Wafer thinning device

Abstract

The utility model discloses a wafer thinning device which comprises a grinding device, and the grinding device comprises a grinding wheel mechanism. The grinding wheel mechanism comprises a grinding wheel mounting frame, a first Z-axis lifting mechanism mounted on one side of the grinding wheel mounting frame, a Z-axis lifting plate connected with the first Z-axis lifting mechanism, a main shaft mounting seat connected to one side of the Z-axis lifting plate, and an electric main shaft mounted on the main shaft mounting seat; the electric spindle is further in driving connection with a grinding wheel mounting seat, and a first grinding wheel is further mounted at the bottom of the grinding wheel mounting seat; a plurality of first grinding wheel teeth arranged in the vertical direction are arranged in the circumferential direction of the bottom of the first grinding wheel at intervals. Compared with equipment applying an air floating main shaft, a mechanical main shaft grinding mode is adopted, the rigidity is greatly improved, the rotary table device can adapt to grinding of high-hardness materials, the application range is wider, meanwhile, the rotary table device is good in waterproof performance, grinding water can be prevented from entering the rotary table, normal work of the rotary table is prevented from being influenced, and practicability is high.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer manufacturing, in particular to a wafer thinning device. Background Art

[0002] In the silicon wafer manufacturing process, grinders are used to thin wafers cut from silicon ingots. As semiconductor chips become thinner and more powerful, the accuracy of the plane during the thinning process becomes increasingly important. At the same time, for packaging testing (back-end) - back-side thinning, the back grinder is used to grind the back side of the wafer to make it thinner. It is suitable for precision grinding of hard and brittle materials such as silicon wafers, silicon carbide, sapphire, ceramics, and optical glass.

[0003] At present, domestic thinning machines started late, while foreign ones started relatively early, and their technology is more mature than that of China. In addition, foreign wafer thinning machines use mature air flotation accessories processing and thinning methods. Their core technology is still in the hands of foreign countries, and the equipment is relatively expensive and the cost is high. At the same time, foreign thinning machines are more targeted at easy-to-cut materials such as silicon wafers, but for products with higher hardness such as sapphire and silicon carbide wafers, foreign equipment is not very suitable. Therefore, wafer epitaxial products based on sapphire and silicon carbide currently have huge market capacity, and there is an urgent need for a domestic equipment to replace foreign equipment. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer thinning device, which adopts a mechanical spindle grinding method. Compared with the equipment using an air-floating spindle, the rigidity is greatly improved, and it can adapt to the grinding of high-hardness materials and has a wider range of applications. At the same time, the turntable device has good waterproof performance, which can prevent grinding water from entering the inside of the turntable, thereby avoiding affecting the normal operation of the turntable, and has strong practicality.

[0005] In order to achieve the above objectives, the following technical solutions are adopted:

[0006] A wafer thinning device comprising

[0007] A grinding device, comprising a grinding wheel mechanism; the grinding wheel mechanism comprising a grinding wheel mounting frame, a first Z-axis lifting mechanism mounted on one side of the grinding wheel mounting frame, a Z-axis lifting plate connected to the first Z-axis lifting mechanism, a spindle mounting seat connected to one side of the Z-axis lifting plate, and an electric spindle mounted on the spindle mounting seat; the electric spindle is further driven and connected to the grinding wheel mounting seat, and a first grinding wheel is further mounted on the bottom of the grinding wheel mounting seat; a plurality of first grinding wheel teeth arranged in a vertical direction are spaced apart on the bottom circumference of the first grinding wheel;

[0008] A turntable device, the turntable device is arranged below the first grinding wheel;

[0009] A cooling water spray assembly is arranged close to the turntable device.

