Efficient heat dissipation device convenient to assemble and electronic equipment

Abstract

The utility model discloses an efficient heat dissipation device convenient to assemble and electronic equipment. The heat dissipation device comprises an upper cover plate, a bottom cavity, a heat dissipation A single sheet and a heat dissipation B single sheet. The upper cover plate is covered with a first solder layer and is provided with a mounting through groove; a second solder layer covers the overlapped side surface of the heat dissipation single sheet A and / or the heat dissipation single sheet B, and the heat dissipation single sheet A and the heat dissipation single sheet B extend downwards at the end part of the corresponding flow channel wall surface to form a connecting part; the radiating A single sheet is provided with a folding sheet which is bent and extends towards the radiating B single sheet; the heat dissipation single pieces A and the heat dissipation single pieces B are inserted into the mounting through grooves in a mutually stacked mode at the top of the upper cover plate, the connecting parts are stacked to define a flow channel connector part, the folding pieces stretch out of the sides, away from the heat dissipation single pieces A, of the heat dissipation single pieces B, the stretching-out ends of the folding pieces make contact with the adjacent heat dissipation single pieces A for positioning, and the bottom cavity is assembled at the bottom of the upper cover plate in a stacked mode. Forming an assembled semi-finished product; and assembling a semi-finished product and performing one-time vacuum welding fixation. In this way, assembling is convenient and fast, and stability is ideal.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to an efficient heat dissipation device and an electronic device that are convenient for assembly. Background Art

[0002] Heat dissipation devices are widely used in electronic devices. For example, in communication devices, heat dissipation devices are often used to dissipate heat from chips, power supplies, etc. The heat dissipation device usually includes a heat dissipation substrate and a plurality of heat dissipation fins arranged on the heat dissipation substrate. The heating element is generally attached to the heat dissipation substrate, and the heating element and the heat dissipation fins are distributed on two opposite sides of the heat dissipation substrate. A cavity and a flow channel are preset in the heat dissipation substrate and the heat dissipation fins, and a working fluid medium (also referred to as a refrigerant) flows inside. Since the heat dissipation fins are welded to the heat dissipation substrate, the problem of leakage of the working fluid medium is likely to occur at the weld. Therefore, those skilled in the art are committed to how to improve the problem of leakage of the working fluid medium.

[0003] For example: CN 117222184 A discloses a phase change heat dissipation device and a communication device, including: a substrate having a first hollow cavity; a plurality of fin arrays, each fin having a second hollow cavity, and the second hollow cavities of the fins are communicated through a connecting portion located outside the fins; the fins include a first fin and a second fin located at both ends of the fin array in the first extending direction, the bottom of the first fin has a first inlet communicated with its second hollow cavity, the bottom of the second fin has a first outlet communicated with its second hollow cavity, and each fin array is fixedly connected to the substrate through the first inlet and the first outlet. The substrate absorbs the heat of the heating element, so that the working medium undergoes a phase change cycle in the first hollow cavity and the second hollow cavity to dissipate the heat through the fins. Each fin array flow channel and the cavity of the substrate have only two docking ports to reduce the number of solder joints and leakage, thereby improving the use reliability of the heat dissipation device. However, its docking port needs to be connected to a connecting pipe, and then the connecting pipe is welded to the substrate. The welding operation is troublesome. Especially in the link of adding the connecting pipe, there is still a risk of false soldering, and there is still a hidden danger of leakage of the working fluid medium.

[0004] For another example, CN 117222183 A discloses a phase change radiator and a communication device. The phase change radiator includes a substrate unit and a fin unit. The substrate unit includes a first surface and a second surface. The first surface is used to face the heat generating element, and the second surface is used to mount the fin unit. The fin unit includes a mounting portion abutting against the second surface and a heat dissipation portion extending from the mounting portion. The mounting portion is provided with a second opening communicating with the refrigerant channel of the heat dissipation portion, and the second surface is provided with a first opening communicating with the internal hollow cavity of the substrate unit. When the mounting portion abuts against the second surface, the first opening and the second opening are fixed by welding. By welding and fixing the two openings of the mounting portion and the substrate unit, the welding area is small and the weld is short, which reduces the welding difficulty and improves the process yield, so that refrigerant leakage is not easily caused. During actual welding, it is equivalent to fitting and welding the surfaces where the two openings are located respectively. Limited by the flatness of the surfaces, it is difficult to achieve an ideal fit between the two surfaces, resulting in a potential risk of working fluid medium leakage at the welded joint although the fitting and welding are carried out.

[0005] In addition, both of the above two existing phase change heat dissipation devices have the problem of troublesome assembly.

[0006] Therefore, it is necessary to study a new technical solution to solve the above problems. Utility Model Content

[0007] In view of this, in view of the deficiencies of the prior art, the main purpose of the present utility model is to provide a highly efficient heat dissipation device and an electronic device that are convenient for assembly, which are convenient and fast to assemble and have relatively ideal stability.

