Polishing area cleaning device

Abstract

The utility model provides a polishing area cleaning device which comprises a base, a rotary driving part, a liquid supply sleeve, a rotary head, a grinding liquid pipe and a cleaning liquid pipe, the liquid supply sleeve is arranged above the base, the rotary head is rotatably connected into the liquid supply sleeve, the rotary driving part is connected to the outer end of the liquid supply sleeve, and the grinding liquid pipe is connected with the cleaning liquid pipe. The grinding fluid pipe and the cleaning fluid pipe are both connected to the inner end of the rotating head, a first fluid inlet hole and a second fluid inlet hole are formed in the peripheral wall of the fluid supply sleeve, a first channel and a second channel are formed in the rotating head, the end of the grinding fluid pipe is connected with a first spray head, and a second spray head is arranged on the peripheral wall of the cleaning fluid pipe. According to the polishing area cleaning device provided by the utility model, the grinding fluid is supplied to the grinding fluid pipe through the first channel, the smooth wafer polishing process is ensured, when the polishing is completed and the grinding disc needs to be cleaned, the cleaning fluid is supplied to the cleaning fluid pipe through the second channel, and the grinding disc and peripheral components are comprehensively washed through the rotation of the cleaning fluid pipe, so that the polishing efficiency is improved. And the cleaning efficiency and the cleaning quality are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer polishing, and more specifically relates to a polishing area cleaning device. Background Art

[0002] Chemical Mechanical Planarization (CMP) is a method that uses chemical etching and mechanical force to planarize silicon wafers or other substrate materials during processing. The above method is widely used in wafer polishing.

[0003] During chemical mechanical polishing, the polishing slurry (slurry) will splash onto various areas of the polishing zone during the relative rotation of the grinding platen and the grinding head. Over time, the suspended particles in the polishing slurry will form a layer of hard crystals as the water is lost. These crystals adhere to the spindle system, spindle bearing support, rotating bracket system and other locations in the polishing zone. If these crystals are not cleaned for a long time, they will form large crystals. Under the influence of machine vibration, these crystals will fall irregularly onto the polishing pad, causing scratches on the product and forming defects, which will affect the polishing quality of the wafer. Utility Model Content

[0004] The purpose of the utility model is to provide a polishing area cleaning device, which can effectively wash away the residual grinding fluid on the grinding disc in time to prevent it from forming crystals, thereby increasing the product yield.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a polishing area cleaning device, including a base, a rotating drive member, a liquid supply sleeve, a rotating head, a grinding liquid pipe and a cleaning liquid pipe. The base is arranged on the outside of the grinding disc, the liquid supply sleeve is arranged above the base, the rotating head is rotatably connected to the liquid supply sleeve, the rotating drive member is connected to the outer end of the liquid supply sleeve and is connected to the rotating head to drive the rotating head to rotate, the grinding liquid pipe and the cleaning liquid pipe are both connected to the inner end of the rotating head, and the cleaning liquid pipe is sleeved on the outer periphery of the grinding liquid pipe, a first liquid inlet hole and a second liquid inlet hole are provided on the outer peripheral wall of the liquid supply sleeve, a first channel respectively connected to the first liquid inlet hole and the grinding liquid pipe and a second channel respectively connected to the second liquid inlet hole and the cleaning liquid pipe are provided on the rotating head, the end of the grinding liquid pipe passes through the cleaning liquid pipe and is connected to a first nozzle, and a second nozzle is provided on the peripheral wall of the cleaning liquid pipe.

[0006] In one possible implementation, a first annular groove connected to the first liquid inlet hole and a second annular groove connected to the second liquid inlet hole are provided on the peripheral wall of the rotating head. The first channel is arranged at the axis of the rotating head and is connected to the first annular groove through a radial hole. The second channel is arranged parallel to the first channel and is connected to the second annular groove.

[0007] In some embodiments, an axially extending partition plate is provided in the rotating head and the grinding liquid tube, and the partition plate is used to separate the first channel and the inner cavity of the grinding liquid tube into two branch channels;

[0008] There are two first liquid inlet holes, two first annular grooves, two radial holes and two second nozzles respectively. The two first annular grooves are spaced apart along the axial direction of the rotating head. The radial hole is used to connect the first annular groove and the branch channel.