[0010] Furthermore, the grinding device also includes a grinding wheel spray assembly; the grinding wheel spray assembly includes a spray mounting seat, a spray pipe, and a first nozzle; the spray mounting seat is installed on the upper part of the electric spindle, one end of the spray pipe is connected to the spray mounting seat, and the other end of the spray pipe is arranged through the electric spindle; a first through hole is also opened in the middle of the bottom of the grinding wheel mounting seat, and the spray pipe passes through one end of the electric spindle and is inserted into the first through hole; the first nozzle is arranged in the first grinding wheel and is installed on one end of the spray pipe inserted in the first through hole; a number of nozzles are also installed at intervals on the outer wall circumference of the first nozzle, and the nozzles are arranged in the direction of the first grinding wheel teeth.

[0011] Furthermore, the grinding wheel spray assembly also includes a first waterproof cover and a waterproof cover; the first waterproof cover is in a truncated cone structure, the first waterproof cover is installed at the bottom of the electric spindle, and the end of the first waterproof cover with a smaller diameter is inserted into the electric spindle; the end of the spray pipe with a nozzle installed is arranged through the first waterproof cover; the waterproof cover is installed at the bottom of the grinding wheel mounting seat, and a second through hole is also opened on the waterproof cover corresponding to the first through hole; one end of the first nozzle is located in the second through hole and is connected to the spray pipe; the other end of the first nozzle is arranged to pass through the second through hole, and the nozzle is installed on the end of the first nozzle that passes through the second through hole.

[0012] Furthermore, a first positioning ring is installed at the bottom of the grinding wheel mounting seat; the bottom of the first positioning ring is connected to a first retaining ring, and a part of the first retaining ring protrudes outward from the first positioning ring; the top of the first grinding wheel is provided with a third through hole extending through to its bottom, and the inner wall of the third through hole is also provided with a first notch; the first notch is adapted to the part of the first retaining ring protruding outward from the first positioning ring.

[0013] Furthermore, the turntable device includes a rotation drive mechanism, a mechanical turntable, a vacuum suction plate, and a ceramic disk; the mechanical turntable is connected to the rotation drive mechanism, and the top of the mechanical turntable is also connected to a mounting flange; the vacuum suction plate is installed on the mounting flange; the ceramic disk is arranged on the vacuum suction plate, and the top of the ceramic disk is used to support the product to be thinned; the interior of the mechanical turntable is an axially hollow structure, and the bottom of the mechanical turntable is also equipped with a rotating joint that can rotate with the mechanical turntable and is used to connect to an external air source; the top of the vacuum suction plate is also equipped with a first positioning column for limiting and fixing the ceramic disk, and the bottom of the vacuum suction plate is also connected to a turntable waterproof cover that wraps the mounting flange.

[0014] Furthermore, the rotation drive mechanism includes a first fixed bracket, a first reducer mounted on the first fixed bracket, a driving wheel mounted on the output shaft of the first reducer, a driven wheel mounted on the mechanical turntable, a first synchronous belt wound between the driving wheel and the driven wheel, and a first rotating motor connected to the first reducer.

[0015] Furthermore, the cooling water spray assembly includes a cooling water joint and a cooling water pipe installed on the cooling water joint and arranged close to the ceramic disk; a cooling water nozzle is also installed at one end of the cooling water pipe for discharging water.

[0016] By adopting the above solution, the beneficial effects of the utility model are:

[0017] The utility model adopts a mechanical spindle grinding method. Compared with the equipment using an air-floating spindle, the rigidity is greatly improved, which can adapt to the grinding of high-hardness materials and has a wider range of applications. At the same time, the turntable device has good waterproof performance, which can prevent grinding water from entering the turntable, thereby avoiding affecting the normal operation of the turntable and having strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural diagram of the utility model;

[0019] Figure 2 This is a schematic structural diagram of the grinding device of the present utility model;

[0020] Figure 3 for Figure 2 The structural diagram of the grinding wheel mechanism is omitted;

[0021] Figure 4 It is a structural schematic diagram of the grinding wheel mechanism of the present utility model;

[0022] Figure 5 An exploded view of the grinding wheel mechanism of the present invention from one perspective;

[0023] Figure 6 An exploded view of the grinding wheel mechanism of the present invention from another perspective;

[0024] Figure 7 It is a cross-sectional view of the grinding wheel mechanism of the present utility model;

