited. It should be noted that the substrate 211 and the heat dissipation partition 24 can be designed into a split - type fixed - connection structure. For example, but not limited to, they can be designed with matching connection holes and fixed by fasteners. It can also be designed into an integral structure, that is, the substrate 211 is used as part of the structure of the heat dissipation partition 24.

[0089] Refer to Figure 1 and Figure 2, the substrate heat dissipation part 213 is arranged on the second board surface 2112. Its specific structural form can be heat dissipation fins, or other heat dissipation structural forms commonly used by those skilled in the art, such as heat dissipation aluminum blocks, heat pipes, etc. The specific structural form is not limited, as long as it can dissipate the heat of the substrate 211. The connection mode between the substrate heat dissipation part 213 and the second board surface 2112 can be designed as an integral structure, such as integral injection molding, or a split fixed connection structure, such as welding connection, etc. No more specific limitations are made here.

[0090] In addition, referring to Figures 3-6 As shown, the heat pipe heat dissipation unit 212 is connected to the substrate 211, and it is mainly used to absorb the heat of the substrate 211 and dissipate this part of the heat. Specifically, the heat pipe heat dissipation unit 212 has a heat pipe evaporation section 21201, a heat pipe condensation section 21203 and heat pipe heat dissipation fins 216; among them, the heat pipe evaporation section 21201 is arranged on the substrate 211 and connected to the substrate 211 for heat exchange with the substrate 211. The connection mode between the heat pipe evaporation section 21201 and the substrate 211 can be, but is not limited to, fixed connection modes such as welding or bonding; the heat pipe condensation section 21203 is located on one side of the substrate 211 corresponding to the second board surface 2112. The number of the heat pipe heat dissipation fins 216 is multiple, and they are arranged on the heat pipe condensation section 21203 in a sequentially spaced manner. The arrangement mode of each heat pipe heat dissipation fin 216 on the heat pipe condensation section 21203 can be, but is not limited to, designed as an equally spaced parallel arrangement mode. This mode is more convenient for design and manufacture. The specific connection mode between the heat pipe condensation section 21203 and the heat pipe heat dissipation fins 216 can be, but is not limited to, fixed connection modes such as welding.

[0091] It is worth mentioning that those skilled in the art should be able to know the basic structure and working principle of the heat pipe heat dissipation unit 212. The working principle of the heat pipe heat dissipation unit 212 is to conduct heat from the heat source to the surface of the heat dissipation structure (that is, the heat pipe heat dissipation fins 216) through the heat conduction and phase change characteristics of the heat pipe (the heat pipe evaporation section 21201 and the heat pipe condensation section 21203), and then dissipate the heat to the air through the heat pipe heat dissipation fins 216, so as to achieve the purpose of heat dissipation. Specifically, the heat pipe evaporation section 21201 will absorb the heat generated by the heat source (such as power semiconductor devices, etc.), and make the liquid in its liquid absorption core tube boil into steam. The steam with heat will move from the heat pipe evaporation section 21201 to the heat pipe condensation section 21203. When the steam transfers the heat to the heat pipe condensation section 21203, the steam will condense into liquid. The condensed liquid will return to the heat pipe evaporation section 21201 through the capillary action of the liquid absorption core on the pipe wall, and repeat this cycle process to continuously dissipate heat.

[0092] In the actual application process of this radiator, heat exchange is carried out by bringing the first plate surface 2111 into contact with the corresponding power heating device 11 on the power conversion device. Thus, the heat of the power heating device 11 can be transferred to the substrate 211. On the one hand, the substrate 211 dissipates heat through the substrate heat dissipation part 213 provided on the second plate surface 2112, thereby realizing one heat dissipation path. On the other hand, the heat pipe evaporation section 21201 of the heat pipe heat dissipation unit 212 can absorb the heat of the substrate 211. The absorbed heat is transferred to the heat pipe condensation section 21203, and then the heat pipe heat dissipation fins 216 on the heat pipe condensation section 21203 carry out condensation heat dissipation, which can realize another heat dissipation path. Therefore, by using the above radiator, the heat pipe heat dissipation fins 216 are directly arranged on the heat pipe condensation section 21203, effectively reducing the heat transfer path, helping to enhance the heat exchange efficiency of the heat pipe, and achieving a more efficient heat dissipation effect by utilizing the heat pipe phase change heat dissipation principle. In addition, the heat dissipation fin structure of the substrate through two heat dissipation paths greatly increases the total heat dissipation fin area and significantly improves the heat dissipation performance of the radiator.