[0009] In some embodiments, two liquid outlet branches extending downward are provided at the end of the grinding liquid tube, the liquid outlet branches are connected to the two branch channels one by one, and the two first nozzles are connected to the lower ends of the liquid outlet branches one by one.

[0010] In some embodiments, the two first liquid inlet holes are spaced apart along the axial direction of the liquid supply sleeve, the two first annular grooves are spaced apart along the axial direction of the rotating head, and the two radial holes are spaced apart along the circumference and axial direction of the rotating head and are respectively connected to the two branch channels one by one.

[0011] In a possible implementation, the second liquid inlet hole is located on a side of the liquid supply sleeve away from the rotary drive member, and a diameter of the second liquid inlet hole is smaller than a width of the second annular groove in the axial direction of the rotary head.

[0012] In some embodiments, a sealing member is provided on the outer periphery of the rotating head, and the sealing member is used to seal the gap between the rotating head and the liquid supply sleeve.

[0013] In a possible implementation, a plurality of second nozzles are provided at intervals along the axial direction of the cleaning liquid pipe, and the second nozzles are conical nozzles or fan-shaped nozzles.

[0014] In one possible implementation, a rotating seat and a driving motor are also provided on the base. The rotating seat is rotatably connected to the base. The driving motor is used to drive the rotating seat to swing horizontally. The liquid supply sleeve and the rotating driving member are respectively connected to the rotating seat. The grinding liquid tube and the cleaning liquid tube can swing horizontally with the rotating seat.

[0015] In a possible implementation, the polishing area cleaning device further includes a controller, which is electrically connected to the rotating drive member and the drive motor, respectively, and is configured to send start / stop instructions to the rotating drive member or the drive motor.

[0016] Compared with the prior art, the solution shown in the embodiment of the present application utilizes the first channel in the rotating head to supply grinding liquid to the grinding liquid tube to ensure the smooth progress of the wafer polishing process. When polishing is completed and the grinding disk needs to be cleaned, the second channel is used to supply cleaning liquid to the cleaning liquid tube. The rotating head can drive the grinding liquid tube and the cleaning liquid tube to rotate synchronously under the action of the rotating drive member, and the rotation of the cleaning liquid tube is used to achieve comprehensive flushing of the grinding disk and peripheral components, thereby improving cleaning efficiency and ensuring cleaning quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] Figure 1 A schematic diagram of the main structure of the polishing area cleaning device provided by an embodiment of the present utility model in use;

[0019] Figure 2 A schematic top view of the polishing area cleaning device provided by an embodiment of the present invention (the base is omitted);

[0020] Figure 3 For the embodiment of the utility model Figure 2 Schematic diagram of the partially enlarged structure of middle Ⅰ;

[0021] Figure 4 For the embodiment of the utility model Figure 3 Schematic diagram of the cross-sectional structure of AA;

[0022] Figure 5 For the embodiment of the utility model Figure 1 Schematic diagram of the top view of the polishing area cleaning device.

[0023] Among them, the reference numerals in the figures are:

[0024] 1. Base; 2. Rotating drive member; 3. Liquid supply sleeve; 31. First liquid inlet hole; 32. Second liquid inlet hole; 33. Sealing member; 4. Rotating head; 41. Branch channel; 42. Second channel; 43. First annular groove; 44. Second annular groove; 45. Radial hole; 47. Partition plate; 5. Grinding liquid pipe; 51. First nozzle; 52. Liquid outlet branch pipe; 6. Cleaning liquid pipe; 61. Second nozzle; 7. Rotating seat; 8. Grinding disc; 9. Platform. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or indirectly on the other element. It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. The terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "several" means two or more, unless otherwise clearly and specifically defined.