[0008] Another purpose thereof is to provide a highly efficient heat dissipation device and an electronic device that are convenient for assembly, effectively solving the problem of potential leakage of working fluid medium at the welded joint in the traditional technology.

[0009] To achieve the above object, the present utility model adopts the following technical solutions:

[0010] A highly efficient heat dissipation device that is convenient for assembly includes an upper cover plate, a bottom cavity, a heat dissipation single piece A and a heat dissipation single piece B.

[0011] A first solder layer is covered on the top surface of the upper cover plate, and a mounting through groove is provided on the top surface of the upper cover plate.

[0012] The bottom cavity has a cavity for accommodating a fluid medium.

[0013] The overlapping side surfaces of the heat dissipation A single piece and / or the heat dissipation B single piece are covered with a second solder layer. Matching corresponding flow channel wall surfaces are provided on the overlapping side surfaces of the heat dissipation A single piece and the heat dissipation B single piece. The heat dissipation A single piece and the heat dissipation B single piece extend downward at the ends of the corresponding flow channel wall surfaces to form connecting parts; a folding piece that bends and extends towards the heat dissipation B single piece is provided on the heat dissipation A single piece;

[0014] The heat dissipation A single piece and the heat dissipation B single piece are stacked and inserted into the installation through groove on the top of the upper cover plate. The connecting parts are stacked and enclosed to form a flow channel interface part. The folding piece extends out of the side of the heat dissipation B single piece away from the heat dissipation A single piece, and the extending end of the folding piece contacts and positions with the adjacent heat dissipation A single piece. And, the bottom cavity body is stacked and assembled at the bottom of the upper cover plate, thus forming an assembled semi-finished product; the assembled semi-finished product is fixed by vacuum soldering at one time.

[0015] As a preferred solution, the peripheral edge of the top end of the installation through groove is chamfered to form an annular diversion surface around the installation through groove. An annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular diversion surface. During vacuum soldering, the first solder layer on the top surface of the upper cover plate melts and flows into the annular gap along the annular diversion surface, and then a sealed soldering is formed between the outer peripheral surface of the flow channel interface part and the annular diversion surface.

[0016] As a preferred solution, the folding piece is arranged at the edge position of the front side, rear side or top of the heat dissipation A single piece, so that the folding piece of the heat dissipation A single piece clamps and positions the periphery of the heat dissipation B single piece.

[0017] As a preferred solution, the folding piece is also arranged in the middle area of the heat dissipation A single piece except the edge on the plate. The folding piece is bent from the first hollow part on the heat dissipation A single piece. Correspondingly, a second hollow part opposite to it is formed on the heat dissipation B single piece for the folding piece of the heat dissipation A single piece to pass through.

[0018] As a preferred solution, a plurality of folding pieces are arranged in the middle area, and multiple rows are arranged at intervals in the vertical direction. Each row includes a plurality of folding pieces arranged at intervals in the front-rear direction.

[0019] As a preferred solution, two groups of riveting convex parts are respectively arranged at both ends of the installation through groove corresponding to the bottom of the upper cover plate. Each group of riveting convex parts includes two riveting convex parts arranged at intervals left and right. The flow channel interface part extends downward out of the bottom of the upper cover plate and extends into the space between the two riveting convex parts, and the flow channel interface part is fixed by pressing the riveting convex parts.

[0020] As a preferred solution, a butt joint surface is provided at the front end and / or the rear end of the flow channel interface part. After the flow channel interface part is inserted into the installation through groove, the butt joint surface abuts against the top surface of the upper cover plate.

[0021] As a preferred solution, the connecting part includes a flow channel enclosing wall and first wall parts respectively connected to both ends of the flow channel enclosing wall. The flow channel enclosing wall encloses to form a flow channel interface, and the first wall parts at both ends correspondingly fit to form a widened part, and the first wall parts at both ends extend into the space between the two riveting convex parts.

[0022] As a preferred solution, a first capillary filler is filled in the flow channel;

[0023] and / or:

[0024] A second capillary filler is filled in the cavity.

[0025] An electronic device includes a heating element and a heat dissipation device; the heat dissipation device is an efficient heat dissipation device convenient for assembly described in any one of the previous items.

[0026] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solutions, it is mainly through the setting of the upper cover plate, the bottom cavity body, the heat dissipation A single piece and the heat dissipation B single piece. In particular, a folding piece is provided on the heat dissipation A single piece and bends and extends towards the heat dissipation B single piece. During assembly, the heat dissipation A single piece and the heat dissipation B single piece are inserted into the installation through groove in a stacked manner on the top of the upper cover plate. The connecting parts are stacked and enclosed to form a flow channel interface part. The folding piece extends out of the side of the heat dissipation B single piece away from the heat dissipation A single piece, and the extending end of the folding piece contacts and positions with the adjacent heat dissipation A single piece. And the bottom cavity body is stacked and assembled at the bottom of the upper cover plate, thus forming an assembled semi-finished product; the assembled semi-finished product is fixed by vacuum welding at one time, which is convenient and fast to assemble and has relatively ideal stability. Since the top surface of the upper cover plate is covered with a first solder layer, during vacuum welding, the first solder layer on the top surface of the upper cover plate melts and can flow into the gap between the flow channel interface part and the installation through groove to form a sealed welded fixation, effectively solving the problem of potential leakage of the working fluid medium at the welding part in the traditional technology.