[0025] Figure 8 This is a schematic structural diagram of the turntable device of the present utility model;

[0026] Figure 9 This is a schematic structural diagram of the mechanical turntable and the rotation drive mechanism of the present invention;

[0027] Figure 10 This is an exploded view of the mechanical turntable of the present utility model;

[0028] The accompanying drawings illustrate:

[0029] 1. Grinding device; 2. Turntable device; 3. Cooling water spray assembly; 4. First fixed box; 5. First installation box; 11. Grinding wheel mechanism; 12. Grinding wheel spray assembly; 13. Balancing assembly; 14. Anti-fall assembly; 21. Rotation drive mechanism; 22. Mechanical turntable; 23. Vacuum suction plate; 24. Ceramic disc; 25. Mounting flange; 26. Rotary joint; 31. Cooling water joint; 32. Cooling water pipe; 33. Cooling water nozzle; 51. First lifting Door assembly; 111, grinding wheel mounting bracket; 112, first Z-axis lifting mechanism; 113, Z-axis lifting plate; 114, leveling ring; 115, electric spindle; 116, grinding wheel mounting bracket; 117, first grinding wheel; 118, spindle fixing plate; 119, spindle fixing bracket; 121, spray mounting bracket; 122, spray pipe; 123, first nozzle; 124, nozzle; 125, first waterproof cover; 126, waterproof cover; 131, first bracket; 132 , first connecting frame; 133, balancing cylinder; 134, first connecting shaft; 135, second connecting block; 136, second connecting shaft; 137, first connecting rod; 141, first fixing rod; 142, second connecting rod; 143, limit screw; 144, third connecting block; 211, first fixing bracket; 212, first reducer; 213, driving wheel; 214, driven wheel; 215, first synchronous belt; 216, first rotating motor; 217, U Type photoelectric sensor; 218, sensor plate; 231, first positioning column; 232, turntable waterproof cover; 233, first waterproof pad; 251, first positioning platform; 252, second positioning column; 253, first sealing ring; 1111, grating scale; 1112, first grating; 1161, first positioning ring; 1162, first retaining ring; 1163, first notch; 1171, first grinding wheel tooth; 1191, second waterproof cover; 1192, first connecting block. DETAILED DESCRIPTION

[0030] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Reference Figures 1 to 10 As shown, the utility model provides a wafer thinning device, in one embodiment, comprising

[0032] A grinding device 1 includes a grinding wheel mechanism 11; the grinding wheel mechanism 11 includes a grinding wheel mounting frame 111, a first Z-axis lifting mechanism 112 mounted on one side of the grinding wheel mounting frame 111, a Z-axis lifting plate 113 connected to the first Z-axis lifting mechanism 112, a spindle mounting seat connected to one side of the Z-axis lifting plate 113, and an electric spindle 115 mounted on the spindle mounting seat; the electric spindle 115 is also driven and connected to a grinding wheel mounting seat 116, and a first grinding wheel 117 is also mounted on the bottom of the grinding wheel mounting seat 116; a plurality of first grinding wheel teeth 1171 arranged in a vertical direction are spaced apart on the bottom circumference of the first grinding wheel 117;

[0033] A turntable device 2, the turntable device 2 is arranged below the first grinding wheel 117;

[0034] The cooling water spraying assembly 3 is arranged close to the turntable device 2 .

[0035] Continue to refer to Figures 1 to 10 As shown, in this embodiment, the device also includes a first fixed box 4 and a first installation box 5; the first installation box 5 is connected to one side of the top of the first fixed box 4, and the front, top and bottom of the first installation box 5 are all opened; the grinding device 1 is installed on the other side of the top of the first fixed box 4, and the electric spindle 115 of the grinding device 1 is located at the top opening of the first installation box 5. Under the drive of the first Z-axis lifting mechanism 112, it can be lowered into the first installation box 5 through the top opening of the first installation box 5; the turntable device 2 is installed on the first fixed box 4, and the turntable device 2 is used to carry and drive the part of the product to be thinned to perform rotational motion. It is located in the first installation box 5 and is arranged opposite to the first grinding wheel 117. The first grinding wheel 117 can be lowered to the product and ground through the first grinding wheel teeth 1171 under the drive of the electric spindle 115; the first lifting door assembly 51 (including the lifting door and the lifting drive cylinder connected to the lifting door) is also installed at the front opening of the first installation box 5. The lifting drive cylinder can drive the lifting door to open so that the staff can take and place the product. At the same time, during grinding, the lifting door can be closed to prevent the grinding water from leaking out; the cooling water spraying assembly 3 is installed on one side of the first installation box 5, and is used to spray cooling water to the product for cooling and grinding.