[0093] In some specific embodiments, referring to Figure 1 and Figure 3 as shown, on the side of the substrate 211 corresponding to the first plate surface 2111, an embedding opening can be specifically provided, and the heat pipe evaporation section 21201 is embedded in the embedding opening. The heat pipe evaporation section 21201 can be specifically embedded in the embedding opening by means of fixed connection methods such as welding and bonding. By designing such an embedded structural form, compared with the heat pipe evaporation section 21201 being attached to the surface of the substrate 211 on one side, the contact area between the heat pipe evaporation section 21201 and the substrate 211 is larger, making it more convenient for heat transfer between the two, that is, the heat transfer efficiency between the two is higher.

[0094] Specifically, referring to Figures 1-7 , on the side of the heat pipe evaporation section 21201 embedded in the substrate 211 corresponding to the first plate surface 2111, it is preferably designed to be flush with the first plate surface 2111. By designing such a structural form, the surface of the heat pipe evaporation section 21201 corresponding to the first plate surface 2111 can be directly attached to the power heating device 11 for heat exchange, that is, direct contact heat exchange, or indirect attachment heat exchange such as through thermal conductive adhesive bonding. The heat exchange is more direct and the heat exchange efficiency is higher.

[0095] In a further embodiment, referring to Figure 13 as shown, on the side of the above substrate 211 corresponding to the first plate surface 2111, a fixed substrate 210 is also provided for pressing and fixing the heat pipe evaporation section 21201 to the first plate surface 2111. The fixed substrate 210 can be specifically fixed to the substrate 211 by means of fasteners. By designing the fixed substrate 210, the fixation of the heat pipe evaporation section 21201 is more reliable, and it can effectively prevent the heat pipe evaporation section 21201 from falling off the substrate 211.

[0096] In some other specific embodiments, with reference to Figure 1 and Figures 3-5 as shown, the heat pipe evaporation section 21201 and the heat pipe condensation section 21203 can be specifically connected through the heat pipe connection section 21202. The heat pipe connection section 21202 is configured as a bent structure that bends from the substrate 211 towards the second plate surface 2112 side, so that the heat pipe condensation section 21203 and the heat pipe evaporation section 21201 are arranged at an angle, and this angle is preferably but not limited to 90°±5°; among them, with reference to Figure 1 , Figure 3 and Figure 5 as shown, the heat pipe connection section 21202 can be arranged on the outer end side of the substrate 211 to Figure 3 take as an example, the heat pipe evaporation section 21201 extends from the outer edge of the substrate 211 and is connected to the heat pipe connection section 21202. After the heat pipe connection section 21202 bends towards the second plate surface 2112 side of the substrate 211, it is connected to the heat pipe condensation section 21203; with reference to Figure 4 as shown, it can also be that an avoidance groove 2113 is provided at the corresponding position on the substrate 211. At this time, the heat pipe connection section 21202 is connected to the heat pipe evaporation section 21201 inside the substrate 211, passes through the avoidance groove 2113 and bends out to be connected to the heat pipe condensation section 21203. In the actual application process, it can be selected and configured according to actual needs, and no more specific limitations are made here. By designing the heat pipe connection section 21202 into the above-mentioned bent structure, it is more convenient to arrange the heat pipe heat dissipation fins 216 on the heat pipe condensation section 21203. For example, when the bending angle of the heat pipe connection section 21202 is 90 degrees, the heat pipe heat dissipation fins 216 can be designed to be arranged perpendicular to the heat pipe condensation section 21203.

