Heat dissipation device for inversion and boost all-in-one machine and inversion and boost all-in-one machine
By placing the scattered structure on the cooling airflow path of the power conversion box in the inverter booster integrated machine, forced convection heat dissipation is achieved by using the air duct shell to guide the cooling airflow, which solves the problem of insufficient cooling effect of the oil transformer and reduces cost and noise.
Patent Information
- Application Number
- CN202422256127.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-13
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-13
AI Technical Summary
The oil transformer of the existing inverter booster is limited in cooling and is easy to overheat, and the additional fan increases cost and noise.
By setting a flap-dispersed structure on the cooling airflow flow path of the power conversion box, the power conversion box and the oil tank share the power mechanism to dissipate heat, and using the air duct shell to guide the cooling airflow to the flap-dispersed structure, forcing convection heat dissipation is achieved, avoiding additional fans.
Without adding fans, the heat dissipation effect of the transformer is improved, the cost and power consumption of the inverter booster machine is reduced, and the noise is reduced.
Smart Images

Figure CN223182535U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of inverter-booster integrated machines, and particularly to a heat dissipation device for an inverter-booster integrated machine and an inverter-booster integrated machine. Background Technique
[0002] The existing inverter-booster integrated machine includes parts such as a power converter 1 (PCS) and an oil transformer 2, as Figure 1 shown. The power converter 1 cools and dissipates heat from semiconductor power devices by means of air cooling, liquid cooling or heat siphon (phase change); for the high and low voltage windings and iron core of the oil transformer immersed in the transformer oil in the oil tank, the heat is transferred to the transformer oil, and the transformer oil is naturally cooled in the finned radiator structure 3, and finally the cooling of the high and low voltage windings and the iron core is realized.
[0003] In actual operation, the oil transformer 2 is naturally cooled by the transformer oil in the finned radiator structure 3, and its cooling effect is limited, and there is a risk of overheating of the windings or the iron core; to enhance the cooling effect, the finned radiator structure 3 can be directly blown by adding a fan 4, as Figure 2 shown (the position of the fan 4 is not fixed and can be above or below the finned radiator structure 3, etc.), so that the transformer oil in the finned radiator structure 3 changes from the original natural cooling to forced convection cooling. Although this solution is beneficial to the heat dissipation of the oil transformer, however, the additional setting of the fan 4 will cause an increase in cost and power consumption, and the noise of the entire inverter-booster integrated machine will also increase due to the addition of the fan. Summary of the Utility Model
[0004] The main purpose of the utility model is to provide a heat dissipation device for an inverter-booster integrated machine and an inverter-booster integrated machine. While increasing the heat dissipation effect of the oil transformer, the above-mentioned inverter-booster integrated machine can not only reduce the cost and power consumption of the heat dissipation of the inverter-booster integrated machine, but also reduce the noise of the inverter-booster integrated machine.
[0005] To achieve the above purpose, the utility model provides a heat dissipation device for an inverter-booster integrated machine, including: a transformer box, including an oil tank and a finned radiator structure connected to the oil tank, the finned radiator structure having an oil passage communicating with the inside of the oil tank, both the oil passage and the inside of the oil tank being configured to allow the passage of transformer oil, and the oil tank being used to accommodate a winding structure; a power conversion box for accommodating semiconductor power devices; a power mechanism for driving cooling air flow into the power conversion box to dissipate heat from the power conversion box; wherein at least part of the finned radiator structure is located on the flow path of the cooling air flow of the power conversion box.
[0006] Furthermore, the heat dissipation device for the inverter-booster integrated machine further includes a duct housing for passing the cooling air flow, the duct housing having an air inlet and an air outlet, one of the air inlet and the air outlet being communicated with the inside of the power conversion box, and the other of the air inlet and the air outlet being arranged facing the finned radiator structure.
[0007] Further, the heat dissipation device for the inverter-booster integrated machine further includes a radiator located in the power conversion box, and the radiator is configured to dissipate heat from the semiconductor power devices.
[0008] Further, the power conversion box is provided with a ventilation opening, and the ventilation opening and the air duct housing are located on both sides of the radiator.
[0009] Further, the power conversion box includes a first box body and a second box body. A condenser is provided in the first box body, and an evaporator for dissipating heat from the semiconductor power devices is provided in the second box body; both the first box body and the second box body are communicated with the air duct housing.
[0010] Further, the first box body has a first inlet and a first outlet, and the second box body has a second inlet and a second outlet; the first outlet of the first box body and the second outlet of the second box body are both communicated with the air inlet of the air duct housing, and the air outlet is arranged towards the finned heat dissipation structure; or, the first inlet of the first box body and the second inlet of the second box body are both communicated with the air outlet of the air duct housing, and the air inlet of the air duct housing is arranged towards the finned heat dissipation structure.