[0036] In this embodiment, the grinding wheel mounting frame 111 is a marble column. Using the marble column as the base of the device can ensure the stability of the device operation. The first Z-axis lifting mechanism 112 includes two slide rails, a servo motor, a reducer, and a lead screw; the two slide rails are arranged in parallel and spaced apart on one side of the grinding wheel mounting frame 111, and two sliders are connected to each slide rail; one side of the Z-axis lifting plate 113 is connected to the four sliders, and the lead screw is arranged between the two slide rails. The nut on the lead screw is connected to the middle part of one side of the Z-axis lifting plate 113. The servo motor is installed on the top side of the grinding wheel mounting frame 111 and is connected to one end of the lead screw through the reducer. Under the drive of the servo motor, the Z-axis lifting plate 113 can be driven up and down through the lead screw so that the grinding wheel mechanism 11 can grind the product; the electric spindle 115 provides a means to drive the first grinding wheel 117 rotates, and then grinds the product through the first grinding wheel teeth 1171 on the circumference of the bottom edge of the first grinding wheel 117; at the same time, the grinding device 1 also includes a grinding wheel spray component 12, which is installed on the grinding wheel mechanism 11. During the grinding process, the friction between the first grinding wheel teeth 1171 and the product will generate a large amount of heat, and the grinding wheel spray component 12 can be connected to external cooling water and spray the cooling water onto the tooth surface of the first grinding wheel teeth 1171, thereby playing a role in cooling and chip removal; in addition, the grinding device 1 also includes a balancing component 13, which is installed on the grinding wheel mounting frame 111 and connected to the spindle mounting seat. It can offset the weight of the Z-axis component, thereby reducing the deformation of the mechanism and improving the operability of the power unit and the support unit.

[0037] In one embodiment, the grinding device 1 also includes a grinding wheel spray assembly 12; the grinding wheel spray assembly 12 includes a spray mounting seat 121, a spray pipe 122, and a first nozzle 123; the spray mounting seat 121 is installed on the upper part of the electric spindle 115, one end of the spray pipe 122 is connected to the spray mounting seat 121, and the other end of the spray pipe 122 is arranged through the electric spindle 115; a first through hole is also opened in the middle of the bottom of the grinding wheel mounting seat 116, and one end of the spray pipe 122 passes through the electric spindle 115 and is inserted into the first through hole; the first nozzle 123 is arranged in the first grinding wheel 117 and is installed at one end of the spray pipe 122 inserted in the first through hole; a plurality of nozzles 124 are also installed at intervals on the circumference of the outer wall of the first nozzle 123, and the nozzles 124 are arranged in the direction of the first grinding wheel teeth 1171.

[0038] In this embodiment, the top of the spray pipe 122 is connected to an external cooling water supply device. There are four groups of nozzles 124, which are evenly spaced and installed on the outer wall of the first nozzle 123. The cooling water supply device passes cooling water into the spray pipe 122, and then sprays it onto the tooth surface of the first grinding wheel teeth 1171 through the nozzle to cool it. At the same time, the grinding wheel spray assembly 12 also includes a first waterproof cover 125; the first waterproof cover 125 has a frustum-shaped structure and is installed at the bottom of the electric spindle 115, with the smaller end of the first waterproof cover 125 inserted into the electric spindle 115. The end of the spray pipe 122 equipped with the nozzles 124 is arranged through the first waterproof cover 125. The first waterproof cover 125 prevents cooling water from splashing into the electric spindle 115, thereby preventing the cooling water from damaging the electric spindle 115 and ensuring the normal operation of the electric spindle 115.

