Testing device

Abstract

The utility model provides a testing device. The testing device comprises: a first cooling member; the test main body is used for testing the to-be-tested piece, the test main body is arranged on the refrigeration side of the first cooling piece, and the first cooling piece is used for cooling the test main body and / or the to-be-tested piece; a second cooling member; the first heat transfer part comprises at least two heat transfer structures, at least one heat transfer structure is arranged on the heat dissipation side of the first cooling part, at least the other heat transfer structure is arranged on the refrigeration side of the second cooling part, and the first heat transfer part is used for transferring heat generated by the first cooling part to the second cooling part; the second cooling part is used for cooling the first heat transfer part. The chip testing device effectively solves the problem that the accuracy of the testing result of the chip testing device in the prior art is low.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a testing device. Background Art

[0002] Currently, packaged chips undergo low-temperature testing after manufacturing. This testing measures the chip's parameters at low temperatures to ensure high final product quality. During this testing process, workers typically first use in-situ refrigeration equipment to cool the packaged chips, then test them using a programming socket.

[0003] In the existing technology, chip in-situ cooling equipment has two major disadvantages: first, it is large in size (cannot be easily transported), and workers need to travel back and forth between the test site and the in-situ cooling equipment many times during the actual testing process, which seriously affects the workers' testing efficiency; second, it is expensive, usually more than 100,000 yuan. As a result, some manufacturers have begun to integrate the cooling device and the burning socket into one to form a new type of testing device that is highly portable, inexpensive, and can cool and reduce the temperature of packaged chips anytime and anywhere.

[0004] However, the cooling and temperature reduction effects of the new test devices in the prior art are relatively poor. During the actual test process, the temperature of the packaged chip itself is prone to fluctuations and may even fail to meet the test requirements, seriously affecting the accuracy of the test results of the test device. Utility Model Content

[0005] The main purpose of the present invention is to provide a testing device to solve the problem of low test result accuracy of chip testing devices in the prior art.

[0006] In order to achieve the above-mentioned objectives, the utility model provides a testing device, including: a first cooling member; a test body, used to test the test member to be tested, the test body is arranged on the cooling side of the first cooling member, and the first cooling member is used to cool the test body and / or the test member to be tested; a second cooling member; a first heat transfer member, including at least two heat transfer structures, at least one heat transfer structure is arranged on the heat dissipation side of the first cooling member, and at least another heat transfer structure is arranged on the cooling side of the second cooling member, the first heat transfer member is used to transfer the heat generated by the first cooling member to the second cooling member, and the second cooling member is used to cool the first heat transfer member.

[0007] Furthermore, the testing device further comprises: a housing having a mounting cavity, wherein the first cooling element and / or the testing body and / or the second cooling element and / or the first heat transfer element are arranged in the mounting cavity.

[0008] Furthermore, the first cooling element includes a semiconductor refrigeration sheet; and / or the second cooling element includes a semiconductor refrigeration sheet.

[0009] Furthermore, the heat transfer structure has a first accommodating cavity, a first liquid inlet and a first liquid outlet. The first liquid inlet and the first liquid outlet are both connected to the first accommodating cavity. The first accommodating cavity is used to accommodate the heat transfer medium. The first heat transfer element also includes: a connecting structure. In two adjacent heat transfer structures, the first liquid inlet of one heat transfer structure is connected to the first liquid outlet of the other heat transfer structure through the connecting structure.

[0010] Furthermore, at least a portion of the heat transfer structure is made of a heat conductive material; and / or at least a portion of the communication structure is made of a heat insulating material.

[0011] Furthermore, at least one heat transfer structure also has a second liquid inlet and a second liquid outlet, and the second liquid inlet and the second liquid outlet are both connected to the first accommodating cavity. The testing device also includes: a pump body structure, which is connected to the second liquid inlet and the second liquid outlet, and the pump body structure is used to drive at least part of the heat transfer medium to flow.