[0027] In addition, through the chamfering setting of the opening periphery of the installation through groove, an annular diversion surface surrounding the installation through groove is formed, which is convenient for the molten solder to better flow into the gap between the flow channel interface part and the installation through groove, further ensuring the welding effect and not easily appearing situations such as false soldering or loosening and cracking at the welding part.

[0028] To more clearly illustrate the structural features and functions of the present invention, the present invention will be described in detail below with reference to the drawings and specific embodiments. Description of the Drawings

[0029] Figure 1 is an exploded view of the heat dissipation device according to an embodiment of the present utility model;

[0030] Figure 2 is an exploded view of the heat dissipation single piece A and the heat dissipation single piece B of the first group of heat dissipation fins on the right side of the heat dissipation device according to an embodiment of the present utility model;

[0031] Figure 3 is an exploded view of the heat dissipation single piece A and the heat dissipation single piece B of the second group of heat dissipation fins on the right side of the heat dissipation device according to an embodiment of the present utility model;

[0032] Figure 4 is a partial structural view of the heat dissipation single piece A and the heat dissipation single piece B of the heat dissipation device according to an embodiment of the present utility model;

[0033] Figure 5 is a partial structural view (before vacuum welding) of a group of heat dissipation fins of the heat dissipation device according to an embodiment of the present utility model disposed on a heat dissipation base;

[0034] Figure 6A is a partial structural view (before welding) of the flow channel interface portion and the upper cover plate of the heat dissipation device according to an embodiment of the present utility model after assembly;

[0035] Figure 6B is a partial structural view (after welding) of the flow channel interface portion and the upper cover plate of the heat dissipation device according to an embodiment of the present utility model after assembly;

[0036] Figure 7 is a partial three-dimensional view (showing the bottom structure of the upper cover plate) of the heat dissipation single piece A and the heat dissipation single piece B of the heat dissipation device according to an embodiment of the present utility model disposed on the upper cover plate;

[0037] Figure 8 is a cross-sectional view of the heat dissipation single piece A and the heat dissipation single piece B of another embodiment of the present utility model with a first capillary filler disposed in the middle;

[0038] Figure 9 is an exploded view of a second capillary filler disposed in the bottom cavity of another embodiment of the present utility model;

[0039] Figure 10 is an assembly view of a second capillary filler disposed in the bottom cavity of another embodiment of the present utility model. Detailed implementation manners

[0040] Please refer to Figures 1 to 10 as shown, which shows the specific structures of various embodiments of the present utility model.

[0041] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0042] An efficient heat dissipation device that is easy to assemble, which is applicable to dissipating heat from high-power electronic components. It includes an upper cover plate 1, a bottom cavity 2, a heat dissipation single piece A 3, and a heat dissipation single piece B 4.

[0043] A first solder layer C1 is covered on the top surface of the upper cover plate 1, and an installation through groove 101 is provided on the top surface of the upper cover plate 1.

[0044] A cavity 201 for accommodating a fluid medium is provided inside the bottom cavity 2.

[0045] A second solder layer is covered on the overlapping side surfaces of the heat dissipation single piece A 3 and / or the heat dissipation single piece B 4. Matching corresponding flow channel wall surfaces are provided on the overlapping side surfaces of the heat dissipation single piece A 3 and the heat dissipation single piece B 4. Connecting parts are formed by the heat dissipation single piece A 3 and the heat dissipation single piece B 4 extending downward at the ends of the corresponding flow channel wall surfaces. A folding piece 301 that bends and extends towards the heat dissipation single piece B 4 is provided on the heat dissipation single piece A 3. Preferably, the folding piece is arranged at the edge position of the front side, rear side or top of the heat dissipation single piece A 3, so that the folding piece 301 of the heat dissipation single piece A 3 clamps and positions the periphery of the heat dissipation single piece B 4. Preferably, the folding piece 301 is also arranged in the middle area of the heat dissipation single piece A 3 except the edge. The folding piece 301 is bent from a first hollow area 302 on the heat dissipation single piece A 3. Correspondingly, a second hollow area 401 opposite thereto is formed on the heat dissipation single piece B 4 for the folding piece 301 of the heat dissipation single piece A 3 to pass through. A plurality of folding pieces 301 are arranged in the middle area, and are arranged in multiple rows at vertical intervals. Each row includes a plurality of folding pieces arranged at horizontal intervals.