[0011] Further, the first box body has a first inlet and a first outlet, and the second box body has a second inlet and a second outlet; the second outlet of the second box body is communicated with the first inlet of the first box body, the first outlet of the first box body is communicated with the air inlet of the air duct housing, and the air outlet is arranged towards the finned heat dissipation structure; or, the second inlet of the second box body is communicated with the first outlet of the first box body, the first inlet of the first box body is communicated with the air outlet of the air duct housing, and the air inlet of the air duct housing is arranged towards the finned heat dissipation structure.
[0012] Further, the first box body has a first inlet and a first outlet, and the second box body has a second inlet and a second outlet; there are two air duct housings, and the two air duct housings are respectively located on the first side and the second side of the finned heat dissipation structure; the air inlet of the air duct housing located on the first side is communicated with the first outlet of the first box body, and the air outlet of the air duct housing located on the first side is arranged towards the finned heat dissipation structure; the air outlet of the air duct housing located on the second side is communicated with the second inlet of the second box body, and the air inlet of the air duct housing located on the second side is arranged towards the finned heat dissipation structure.
[0013] Further, the power conversion box includes a first box body and a second box body. A condenser is provided in the first box body, and an evaporator for dissipating heat from the semiconductor power devices is provided in the second box body; one of the air inlet and the air outlet is communicated with the first box body, and the other of the air inlet and the air outlet is arranged towards the finned heat dissipation structure.
[0014] Further, the heat dissipation device for the inverter-booster integrated machine further includes a heat dissipation structure, and the heat dissipation structure includes: a mounting member mounted on the air duct housing; a plurality of heat dissipation members spaced apart from each other on the mounting member, one end of each heat dissipation member extends into the air duct housing, and the other end of each heat dissipation member is located outside the air duct housing.
[0015] Further, the power mechanism includes a fan, and at least one of the finned structure, the power conversion box, inside the power conversion box, the air duct housing, and inside the air duct housing is provided with a fan.
[0016] According to another aspect of the present invention, the present invention provides an inverter-booster integrated machine, including: the heat dissipation device for the inverter-booster integrated machine as described above; a winding structure located inside the fuel tank; and semiconductor power devices installed inside the power conversion box.
[0017] Further, the inverter-booster integrated machine further includes a reactor, and the reactor is located inside the power conversion box or inside the fuel tank.
[0018] By applying the technical solution of the present invention, by making at least part of the finned structure located on the flow path of the cooling air flow of the power conversion box, the power conversion box and the fuel tank can share the power mechanism for heat dissipation. In this way, without additionally increasing a fan in the inverter-booster integrated machine, not only can the natural cooling of the finned structure of the transformer box be changed to forced convection, so as to realize the simultaneous heat dissipation of the power conversion box and the transformer box, but also the noise of the entire inverter-booster integrated machine can be prevented from increasing due to the addition of a fan. In this way, while increasing the heat dissipation effect of the transformer box, not only can the cost and power consumption of the heat dissipation of the inverter-booster integrated machine be reduced, but also the noise of the inverter-booster integrated machine can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The specification drawings forming a part of this application are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:
[0020] Figure 1 Shows a schematic structural diagram of an inverter-booster integrated machine in the prior art (natural cooling);
[0021] Figure 2 Shows Figure 1 The schematic structural diagram of the inverter-booster integrated machine (an additional fan is provided to form forced convection);
[0022] Figure 3 Shows a schematic structural diagram of Embodiment 1 of the inverter-booster integrated machine of the present invention;
[0023] Figure 4 Shows a schematic structural diagram of Embodiment 2 of the inverter-booster integrated machine of the present invention;
[0024] Figure 5 Shows a schematic structural diagram of Embodiment 3 of the inverter-booster integrated machine of the present invention;
[0025] Figure 6 Fig. shows a schematic structural diagram of the fourth embodiment of the integrated inverter-booster of the present utility model;
[0026] Figure 7 Fig. shows a schematic structural diagram of one embodiment of the fifth embodiment of the integrated inverter-booster of the present utility model;
[0027] Figure 8 Fig. shows another schematic structural diagram of the fifth embodiment of the integrated inverter-booster of the present utility model;
[0028] Figure 9 Fig. shows a schematic structural diagram of one embodiment of the sixth embodiment of the integrated inverter-booster of the present utility model;
[0029] Figure 10 Fig. shows another schematic structural diagram of the sixth embodiment of the integrated inverter-booster of the present utility model;
[0030] Figure 11 Fig. shows a schematic structural diagram of the seventh embodiment of the integrated inverter-booster of the present utility model;
[0031] Figure 12 Fig. shows a schematic structural diagram of the eighth embodiment of the integrated inverter-booster of the present utility model;
[0032] Figure 13 Fig. shows a schematic structural diagram of the ninth embodiment of the integrated inverter-booster of the present utility model;
[0033] Figure 14 Fig. shows a schematic structural diagram of the tenth embodiment of the integrated inverter-booster of the present utility model;
[0034] Figure 15 Fig. shows a schematic structural diagram of the eleventh embodiment of the integrated inverter-booster of the present utility model;
[0035] Figure 16 Fig. shows Figure 3 a schematic structural diagram of one embodiment of the heat dissipation structure of the integrated inverter-booster;
[0036] Figure 17 Fig. shows Figure 3 a schematic structural diagram of another embodiment of the heat dissipation structure of the integrated inverter-booster;
[0037] Figure 18 Fig. shows Figure 3 a schematic structural diagram of the assembly structure of the heat dissipation structure of the integrated inverter-booster.