[0012] Furthermore, the first cooling member, the test body, the second cooling member and the first heat transfer member are all arranged in the installation cavity, and the at least two heat transfer structures include a first heat transfer structure and a second heat transfer structure, the first heat transfer structure is arranged on the heat dissipation side of the first cooling member, and the second heat transfer structure is arranged on the cooling side of the second cooling member, and the test device also includes: a second heat transfer member, at least a part of the second heat transfer member is arranged on the heat dissipation side of the second cooling member; wherein a through hole connected to the installation cavity is provided on the shell, and at least another part of the second heat transfer member extends from the through hole to the outside of the installation cavity, and the second heat transfer member is used to transfer the heat generated by the second cooling member to the outside of the installation cavity.

[0013] Furthermore, the second heat transfer element has a second accommodating cavity and a third liquid outlet, the second accommodating cavity is used to accommodate a heat transfer medium, and the test device also includes: a heat dissipation device, which is arranged outside the installation cavity, and the heat dissipation device includes a main structure and a fan structure, and the main structure has a accommodating recess, and the accommodating recess is connected to the second accommodating cavity through the third liquid outlet, so that when at least part of the heat transfer medium located in the second accommodating cavity flows into the accommodating recess, the heat generated by the second cooling element is transferred to the outside of the installation cavity; wherein, the fan structure is arranged on the main structure to dissipate heat from the heat transfer medium located in the accommodating recess.

[0014] Furthermore, the second heat transfer element includes: a heat transfer body, which is arranged on the heat dissipation side of the second cooling element and is located in the installation cavity, the heat transfer body having a second accommodating cavity, a third liquid inlet and a third liquid outlet, and the third liquid inlet is connected to the second accommodating cavity; a tubular structure, which is passed through the through hole; wherein, there are at least two tubular structures and at least two through holes, and the at least two tubular structures are arranged in a one-to-one correspondence with the at least two through holes, the third liquid inlet is connected to the accommodating recess through at least one tubular structure, and the third liquid outlet is connected to the accommodating recess through at least another tubular structure.

[0015] Furthermore, a heat-conducting layer is provided between the first heat transfer structure and the first cooling member; and / or, a heat-conducting layer is provided between the second heat transfer structure and the second cooling member; and / or, a heat-conducting layer is provided between the heat transfer body and the second cooling member; and / or, a heat-conducting layer is provided between the first cooling member and the test body.

[0016] Applying the technical solution of the present invention, the test body of the test device is used to test the test piece to be tested, the test body is arranged on the cooling side of the first cooling member, the first cooling member is used to cool the test body and / or the test piece to be tested, the first heat transfer member includes at least two heat transfer structures, at least one heat transfer structure is arranged on the heat dissipation side of the first cooling member, and at least another heat transfer structure is arranged on the cooling side of the second cooling member, the first heat transfer member is used to transfer the heat generated by the first cooling member to the second cooling member, and the second cooling member is used to cool the first heat transfer member. In this way, during the operation of the test device, the second cooling member can continuously cool down the heat transfer structure corresponding to it, so as to ensure that the heat absorbed by the heat transfer structure corresponding to the first cooling member can be transferred quickly and efficiently, thereby reducing the temperature of the heat dissipation side of the first cooling member. While the temperature of the heat dissipation side of the first cooling member is reduced, the cooling effect of its cooling side will increase accordingly, so as to ensure that the cooling effect of the first cooling member can meet the test requirements of the test piece to be tested, thereby avoiding the reduction in the accuracy of the test results due to temperature fluctuations of the test piece to be tested or the inability to reach a sufficiently low temperature, thereby solving the problem of low test result accuracy of the chip testing device in the prior art and improving the quality of the finished chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting part of this application are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0018] Figure 1 A schematic diagram of the three-dimensional structure of the testing device according to an embodiment of the present utility model after the housing is removed is shown;

[0019] Figure 2 Shown Figure 1 Cross-sectional view of the test device in FIG.