[0046] During assembly, the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are inserted into the installation through groove 101 in a stacked manner on the top of the upper cover plate 1. The connecting parts are stacked and enclosed to form a flow channel interface part 347. The folding piece extends out of the side of the heat dissipation single piece B 4 away from the heat dissipation single piece A 3. The extending end of the folding piece 301 is in contact with and positioned against the adjacent heat dissipation single piece A 3. Moreover, the bottom cavity 2 is stacked and assembled at the bottom of the upper cover plate 1, thus forming an assembled semi-finished product. The assembled semi-finished product is fixed by vacuum soldering at one time, which is convenient and fast for assembly and has relatively ideal stability. Since the top surface of the upper cover plate 1 is covered with a first solder layer C1, during vacuum soldering, the first solder layer C1 on the top surface of the upper cover plate 1 melts and can flow into the gap between the flow channel interface part 347 and the installation through groove 101 to form a sealed soldering fixation, effectively solving the problem of potential leakage of the working fluid medium at the soldering part in the traditional technology.

[0047] Further, in order to facilitate the molten solder to better flow into the gap between the flow channel interface part 347 and the installation through groove 101, further ensure the soldering effect, and prevent the occurrence of problems such as false soldering, loosening or cracking at the soldering part, the top peripheral edge of the installation through groove 101 is chamfered to form an annular guiding surface 102 around the installation through groove 101. An annular gap 105 is formed between the outer peripheral surface of the flow channel interface part 347 and the annular guiding surface 102. During vacuum soldering, the first solder layer C1 on the top surface of the upper cover plate 1 melts and flows more rapidly into the annular gap 105 along the annular guiding surface 102 to form a complete ring of solder D, thereby forming a sealed soldering between the outer peripheral surface of the flow channel interface part 347 and the annular guiding surface 102.

[0048] Specifically in this embodiment, the heat dissipation single piece A 3 is provided with a folding piece 301 that bends and extends towards the heat dissipation single piece B 4. After the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are stacked, the folding piece 301 extends out of the side of the heat dissipation single piece B 4 away from the heat dissipation single piece A 3. The extending end of the folding piece 301 is in contact with and positioned against the adjacent heat dissipation single piece A 3.

[0049] The flap 301 can be arranged at the edge positions such as the front side, the rear side, and the top of the heat dissipation single piece 3 of type A, so as to form a peripheral clamping and positioning of the heat dissipation single piece 3 of type A on the heat dissipation single piece 4 of type B, which is beneficial to the superposition stability of the two. The overall integrity of the superposed heat dissipation single pieces is good. The flap 301 can also be arranged in the middle area (the middle area referred to here does not mean the absolutely centered position in an absolute sense, but actually refers to the internal area surrounded by the edges) of the board of the heat dissipation single piece 3 of type A except for the edges. These flaps 301 are bent from the first hollow 302 on the heat dissipation single piece 3 of type A. Correspondingly, a second hollow 401 that is opposite and has the same or substantially the same shape is also formed on the heat dissipation single piece 4 of type B. Of course, it is usually not necessary to retain the flap 301 cut and bent from the hollow on the heat dissipation single piece 4 of type B like the heat dissipation single piece 3 of type A. The second hollow 401 on the heat dissipation single piece 4 of type B is mainly used for the flap 301 of the heat dissipation single piece of type A of the heat sink 200 in its own group to pass through, playing an avoidance role. During actual production, if the heat dissipation single piece 4 of type B also retains the flap 301 cut and bent from the hollow like the heat dissipation single piece 3 of type A, it can also be achieved as long as the flaps 301 of the heat dissipation single piece 3 of type A and the heat dissipation single piece 4 of type B are arranged in a stacked manner. Since one or more flaps 301 can be arranged in the middle area, these flaps 301 play a good role in positioning the heat sinks 200 of adjacent groups in the left-right direction, strengthening the structural correlation between the heat sinks 200 of each group. The heat sinks 200 of each group are not prone to shaking, making the overall structural strength better. Moreover, the flaps 301 can also play a role in strengthening the heat conduction between the heat sinks 200 of each group. Figure 3 The multiple flaps 301 in the middle area shown are arranged in multiple rows at vertical intervals, and each row includes multiple flaps 301 arranged at horizontal intervals. The arrangement of the multiple flaps 301 makes the contact positioning stress points between the heat sinks 200 of each group dispersed and uniform. After welding, a welded fixation will be formed at the contact positioning, making all the heat sinks 200 form a heat dissipation module with good strength and not easily deformed, which is more convenient for assembly and has better structural stability.