[0027] Please also refer to Figures 1 to 5 Now, the polishing area cleaning device provided by the utility model is described. The polishing area cleaning device includes a base 1, a rotating drive member 2, a liquid supply sleeve 3, a rotating head 4, a grinding liquid pipe 5 and a cleaning liquid pipe 6. The base 1 is arranged on the outside of the grinding disc 8, the liquid supply sleeve 3 is arranged above the base 1, the rotating head 4 is rotatably connected to the liquid supply sleeve 3, the rotating drive member 2 is connected to the outer end of the liquid supply sleeve 3, and is connected to the rotating head 4 to drive the rotating head 4 to rotate, the grinding liquid pipe 5 and the cleaning liquid pipe 6 are both connected to the inner end of the rotating head 4, and the cleaning liquid pipe 6 is sleeved on the outer periphery of the grinding liquid pipe 5, a first liquid inlet hole 31 and a second liquid inlet hole 32 are provided on the outer peripheral wall of the liquid supply sleeve 3, the rotating head 4 is provided with a first channel respectively connected to the first liquid inlet hole 31 and the grinding liquid pipe 5, and a second channel 42 respectively connected to the second liquid inlet hole 32 and the cleaning liquid pipe 6, the end of the grinding liquid pipe 5 passes through the cleaning liquid pipe 6 and is connected to a first nozzle 51, and a second nozzle 61 is provided on the peripheral wall of the cleaning liquid pipe 6.

[0028] Compared with the prior art, the polishing area cleaning device provided in this embodiment uses the first channel in the rotating head 4 to supply grinding liquid to the grinding liquid tube 5 to ensure the smooth progress of the wafer polishing process. When polishing is completed and the grinding disk 8 needs to be cleaned, the second channel 42 is used to supply cleaning liquid to the cleaning liquid tube 6. The rotating head 4 can drive the grinding liquid tube 5 and the cleaning liquid tube 6 to rotate synchronously under the action of the rotating drive part 2, and the rotation of the cleaning liquid tube 6 is used to achieve comprehensive flushing of the grinding disk 8 and peripheral components, thereby improving cleaning efficiency and ensuring cleaning quality.

[0029] In this embodiment, the grinding disc 8 and the base 1 are both arranged above the platform 9, and the base 1 is located on one side of the grinding disc 8. When grinding the wafer, the rotary drive 2 is in a stopped state, the first liquid inlet 31 supplies grinding liquid into the first channel, and the first nozzle 51 sprays the grinding liquid onto the grinding disc 8 to polish the wafer. After the wafer grinding is completed, the grinding disc 8 needs to be cleaned, the first liquid inlet 31 stops supplying grinding liquid, and the second liquid inlet 32 starts supplying cleaning liquid. At this time, the rotary drive 2 drives the rotating head 4, the grinding liquid pipe 5 and the cleaning liquid pipe 6 to rotate synchronously, and the second nozzle 61 sprays cleaning liquid to different positions of the grinding disc 8. At the same time, the polishing head, the rotating bracket and the spindle system outside the grinding disc 8 are also cleaned, which helps to increase the cleaning range and effectively clean the grinding disc 8 and peripheral components.

[0030] In one possible implementation, see Figures 1 to 5 A first annular groove 43 communicating with the first liquid inlet hole 31 and a second annular groove 44 communicating with the second liquid inlet hole 32 are provided on the peripheral wall of the rotating head 4. The first channel is arranged at the axis of the rotating head 4 and is connected to the first annular groove 43 through a radial hole 45. The second channel 42 is arranged parallel to the first channel and is connected to the second annular groove 44.

[0031] In this embodiment, the first annular groove extends along the circumference of the rotating head 4 and maintains a state of communication with the first liquid inlet hole 31. The grinding liquid supplied by the first liquid inlet hole 31 is sent into the first channel through the radial hole 45, and then supplied to the position of the first nozzle 51 through the grinding liquid tube 5. The grinding liquid is sprayed onto the grinding disk 8 by the first nozzle 51 to ensure the effective supply of grinding liquid during the grinding process.

[0032] Similarly, the second annular groove extends along the circumference of the rotating head 4 and maintains a state of communication with the second liquid inlet hole 32. The grinding liquid supplied from the second liquid inlet hole 32 is sent into the second channel 42 through the second annular groove 44, and then supplied to the position of the second nozzle 61 through the cleaning liquid pipe 6. The cleaning liquid is sprayed onto the grinding disc 8 by the second nozzle 61. Combined with the rotating action of the cleaning liquid pipe 6, the comprehensiveness and effectiveness of the cleaning are guaranteed, while the cleaning efficiency is improved.