[0020] The above drawings include the following reference numerals:

[0021] 10. First cooling element; 20. Test body; 30. Second cooling element; 40. First heat transfer element; 41. Heat transfer structure; 411. First liquid inlet; 412. First liquid outlet; 413. First heat transfer structure; 414. Second heat transfer structure; 42. Connecting structure; 50. Shell; 51. Mounting cavity; 52. Through hole; 60. Heat dissipation device; 70. Second heat transfer element; 71. Heat transfer body; 72. Tubular structure; 80. Host computer; 90. Power supply. DETAILED DESCRIPTION

[0022] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0023] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0024] In the present invention, unless otherwise specified, directional words such as "up" and "down" are generally used with respect to the directions shown in the drawings, or with respect to the vertical, perpendicular or gravity direction; similarly, for ease of understanding and description, "left" and "right" are generally used with respect to the left and right shown in the drawings; "inside" and "outside" refer to the inside and outside relative to the outline of each component itself, but the above directional words are not used to limit the present invention.

[0025] In order to solve the problem of low test result accuracy of chip testing devices in the prior art, the present application provides a testing device.

[0026] like Figure 1 and Figure 2 As shown, the testing device includes a first cooling element 10, a test body 20, a second cooling element 30, and a first heat transfer element 40. The test body 20 is used to test the test piece. The test body 20 is arranged on the cooling side of the first cooling element 10. The first cooling element 10 is used to cool the test body 20 and / or the test piece. The first heat transfer element 40 includes at least two heat transfer structures 41, at least one heat transfer structure 41 is arranged on the heat dissipation side of the first cooling element 10, and at least another heat transfer structure 41 is arranged on the cooling side of the second cooling element 30. The first heat transfer element 40 is used to transfer heat generated by the first cooling element 10 to the second cooling element 30. The second cooling element 30 is used to cool the first heat transfer element 40.

[0027] Applying the technical solution of this embodiment, the test body 20 of the test device is used to test the test piece, and the test body 20 is arranged on the cooling side of the first cooling member 10. The first cooling member 10 is used to cool the test body 20 and / or the test piece. The first heat transfer member 40 includes at least two heat transfer structures 41, at least one heat transfer structure 41 is arranged on the heat dissipation side of the first cooling member 10, and at least another heat transfer structure 41 is arranged on the cooling side of the second cooling member 30. The first heat transfer member 40 is used to transfer the heat generated by the first cooling member 10 to the second cooling member 30, and the second cooling member 30 is used to cool the first heat transfer member 40. In this way, during the operation of the test device, the second cooling member 30 can continuously cool down the heat transfer structure 41 corresponding to it, so as to ensure that the heat absorbed by the heat transfer structure 41 corresponding to the first cooling member 10 can be transferred quickly and efficiently, thereby reducing the temperature of the heat dissipation side of the first cooling member 10. While the temperature of the heat dissipation side of the first cooling member 10 is reduced, the cooling effect of its cooling side will increase accordingly, so as to ensure that the cooling effect of the first cooling member 10 can meet the test requirements of the test piece to be tested, thereby avoiding the reduction in the accuracy of the test results due to temperature fluctuations of the test piece to be tested or the inability to reach a sufficiently low temperature, thereby solving the problem of low test result accuracy of the chip testing device in the prior art and improving the quality of the finished chip.

[0028] In this embodiment, there are two heat transfer structures 41 , one heat transfer structure 41 is provided on the heat dissipation side of the first cooling element 10 , and the other heat transfer structure 41 is provided on the cooling side of the second cooling element 30 .

[0029] It should be noted that the number of heat transfer structures 41 is not limited to this and can be adjusted according to working conditions and usage requirements. Optionally, there are three, four, five, six, seven, or more heat transfer structures 41.

[0030] In this embodiment, the device to be tested is a packaged chip.

[0031] In this embodiment, the test body 20 is a burning seat, which includes a seat body and an upper flip cover set on the seat body. A plug-in structure is set on the seat body, and the packaged chip is plugged into the seat body. The test device also includes a host computer 80, which is electrically connected to the burning seat. During the operation of the test device, the host computer 80 will obtain relevant information to be tested of the packaged chip through the burning seat to complete the test task.