[0050] Among them, a first solder layer (such as a brazing layer) is covered on the top surface of the upper cover plate 1. An installation through groove 101 is provided on the top surface of the upper cover plate 1. The top peripheral edge of the installation through groove 101 is chamfered (which can be an inclined chamfer or an arc chamfer) to form an annular diversion surface 102 around the installation through groove 101. Matching corresponding flow channel wall surfaces are provided on the overlapping side surfaces of the heat dissipation single piece A 3 and the heat dissipation single piece B 4. Moreover, the heat dissipation single piece A 3 and the heat dissipation single piece B 4 extend downward at the ends of the corresponding flow channel wall surfaces to form a connecting portion 342. The heat dissipation single piece A 3 and the heat dissipation single piece B 4 are inserted into the installation through groove 101 in an overlapping manner to form a first-stage semi-finished product. Among them, the connecting portions 342 are overlapped to form a flow channel interface portion 347. An annular gap 105 is formed between the outer peripheral surface of the flow channel interface portion 347 and the annular diversion surface 102. Since two sets of riveting convex portions 104 are respectively provided at both ends of the installation through groove 101 corresponding to the bottom of the upper cover plate 1, each set of riveting convex portions 104 includes two riveting convex portions 104 arranged at a left-right interval. The connecting portion 342 extends downward out of the bottom of the upper cover plate 1 and extends into the space between the two riveting convex portions 104. The connecting portion 342 of the heat dissipation single piece A 3 and the heat dissipation single piece B 4 is tightly fixed by pressing the riveting convex portions 104. Here, the connecting portion 342 includes a flow channel enclosing wall 343 and first wall body portions 345 respectively connected to both ends of the flow channel enclosing wall 343. The flow channel enclosing wall 343 encloses to form a closed flow channel interface. The first wall body portions 345 at both ends are correspondingly attached to form a widened portion. The first wall body portions 345 at both ends extend into the space between the two riveting convex portions 104. A second wall body portion 346 also extends at the outer end of the first wall body portion 345. The lower end surface of the second wall body portion 346 is higher than the lower end surface of the first wall body portion 345, so that the lower end surface of the second wall body portion 346 serves as an abutting surface. After the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are inserted into the installation through groove 101 in an overlapping manner, the abutting surface abuts against the top surface of the upper cover plate 1. Therefore, when the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are inserted into the installation through groove 101 in an overlapping manner, the lower end surface of the second wall body portion 346 plays a role in limiting the insertion depth and also plays a role in pre-insertion positioning. Moreover, two riveting convex portions 104 can be riveted at the bottom of the upper cover plate 1 to fix the heat dissipation single piece A 3 and the heat dissipation single piece B 4.

[0051] Then, load the semi-finished product of the first stage into the bottom cavity 2 to form a semi-finished product of the second stage. The upper cover plate 1 and the bottom cavity 2 enclose a cavity. This assembly process can achieve the airtight assembly of the upper cover plate 1 and the bottom cavity 2, or it may still rely on subsequent vacuum welding to play a role in welding and fixing the upper cover plate 1 and the bottom cavity 2. The inside of the flow channel interface portion 347 communicates downward with the cavity. Perform vacuum welding on the semi-finished product of the second stage. After the first solder layer on the top surface of the upper cover melts, it flows into the annular gap along the annular diversion surface 102, and then a seal welding is formed between the outer peripheral surface of the flow channel interface portion 347 and the annular diversion surface 102.

[0052] The overlapping side surfaces of the heat dissipation single piece A 3 and / or the heat dissipation single piece B 4 are covered with a second solder layer, and the overlapping side surfaces of the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are mutually bonded and fixed by welding. The heat dissipation single piece A 3 and the heat dissipation single piece B 4 may have been welded together before being inserted into the installation through groove 101, or after inserting the heat dissipation single piece A 3 and the heat dissipation single piece B 4 into the installation through groove 101, when performing vacuum welding on the semi-finished product of the second stage, a finished product is welded at one time.

[0053] Before inserting the heat dissipation single piece A 3 and the heat dissipation single piece B 4 into the installation through groove 101 of the upper cover plate 1, a first capillary filler can be filled between the heat dissipation single piece A 3 and the heat dissipation single piece B 4, that is, on the flow channel wall surface. It is also possible to first fill the cavity 201 of the bottom cavity 2 with a second capillary filler before loading the first semi-finished product into the bottom cavity 2.

[0054] Provide an electronic device, such as a communication device, which includes a heating element and a heat dissipation device. Generally, the bottom of the bottom cavity 22 of the heat dissipation device is attached to the heating element, and the heat dissipation device is an efficient heat dissipation device that is easy to assemble as described above.

[0055] Next, introduce a manufacturing method for assembling and welding a finished product at one time with components such as the upper cover plate 1, the bottom cavity 2, several heat dissipation single pieces A 3, and several heat dissipation single pieces B 4, which includes the following steps:

[0056] Step 1, prepare the upper cover plate 1, the bottom cavity 2, several heat dissipation single pieces A 3, and several heat dissipation single pieces B 4;

[0057] Among them, the upper cover plate 1 is a composite layer material with a solder layer, such as an aluminum-based brazing composite layer material. Therefore, a first solder layer C1 is covered on its top surface. The top surface of the upper cover plate 1 is provided with several installation through grooves 101 arranged at left and right intervals, which means that the installation through grooves 101 communicate with the top surface and the bottom surface of the upper cover plate 1. The top peripheral edge of the installation through groove 101 is chamfered to form an annular diversion surface 102 around the installation through groove 101.