[0038] Among them, the above-mentioned drawings include the following reference numerals:
[0039] 11. Fuel tank; 12. Plate fin structure; 21. Power conversion box; 211. First box body; 212. Second box body; 22. Power mechanism; 23. Radiator; 24. Semiconductor power device; 25. Condenser; 26. Evaporator; 27. Reactor; 28. Vent; 50. Air duct housing; 51. Air inlet; 52. Air outlet; 55. Mounting part; 56. Heat dissipating part. Detailed implementation manners
[0040] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The following will describe the present invention in detail with reference to the drawings and in combination with the embodiments.
[0041] As Figure 3 shown, the embodiment of the present invention provides a heat dissipation device for an inverter-booster integrated machine. The heat dissipation device for the inverter-booster integrated machine includes: a transformer box, including a fuel tank 11 and a plate fin structure 12 connected to the fuel tank 11. The plate fin structure 12 has an oil passage communicating with the inside of the fuel tank 11. Both the oil passage and the inside of the fuel tank 11 are configured to be able to introduce transformer oil. The fuel tank 11 is used to accommodate the winding structure; a power conversion box 21, used to accommodate a semiconductor power device 24; a power mechanism 22, used to drive cooling air flow into the power conversion box 21 to dissipate heat from the power conversion box 21; wherein, at least part of the plate fin structure 12 is located on the flow path of the cooling air flow of the power conversion box 21.
[0042] In the above technical solution, by making at least part of the plate fin structure 12 located on the flow path of the cooling air flow of the power conversion box 21, the power conversion box 21 and the fuel tank 11 can share the power mechanism 22 for heat dissipation. In this way, without adding an extra fan to the inverter-booster integrated machine, not only can the natural cooling of the plate fin structure 12 of the transformer box be changed to forced convection, so as to realize simultaneous heat dissipation for the power conversion box 21 and the transformer box, but also the noise of the entire inverter-booster integrated machine can be prevented from increasing due to the addition of a fan. In this way, while increasing the heat dissipation effect of the transformer box, not only can the cost and power consumption of the heat dissipation of the inverter-booster integrated machine be reduced, but also the noise of the inverter-booster integrated machine can be reduced.
[0043] Preferably, in the embodiment of the present invention, the power mechanism 22 includes a fan, and at least one of the plate fin structure 12, the power conversion box 21, inside the power conversion box 21, on the air duct housing 50, and inside the air duct housing 50 is provided with a fan. In this way, the fan can provide cooling air flow to simultaneously dissipate heat from the power conversion box 21 and the fuel tank 11.
[0044] As Figure 3As shown in the figure, in the embodiment of the present utility model, the heat dissipation device for the inverter-booster integrated machine further includes an air duct housing 50 for passing cooling air flow. The air duct housing 50 has an air inlet 51 and an air outlet 52. One of the air inlet 51 and the air outlet 52 is in communication with the interior of the power conversion box 21, and the other of the air inlet 51 and the air outlet 52 is arranged towards the finned heat dissipation structure 12.
[0045] In the above technical solution, by additionally providing the air duct housing 50, the cooling air flow in the power conversion box 21 can act on the finned heat dissipation structure 12 through the air inlet 51 and the air outlet 52, so that the cooling air flow dissipates heat from the fuel tank 11, and the air duct housing 50 can guide the air flow, which can reduce the noise of the air flow.
[0046] Specifically, in the embodiment of the present utility model, the air duct housing 50 can also provide an installation space for a noise reduction accessory (i.e., the following heat dissipation structure).
[0047] As Figure 16 shown, in the embodiment of the present utility model, the heat dissipation device for the inverter-booster integrated machine further includes a heat dissipation structure. The heat dissipation structure includes: a mounting member 55 mounted on the air duct housing 50; a plurality of heat dissipation members 56 spaced apart on the mounting member 55. One end of each heat dissipation member 56 extends into the air duct housing 50, and the other end of each heat dissipation member 56 is located outside the air duct housing 50. In this way, the heat in the air duct housing 50 can be transferred to the external environment, so as to effectively reduce the temperature in the air duct housing 50, thereby increasing the convective heat dissipation effect on the finned heat dissipation structure 12 or reducing the temperature entering the power conversion box 21.
[0048] It should be noted that the appropriate number, size and type of heat dissipation members 56 can be selected according to the heat dissipation requirements, and the installation space for the mounting member 55 is reserved on the air duct housing 50 in advance. The fixing method of the air duct housing 50 and the heat dissipation mounting member 55 is not limited, such as bolt locking, etc.