[0032] In this embodiment, the first cooling member 10 is used to cool the packaged chip.

[0033] Specifically, the first cooling member 10 is integrated on the upper flip cover of the programming seat and moves synchronously with the upper flip cover. When the staff inserts the packaged chip and operates the upper flip cover to flip and close, the first cooling member 10 can contact the packaged chip to cool the packaged chip.

[0034] It should be noted that the arrangement of the first cooling member 10 is not limited to this, and can also be arranged on the burning seat. The first cooling member 10 cools the burning seat and thus cools the packaged chip inside the burning seat.

[0035] In this embodiment, the testing device further includes a power supply 90 , which is electrically connected to various components requiring electricity to provide power.

[0036] Optionally, the test device further comprises a shell 50, the shell 50 having an installation cavity 51, and the first cooling member 10 and / or the test body 20 and / or the second cooling member 30 and / or the first heat transfer member 40 are arranged in the installation cavity 51. In this way, the above arrangement, on the one hand, makes the arrangement positions of the first cooling member 10, the test body 20, the second cooling member 30 and the first heat transfer member 40 more flexible and diverse, so as to adapt to different working conditions and usage requirements, and also improves the processing flexibility of the staff. On the other hand, because the shell 50 can separate the installation cavity 51 and the outside world, the air with high humidity from the outside world cannot continuously enter the installation cavity 51, and frost cannot form on the surface of the first cooling member 10, the test body 20, the second cooling member 30 and the first heat transfer member 40, thereby extending the service life of the test device.

[0037] Specifically, the packaged chip needs to reach -55°C during the actual test process. The operating temperatures of the first cooling member 10, the test body 20, the second cooling member 30 and the first heat transfer member 40 are all below zero. Water vapor in the air can easily frost on the surface of the above-mentioned devices. In this embodiment, by adding a shell 50 to separate the installation cavity 51 from the outside world, frosting can be effectively avoided, thereby avoiding the short circuit problem of the device caused by frost turning into water, greatly extending the service life of the test device.

[0038] In this embodiment, the installation cavity 51 is a sealed cavity.

[0039] Specifically, to facilitate access to components within cavity 51 and replacement of packaged chips for testing, housing 50 is provided with an opening and a switch door. The switch door is reversibly positioned at the opening, allowing personnel to operate the switch door to cover or open the opening. Furthermore, sealing strips and other sealing elements are provided at each opening connecting housing 50 to the outside world to ensure a high degree of sealing performance within cavity 51.

[0040] Optionally, the first cooling element 10 comprises a semiconductor cooling sheet, and / or the second cooling element 30 comprises a semiconductor cooling sheet. This arrangement ensures high cooling performance for the first cooling element 10 and the second cooling element 30 while miniaturizing the first cooling element 10 and the second cooling element 30, thereby achieving a miniaturized design for the test device and improving its portability and transportability.

[0041] In this embodiment, the first cooling member 10 and the second cooling member 30 both include semiconductor fins.

[0042] In this embodiment, the semiconductor refrigeration plate is a four-stage refrigeration pagoda-type TE refrigeration plate, and its maximum theoretical temperature difference is about 100°C. That is, if the temperature of the heat dissipation side of the first cooling member 10 and the second cooling member 30 can be maintained at 20°C, the temperature of the cooling side can reach -80°C, thereby meeting the -55°C requirement during the packaged chip test, further improving the accuracy of the test results of the test device.

[0043] In this embodiment, the heat dissipation side is the hot surface of the semiconductor refrigeration plate, and the cooling side is the cold surface of the semiconductor refrigeration plate.