[0033] For some examples, see Figures 1 to 5 , an axially extending partition plate 47 is provided in the rotating head 4 and the grinding liquid tube 5, and the partition plate 47 is used to separate the first channel and the inner cavity of the grinding liquid tube 5 into two branch channels 41;

[0034] There are two first liquid inlet holes 31 , two first annular grooves 43 , two radial holes 45 and two second nozzles 61 respectively. The two first annular grooves 43 are spaced apart along the axial direction of the rotating head 4 . The radial hole 45 is used to connect the first annular groove 43 and the branch channel 41 .

[0035] In this embodiment, when different types of grinding fluid need to be supplied to the grinding disc 8, a partition plate 47 disposed within the rotating head 4 and the grinding fluid tube 5 is used to separate the first channel and the inner cavity of the grinding fluid tube 5 into two branch channels 41. The first channel and the inner cavity of the grinding fluid tube 5 are interconnected, and the partition plate 47 extends along the circumference of the rotating head 4 into the cleaning fluid tube 6, dividing the interior space of the first channel and the grinding fluid tube 5 into two semi-cylindrical spaces, namely the branch channels 41. Correspondingly, two first liquid inlet holes 31, two first annular grooves 43, two radial holes 45, and two second nozzles 61 are each provided for supplying different types of grinding fluid.

[0036] According to the grinding requirements, one of the branch channels 41 may be selected to supply the grinding liquid, or two branch channels 41 may be selected to supply the grinding liquid synchronously.

[0037] For some examples, see Figures 1 to 5 The end of the grinding liquid tube 5 is provided with two liquid outlet branches 52 extending downward, respectively. The liquid outlet branches 52 are connected to the two branch channels 41 in a one-to-one correspondence, and the two first nozzles 51 are connected to the lower ends of the liquid outlet branches 52 in a one-to-one correspondence. The end of the grinding liquid tube 5 adjacent to the grinding disc 8 is arranged to pass through the end surface of the corresponding end of the cleaning liquid tube 6. The liquid outlet branch 52 provided at the end of the grinding liquid tube 5 can drain the grinding liquid downward. When polishing the wafer, the grinding liquid tube 5 is in a stationary state, and the first nozzles 51 spray the grinding liquid onto the grinding disc 8, ensuring the effective spraying of the grinding liquid to meet the polishing requirements of the wafer.

[0038] For some examples, see Figures 1 to 5 , the two first liquid inlet holes 31 are spaced apart along the axial direction of the liquid supply sleeve 3, the two first annular grooves 43 are spaced apart along the axial direction of the rotating head 4, and the two radial holes 45 are spaced apart along the circumferential and axial directions of the rotating head 4, and are respectively connected with the two branch channels 41 in a one-to-one correspondence. The two first liquid inlet holes 31 are spaced apart along the axial direction of the liquid supply sleeve 3, and supply different types of grinding liquids to the two branch channels 41 respectively. The two first annular grooves 43 are spaced apart along the axial direction of the rotating head 4, and are respectively connected with the two first liquid inlet holes 31 in a one-to-one correspondence, ensuring the effective separation of the two grinding liquids and realizing the separate supply of different grinding liquids. The two radial holes 45 are not only spaced apart along the axial direction of the rotating head 4 to meet the connection effect with the two first annular grooves 43, but also the two radial holes 45 are spaced apart along the circumferential direction of the rotating head 4 to meet the connection effect with the two branch channels 41 in a one-to-one correspondence.

[0039] In one possible implementation, see Figures 1 to 5Second liquid inlet 32 is located on the side of liquid supply sleeve 3 away from rotary drive member 2. The diameter of second liquid inlet 32 is smaller than the axial width of second annular groove 44 in rotating head 4. Second liquid inlet 32 communicates with second annular groove 44, allowing cleaning liquid to be promptly delivered to cleaning liquid pipe 6 through second channel 42. Specifically, cleaning liquid is delivered to the interlayer formed by the outer wall of grinding liquid pipe 5 and the inner wall of cleaning liquid pipe 6, facilitating the timely delivery of cleaning liquid to cleaning liquid pipe 6 and meeting the cleaning requirements of grinding disc 8.