[0049] It should be noted that in the embodiment of the present utility model, the heat dissipation structure can also be provided on the box wall of the power conversion box 21 and / or the box wall of the fuel tank 11 to increase the heat dissipation effect.
[0050] In the embodiment of the present utility model, a noise reduction accessory can also be provided on the air duct housing 50 to reduce the air flow noise.
[0051] As Figure 18 shown, in the embodiment of the present utility model, the heat dissipation member 56 is a heat dissipation fin, for example, a double-sided shovel tooth structure, etc., or, as Figure 17 shown, the heat dissipation member 56 can also be a heat dissipation column.
[0052] As Figure 3As shown in the figure, an embodiment of the present utility model provides an integrated inverter and booster. The integrated inverter and booster includes: the heat dissipation device for the integrated inverter and booster as described above; a winding structure located in the fuel tank 11; and semiconductor power devices 24 installed in the power conversion box 21. In this way, the airflow generated by the power mechanism 22 can dissipate heat from the semiconductor power devices 24, the fuel tank 11 is filled with transformer oil to conduct heat for the winding structure, and heat dissipation is carried out through the forced convection generated at the finned structure 12.
[0053] It should be noted that in the embodiment of the present utility model, the winding structure is located in the fuel tank 11 to form a transformer box, and the semiconductor power devices 24 are installed in the power conversion box 21 to form a power converter (PCS).
[0054] Specifically, in the embodiment of the present utility model, the winding structure includes oil transformer high and low voltage windings and an iron core.
[0055] As Figure 3 and Figure 4 shown in the figure, in the embodiment of the present utility model, the integrated inverter and booster further includes a reactor 27, and the reactor 27 is located in the power conversion box 21 or the fuel tank 11. In this way, when the reactor 27 is located in the power conversion box 21, the cooling airflow generated by the power mechanism 22 in the power conversion box 21 can be used to dissipate heat from the reactor 27, or the heat generated by the reactor 27 can be transferred to the flow path of the cooling airflow by the following coolant (i.e., the evaporator 26) to dissipate heat from the reactor 27; alternatively, when the reactor 27 is located in the fuel tank 11, the transformer oil in the fuel tank 11 is used to dissipate heat from the reactor 27.
[0056] Furthermore, if the reactor 27 is moved into the fuel tank 11, the space of the fuel tank 11 can be fully utilized to reduce the volume of the power converter, thereby improving the power density of the entire integrated inverter and booster.
[0057] Embodiment 1
[0058] As Figure 3 shown in the figure, in Embodiment 1 of the present utility model, the heat dissipation device for the integrated inverter and booster further includes a radiator 23 located in the power conversion box 21, and the radiator 23 is configured to dissipate heat from the semiconductor power devices 24. Among them, the air inlet 51 is communicated with the inside of the power conversion box 21, the air outlet 52 is arranged facing the finned structure 12, and the reactor 27 is located in the power conversion box 21.
[0059] With the above settings, under the action of the power mechanism 22, the cooling air flow in the power conversion box 21 flows through the radiator 23 and the reactor 27 and then blows towards the finned radiator structure 12 through the air inlet 51, the air duct housing 50 and the air outlet 52. In this way, without adding an extra fan to the inverter-booster integrated machine, not only can the semiconductor power devices 24 and the reactor 27 in the power conversion box 21 be cooled, but also the finned radiator structure 12 can be cooled, thereby cooling the high- and low-voltage windings and the iron core of the oil transformer located in the oil tank 11. In this way, while enhancing the heat dissipation effect of the transformer box, not only can the cost and power consumption of the inverter-booster integrated machine for heat dissipation be reduced, but also the noise of the inverter-booster integrated machine can be reduced.
[0060] It should be noted that, as Figure 3 shown, in the first embodiment of the present invention, the main power mechanism 22 includes a fan, the fan is located in the power conversion box 21, the cooling medium is the cooling air flow, and the fan drives the cooling air flow to the finned radiator structure 12 so that the finned radiator structure 12 is located on the flow path of the cooling air flow in the power conversion box 21.
[0061] As Figure 3 shown, in the first embodiment of the present invention, the power conversion box 21 is provided with a ventilation opening 28, and the ventilation opening 28 and the air duct housing 50 are located on both sides of the radiator 23. In this way, the area of the cooling air flow flowing through the radiator can be increased, thereby improving the heat dissipation effect.
[0062] Specifically, in the first embodiment of the present invention, the fan is placed on the top of the power conversion box 21, and a top-inlet and bottom-outlet air duct design is adopted. The reactor 27 is located below the semiconductor power device 24. The air first cools the semiconductor power device 24 and then blows towards the reactor 27 to cool it, and by diverting the air outlet of the power converter to the finned radiator structure 12, the transformer oil in the finned radiator structure 12 changes from natural cooling to forced convection, increasing the heat dissipation effect of the transformer box.