[0044] like Figure 1 and Figure 2 As shown, the heat transfer structure 41 has a first accommodating cavity, a first liquid inlet 411 and a first liquid outlet 412. The first liquid inlet 411 and the first liquid outlet 412 are both connected to the first accommodating cavity. The first accommodating cavity is used to accommodate a heat transfer medium. The first heat transfer element 40 also includes a connecting structure 42. In two adjacent heat transfer structures 41, the first liquid inlet 411 of one heat transfer structure 41 is connected to the first liquid outlet 412 of the other heat transfer structure 41 through the connecting structure 42. In this way, the above arrangement enables the heat transfer structure 41 to transfer heat through the heat transfer medium contained therein, thereby improving the heat transfer reliability and heat transfer efficiency of the first heat transfer element 40. On the other hand, the first accommodating cavities of the two adjacent heat transfer structures 41 can also be connected through the connecting structure 42, so that the heat transfer medium can flow between the two adjacent heat transfer structures 41, further improving the heat transfer reliability of the first heat transfer element 40.

[0045] In this embodiment, the heat transfer medium is cooling water.

[0046] In this embodiment, the communication structure 42 is tubular.

[0047] Specifically, the first heat transfer element 40 is actually a water-cooled structure. Some test devices in the prior art also actually use a water-cooled structure to transfer heat to the heat dissipation side of the cooling element to improve the cooling effect of the cooling element. However, if the packaged chip needs to reach -55°C, considering the loss in heat transfer, the cooling side of the first cooling element 10 needs to reach below -60°C. Therefore, the heat dissipation side of the first cooling element 10 must be below 40°C, and the temperature of the cooling water must be lower, such as below 35°C to ensure that the heat can be effectively taken away. Cooling water below 35°C is already difficult to produce efficient heat exchange with the air, and adding a fan for heat dissipation cannot meet the requirements. In this embodiment, a second cooling element 30 is added to cool the cooling water so that the temperature of the cooling water breaks through the room temperature limit and is close to 0°C or even below 0°C, thereby ensuring that the packaged chip can reach -55°C.

[0048] In this embodiment, the heat transfer structure 41 is a rectangular parallelepiped structure and is placed horizontally as a whole to ensure that the heat transfer structure 41 has a large flat outer surface, thereby facilitating the installation of the first cooling member 10 and the second cooling member 30 .

[0049] In this embodiment, the second cooling element 30 includes a plurality of semiconductor fins. These fins are arranged in a plurality and spaced apart on the upper surface of the heat transfer structure 41 along the length and / or width of the heat transfer structure 41. This arrangement not only increases the contact area between the second cooling element 30 and the heat transfer structure 41, thereby enhancing the cooling effect of the second cooling element 30, but also ensures a more uniform cooling area across the second cooling element 30, thereby preventing portions of the cooling water within the heat transfer structure 41 from being left uncooled.

[0050] In this embodiment, the second cooling element 30 includes six semiconductor refrigeration fins, which are evenly arranged in a 2*3 pattern on the upper surface of the heat transfer structure 41 .

[0051] Optionally, at least a portion of the heat transfer structure 41 is made of a heat-conducting material; and / or, at least a portion of the connecting structure 42 is made of a heat-insulating material. Thus, the above arrangement, on the one hand, allows the heat transfer structure 41 itself to have a better heat-conducting effect, thereby further improving the heat transfer reliability of the first heat transfer member 40; on the other hand, it can prevent the heat of the heat transfer medium in the connecting structure 42 from being transferred to the installation cavity 51, thereby preventing the temperature in the installation cavity 51 from rising, thereby improving the temperature stability in the installation cavity 51. At the same time, the above arrangement makes the materials used to make the heat transfer structure 41 and the connecting structure 42 more flexible and diverse, so as to adapt to different working conditions and usage requirements, and also improves the processing flexibility of the staff.

[0052] In this embodiment, the heat transfer structure 41 is made of heat-conductive metal, such as copper, copper alloy, iron, and iron alloy.

[0053] In this embodiment, at least one heat transfer structure 41 further includes a second liquid inlet and a second liquid outlet, both of which are connected to the first accommodating chamber. The testing device also includes a pump structure, which is connected to both the second liquid inlet and the second liquid outlet and is used to drive the flow of at least a portion of the heat transfer medium. Thus, the above arrangement enables the circulation of the heat transfer medium within the first heat transfer element 40 through the pump structure, thereby further enhancing the heat transfer efficiency of the first heat transfer element 40.