[0039] In addition, the grinding wheel spray assembly 12 also includes a waterproof cover 126; the waterproof cover 126 is mounted on the bottom of the grinding wheel mounting base 116, and a second through hole is formed on the waterproof cover 126 corresponding to the first through hole; one end of the first nozzle 123 is located in the second through hole and is connected to the spray pipe 122; the other end of the first nozzle 123 is arranged to pass through the second through hole, and the nozzle 124 is mounted on the end of the first nozzle 123 that passes through the second through hole. The waterproof cover 126 is composed of two semicircular covers, the straight sides of the two covers are spliced together, and the middle of the straight sides of the two covers each have a semicircular notch, and the two notches form a second through hole, and the diameter of the second through hole is smaller than the first through hole; by providing the waterproof cover 126, the cooling water can be further prevented from splashing into the electric spindle 115, further improving the waterproof performance.

[0040] In one embodiment, a first positioning ring 1161 is further installed at the bottom of the grinding wheel mounting seat 116; a first retaining ring 1162 is connected to the bottom of the first positioning ring 1161, and a portion of the first retaining ring 1162 protrudes outward from the first positioning ring 1161; a third through hole is provided on the top of the first grinding wheel 117, which passes through to its bottom, and a first notch 1163 is further provided on the inner wall of the third through hole; the first notch 1163 is adapted to the portion of the first retaining ring 1162 protruding outward from the first positioning ring 1161. In this embodiment, there are two first retaining rings 1162, and the two first retaining rings 1162 are arranged opposite to each other. When installing the first grinding wheel 117, the first notch 1163 can be aligned with the first retaining ring 1162, and then it is clamped on the first positioning ring 1161 through the third through hole. Subsequently, the first grinding wheel 117 is rotated to cause the first retaining ring 1162 and the first notch 1163 to be misaligned, so that the first retaining ring 1162 blocks the first grinding wheel 117 to prevent it from falling. Then, the first grinding wheel 117 is locked and fixed to the bottom of the grinding wheel mounting seat 116 using screws. It is easy to install and disassemble, and it is convenient to replace different types of first grinding wheels 117 according to actual usage needs.

[0041] In one embodiment, the spindle mounting seat includes a spindle fixing plate 118 installed on one side of the Z-axis lifting plate 113, and a spindle fixing seat 119 integrally connected to the middle part of one side of the spindle fixing plate 118; a fourth through hole is also opened on the spindle fixing seat 119, and a horizontal adjustment ring 114 is also connected to the bottom of the spindle fixing seat 119; the electric spindle 115 is arranged in the fourth through hole and installed on the horizontal adjustment ring 114; the grinding wheel mechanism 11 also includes a second waterproof cover 1191; the second waterproof cover 1191 is coaxially installed on the outer wall of the horizontal adjustment ring 114, and the grinding wheel mounting seat 116 is located below the second waterproof cover 1191. In order to improve the stability of the operation of the electric spindle 115, the spindle mounting seat is made of cast iron to avoid the stability of the movement of the electric spindle 115 due to material deformation. At the same time, the grinding wheel mounting seat 116 is made of rust-proof material and is heat-treated to avoid later material deformation, thereby improving the installation accuracy of the grinding wheel. The horizontal adjustment ring 114 can be used to fine-tune the installation angle of the electric spindle 115 to ensure its horizontal installation. In addition, the second waterproof cover 1191 can prevent the cooling water used for grinding from splashing outside the equipment, thereby avoiding affecting the normal operation of other mechanisms.