[0063] Embodiment Two
[0064] Since the reactor 27 of the power converter has a relatively large self-air resistance, the air volume of the air flow generated by the fan blowing to the finned radiator structure 12 is small and the air temperature is high. Therefore, as Figure 4 shown, the difference between the second embodiment and the first embodiment of the present invention is that the reactor 27 in the power conversion box 21 can be moved into the oil tank 11 through structural deformation so that the heat dissipation method of the reactor 27 is the same as that of the high- and low-voltage windings and the iron core of the oil transformer. At this time, the air outlet volume of the power converter will increase and the air temperature will decrease, thereby enhancing the convective heat transfer effect of the transformer oil in the finned radiator structure 12.
[0065] Other structures of the second embodiment are the same as those of the first embodiment and will not be elaborated here.
[0066] Embodiment Three
[0067] As shown in Figure 5 , the difference between the third embodiment and the first embodiment of the present utility model is that the air outlet 52 is communicated with the inside of the power conversion box 21, and the air inlet 51 is arranged facing the finned structure 12. In this way, under the action of the power mechanism 22, the air flow enters the air inlet 51, the air duct housing 50 and the air outlet 52 in sequence through the finned structure 12, and enters the power conversion box 21 from the air outlet 52 and flows through the radiator 23 and the reactor 27 in sequence, and then is discharged through the ventilation port 28. In this way, without additionally adding a fan to the inverter boost integrated machine, the incoming air of the power converter first passes through the finned structure 12, so that the transformer oil in the finned structure 12 changes from natural cooling to forced convection, increasing the heat dissipation effect of the transformer box.
[0068] The other structures of the third embodiment are the same as those of the first embodiment, and will not be elaborated here.
[0069] Embodiment Four
[0070] As shown in Figure 6 , the difference between the fourth embodiment and the third embodiment of the present utility model is that the reactor 27 in the power conversion box 21 can be moved to the oil tank 11 through structural deformation, so that the heat dissipation method of the reactor 27 is the same as that of the high-voltage and low-voltage windings and the iron core of the oil transformer. At this time, the air output of the power converter will increase and the air temperature will decrease, thereby improving the convective heat transfer effect of the transformer oil in the finned structure 12.
[0071] The other structures of the fourth embodiment are the same as those of the third embodiment, and will not be elaborated here.
[0072] Embodiment Five
[0073] As shown in Figure 7 and Figure 8 , in the fifth embodiment of the present utility model, the power converter adopts a heat dissipation method of liquid cooling, thermosiphon or vapor compression refrigeration, that is, the radiator 23 is not provided in the power conversion box 21. The power conversion box 21 includes a first box body 211 and a second box body 212. A condenser 25 is provided in the first box body 211, and an evaporator 26 for dissipating heat from the semiconductor power device 24 is provided in the second box body 212; both the first box body 211 and the second box body 212 are communicated with the air duct housing 50, and the first box body 211 has a first inlet and a first outlet, and the second box body 212 has a second inlet and a second outlet; the first outlet of the first box body 211 and the second outlet of the second box body 212 are both communicated with the air inlet 51 of the air duct housing 50, and the air outlet 52 is arranged facing the finned structure 12.
[0074] Further, the reactor 27 is located in the oil tank provided with the evaporator 26. The power mechanism 22 includes two fans, and both the first box body 211 and the second box body 212 are provided with fans inside. The cooling medium is a cooling air flow, and the fans drive the cooling air flow to the finned structure 12 so that the finned structure 12 is located on the flow path of the cooling air flow of the power conversion box 21.
[0075] With the above arrangement, under the action of the power mechanism 22, the air flow can enter the first box body 211 and the second box body 212 through the first inlet and the second inlet respectively. The air flows in the first box body 211 and the second box body 212 can respectively enter the air duct housing 50 through the two air inlets 51 to converge, and are blown towards the finned structure 12 through the air outlet 52. In this way, the cooling air flow of the second box body 212 can dissipate heat from the reactor 27, the air flow in the first box body 211 can dissipate heat from the condenser 25, and the air flow blown out from the air outlet 52 can dissipate heat from the finned structure 12, so as to dissipate heat from the high-voltage and low-voltage windings and the iron core of the oil transformer located in the oil tank 11. In this way, without additionally increasing the fan in the inverter-booster integrated machine, the heat dissipation effect of the transformer box can be increased, so as to reduce the cost and power consumption of heat dissipation of the inverter-booster integrated machine.
[0076] It should be noted that in the fifth embodiment of the present invention, the condenser 25 and the evaporator 26 are respectively the evaporation end and the condensation end of the liquid cooling system.
[0077] Specifically, in the fifth embodiment of the present invention, the semiconductor power device 24 is cooled at the evaporator 26, and its heat is taken away by the outside air through the condenser 25 of the first box body 211, while the reactor 27 is placed in the second box body 212 to achieve forced air cooling through the fan.