[0040] For some examples, see Figures 1 to 5 The outer periphery of the rotating head 4 is provided with a seal 33, which is used to seal the gap between the rotating head 4 and the liquid supply sleeve 3. By providing the seal 33 between the outer periphery of the rotating head 4 and the inner periphery of the liquid supply sleeve 3, an effective seal between the rotating head 4 and the liquid supply sleeve 3 is ensured, preventing the grinding liquid and the cleaning liquid from flowing in the gap between the rotating head 4 and the liquid supply sleeve 3, and ensuring the orderly supply of the polishing liquid or the cleaning liquid.

[0041] In one possible implementation, see Figures 1 to 5 A plurality of second nozzles 61 are provided axially spaced apart along the cleaning liquid pipe 6. The second nozzles 61 are conical or fan-shaped. Providing multiple second nozzles 61 improves the cleaning efficiency of the grinding disc 8. The conical or fan-shaped second nozzles 61 further expand the cleaning liquid spray range, improving the comprehensiveness and effectiveness of the cleaning process.

[0042] In one possible implementation, see Figures 1 to 5 The base 1 is also provided with a rotating seat 7 and a driving motor. The rotating seat 7 is rotatably connected to the base 1. The driving motor is used to drive the rotating seat 7 to swing horizontally. The liquid supply sleeve 3 and the rotating driving member 2 are respectively connected to the rotating seat 7. The grinding liquid pipe 5 and the cleaning liquid pipe 6 can swing horizontally with the rotating seat 7.

[0043] In this embodiment, while the rotary drive member 2 is used to drive the cleaning liquid pipe 6 to rotate circumferentially, the driving motor is also used to drive the rotating seat 7 to rotate, thereby driving the upper rotating head 4, the liquid supply sleeve 3, the grinding liquid pipe 5 and the cleaning liquid pipe 6 to swing horizontally synchronously, so that the cleaning liquid pipe 6 can fully cover the top area of the grinding disc 8, thereby achieving effective spraying of the grinding disc 8 over a larger range, thereby improving the spraying efficiency.

[0044] In one possible implementation, see Figures 1 to 5 The polishing area cleaning device also includes a controller, which is electrically connected to the rotating drive member 2 and the drive motor respectively, and is used to send start and stop instructions to the rotating drive member 2 or the drive motor.

[0045] In this embodiment, a controller is provided to control the start and stop of the rotary drive member 2 and the drive motor, thereby achieving efficient switching between the grinding and cleaning processes. Furthermore, a timer electrically connected to the controller can also be provided to transmit a timing signal to the controller, which then determines whether to start or stop the rotary drive member 2 or the drive motor according to a preset program, thereby achieving automatic grinding and cleaning of the device, thereby improving wafer processing efficiency.

[0046] The above-mentioned polishing area cleaning device utilizes the first channel in the rotating head 4 to supply grinding liquid to the grinding liquid tube 5 to ensure the smooth progress of the wafer polishing process. When polishing is completed and the grinding disk 8 needs to be cleaned, the second channel 42 is utilized to supply cleaning liquid to the cleaning liquid tube 6. The rotating head 4 can drive the grinding liquid tube 5 and the cleaning liquid tube 6 to rotate synchronously under the action of the rotating drive member 2. The rotation of the cleaning liquid tube 6 is utilized to achieve comprehensive flushing of the grinding disk 8 and peripheral components, thereby improving cleaning efficiency and ensuring cleaning quality.