[0097] It should be noted that the heat pipe connection section 21202 is a connection structure between the heat pipe evaporation section 21201 and the heat pipe condensation section 21203. Specifically, the three heat pipe sections of the heat pipe evaporation section 21201, the heat pipe connection section 21202, and the heat pipe condensation section 21203 can be an integral structure or a split fixed connection structure. For example, the connection position between the heat pipe evaporation section 21201 and the heat pipe condensation section 21203 is directly inserted and connected, and the corresponding connection section at the insertion position then constitutes the heat pipe connection section 21202. By designing it into the above structural form, the surface of the heat pipe evaporation section 21201 corresponding to the first plate surface 2111 can be directly attached to the power heating device 11 for heat exchange, the heat exchange is more direct, and the heat exchange efficiency is higher.

[0098] In some more specific embodiments, the above-mentioned substrate heat dissipation part 213 is preferably designed as heat dissipation fins, and the heat dissipation fins are preferably but not limited to being arranged perpendicular to the second plate surface 2112. By designing such a structural form, the arrangement of the substrate heat dissipation part 213 is more convenient; in addition, the above-mentioned heat pipe heat dissipation fins 216 are preferably but not limited to being designed parallel to the second plate surface 2112. By designing such a structural form, the arrangement of the substrate heat dissipation part 213 and the heat pipe heat dissipation fins 216 is more convenient, and at the same time, it is easier to realize the centralized arrangement of the two heat dissipation fin structures.

[0099] In some other specific embodiments, referring to Figure 1 and Figure 2 as shown, the heat pipe heat dissipation unit 212 may specifically include a first heat pipe heat dissipation unit 2121 and / or a second heat pipe heat dissipation unit 2122, that is, the heat pipe heat dissipation unit 212 may specifically include one of the first heat pipe heat dissipation unit 2121 and the second heat pipe heat dissipation unit 2122, or may include both the first heat pipe heat dissipation unit 2121 and the second heat pipe heat dissipation unit 2122 at the same time. Among them, the first heat pipe heat dissipation unit 2121 includes a first heat pipe evaporation section 21211, a first heat pipe condensation section 21213, and a first heat pipe heat dissipation fin 214. The first heat pipe evaporation section 21211 is disposed on the substrate 211, or is connected to the substrate 211 and is arranged in a heat exchange manner with the substrate 211. The first heat pipe condensation section 21213 can be connected to the first heat pipe evaporation section 21211 through a first heat pipe connection section 21212. The number of the first heat pipe heat dissipation fins 214 is multiple and is arranged on the first heat pipe condensation section 21213 at intervals in sequence, and the first heat pipe condensation section 21213 and the first heat pipe heat dissipation fins 214 thereon are arranged on the first side of the substrate fin group formed by the substrate heat dissipation part 213; the second heat pipe heat dissipation unit 2122 includes a second heat pipe evaporation section 21221, a second heat pipe condensation section 21223, and a second heat pipe heat dissipation fin 215. The second heat pipe evaporation section 21221 is disposed on the substrate 211, or is connected to the substrate 211 and is arranged in a heat exchange manner with the substrate 211. The second heat pipe condensation section 21223 can be connected to the second heat pipe evaporation section 21221 through a second heat pipe connection section 21222. The number of the second heat pipe heat dissipation fins 215 is multiple and is arranged on the second heat pipe condensation section 21223 at intervals in sequence, and the second heat pipe condensation section 21223 and the second heat pipe heat dissipation fins 215 thereon are arranged on the second side of the substrate fin group.

[0100] Specifically, the first side and the second side of the substrate fin group may specifically but not be limited to be constructed as two opposite sides of the substrate fin group. By designing such a structural form, the overall structure of the radiator is more symmetric and coordinated, and the heat dissipation effect is more uniform. For those skilled in the art to better understand the two opposite sides of the substrate fin group, the following is taken as an exampleFigure 1 For example, for the sake of convenience in description, the substrate heat dissipation part 213 is described as a planar structure without thickness. Referring to Figure 1 as shown, the above-mentioned substrate heat dissipation part 213 has a first side 2131 and a second side 2132 that are perpendicular to each other. The first side 2131 is perpendicular to the second plate surface 2112. The first side and the second side of the substrate fin group are respectively located in two extending directions of the second side 2132.