[0078] Specifically, as Figure 7 and Figure 8 shown, in the fifth embodiment of the present invention, the air duct housing 50 includes a first housing section and a second housing section that are connected and arranged at an angle to form an L-shaped air duct housing 50. The first housing section and the second housing section are respectively connected to the first box body 211 and the second box body 212, and the outlet of the first housing section is arranged towards the finned structure 12; in one embodiment, the air duct housing 50 can also be V-shaped.
[0079] As Figure 7 shown, in the fifth embodiment of the present invention, the air outlet 52 can be located above the finned structure 12, or can be located below the finned structure 12 as Figure 8 shown.
[0080] Embodiment Six
[0081] As Figure 9 and Figure 10As shown in the figure, the difference between the sixth embodiment and the fifth embodiment of the present utility model is that the first inlet of the first box body 211 and the second inlet of the second box body 212 are both communicated with the air outlet 52 of the air duct housing 50, and the air inlet 51 of the air duct housing 50 faces the finned structure.
[0082] With the above settings, under the action of the power mechanism, the cooling air flow can flow through the finned structure 12, enter the air duct housing 50 from the air inlet 51, and then enter the first box body 211 and the second box body 212 respectively through the air outlet 52 and be discharged from the first outlet and the second outlet. In this way, the air flow in the second box body 212 can dissipate heat from the reactor 27, and the cooling air flow flowing through the finned structure 12 can dissipate heat from the finned structure 12, so as to dissipate heat from the high-voltage and low-voltage windings and the iron core of the oil transformer located in the oil tank 11. In this way, without additionally adding a fan to the inverter boost integrated machine, the heat dissipation effect of the transformer box can be increased, so as to reduce the cost and power consumption of the heat dissipation of the inverter boost integrated machine.
[0083] As Figure 9 shown, in the sixth embodiment of the present utility model, the air inlet 51 can be located above the finned structure 12, or as Figure 10 shown, located below the finned structure 12.
[0084] Other structures of the sixth embodiment are the same as those of the fifth embodiment and will not be described in detail here.
[0085] Embodiment Seven
[0086] As Figure 11 shown, the difference between the seventh embodiment and the fifth embodiment of the present utility model is that the first box body 211 has a first inlet and a first outlet, and the second box body 212 has a second inlet and a second outlet; there are two air duct housings 50, and the two air duct housings 50 are respectively located on the first side and the second side of the finned structure 12; the air inlet 51 of the air duct housing 50 located on the first side is communicated with the first outlet of the first box body 211, and the air outlet 52 of the air duct housing 50 located on the first side faces the finned structure 12; the air outlet 52 of the air duct housing 50 located on the second side is communicated with the second inlet of the second box body 212, and the air inlet 51 of the air duct housing 50 located on the second side faces the finned structure 12.
[0087] With the above settings, under the action of the power mechanism 22, the cooling air flows into the first box body 211 through the first inlet, then enters the air duct shell 50 on the first side through the first outlet, and blows towards the finned structure 12 from the air outlet 52 of the air duct shell 50 on the first side to dissipate heat from the finned structure 12. The air flow passing through the finned structure 12 flows into the second box body 212 through the air duct shell 50 on the second side, and can dissipate heat from the reactor 27 inside the second box body 212. In this way, without adding an extra fan to the inverter step-up integrated machine, the heat dissipation effect of the transformer box can be increased, so as to reduce the cost and power consumption of heat dissipation of the inverter step-up integrated machine.
[0088] Further, the outside air first undergoes forced convection with the transformer oil in the finned structure 12, and then enters the second box body 212 provided with the reactor to complete the air-cooled heat dissipation of the reactor 27; at the same time, the air outlet of the condenser 25 is diverted to the finned structure 12 to further increase the heat dissipation effect of the transformer box.
[0089] Other structures of the seventh embodiment are the same as those of the fifth embodiment, and will not be described in detail here.
[0090] Embodiment Eight
[0091] As Figure 12 shown, the difference between the eighth embodiment of the present utility model and the fifth embodiment lies in that the second outlet of the second box body 212 is communicated with the first inlet of the first box body 211, the first outlet of the first box body 211 is communicated with the air inlet 51 of the air duct shell 50, and the air outlet 52 is arranged towards the finned structure 12.
[0092] With the above settings, under the action of the power mechanism 22, the air flow enters the first box body 211 from the second box body 212, and then enters the air duct shell 50 through the first outlet and the air inlet 51 of the first box body 211. The air flow in the air duct shell 50 is diverted to the finned structure 12 through the air outlet 52 to complete the heat dissipation of the reactor 27 and the fuel tank 11. In this way, by arranging the first box body 211 and the second box body 212 in series, the cooling air flow and the evaporator 26 can simultaneously dissipate heat from the semiconductor power device 24 in the second box body 212 to improve the heat dissipation effect.
[0093] Other structures of the eighth embodiment are the same as those of the fifth embodiment, and will not be described in detail here.