[0047] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Polishing area cleaning device, characterized in that, The invention comprises a base (1), a rotary drive member (2), a liquid supply sleeve (3), a rotary head (4), a grinding liquid pipe (5) and a cleaning liquid pipe (6), wherein the base (1) is arranged on the outside of a grinding disc (8), the liquid supply sleeve (3) is arranged above the base (1), the rotary head (4) is rotatably connected to the liquid supply sleeve (3), the rotary drive member (2) is connected to the outer end of the liquid supply sleeve (3) and is connected to the rotary head (4) to drive the rotary head (4) to rotate, the grinding liquid pipe (5) and the cleaning liquid pipe (6) are both connected to the inner end of the rotary head (4), and the cleaning liquid pipe (6) is connected to the inner end of the rotary head (4). The cleaning liquid pipe (6) is sleeved on the outer periphery of the grinding liquid pipe (5); a first liquid inlet hole (31) and a second liquid inlet hole (32) are provided on the outer peripheral wall of the liquid supply sleeve (3); a first channel is provided on the rotating head (4) and is respectively connected to the first liquid inlet hole (31) and the grinding liquid pipe (5); and a second channel (42) is provided and is respectively connected to the second liquid inlet hole (32) and the cleaning liquid pipe (6); an end of the grinding liquid pipe (5) passes through the cleaning liquid pipe (6) and is connected to a first nozzle (51); a second nozzle (61) is provided on the peripheral wall of the cleaning liquid pipe (6).

2. The polishing area cleaning device according to claim 1, characterized in that: A first annular groove (43) communicating with the first liquid inlet hole (31) and a second annular groove (44) communicating with the second liquid inlet hole (32) are provided on the peripheral wall of the rotary head (4); the first channel is arranged at the axis of the rotary head (4) and is connected to the first annular groove (43) via a radial hole (45); the second channel (42) is arranged parallel to the first channel and is connected to the second annular groove (44).

3. The polishing area cleaning device according to claim 2, characterized in that: An axially extending partition plate (47) is provided in the rotating head (4) and the grinding liquid tube (5), and the partition plate (47) is used to separate the first channel and the inner cavity of the grinding liquid tube (5) into two branch channels (41); The first liquid inlet hole (31), the first annular groove (43), the radial hole (45) and the second nozzle (61) are respectively provided with two, the two first annular grooves (43) are arranged at intervals along the axial direction of the rotating head (4), and the radial hole (45) is used to connect the first annular groove (43) and the branch channel (41).

4. The polishing area cleaning device according to claim 3, characterized in that: The end of the grinding liquid pipe (5) is provided with two liquid outlet branches (52) extending downward respectively, the liquid outlet branches (52) are connected to the two branch channels (41) in a one-to-one correspondence, and the two first nozzles (51) are connected to the lower ends of the liquid outlet branches (52) in a one-to-one correspondence.

5. The polishing area cleaning device according to claim 3, characterized in that: The two first liquid inlet holes (31) are spaced apart along the axial direction of the liquid supply sleeve (3), the two first annular grooves (43) are spaced apart along the axial direction of the rotary head (4), and the two radial holes (45) are spaced apart along the circumferential and axial directions of the rotary head (4) and are respectively connected to the two branch channels (41) in a one-to-one correspondence.

6. The polishing area cleaning device according to claim 2, characterized in that: The second liquid inlet hole (32) is located on a side of the liquid supply sleeve (3) away from the rotary drive member (2), and the diameter of the second liquid inlet hole (32) is smaller than the width of the second annular groove (44) in the axial direction of the rotary head (4).

7. The polishing area cleaning device according to claim 1, wherein: The outer periphery of the rotary head (4) is provided with a sealing member (33), and the sealing member (33) is used to seal the gap between the rotary head (4) and the liquid supply sleeve (3).

8. The polishing area cleaning device according to any one of claims 1 to 7, characterized in that: A plurality of the second nozzles (61) are spaced apart along the axial direction of the cleaning liquid pipe (6), and the second nozzles (61) are conical nozzles or fan-shaped nozzles.

9. The polishing area cleaning device according to any one of claims 1 to 7, characterized in that: The base (1) is further provided with a rotating seat (7) and a driving motor. The rotating seat (7) is rotatably connected to the base (1). The driving motor is used to drive the rotating seat (7) to swing horizontally. The liquid supply sleeve (3) and the rotating driving member (2) are respectively connected to the rotating seat (7). The grinding liquid pipe (5) and the cleaning liquid pipe (6) can swing horizontally following the rotating seat (7).

10. The polishing area cleaning device according to claim 9, characterized in that: The polishing area cleaning device further comprises a controller, which is electrically connected to the rotating drive member (2) and the drive motor respectively, and is used to send start and stop instructions to the rotating drive member (2) or the drive motor.

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