[0101] It should be noted that, referring to Figure 1 and Figure 2 as shown, the first heat pipe evaporation section 21211 and the second heat pipe evaporation section 21221 can be specifically configured as a split structure, that is, the first heat pipe evaporation section 21211 and the second heat pipe evaporation section 21221 are two independent heat pipe structures that are not connected to each other; it can also be referred to Figure 5 as shown, the first heat pipe evaporation section 21211 and the second heat pipe evaporation section 21221 are configured as an integral structure. In the actual application process, it can be selected and configured according to actual needs, and no more specific limitations are made here.

[0102] In addition, it should be noted that the number of heat pipe heat dissipation units 212 provided on the substrate 211 of the above radiator can be one or multiple (that is, two or more). For example, Figure 5 shows the structure with one heat pipe heat dissipation unit 212 provided on the substrate 211; for another example, Figure 1 , Figures 2-4 and 7 show the structure with two heat pipe heat dissipation units 212 provided on the substrate 211; for still another example, Figure 13 shows the structure with six heat pipe heat dissipation units 212 provided on the substrate 211. In the actual application process, it can be selected and configured according to actual needs, and no more specific limitations are made here.

[0103] In addition, when the number of heat pipe heat dissipation units 212 is multiple, adjacent heat pipe heat dissipation units 212 can be designed to share the heat pipe heat dissipation fins 216. The specific sharing method of the heat pipe heat dissipation fins 216 can be designed as Figure 7 as shown, the heat pipe condensation sections 21203 of two adjacent heat pipe heat dissipation units 212 arranged adjacent to each other in the second plate surface 2112 of the substrate 211 share a group of heat pipe heat dissipation fins 216; it can also be designed as Figure 13 and Figure 14 as shown, the heat pipe heat dissipation fins 216 of the heat pipe heat dissipation unit 212 are located on two opposite edge sides of the substrate 211, and the heat pipe condensation sections 21203 located on the same edge side share a group of heat pipe heat dissipation fins 216. By sharing the heat dissipation fins, the production of the heat pipe heat dissipation fins 216 is made more convenient, which helps to reduce costs, and at the same time, the heat dissipation capabilities of each heat pipe heat dissipation unit 212 are more balanced.

[0104] In another embodiment of the present application, with reference to Figures 8-12 As shown, a power conversion device is further provided, including a housing. A heat dissipation partition 24 is arranged inside the housing. The heat dissipation partition 24 divides the inner cavity of the housing into a first cavity 1 and a second cavity 2. A power heating device 11 (such as a semiconductor power device) is arranged in the first cavity 1. A radiator 21 is arranged on one side of the heat dissipation partition 24 corresponding to the second cavity 2, and the power heating device 11 is arranged on one side of the heat dissipation partition 24 corresponding to the first cavity 1 for heat exchange with the power heating device 11. A corresponding installation opening can be designed on the side of the heat dissipation partition 24 corresponding to the power heating device 11. Such a design enables the power heating device 11 and the radiator 21 to achieve conformal heat exchange, that is, direct contact heat exchange or indirect contact heat exchange through thermal conductive adhesive. Among them, the radiator 21 is the radiator 21 described in any of the above solutions. Since the radiator 21 has the aforementioned technical effects, the power conversion device having the radiator 12 should also have corresponding technical effects, which will not be elaborated here.

[0105] In a further embodiment, in order to enable the second cavity 2 to exchange air flow with the external environment of the housing, a heat dissipation fan 26 should also be arranged in the second cavity 2. The second cavity 2 has an air inlet 22 and an air outlet 23. The heat dissipation fan 26 is arranged on the air flow path formed by the air inlet 22 and the air outlet 23 to provide power for the air flow path formed by the air inlet 22 and the air outlet 23, and the heat dissipation fan 26 is located on this air flow path.

[0106] It should be noted that the heat dissipation fan 26 can be specifically designed to be arranged close to the air inlet 22, or can be designed to be arranged close to the air outlet 23, or heat dissipation fans 26 are arranged close to both the air inlet 22 and the air outlet 23. And the number of heat dissipation fans 25 arranged at the air inlet 22 and the air outlet 23 is not limited, and can be selected and configured according to the actual heat dissipation requirements and the arrangement areas of the corresponding heat pipe heat dissipation fins 216 and the substrate heat dissipation part 213.