[0094] Embodiment Nine
[0095] As Figure 13As shown in the figure, the difference between the ninth embodiment and the eighth embodiment of the present utility model lies in that the second inlet of the second box body 212 is communicated with the first outlet of the first box body 211, the first inlet of the first box body 211 is communicated with the air outlet 52 of the air duct shell 50, and the air inlet 51 of the air duct shell 50 faces the finned structure. In this way, the cooling air flow can first flow through the finned structure 12, and then flow into the second box body 212 through the air duct shell 50 and the first box body 211. It can also enable the cooling air flow and the evaporator 26 to dissipate heat from the semiconductor power device 24 in the second box body 212 at the same time, so as to improve the heat dissipation effect.
[0096] The other structures of the ninth embodiment are the same as those of the eighth embodiment, and will not be elaborated here.
[0097] Embodiment Ten
[0098] As Figure 14 As shown in the figure, in the tenth embodiment of the present utility model, the power converter adopts a heat dissipation method of liquid cooling, thermosiphon or vapor compression refrigeration. The power conversion box 21 includes a first box body 211 and a second box body 212. A condenser 25 is provided in the first box body 211, and an evaporator 26 for dissipating heat from the semiconductor power device 24 is provided in the second box body 212; the air inlet 51 is communicated with the first box body 211, and the air outlet 52 faces the finned structure 12. Among them, a fan is provided in the first box body 211, and the reactor 27 is located in the oil tank 11.
[0099] Through the above settings, under the action of the power mechanism 22, the cooling air flow enters the first box body 211 to dissipate heat from the condenser 25, and then enters the air duct shell 50 through the air inlet 51. The air flow in the air duct shell 50 is diverted to the finned structure 12 through the air outlet 52, and the transformer oil in the finned structure 12 changes from natural cooling to forced convection to complete the heat dissipation of the transformer box itself and the reactor 27.
[0100] Specifically, in the tenth embodiment of the present utility model, the reactor 27 is located in the oil tank 11, so that the heat dissipation method of the reactor 27 is the same as that of the high- and low-voltage windings and the iron core of the oil transformer.
[0101] Specifically, in the tenth embodiment of the present utility model, the semiconductor power device 24 is cooled at the evaporator 26, and its heat is taken away by the cooling air flow through the condenser 25 placed in the first box body 211.
[0102] It should be noted that in the tenth embodiment of the present utility model, the condenser 25 and the evaporator 26 are respectively the evaporation end and the condensation end of the liquid cooling system.
[0103] It should be noted that the cooling medium is the cooling air flow, and the fan drives the cooling air flow to the finned structure 12, so that the finned structure 12 is located on the flow path of the cooling air flow of the power conversion box 21.
[0104] Embodiment XI
[0105] As Figure 15 shown, the difference between Embodiment XI of the present utility model and Embodiment X is that the air outlet 52 communicates with the inside of the first box body 211, and the air inlet 51 is arranged towards the finned structure 12.
[0106] With the above arrangement, under the action of the power mechanism 22, the cooling air flows through the finned structure 12 and enters the air duct housing 50 from the air inlet 51, and then the cooling air in the air duct housing 50 enters the first box body 211 through the air outlet 52. In this way, the transformer oil in the finned structure 12 changes from natural cooling to forced convection to complete the heat dissipation of the transformer tank itself and the reactor 27.
[0107] The other structures of Embodiment XI are the same as those of Embodiment X and will not be described in detail here. It should be noted that all the above solutions can be applied to the situation where multiple power converters (PCS) are paralleled with an oil transformer. And by additionally arranging the air duct housing 50, the air outlet (or air inlet) of the power converter (PCS) is diverted to the finned structure 12, avoiding the mutual influence between the air outlets when multiple power converters PCS are paralleled.
[0108] From the above description, it can be seen that the above embodiments of the present utility model achieve the following technical effects: by making at least part of the finned structure located on the flow path of the cooling air of the power conversion box, the power conversion box and the oil tank can share the power mechanism for heat dissipation. In this way, without additionally increasing the fan in the inverter-booster integrated machine, not only can the natural cooling of the finned structure of the transformer tank be changed to forced convection, so as to realize the simultaneous heat dissipation of the power conversion box and the transformer tank, but also the noise of the whole inverter-booster integrated machine can be prevented from increasing due to the addition of the fan. In this way, while increasing the heat dissipation effect of the transformer tank, not only can the cost and power consumption of the heat dissipation of the inverter-booster integrated machine be reduced, but also the noise of the inverter-booster integrated machine can be reduced.
[0109] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.
Claims
1. A heat dissipation device for an inverter-booster integrated machine, characterized in that, Comprising: A transformer box, including an oil tank (11) and a finned structure (12) connected to the oil tank (11), the finned structure (12) having an oil passage communicating with the inside of the oil tank (11), both the oil passage and the inside of the oil tank (11) being configured to allow transformer oil to pass through, and the oil tank (11) being used to accommodate a winding structure; A power conversion box (21) for accommodating semiconductor power devices (24); A power mechanism (22) for driving a cooling air flow into the power conversion box (21) to dissipate heat from the power conversion box (21); Wherein, at least part of the finned structure (12) is located on the flow path of the cooling air flow of the power conversion box (21).