[0042] In one embodiment, the two ends of one side of the spindle fixing plate 118 are further integrally connected with a first connecting block 1192; the balancing assembly 13 is provided with two groups, and the two balancing assemblies 13 are respectively arranged on one side of a first connecting block 1192; the balancing assembly 13 includes a first bracket 131, a first connecting frame 132, and a balancing cylinder 133; the first bracket 131 is installed on the top of the grinding wheel mounting frame 111, and the first connecting frame 132 is connected to one end of the first bracket 131; the first connecting frame A U-shaped notch is formed on the frame 132, and a first connecting shaft 134 is connected between the inner walls of the U-shaped notch. A second connecting block 135 is mounted on the top of the balancing cylinder 133, and the second connecting block 135 is sleeved on the first connecting shaft 134. A second connecting shaft 136 is also mounted horizontally on one side of the first connecting block 1192. The output shaft of the balancing cylinder 133 is also driven and connected to a first connecting rod 137, one end of which is sleeved on the second connecting shaft 136. The balancing cylinder 133 can provide an upward pulling force on the Z-axis lifting plate 113 to offset the weight of the Z-axis components, thereby reducing deformation of the mechanism and ensuring the stability and smoothness of the device operation.

[0043] At the same time, it also includes an anti-falling component 14; the anti-falling component 14 includes a first fixing rod 141, a second connecting rod 142, a limit screw 143, and a third connecting block 144; the first fixing rod 141 is installed on the top of the grinding wheel mounting frame 111, and one end of the first fixing rod 141 extends to the top of the Z-axis lifting plate 113; the second connecting rod 142 is movable in the vertical direction through one end of the first fixing rod 141; the third connecting block 144 is installed on the top of the Z-axis lifting plate 113 and is connected to the bottom of the second connecting rod 142; the limit screw 143 is arranged above the first fixing rod 141 and is installed on the second connecting rod 142. The anti-fall assembly 14 is provided with two groups, each connected to one end of the top of the Z-axis lifting plate 113. The limit screw 143 can be used to limit the downward stroke of the Z-axis lifting plate 113, thereby preventing the Z-axis lifting plate 113 from suddenly falling when the device is abnormally powered off, thereby avoiding damage to the product and the device and improving the safety of the device operation. In addition, a grating scale 1111 is also installed on one side of the grinding wheel mounting frame 111 in the vertical direction, and a first grating 1112 for use with the grating scale 1111 is also installed at one end of the Z-axis lifting plate 113 corresponding to the grating scale 1111. The grating scale 1111 and the first grating 1112 can provide real-time feedback of the Z-axis position information, thereby reducing mechanical transmission errors and improving the operating accuracy of the device.

[0044] In one embodiment, the turntable device 2 includes a rotation drive mechanism 21, a mechanical turntable 22, a vacuum suction plate 23, and a ceramic disk 24; the mechanical turntable 22 is connected to the rotation drive mechanism 21, and the top of the mechanical turntable 22 is also connected to a mounting flange 25; the vacuum suction plate 23 is installed on the mounting flange 25; the ceramic disk 24 is arranged on the vacuum suction plate 23, and the top of the ceramic disk 24 is used to support the product to be thinned; the interior of the mechanical turntable 22 is an axially hollow structure, and the bottom of the mechanical turntable 22 is also equipped with a rotary joint 26 that can rotate with the mechanical turntable 22 and is used to connect to an external air source; the top of the vacuum suction plate 23 is also equipped with a first positioning column 231 for limiting and fixing the ceramic disk 24, and the bottom of the vacuum suction plate 23 is also connected to a turntable waterproof cover 232 that wraps the mounting flange 25 therein.

[0045] In this embodiment, the mechanical turntable 22 includes a turntable shell and a rotating spindle installed in the turntable shell; the rotating spindle is axially hollow inside and is connected to the rotating drive mechanism 21, and the mounting flange 25 is installed on the rotating spindle. The rotating drive mechanism 21 can drive the rotating spindle to drive the mounting flange 25 to rotate; the vacuum suction plate 23 is installed on the mounting flange 25 and can rotate synchronously with the mounting flange 25; the rotary joint 26 is connected to the vacuum suction plate 23 through the air pipe or the hollow channel inside the rotating spindle, and the vacuum suction plate 23 is provided with a plurality of vacuum adsorption holes. The rotary joint 26 can be connected to an external negative pressure air source to adsorb and fix the ceramic disk 24 through the vacuum adsorption holes on the vacuum suction plate 23 (the product to be thinned is pre-bonded to the ceramic disk 24). When the vacuum suction plate 23 rotates with the mounting flange 25, it can drive the ceramic disk 24 and the product to rotate synchronously, so that the grinding mechanism of the thinning turntable device 2 can grind the product.