[0107] In some more specific embodiments, with reference to Figures 8-12As shown, when the above-mentioned cooling fan 26 is arranged close to the air inlet 22, the air inlet 22 is preferably arranged facing the air inlet surface of the cooling fan 26. The heat dissipation channels formed by two adjacent substrate heat dissipation parts 213 on the radiator 21 and the heat dissipation channels formed by two adjacent heat pipe heat dissipation fins 216 are both configured to be along the air outlet direction of the cooling fan 26, so that the air flow of the cooling fan 26 can flow through the substrate heat dissipation part 213 and the heat pipe heat dissipation fins 216 more smoothly, and the installation of the cooling fan 26 is also more convenient. Among them, the number of the air inlet 22 and the air outlet 23 can be arranged according to actual needs, and no more specific limitations are made here.

[0108] In some more specific embodiments, referring to Figure 8 、 Figure 9 and Figure 12 As shown, the air inlet 22 is arranged on the circumferential side wall of the second cavity 2 corresponding to the heat dissipation partition 24 perpendicular thereto. This circumferential wall surface has four side wall surfaces, and the air inlet 22 can be designed on any one of the four side wall surfaces; the air outlet 23 is arranged on at least one of the remaining side walls of the circumferential side wall of the second cavity 2 corresponding to the heat dissipation partition 24 perpendicular thereto except the side wall where the air inlet 23 is arranged. Specifically, the air outlet 23 may include at least one of the first sub-air outlet 231, the second sub-air outlet 232, and the third sub-air outlet 233; among them, the first sub-air outlet 231 faces the air outlet surface of the cooling fan 26, and the second sub-air outlet 232 and the third sub-air outlet 233 are respectively arranged on two side walls of the second cavity 2 perpendicular to the air outlet surface of the cooling fan 26.

[0109] For the convenience of description, the heat dissipation channel formed by two adjacent substrate heat dissipation parts 213 on the radiator 21 is defined as the first heat dissipation channel, and the heat dissipation channel formed by two adjacent heat pipe heat dissipation fins 216 is defined as the second heat dissipation channel. The first heat dissipation channel and the second heat dissipation channel are preferably both configured to be arranged along the air outlet direction of the cooling fan 26. Designed in this way, the air flow brought by the cooling fan 26 can flow through the first heat dissipation channel and the second heat dissipation channel more smoothly, which helps to improve the heat dissipation effect.

[0110] In a further embodiment, the above-mentioned first heat dissipation channel and the second heat dissipation channel can be specifically designed as shown in Figure 8 and Figure 9 shown in a structure form arranged in sequence in the air outlet direction of the cooling fan 26, such as referring to; the first heat dissipation channel and the second heat dissipation channel can also be designed as shown in Figure 12 shown in a side-by-side arrangement in the air outlet direction of the cooling fan 26. During actual application, it can be arranged according to actual needs, and no more specific limitations are made here.

[0111] In some other specific embodiments, referring to Figure 11As shown, the cooling fan 26 is arranged close to the air inlet 22. The air inlet 22 can be provided on the cavity wall of the second cavity 2 opposite to the heat dissipation partition 24, and the air inlet 22 faces the air inlet surface of the cooling fan 26; the air outlet 23 is provided on at least one of the circumferential side walls of the second cavity 2 perpendicular to the heat dissipation partition 24. Specifically, the air outlet 23 can include at least one of the fourth sub-air outlet 234, the fifth sub-air outlet 235, the sixth sub-air outlet 236, and the seventh sub-air outlet 237; among them, the fourth sub-air outlet 234, the fifth sub-air outlet 235, the sixth sub-air outlet 236, and the seventh sub-air outlet 237 are respectively provided on the four side walls of the second cavity 2 perpendicular to the heat dissipation partition 24; the air outlet surface of the cooling fan 26 faces the substrate fin group formed by the substrate heat dissipation part 213 of the radiator 21. The heat dissipation channels formed by two adjacent substrate heat dissipation parts 213 on the radiator 21 are defined as the first heat dissipation channels, and the heat dissipation channels formed by two adjacent heat pipe heat dissipation fins 216 are defined as the second heat dissipation channels. The first heat dissipation channels and the second heat dissipation channels are configured as two mutually connected heat dissipation channels, and the air outlet surface of the cooling fan 26 faces the first heat dissipation channels. It should be noted that one or more of the fourth sub-air outlet 234, the fifth sub-air outlet 235, the sixth sub-air outlet 236, and the seventh sub-air outlet 237 can be designed on their respective corresponding side walls. For example, referring to Figure 11 As shown, two sixth sub-air outlets 236 are designed on the corresponding side wall, and two seventh sub-air outlets 237 are designed on the corresponding side wall. During actual application, the layout can be selected according to actual needs.