[0054] like Figure 1 and Figure 2 As shown, the first cooling element 10, the test body 20, the second cooling element 30, and the first heat transfer element 40 are all disposed within the mounting cavity 51. The at least two heat transfer structures 41 include a first heat transfer structure 413 and a second heat transfer structure 414. The first heat transfer structure 413 is disposed on the heat dissipation side of the first cooling element 10, and the second heat transfer structure 414 is disposed on the cooling side of the second cooling element 30. The test device also includes a second heat transfer element 70, at least a portion of which is disposed on the heat dissipation side of the second cooling element 30. The housing 50 is provided with a through hole 52 communicating with the mounting cavity 51, and at least another portion of the second heat transfer element 70 extends from the through hole 52 to the outside of the mounting cavity 51. The second heat transfer element 70 is used to transfer heat generated by the second cooling element 30 to the outside of the mounting cavity 51. Thus, since the first cooling element 10, the test body 20, the second cooling element 30, and the first heat transfer element 40 are all disposed within the mounting cavity 51, the housing 50 can alleviate frost formation on the above-mentioned devices. At the same time, the above-mentioned setting can transfer the heat on the heat dissipation side of the second cooling member 30 (actually most of the heat during the operation of the test device) to the outside through the second heat transfer member 70, so as to avoid the accumulation of this heat in the installation cavity 51 and cause the temperature in the installation cavity 51 to rise, further ensuring that the packaged chip can have a sufficiently low temperature during the test process.

[0055] like Figure 1As shown, the second heat transfer member 70 has a second accommodating cavity and a third liquid outlet. The second accommodating cavity is used to accommodate heat transfer medium. The test device also includes a heat dissipation device 60, which is arranged outside the installation cavity 51. The heat dissipation device 60 includes a main structure and a fan structure. The main structure has a accommodating recess. The accommodating recess is connected to the second accommodating cavity through the third liquid outlet. When at least part of the heat transfer medium in the second accommodating cavity flows into the accommodating recess, the heat generated by the second cooling member 30 is transferred to the outside of the installation cavity 51. The fan structure is arranged on the main structure to dissipate heat from the heat transfer medium in the accommodating recess by blowing air to the heat transfer medium. Thus, the above arrangement, on the one hand, dissipates heat from the heat transfer medium through the heat dissipation device 60, thereby improving the heat transfer reliability and efficiency of the second heat transfer element 70, thereby improving the cooling effect of the second cooling element 30. On the other hand, because the heat dissipation device 60 is disposed outside the installation cavity 51, the size and specifications of the heat dissipation device 60 are no longer limited by the size of the installation cavity 51, thereby allowing personnel to select a heat dissipation device 60 of appropriate specifications and size according to actual testing requirements, thereby improving the heat dissipation reliability of the heat dissipation device 60. At the same time, the above arrangement enables the second heat transfer element 70 to transfer heat through the heat transfer medium therein.

[0056] In this embodiment, the second heat transfer member 70 includes a heat transfer body 71 and a tubular structure 72. The heat transfer body 71 is arranged on the heat dissipation side of the second cooling member 30 and is located in the installation cavity 51. The heat transfer body 71 has a second accommodating cavity, a third liquid inlet and a third liquid outlet. The third liquid inlet is connected to the second accommodating cavity. The tubular structure 72 is passed through the through hole 52. There are at least two tubular structures 72 and at least two through holes 52. The at least two tubular structures 72 are arranged in a one-to-one correspondence with the at least two through holes 52. The third liquid inlet is connected to the accommodating recess through at least one tubular structure 72, and the third liquid outlet is connected to the accommodating recess through at least another tubular structure 72. In this way, the heat transfer medium can circulate between the second accommodating cavity and the accommodating recess through the tubular structure 72, further improving the heat transfer reliability of the second heat transfer member 70.