[0046] At the same time, the cooling water spray assembly 3 includes a cooling water connector 31 (installed on the first installation box 5), and a cooling water pipe 32 installed on the cooling water connector 31 and arranged near the ceramic disk 24; the cooling water pipe 32 is also equipped with a cooling water nozzle 33 at one end for water outlet; the cooling water connector 31 can be connected to an external water source. When the ceramic disk 24 drives the product to rotate for grinding, cooling water can be sprayed to the product through the cooling water nozzle 33 for cooling and grinding. At the same time, a turntable waterproof cover 232 is also provided to prevent grinding water from entering the inside of the turntable, thereby avoiding affecting the normal operation of the turntable. In addition, a plurality of first positioning columns 231 are also provided on the circumference of the top edge of the vacuum suction plate 23, which can limit and fix the ceramic disk 24 to ensure its placement stability.

[0047] In one embodiment, a first limiting groove is defined in the center of the top of the mounting flange 25, and a first positioning platform 251 is connected to the first limiting groove. A through-hole is defined at the top of the first positioning platform 251, communicating with the interior of the mechanical turntable 22, and a second positioning post 252 is mounted in the through-hole. The second positioning post 252 is axially hollow, with the upper portion of the second positioning post 252 extending outward from the through-hole. A first positioning hole is defined at the bottom of the vacuum suction plate 23, corresponding to the second positioning post 252. The second positioning post 252 and the first positioning hole facilitate the installation of the vacuum suction plate 23. Furthermore, a first annular retaining groove is formed between the outer wall of the first positioning platform 251 and the inner wall of the first limiting groove. A first sealing ring 253 is embedded in the first retaining groove.

[0048] To further enhance waterproof performance, in one embodiment, a first waterproof pad 233 in an annular structure is mounted on the bottom of the vacuum suction plate 23, and a turntable waterproof cover 232 is connected to the bottom of the first waterproof pad 233. The turntable waterproof cover 232 is an axially hollow cylindrical structure that can enclose the mounting flange 25 and a portion of the upper portion of the turntable housing to prevent grinding water from flowing into the turntable.

[0049] In one embodiment, the rotation drive mechanism 21 includes a first fixed bracket 211, a first reducer 212 mounted on the first fixed bracket 211, a driving pulley 213 mounted on the output shaft of the first reducer 212, a driven pulley 214 mounted on the mechanical turntable 22, a first synchronous belt 215 wound between the driving pulley 213 and the driven pulley 214, and a first rotary motor 216 connected to the first reducer 212. The first fixed bracket 211 is fixedly connected to the first fixed box 4. The first rotary motor 216 is a servo motor that can drive the mechanical turntable 22 to rotate via the first reducer 212, the driving pulley 213, the first synchronous belt 215, and the driven pulley 214. The rotation drive mechanism 21 also includes a U-shaped photoelectric sensor 217 disposed near the driven pulley 214. A sensing plate 218 is mounted on the bottom edge of the driven pulley 214 for use with the U-shaped photoelectric sensor 217. The U-shaped photoelectric sensor 217 can detect the position of the sensing piece 218 on the driven wheel 214, thereby determining the rotation position of the mechanical turntable 22 for positioning and closed-loop control.