[0112] In a further embodiment, referring to Figure 8 and Figure 12 As shown, a magnetic device 25 is further provided in the second cavity 2. The cooling fan 26, the radiator 21, and the magnetic device 25 are preferably but not limited to being arranged in sequence along the air flow path formed by the air inlet 22 and the air outlet 23. By designing such a structural form, the external air flow passes through the cooling fan 2 in sequence through the radiator 21 and the magnetic device 25. Since the high-temperature resistance performance of the magnetic device 25 is generally higher than that of the power heating device 11, the above-mentioned structural arrangement is more in line with the heat dissipation requirements of each device.

[0113] It should be noted that the various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0114] As shown in this application and the claims, unless the context clearly indicates otherwise, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. An element defined by the statement "comprising one..." does not exclude the existence of another identical element in the process, method, product, or device that includes the element.

[0115] Among them, in the description of the embodiments of this application, unless otherwise specified, " / " means "or". For example, A / B may mean A or B. The "and / or" herein is only a description of the association relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "a plurality of" means two or more than two.

[0116] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0117] Specific examples are used herein to elaborate on the principles and implementation manners of this application. The description of the above embodiments is only for helping to understand the core idea of this application. It should be noted that for those of ordinary skill in the art, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A radiator, characterized in that, Comprising: A substrate (211) having a first plate surface (2111) and a second plate surface (2112) arranged oppositely, and the first plate surface (2111) is used for heat exchange with a power heating device (11); A substrate heat dissipation part (213) arranged on the second plate surface (2112); A heat pipe heat dissipation unit (212) having a heat pipe evaporation section (21201), a heat pipe condensation section (21203) and heat pipe heat dissipation fins (216); wherein, the heat pipe evaporation section (21201) is arranged on the substrate (211) for heat exchange with the substrate (211); the heat pipe condensation section (21203) is located on one side of the substrate (211) corresponding to the second plate surface (2112), and the heat pipe heat dissipation fins (216) are arranged on the heat pipe condensation section (21203) in a sequentially spaced manner.

2. The radiator according to claim 1, characterized in that, An embedding opening is arranged on one side of the substrate (211) corresponding to the first plate surface (2111), and the heat pipe evaporation section (21201) is embedded in the embedding opening.

3. The radiator according to claim 2, characterized in that, On one side of the substrate (211) corresponding to the first plate surface (2111), a fixing substrate (210) is further arranged for pressing and fixing the heat pipe evaporation section (21201) on the first plate surface (2111).

4. The radiator according to claim 1, wherein The heat pipe evaporation section (21201) is connected to the heat pipe condensation section (21203) through a heat pipe connection section (21202), and the heat pipe connection section (21202) is configured as a bent structure so that the heat pipe condensation section (21203) and the heat pipe evaporation section (21201) are arranged at an angle. Wherein, the heat pipe connection section (21202) is arranged on the outer end side of the substrate (211); or, a avoiding groove (2113) is arranged on the substrate (211), and the heat pipe connection section (21202) is bent and led out from the avoiding groove (2113).

5. The radiator according to claim 1, characterized in that, The substrate heat dissipation part (213) is a heat dissipation fin perpendicular to the second plate surface (2112); and / or, the heat pipe heat dissipation fins (216) are parallel to the second plate surface (2112).