[0057] In this embodiment, the heat transfer body 71 is actually the heat transfer structure 41. Thus, the above configuration makes the size of the heat transfer body 71 consistent with the size of the heat transfer structure 41, ensuring that the heat transfer body 71 can cover the multiple semiconductor fins arranged on the second heat transfer structure 414.

[0058] Optionally, a heat-conducting layer is provided between the first heat transfer structure 413 and the first cooling member 10; and / or a heat-conducting layer is provided between the second heat transfer structure 414 and the second cooling member 30; and / or a heat-conducting layer is provided between the heat transfer body 71 and the second cooling member 30; and / or a heat-conducting layer is provided between the first cooling member 10 and the test member 20. Thus, the above arrangement, on the one hand, improves the heat transfer efficiency between the first heat transfer structure 413 and the first cooling member 10, between the second heat transfer structure 414 and the second cooling member 30, between the heat transfer body 71 and the second cooling member 30, and between the first cooling member 10 and the test member 20 through the heat-conducting layer; and on the other hand, makes the location of the heat-conducting layer more flexible and diverse to adapt to different working conditions and usage requirements, and also improves the processing flexibility of the staff.

[0059] In this embodiment, heat conductive layers are provided between the first heat transfer structure 413 and the first cooling member 10 , between the second heat transfer structure 414 and the second cooling member 30 , between the heat transfer body 71 and the second cooling member 30 , and between the first cooling member 10 and the test body 20 .

[0060] Specifically, the heat conducting layer is formed by coating a heat conducting material.

[0061] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0062] The test body of the test device is used to test a test piece, the test body is arranged on the cooling side of a first cooling member, the first cooling member is used to cool the test body and / or the test piece, the first heat transfer member includes at least two heat transfer structures, at least one heat transfer structure is arranged on the heat dissipation side of the first cooling member, and at least another heat transfer structure is arranged on the cooling side of the second cooling member, the first heat transfer member is used to transfer heat generated by the first cooling member to the second cooling member, and the second cooling member is used to cool the first heat transfer member. In this way, during the operation of the test device, the second cooling member can continuously cool the heat transfer structure arranged corresponding to it, so as to ensure that the heat absorbed by the heat transfer structure arranged corresponding to the first cooling member can be quickly and efficiently transferred, thereby reducing the temperature of the heat dissipation side of the first cooling member. As the temperature of the heat dissipation side of the first cooling member is reduced, the cooling effect of its cooling side is also improved, so as to ensure that the cooling effect of the first cooling member can meet the test requirements of the test piece, avoid the reduction in the accuracy of the test results due to temperature fluctuations of the test piece or the inability to reach a sufficiently low temperature, thereby solving the problem of low test result accuracy of chip testing devices in the prior art and improving the quality of the finished chip.

[0063] Obviously, the embodiments described above are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0064] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, tasks, devices, components and / or combinations thereof.

[0065] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0066] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A testing device, characterized in that: include: a first cooling member (10); A test body (20) is used to test a test piece, the test body (20) is arranged on the cooling side of the first cooling member (10), and the first cooling member (10) is used to cool the test body (20) and / or the test piece; a second cooling member (30); The first heat transfer element (40) includes at least two heat transfer structures (41), at least one of the heat transfer structures (41) is arranged on the heat dissipation side of the first cooling element (10), and at least another heat transfer structure (41) is arranged on the cooling side of the second cooling element (30), the first heat transfer element (40) is used to transfer the heat generated by the first cooling element (10) to the second cooling element (30), and the second cooling element (30) is used to cool the first heat transfer element (40).

2. The testing device according to claim 1, wherein: The testing device further comprises: The housing (50) has an installation cavity (51), and the first cooling member (10) and / or the test body (20) and / or the second cooling member (30) and / or the first heat transfer member (40) are arranged in the installation cavity (51).

3. The testing device according to claim 1, wherein: The first cooling element (10) comprises a semiconductor cooling plate; and / or, The second cooling element (30) includes a semiconductor cooling fin.