2. The heat dissipation device for the integrated inverter-booster machine according to claim 1, characterized in that The heat dissipation device for the inverter-booster integrated machine further includes a duct housing (50) for passing the cooling air flow, the duct housing (50) having an air inlet (51) and an air outlet (52), one of the air inlet (51) and the air outlet (52) being in communication with the inside of the power conversion box (21), and the other of the air inlet (51) and the air outlet (52) being arranged facing the finned structure (12).
3. The heat dissipation device for the integrated inverter-booster according to claim 2, wherein The heat dissipation device for the inverter-booster integrated machine further includes a radiator (23) located in the power conversion box (21), the radiator (23) being configured to dissipate heat from the semiconductor power devices (24).
4. The heat dissipation device for the integrated inverter-booster according to claim 3, characterized in that, A ventilation opening (28) is provided on the power conversion box (21), and the ventilation opening (28) and the duct housing (50) are located on both sides of the radiator (23).
5. The heat dissipation device for the integrated inverter and booster according to claim 2, characterized in that, The power conversion box (21) includes a first box body (211) and a second box body (212), a condenser (25) is provided in the first box body (211), and an evaporator (26) for dissipating heat from the semiconductor power devices (24) is provided in the second box body (212); Both the first box body (211) and the second box body (212) are in communication with the duct housing (50).
6. The heat dissipation device for the integrated inverter-booster according to claim 5, characterized in that, The first box body (211) has a first inlet and a first outlet, and the second box body (212) has a second inlet and a second outlet; The first outlet of the first box body (211) and the second outlet of the second box body (212) are both in communication with the air inlet (51) of the duct housing (50), and the air outlet (52) is arranged facing the finned structure (12); or, The first inlet of the first box body (211) and the second inlet of the second box body (212) are both in communication with the air outlet (52) of the duct housing (50), and the air inlet (51) of the duct housing (50) is arranged facing the finned structure (12).
7. The heat dissipation device for the integrated inverter-booster according to claim 5, characterized in that, The first box body (211) has a first inlet and a first outlet, and the second box body (212) has a second inlet and a second outlet; The second outlet of the second box body (212) is in communication with the first inlet of the first box body (211), the first outlet of the first box body (211) is in communication with the air inlet (51) of the duct housing (50), and the air outlet (52) is arranged facing the finned structure (12); or, The second inlet of the second box body (212) is communicated with the first outlet of the first box body (211), the first inlet of the first box body (211) is communicated with the air outlet (52) of the air duct shell (50), and the air inlet (51) of the air duct shell (50) faces the finned structure (12).
8. The heat dissipation device for the integrated inverter-booster according to claim 5, characterized in that, The first box body (211) has a first inlet and a first outlet, and the second box body (212) has a second inlet and a second outlet; There are two air duct shells (50), and the two air duct shells (50) are respectively located on the first side and the second side of the finned structure (12); The air inlet (51) of the air duct shell (50) located on the first side is communicated with the first outlet of the first box body (211), and the air outlet (52) of the air duct shell (50) located on the first side faces the finned structure (12); The air outlet (52) of the air duct shell (50) located on the second side is communicated with the second inlet of the second box body (212), and the air inlet (51) of the air duct shell (50) located on the second side faces the finned structure (12).
9. The heat dissipation device for the integrated inverter-booster according to claim 2, characterized in that, The power conversion box (21) includes a first box body (211) and a second box body (212). A condenser (25) is provided in the first box body (211), and an evaporator (26) for cooling the semiconductor power device (24) is provided in the second box body (212); One of the air inlet (51) and the air outlet (52) is communicated with the first box body (211), and the other of the air inlet (51) and the air outlet (52) faces the finned structure (12).
10. The heat dissipation device for the integrated inverter-booster according to any one of claims 2 to 9, characterized in that, The heat dissipation device for the inverter-booster integrated machine further includes a heat dissipation structure, and the heat dissipation structure includes: A mounting member (55) mounted on the air duct shell (50); A plurality of heat dissipation members (56) are arranged at intervals on the mounting member (55). One end of each heat dissipation member (56) extends into the air duct shell (50), and the other end of each heat dissipation member (56) is located outside the air duct shell (50).
11. The heat dissipation device for the integrated inverter-booster according to any one of claims 2 to 9, characterized in that, The power mechanism (22) includes a fan, and at least one of the finned structure (12), the power conversion box (21), inside the power conversion box (21), on the air duct shell (50), and inside the air duct shell (50) is provided with the fan.
12. An inverter-booster integrated machine, characterized in that, Including: The heat dissipation device for the inverter-booster integrated machine according to any one of claims 1 to 11; A winding structure located inside the fuel tank (11); A semiconductor power device (24) mounted inside the power conversion box (21).
13. The integrated inverter-booster according to claim 12, characterized in that, The inverter-booster integrated machine further includes a reactor (27), and the reactor (27) is located inside the power conversion box (21) or inside the fuel tank (11).