6. The radiator according to claim 1, characterized in that, The heat pipe heat dissipation unit (212) includes a first heat pipe heat dissipation unit (2121) and / or a second heat pipe heat dissipation unit (2122); Wherein, the first heat pipe heat dissipation unit (2121) includes a first heat pipe evaporation section (21211), a first heat pipe condensation section (21213) and first heat pipe heat dissipation fins (214), and the first heat pipe condensation section (21213) and the first heat pipe heat dissipation fins (214) thereon are arranged on a first side of a substrate fin group formed by the substrate heat dissipation part (213); the second heat pipe heat dissipation unit (2122) includes a second heat pipe evaporation section (21221), a second heat pipe condensation section (21223) and second heat pipe heat dissipation fins (215), and the second heat pipe condensation section (21223) and the second heat pipe heat dissipation fins (215) thereon are arranged on a second side of the substrate fin group.

7. The radiator according to claim 6, wherein The first side and the second side of the substrate fin group are configured as two opposite sides of the substrate fin group.

8. The radiator according to claim 7, characterized in that, The first heat pipe evaporation section (21211) and the second heat pipe evaporation section (21221) are configured as a split structure; or, the first heat pipe evaporation section (21211) and the second heat pipe evaporation section (21221) are configured as an integral structure.

9. The radiator according to any one of claims 1-8, characterized in that, The number of the heat pipe heat dissipation units (212) is at least two; and adjacent heat pipe heat dissipation units (212) share heat pipe heat dissipation fins (216).

10. A power conversion device includes a housing, and a heat dissipation partition (24) is disposed inside the housing. The heat dissipation partition (24) divides the inner cavity of the housing into a first cavity (1) and a second cavity (2). A power heating device (11) is disposed in the first cavity (1), and a radiator (21) is disposed in the second cavity (2). The radiator (21) is disposed on the heat dissipation partition (24) for heat exchange with the power heating device. It is characterized in that, The radiator (21) is the radiator (21) as described in any one of claims 1-9.

11. The power conversion device according to claim 10, wherein A heat dissipation fan (26) is further disposed in the second cavity (2). The second cavity has an air inlet (22) and an air outlet (23). The heat dissipation fan (26) is disposed on the air flow path formed by the air inlet (22) and the air outlet (23). The heat dissipation fan (26) is arranged close to the air inlet (22), and the air inlet surface of the heat dissipation fan (26) faces the air inlet (22).

12. The power conversion device according to claim 11, wherein The air inlet (22) is disposed on one of the circumferential side walls of the second cavity (2) corresponding to the side wall perpendicular to the heat dissipation partition (24), and the air outlet (23) is disposed on at least one of the remaining side walls of the second cavity (2) corresponding to the side wall perpendicular to the heat dissipation partition (24).

13. The power conversion device according to claim 12, characterized in that, The heat dissipation channel formed by two adjacent substrate heat dissipation parts (213) on the radiator (21) is the first heat dissipation channel, and the heat dissipation channel formed by two adjacent heat pipe heat dissipation fins (216) is the second heat dissipation channel. Both the first heat dissipation channel and the second heat dissipation channel are configured to be arranged along the air outlet direction of the heat dissipation fan (26).

14. The power conversion device according to claim 13, wherein The first heat dissipation channel and the second heat dissipation channel are arranged in sequence or side by side in the air outlet direction of the heat dissipation fan (26).

15. The power conversion device according to claim 11, wherein, The air inlet (22) is disposed on the cavity wall of the second cavity (2) opposite to the heat dissipation partition (24); the air outlet (23) is disposed on at least one of the circumferential side walls of the second cavity (2) perpendicular to the heat dissipation partition (24).

16. The power conversion device according to claim 15, wherein, The heat dissipation channel formed by two adjacent substrate heat dissipation parts (213) on the radiator (21) is the first heat dissipation channel, and the heat dissipation channel formed by two adjacent heat pipe heat dissipation fins (216) is the second heat dissipation channel, and the first heat dissipation channel and the second heat dissipation channel are configured as two mutually communicating heat dissipation channels; Wherein, the air outlet surface of the heat dissipation fan (26) faces the first heat dissipation channel.

17. The power conversion device according to any one of claims 11-16, characterized in that, A magnetic device (25) is further disposed in the second cavity (2). The heat dissipation fan (26), the radiator (21) and the magnetic device (25) are arranged in sequence along the air flow path formed by the air inlet (22) and the air outlet (23).

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