4. The testing device according to claim 2, characterized in that The heat transfer structure (41) comprises a first accommodating cavity, a first liquid inlet (411) and a first liquid outlet (412), wherein the first liquid inlet (411) and the first liquid outlet (412) are both in communication with the first accommodating cavity, and the first accommodating cavity is used to accommodate a heat transfer medium. The first heat transfer element (40) further comprises: A connecting structure (42), in which, in two adjacent heat transfer structures (41), the first liquid inlet (411) of one heat transfer structure (41) is connected to the first liquid outlet (412) of the other heat transfer structure (41) through the connecting structure (42).

5. The testing device according to claim 4, characterized in that: At least part of the heat transfer structure (41) is made of a heat-conducting material; and / or at least part of the communication structure (42) is made of a heat-insulating material.

6. The testing device according to claim 4, characterized in that: At least one of the heat transfer structures (41) further comprises a second liquid inlet and a second liquid outlet, wherein the second liquid inlet and the second liquid outlet are both in communication with the first accommodating cavity, and the testing device further comprises: A pump body structure is connected to both the second liquid inlet and the second liquid outlet, and the pump body structure is used to drive at least part of the heat transfer medium to flow.

7. The testing device according to claim 2, characterized in that: The first cooling member (10), the test body (20), the second cooling member (30) and the first heat transfer member (40) are all arranged in the installation cavity (51), at least two of the heat transfer structures (41) include a first heat transfer structure (413) and a second heat transfer structure (414), the first heat transfer structure (413) is arranged on the heat dissipation side of the first cooling member (10), and the second heat transfer structure (414) is arranged on the cooling side of the second cooling member (30), and the test device further includes: a second heat transfer element (70), at least a portion of the second heat transfer element (70) being disposed on the heat dissipation side of the second cooling element (30); The shell (50) is provided with a through hole (52) connected to the installation cavity (51), and at least another part of the second heat transfer member (70) extends from the through hole (52) to the outside of the installation cavity (51), and the second heat transfer member (70) is used to transfer the heat generated by the second cooling member (30) to the outside of the installation cavity (51).

8. The testing device according to claim 7, characterized in that: The second heat transfer member (70) has a second accommodating cavity and a third liquid outlet, the second accommodating cavity is used to accommodate a heat transfer medium, and the testing device further comprises: a heat dissipation device (60) disposed outside the installation cavity (51), the heat dissipation device (60) comprising a main body structure and a fan structure, the main body structure having a receiving recess, the receiving recess being in communication with the second receiving cavity via the third liquid outlet, so that when at least part of the heat transfer medium in the second receiving cavity flows into the receiving recess, the heat generated by the second cooling element (30) is transferred to the outside of the installation cavity (51); Wherein, the fan structure is arranged on the main structure to dissipate heat from the heat transfer medium located in the accommodating recess.

9. The testing device according to claim 8, characterized in that The second heat transfer element (70) comprises: a heat transfer body (71) disposed on the heat dissipation side of the second cooling element (30) and located in the mounting cavity (51); the heat transfer body (71) having the second accommodating cavity, a third liquid inlet, and the third liquid outlet; the third liquid inlet is in communication with the second accommodating cavity; A tubular structure (72) is provided in the through hole (52); wherein, there are at least two tubular structures (72), there are at least two through holes (52), at least two tubular structures (72) are provided in a one-to-one correspondence with at least two through holes (52), the third liquid inlet is connected to the accommodating recess through at least one tubular structure (72), and the third liquid outlet is connected to the accommodating recess through at least another tubular structure (72).

10. The testing device according to claim 9, characterized in that: A heat-conducting layer is provided between the first heat transfer structure (413) and the first cooling element (10); and / or, A heat-conducting layer is provided between the second heat transfer structure (414) and the second cooling member (30); and / or, A heat-conducting layer is provided between the heat transfer body (71) and the second cooling member (30); and / or, A heat-conducting layer is provided between the first cooling member (10) and the test body (20).

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