[0058] A cavity 201 is provided in the bottom cavity body 2, and a number of convex columns 202 are arranged at intervals in the cavity 201 to divide the cavity 201 into a number of zigzag flow channels. An installation column 203 protrudes upward from the peripheral edge of the top end of the bottom cavity body 2. Correspondingly, an installation hole 103 is provided on the peripheral edge of the upper cover plate 1, and the installation column 203 extends into the corresponding installation hole 103 to form the mutual assembly and positioning of the upper cover plate 1 and the bottom cavity body 2. Further, installation columns 203 can also be provided in the cavity 201, and corresponding installation holes 103 are provided on the upper cover plate 1 to improve the assembly stability of the upper cover plate 1 and the bottom cavity body 2. In the subsequent welding process, the installation column 203 and the installation hole 103 are welded and fixed. Specifically, an integral welded seal is formed between the outer peripheral surface of the installation column 203 and the inner peripheral surface of the installation hole 103, the top surface of the upper cover plate 1, and even between the peripheral edge of the top end of the bottom cavity body 2 and the bottom surface of the upper cover plate 1, the outer peripheral surface of the installation column 203, and the inner peripheral surface of the installation hole 103.

[0059] The heat dissipation single piece A 3 and / or the heat dissipation single piece B 4 are also composite layer materials with a solder layer, such as aluminum-based brazing composite layer materials. Therefore, a second solder layer is provided on the overlapping side surface thereof. Preferably, second solder layers are provided on the overlapping side surfaces of the heat dissipation single piece A 3 and the heat dissipation single piece B 4. Compared with the case where only the overlapping side surface of the heat dissipation single piece A 3 or the heat dissipation single piece B 4 is provided with a second solder layer, it is easier to weld and the welding effect is better. Moreover, the heat dissipation single piece A 3 and the heat dissipation single piece B 4 can be designed with the same structure (such as a symmetrical structure), so that the heat dissipation single pieces can be designed, produced, and manufactured in a unified manner, which is beneficial to mass production, better control of production quality, and reduction of production costs. Matching corresponding flow channel walls 341 are provided (such as recessed) on the overlapping side surfaces of the heat dissipation single piece A 3 and the heat dissipation single piece B 4. In this embodiment, flow channel walls 341 are recessed on the overlapping side surfaces of the heat dissipation single piece A 3 and the heat dissipation single piece B 4. It is also possible to only recess a flow channel wall 341 on one overlapping side surface, while the other overlapping side surface is a flat surface, which is equivalent to the flow channel wall 341 on the other overlapping side surface being a flat surface. And connecting portions 342 are formed by the heat dissipation single piece A 3 and the heat dissipation single piece B 4 extending downward at the ends of the corresponding flow channel walls 341; the second solder layer can be on the entire overlapping side surface, or on the area of the overlapping side surface except for the flow channel walls 341, or at least it is necessary to ensure that a closed flow channel 348 can be formed after the heat dissipation single piece A 3 and the heat dissipation single piece B 4 are stacked and welded.

[0060] Step 2: Stack the heat dissipation A single piece 3 and the heat dissipation B single piece 4 and insert them into the installation through groove 101. Among them, the connecting parts 342 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are stacked to form a flow channel interface part 347. The flow channel interface part 347 forms a closed ring. An annular gap is formed between the outer peripheral surface of the flow channel interface part 347 and the annular diversion surface 102, which is equivalent to the annular gap surrounding the outer periphery of the outer peripheral surface of the flow channel interface part 347. The stacked side surfaces of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are in contact. One heat dissipation A single piece 3 and one heat dissipation B single piece 4 are stacked to form a group of heat sinks 200. Their flow channel wall surfaces 341 are matched to form a flow channel, and their connecting parts 342 are also correspondingly matched. Two groups of connecting parts 342 are formed at the lower end of a group of heat sinks 200, corresponding to the fluid inlet and fluid outlet of this group of heat sinks 200. And, the bottom cavity 2 is stacked on the bottom of the upper cover plate 1. The upper cover plate 1 and the bottom cavity 2 form a heat dissipation base 100.

[0061] Step 3: Put the assembled product into a vacuum soldering furnace for soldering operations. Usually, it is a single vacuum soldering. After the first solder layer C1 on the top surface of the upper cover plate 1 melts, it flows into the annular gap along the annular diversion surface 102, and a complete circle of solder D is formed in the annular gap, thereby forming a sealed soldering between the outer peripheral surface of the flow channel interface part 347 and the annular diversion surface 102, solving the problem of leakage of the working fluid medium.

[0062] Further, the solder layer is a brazing layer. In step 3, brazing operations are performed. The assembled product is put into a vacuum brazing furnace for brazing operations, and a finished product is brazed out in one time.

[0063] In the said step 1, a first capillary filler 6 is also prepared. The first capillary filler 6 is filled corresponding to the flow channel wall surface 341, so that the flow channel is filled with the first capillary filler 6.

[0064] In the said step 1, a second capillary filler 7 is also prepared, such as a capillary net. The second capillary filler 7 is filled corresponding to the bottom cavity 2, so that the cavity formed by stacking the upper cover plate 1 and the bottom cavity 2 is filled with a capillary net.

