Automatic sheet arranging machine
By designing an automatic chip disassembly machine, the automatic partitioning of wafer products is achieved using clamping and adsorption mechanisms, the problem of time-consuming and labor-consuming manual partitioning in the prior art is solved, and efficiency and aesthetics are improved.
Patent Information
- Application Number
- CN202422515309.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-17
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-10-17
AI Technical Summary
Wafer products are time-consuming and labor-intensive when packaged, and cannot be guaranteed to be neat and beautiful. The existing technology mainly relies on manual operations and is inefficient.
An automatic chip arrangement machine is designed, including the main body of the equipment, the Y-axis drive platform, the carrier, the material tray, the arch frame, the X-axis drive platform, the Z-axis drive platform and the clamping nozzle module to realize the automatic packaging of wafer products and efficient packaging through clamping and adsorption mechanisms.
It realizes automatic packaging of wafer products, reduces labor intensity, improves work efficiency, and ensures the neat and beautiful appearance of packaging.
Smart Images

Figure CN223187762U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an automatic film arrangement machine. Background Art
[0002] After production, wafers are typically placed in trays. Later, during packaging, the wafers within the trays need to be repacked. Currently, this repackaging process is typically done manually, which is time-consuming, labor-intensive, and inefficient. It also fails to ensure the neatness and aesthetics of the wafers. Utility Model Content
[0003] The main technical problem solved by the utility model is to provide an automatic wafer arrangement machine with a simple, reasonable and reliable structure, which can realize the automatic packaging of wafer products, reduce labor intensity, improve work efficiency and ensure neat and beautiful packaging.
[0004] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide an automatic film arrangement machine, comprising an equipment main body, a Y-axis drive platform, a carrying platform, a carrier, a material tray, an arch frame, an X-axis drive platform, a Z-axis drive platform and a clamping nozzle module, the equipment main body is arranged horizontally, the Y-axis drive platform is arranged on the upper surface of the equipment main body and the Y-axis drive platform is provided with two driving ends that move toward or away from each other, the carrying platform is provided with two and respectively arranged on the two driving ends of the Y-axis drive platform, the opposite sides of the two carrying platforms are respectively provided with concave clamping grooves to fix the material tray, the upper surfaces of the opposite sides of the two carrying platforms are respectively concave with positioning grooves to place the carrier, the arch frame is longitudinally fixed to the rear of both sides of the equipment main body, the X-axis drive platform is fixed to the front side of the horizontal end in the middle of the arch frame, the Z-axis drive platform is fixed to the driving end of the X-axis drive platform, and the clamping nozzle module is longitudinally fixed to the driving end of the Z-axis drive platform.
[0005] In a preferred embodiment of the present invention, a plurality of control buttons are provided on the front side of the device body.
[0006] In a preferred embodiment of the present invention, any of the carrying platforms is provided with two clamping grooves and is arranged in an E-shaped structure.
[0007] In a preferred embodiment of the present invention, the clamping side of the clamping groove is arranged in a stepped structure.
[0008] In a preferred embodiment of the present invention, a control handle is provided on the upper side of the arch frame.
[0009] In a preferred embodiment of the present invention, the clamping nozzle module includes a nozzle assembly in the middle of the bottom and an external clamping claw assembly.
[0010] The beneficial effects of the utility model are as follows: the automatic wafer arrangement machine pointed out by the utility model has a simple, reasonable and reliable structure, can realize the automatic packaging of wafer products, reduce labor intensity, improve work efficiency, and ensure neat and beautiful packaging. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. Among them:
[0012] Figure 1 It is a three-dimensional diagram of a preferred embodiment of an automatic film arrangement machine of the present invention. DETAILED DESCRIPTION
[0013] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0014] See also Figure 1 As shown, the embodiment of the utility model includes:
[0015] An automatic film arrangement machine includes an equipment body 1, a Y-axis drive platform 2, a bearing platform 3, a carrier 4, a material tray 5, an arch frame 6, an X-axis drive platform 7, a Z-axis drive platform 8 and a clamping nozzle module 9.
[0016] The device body 1 is arranged horizontally and placed on a workbench for operation.