[0050] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer thinning device, characterized in that: include A grinding device, comprising a grinding wheel mechanism; the grinding wheel mechanism comprising a grinding wheel mounting frame, a first Z-axis lifting mechanism mounted on one side of the grinding wheel mounting frame, a Z-axis lifting plate connected to the first Z-axis lifting mechanism, a spindle mounting seat connected to one side of the Z-axis lifting plate, and an electric spindle mounted on the spindle mounting seat; the electric spindle is further driven and connected to the grinding wheel mounting seat, and a first grinding wheel is further mounted on the bottom of the grinding wheel mounting seat; a plurality of first grinding wheel teeth arranged in a vertical direction are spaced apart on the bottom circumference of the first grinding wheel; A turntable device, the turntable device is arranged below the first grinding wheel; A cooling water spray assembly is arranged close to the turntable device.

2. The wafer thinning device according to claim 1, characterized in that: The grinding device also includes a grinding wheel spray assembly; the grinding wheel spray assembly includes a spray mounting seat, a spray pipe, and a first nozzle; the spray mounting seat is installed on the upper part of the electric spindle, one end of the spray pipe is connected to the spray mounting seat, and the other end of the spray pipe is arranged through the electric spindle; a first through hole is also opened in the middle of the bottom of the grinding wheel mounting seat, and the spray pipe passes through one end of the electric spindle and is inserted into the first through hole; the first nozzle is arranged in the first grinding wheel and is installed on one end of the spray pipe inserted in the first through hole; a plurality of nozzles are also installed at intervals on the circumference of the outer wall of the first nozzle, and the nozzles are arranged in the direction of the first grinding wheel teeth.

3. The wafer thinning device according to claim 2, characterized in that: The grinding wheel spray assembly also includes a first waterproof cover and a waterproof cover; the first waterproof cover is in a truncated cone structure, the first waterproof cover is installed at the bottom of the electric spindle, and the end of the first waterproof cover with a smaller diameter is inserted into the electric spindle; the end of the spray pipe with a nozzle installed is arranged through the first waterproof cover; the waterproof cover is installed at the bottom of the grinding wheel mounting seat, and a second through hole is also opened on the waterproof cover corresponding to the first through hole; one end of the first nozzle is located in the second through hole and is connected to the spray pipe; the other end of the first nozzle is arranged to pass through the second through hole, and the nozzle is installed on the end of the first nozzle that passes through the second through hole.

4. The wafer thinning device according to claim 1, wherein: A first positioning ring is also installed at the bottom of the grinding wheel mounting seat; a first retaining ring is connected to the bottom of the first positioning ring, and a part of the first retaining ring protrudes outward from the first positioning ring; a third through hole is opened on the top of the first grinding wheel and passes through to its bottom, and a first notch is also opened on the inner wall of the third through hole; the first notch is adapted to the part of the first retaining ring protruding outward from the first positioning ring.

5. The wafer thinning device according to claim 1, wherein: The turntable device includes a rotation drive mechanism, a mechanical turntable, a vacuum suction plate, and a ceramic disc; the mechanical turntable is connected to the rotation drive mechanism, and the top of the mechanical turntable is also connected to a mounting flange; the vacuum suction plate is installed on the mounting flange; the ceramic disc is arranged on the vacuum suction plate, and the top of the ceramic disc is used to support the product to be thinned; the interior of the mechanical turntable is an axially hollow structure, and the bottom of the mechanical turntable is also equipped with a rotary joint that can rotate with the mechanical turntable and is used to connect to an external air source; the top of the vacuum suction plate is also equipped with a first positioning column for limiting and fixing the ceramic disc, and the bottom of the vacuum suction plate is also connected to a turntable waterproof cover that wraps the mounting flange.

6. The wafer thinning device according to claim 5, characterized in that: The rotation drive mechanism includes a first fixed bracket, a first reducer mounted on the first fixed bracket, a driving wheel mounted on the output shaft of the first reducer, a driven wheel mounted on the mechanical turntable, a first synchronous belt wound between the driving wheel and the driven wheel, and a first rotating motor connected to the first reducer.

7. The wafer thinning device according to claim 1, wherein: The cooling water spray assembly includes a cooling water joint and a cooling water pipe installed on the cooling water joint and arranged close to the ceramic disk; a cooling water nozzle is also installed at one end of the cooling water pipe for water outlet.

Images