[0065] In step 2, after the heat dissipation A single sheet 3 and the heat dissipation B single sheet 4 are stacked and inserted into the installation through groove 101, the flow channel interface part 347 extends downward from the bottom of the upper cover plate 1, and a pressing and fixing operation is performed on the extended part of the flow channel interface part 347 to fix the heat dissipation A single sheet 3 and the heat dissipation B single sheet 4 on the upper cover plate 1. The connecting part 342 includes a flow channel enclosing wall 343 and widened fitting walls 344 respectively connected to the front and rear ends of the flow channel enclosing wall 343. The widened fitting wall 344 includes a first wall body part 345 close to the flow channel enclosing wall 343 and a second wall body part 346 far from the flow channel enclosing wall 343. The lower end surface of the second wall body part 346 is higher than the lower end surface of the first wall body part 345, so that the lower end surface of the second wall body part 346 serves as an abutting surface. After the heat dissipation A single sheet 3 and the heat dissipation B single sheet 4 are stacked and inserted into the installation through groove 101, the abutting surface abuts against the top surface of the upper cover plate 1. On the one hand, it plays a role in assembling and positioning to limit the insertion depth. On the other hand, during the subsequent welding process, the first solder layer C1 on the top surface of the upper cover plate 1 forms a welded fixation with the abutting surface, strengthening the bonding stability between the entire set of heat sinks 200 and the upper cover plate 1. At the positions corresponding to the front and rear ends of the installation through groove 101 at the bottom of the upper cover plate 1, two sets of riveting protrusions are respectively arranged. Each set of riveting protrusions includes two riveting protrusions 104 arranged at a left-right interval. The first wall body part 345 extends downward between the two riveting protrusions 104, and the two first wall body parts 345 of the heat dissipation A single sheet 3 and the heat dissipation B single sheet 4 are pressed and fixed by pressing the two riveting protrusions 104. During actual operation, the two riveting protrusions 104 can be pressed in opposite directions, or one riveting protrusion 104 can be extruded towards the other riveting protrusion 104 to press the two first wall body parts 345 of the heat dissipation A single sheet 3 and the heat dissipation B single sheet 4 between the two riveting protrusions 104 to form the fixation of this set of heat sinks 200.

[0066] Preferably, after the heat dissipation A single sheet 3 and the heat dissipation B single sheet 4 are fixed to the upper cover plate 1, the bottom cavity 2 is stacked on the bottom of the upper cover plate 1. A third solder layer is provided on the overlapping side of the bottom cavity 2 and the upper cover plate 1. In step 3, the bottom cavity 2 and the upper cover plate 1 are welded and fixed. The third solder layer is usually a brazing layer, so that in step 3, the upper cover plate 1, the bottom cavity 2, several heat dissipation A single sheets 3, and several heat dissipation B single sheets 4 are brazed at one time to realize the welded fixation of all accessories.

[0067] In addition, regarding the heat dissipation single piece 3 of type A and the heat dissipation single piece 4 of type B, preferably, they are both composite layer materials with solder layers, which can be single-sided with a solder layer or double-sided with solder layers. For the case of single-sided with a solder layer, the solder layer is located on the overlapping side. In this way, when assembling, the folded piece 301 of the heat dissipation single piece 3 of type A and the heat dissipation single piece 4 are in contact positioning during assembly and welding fixation during welding within the same group of heat dissipations. Regarding the upper cover plate 1, it is at least a composite layer material with a solder layer, that is, a solder layer is provided on the top surface, and it can also be double-sided with solder layers, with a solder layer provided on the bottom surface as well, that is, the aforementioned third solder layer is provided on the bottom surface, or a third solder layer can be provided on the top surface of the bottom cavity 2. Preferably, within the same heat dissipation device, the solder layers provided are the same, which is convenient for ensuring the vacuum welding effect. The heat dissipation single piece 3 of type A, the heat dissipation single piece 4 of type B, the upper cover plate 1, the bottom cavity 2, and the connecting plate are all made of metal substrates, such as aluminum substrates, and some are made of aluminum alloys, copper, copper alloys, copper-aluminum composite materials, etc.

[0068] The design focus of the present utility model lies in that mainly through the settings of the upper cover plate, the bottom cavity, the heat dissipation single piece of type A, and the heat dissipation single piece of type B. In particular, the heat dissipation single piece of type A is provided with a folded piece that bends and extends towards the heat dissipation single piece of type B. During assembly, the heat dissipation single piece of type A and the heat dissipation single piece of type B are inserted into the installation through groove on the top of the upper cover plate in an overlapping manner. The connecting parts are overlapped and enclosed to form a flow channel interface part. The folded piece extends out of the side of the heat dissipation single piece of type B that is far from the heat dissipation single piece of type A, and the extending end of the folded piece is in contact positioning with the adjacent heat dissipation single piece of type A. Moreover, the bottom cavity is overlapped and assembled at the bottom of the upper cover plate, thus forming an assembled semi-finished product. The assembled semi-finished product is fixed by one-time vacuum welding, which is convenient and fast for assembly, and the stability is relatively ideal. Since the top surface of the upper cover plate is provided with a first solder layer, during vacuum welding, the first solder layer on the top surface of the upper cover plate melts and can flow into the gap between the flow channel interface part and the installation through groove to form a sealed welding fixation, effectively solving the problem of potential leakage of the working fluid medium at the welding point in the traditional technology.