[0017] A plurality of control buttons 10 are provided on the front side of the device body 1 for starting and stopping the device or performing an emergency stop operation during use.
[0018] The Y-axis driving platform 2 is arranged on the upper surface of the equipment body 1 and is provided with two driving ends that move toward or away from each other. When moving toward each other, it is used to clamp, and when moving away from each other, it is used to unload.
[0019] There are two carrying platforms 3 , which are respectively arranged on the two driving ends of the Y-axis driving platform 2 , and move toward or away from each other along with the two driving ends of the Y-axis driving platform 2 .
[0020] The opposite sides of the two carrying platforms 3 are respectively provided with concave clamping grooves 11 to fix the material tray 5. Any carrying platform 3 is provided with two clamping grooves 11 and is arranged in an E-shaped structure to fix two material trays 5 at the same time, thereby increasing the workload.
[0021] The clamping side of the clamping groove 11 is arranged in a stepped structure, which is convenient for positioning after support.
[0022] The upper surfaces of the two supporting platforms 3 on opposite sides are respectively provided with positioning grooves 12 for placing the carriers 4 to increase the packaging capacity.
[0023] The arch frames 6 are longitudinally fixed to the rear parts of both sides of the equipment body 1 to facilitate the installation of the upper components.
[0024] A control handle 13 is provided on the upper side of the arch frame 6 for setting the parameters of each driving module.
[0025] The X-axis driving platform 7 is fixed to the front side of the horizontal end in the middle of the arch frame 6 to provide driving in the X-axis direction.
[0026] The Z-axis driving platform 8 is fixed to the driving end of the X-axis driving platform 7 , moves along with the driving end of the X-axis driving platform 7 in the X-axis direction, and provides driving in the Z-axis direction.
[0027] The clamping nozzle module 9 is longitudinally fixed to the driving end of the Z-axis driving platform 8 and moves in the Z-axis direction along with the driving end of the Z-axis driving platform 8.
[0028] The clamping nozzle module 9 includes a nozzle assembly in the middle of the bottom and an external clamping claw assembly. When operating, the wafer product is first adsorbed by the nozzle assembly, and then clamped and fixed by the clamping claw assembly.
[0029] In summary, the automatic wafer arrangement machine pointed out in the present invention has a simple, reasonable and reliable structure, can realize the automatic packaging of wafer products, reduce labor intensity, improve work efficiency, and ensure neat and beautiful packaging.
[0030] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. An automatic film arrangement machine, characterized in that: The utility model comprises an equipment main body, a Y-axis driving platform, a carrying platform, a carrier, a material tray, an arch frame, an X-axis driving platform, a Z-axis driving platform and a clamping nozzle module. The equipment main body is horizontally arranged, the Y-axis driving platform is arranged on the upper surface of the equipment main body and the Y-axis driving platform is provided with two driving ends that move toward or away from each other, the carrying platform is provided with two and respectively arranged on the two driving ends of the Y-axis driving platform, the opposite sides of the two carrying platforms are respectively provided with concave clamping grooves for fixing the material tray, the upper surfaces of the opposite sides of the two carrying platforms are respectively concave with positioning grooves for placing the carrier, the arch frame is longitudinally fixed to the rear parts of both sides of the equipment main body, the X-axis driving platform is fixed to the front side of the horizontal end in the middle of the arch frame, the Z-axis driving platform is fixed to the driving end of the X-axis driving platform, and the clamping nozzle module is longitudinally fixed to the driving end of the Z-axis driving platform.
2. The automatic film arrangement machine according to claim 1, characterized in that: A plurality of control buttons are arranged on the front side of the device body.
3. The automatic film arrangement machine according to claim 1, characterized in that: Any of the carrying platforms is provided with two clamping grooves and is arranged in an E-shaped structure.
4. The automatic film arrangement machine according to claim 1, characterized in that: The clamping side of the clamping groove is arranged in a stepped structure.
5. The automatic film arrangement machine according to claim 1, characterized in that: A control handle is provided on the upper side of the arch frame.
6. The automatic film arrangement machine according to claim 1, characterized in that: The clamping nozzle module includes a nozzle assembly in the middle of the bottom and an external clamping claw assembly.