[0069] In addition, through chamfering the opening periphery of the installation through groove to form an annular diversion surface around the installation through groove, it is convenient for the molten solder to better flow into the gap between the flow channel interface part and the installation through groove, further ensuring the welding effect and not easily occurring situations such as false soldering or loosening and cracking at the welding point.

[0070] The above description is only a preferred embodiment of the present utility model, and does not impose any limitation on the technical scope of the present utility model. Therefore, any minor modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. An efficient heat dissipation device that is easy to assemble, characterized in that, It includes an upper cover plate, a bottom cavity, a heat dissipation single piece A and a heat dissipation single piece B; A first solder layer is provided on the top surface of the upper cover plate, and an installation through groove is provided on the top surface of the upper cover plate; A cavity for accommodating a fluid medium is provided in the bottom cavity; A second solder layer is provided on the overlapping side surfaces of the heat dissipation single piece A and / or the heat dissipation single piece B. Matching corresponding flow channel wall surfaces are provided on the overlapping side surfaces of the heat dissipation single piece A and the heat dissipation single piece B. Connection parts are formed by the heat dissipation single piece A and the heat dissipation single piece B extending downward at the ends of the corresponding flow channel wall surfaces; A folding piece that bends and extends toward the heat dissipation single piece B is provided on the heat dissipation single piece A; The heat dissipation single piece A and the heat dissipation single piece B are overlapped and inserted into the installation through groove on the top of the upper cover plate. The connection parts are overlapped and enclosed to form a flow channel interface part. The folding piece extends out of the side of the heat dissipation single piece B away from the heat dissipation single piece A, and the extending end of the folding piece contacts and positions with the adjacent heat dissipation single piece A. And the bottom cavity is overlapped and assembled at the bottom of the upper cover plate, thus forming an assembled semi-finished product; The assembled semi-finished product is fixed by vacuum soldering at one time.

2. The highly efficient heat dissipation device that is convenient for assembly according to claim 1, wherein, The top peripheral edge of the installation through groove is chamfered to form an annular diversion surface around the installation through groove. An annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular diversion surface. During vacuum soldering, the first solder layer on the top surface of the upper cover plate melts and flows into the annular gap along the annular diversion surface, and then a sealed weld is formed between the outer peripheral surface of the flow channel interface part and the annular diversion surface.

3. An efficient heat dissipation device that is easy to assemble according to claim 1, characterized in that, The folding piece is arranged at the edge position of the front side, rear side or top of the heat dissipation single piece A, so that the folding piece of the heat dissipation single piece A clamps and positions the periphery of the heat dissipation single piece B.

4. An efficient heat dissipation device that is easy to assemble according to claim 3, characterized in that, The folding piece is also arranged in the middle area of the heat dissipation single piece A except the edge on the plate. The folding piece is bent from the first hollowed-out part on the heat dissipation single piece A. Correspondingly, a second hollowed-out part opposite thereto is formed on the heat dissipation single piece B for the folding piece of the heat dissipation single piece A to pass through.

5. An efficient heat dissipation device that is easy to assemble according to claim 4, characterized in that, A plurality of folding pieces are arranged in the middle area, and are arranged in multiple rows at vertical intervals. Each row includes a plurality of folding pieces arranged at front-back intervals.

6. An efficient heat dissipation device facilitating assembly according to claim 1, characterized in that, Two groups of riveting convex parts are respectively arranged at both ends of the installation through groove corresponding to the bottom of the upper cover plate. Each group of riveting convex parts includes two riveting convex parts arranged at left-right intervals. The flow channel interface part extends downward out of the bottom of the upper cover plate and extends into the space between the two riveting convex parts, and the flow channel interface part is fixed by pressing the riveting convex parts.

7. An efficient heat dissipation device facilitating assembly according to claim 6, characterized in that, An abutting surface is provided at the front end and / or the rear end of the flow channel interface part. After the flow channel interface part is inserted into the installation through groove, the abutting surface abuts against the top surface of the upper cover plate.

8. An efficient heat dissipation device facilitating assembly according to claim 7, characterized in that, The connection part includes a flow channel enclosing wall and first wall parts respectively connected to both ends of the flow channel enclosing wall. The flow channel enclosing wall encloses to form a flow channel interface. The first wall parts at both ends are correspondingly attached to form a widened part, and the first wall parts at both ends extend into the space between the two riveting convex parts.

9. An efficient heat dissipation device that is convenient for assembly according to claim 1, characterized in that, A first capillary filler is filled in the flow channel; And / or: A second capillary filler is filled in the cavity.

10. An electronic device, characterized in that, It includes a heating element and a heat dissipation device; the heat dissipation device is a highly efficient heat dissipation device convenient for assembly described in any one of claims 1 to 9.

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