Optical module convenient for heat dissipation
By using components such as insulated shells, thermally conductive copper plates and thermally conductive silicone films in the optical module, a thermally conductive path is formed and diffused to the outside of the switch, the problem of heat accumulation of the optical module is solved, and efficient heat dissipation and equipment stability are achieved.
Patent Information
- Application Number
- CN202422317022.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-09-23
AI Technical Summary
The heat generated by optical modules in high-speed optical communication systems is difficult to effectively disperse, resulting in heat accumulation and affecting equipment performance and reliability.
The shell made of heat-insulating material has a cavity and a thermally conductive copper plate inside, combined with thermally conductive silicone sheet and thermally conductive ring to form a complete thermal conductive path, and heat is diffused to the outside of the switch through the heat-dissipation ring to enhance the heat dissipation efficiency.
It realizes efficient heat dissipation in the optical module, avoids temperature increase and performance decline caused by heat accumulation, and improves the stability and reliability of the equipment.
Smart Images

Figure CN223193173U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical communication equipment, in particular to an optical module that is convenient for heat dissipation. Background Art
[0002] Optical modules are core components in optical communication systems, responsible for converting and transmitting optical signals. In high-speed optical communication systems, optical modules generate a large amount of heat.
[0003] Typically, optoelectronic devices use a thermally conductive silicone sheet placed at the bottom of the circuit board to transfer heat to the housing for heat dissipation. However, when the optical module is operating, most of the module itself is plugged into the switch, limiting the area of the housing exposed to the air and affecting heat dissipation efficiency. Furthermore, the switch's internal space is compact, and air flow is not as good as in an open environment. If multiple optical modules operate simultaneously and generate heat, this heat may accumulate inside the switch, forming a heat island effect, which in turn affects the performance of various components within the switch. Utility Model Content
[0004] The purpose of the utility model is to provide an optical module that is easy to dissipate heat, so as to solve the above-mentioned problems existing in the prior art.
[0005] The technical solution of the utility model to solve the above technical problems is as follows:
[0006] A light module that facilitates heat dissipation includes an light module body, a shell of the light module body being made of a heat-insulating material, and cavities being opened inside both side walls of the shell, heat-conducting copper plates being fixedly installed in both cavities, a heat dissipation ring being fixedly installed at one end of the shell facing away from the plug interface of the light module body, the heat-conducting copper plate being fixedly connected to the interior of the heat dissipation ring, a heat-conducting silicone sheet and a heat-conducting ring being fixedly installed on the inner bottom wall of the shell, the top of the heat-conducting silicone sheet being coated with thermal grease and in contact with the bottom of a circuit board, the surface of the heat-conducting ring being in contact with the bottom of an optical signal module, a heat-conducting copper sheet connected to the corresponding heat-conducting silicone sheet and the heat-conducting ring being fixedly installed on the inner bottom wall of the shell, the heat-conducting copper sheet extending into the interior of the cavity and fixedly connected to the heat-conducting copper sheet.
[0007] The beneficial effects of the present invention are as follows: the use of the thermally conductive silicone sheet and the thermally conductive ring ensures that the heat generated by the circuit board and the optical signal module can be efficiently transferred to the thermally conductive copper sheet, and then transferred to the thermally conductive copper plate through the thermally conductive copper sheet, thereby forming a complete heat conduction path. Through the efficient thermal conductivity of the thermally conductive copper plate, the heat generated by the circuit board and the optical signal module is quickly transferred to the heat dissipation ring. Since the heat dissipation ring is located at the end away from the plug interface of the optical module body, that is, located outside the switch, effective heat diffusion and heat dissipation are achieved, ensuring that the heat inside the optical module body can be dissipated in time, avoiding problems such as temperature increase, performance degradation, and even damage caused by heat accumulation.
[0008] On the basis of the above technical solution, the present invention can also be improved as follows.
[0009] Furthermore, a plurality of contact pieces are fixedly mounted on the side and front of the heat dissipation ring.
[0010] Furthermore, air vents are fixedly mounted on both side walls of the shell corresponding to the cavity, and second air holes communicating with the air vents and the cavity are opened on both side walls of the shell corresponding to the cavity.
[0011] Furthermore, a second dustproof net is fixedly installed on the second air vent.
[0012] Furthermore, a plurality of heat dissipation fins are fixedly mounted on a surface of the heat-conducting copper plate facing the second air holes.
[0013] Furthermore, the shell has two side walls corresponding to both ends of the cavity, each of which is provided with a first air vent that connects the air vent bin and the shell.
[0014] Furthermore, a first dustproof net is fixedly installed on the first air vent.
[0015] Furthermore, a plurality of positioning posts are fixedly mounted on the inner bottom wall of the shell, and the circuit board is detachably mounted inside the shell via the plurality of positioning posts. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the overall structure of the utility model;
[0017] Figure 2 Schematic diagram of the internal structure of the shell of this utility model Figure 1 ;
[0018] Figure 3 Schematic diagram of the internal structure of the shell of this utility model Figure 2 ;
[0019] Figure 4 This is a schematic diagram of the internal structure of the cavity and the air-permeable chamber of the utility model.
[0020] In the accompanying drawings, the components represented by the reference numerals are as follows:
[0021] 1. Optical module body; 101. Housing; 102. Circuit board; 103. Optical signal module; 2. Cavity; 3. Thermal copper plate; 4. Thermal silicone sheet; 5. Thermal ring; 6. Thermal copper sheet; 7. Heat dissipation ring; 8. Contact sheet; 9. Ventilation chamber; 10. First vent hole; 11. First dust screen; 12. Second dust screen; 13. Heat dissipation fins; 14. Positioning column. DETAILED DESCRIPTION
[0022] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.
[0023] like Figures 1 to 4 As shown, embodiment 1 of the present invention is an optical module that is easy to dissipate heat, including an optical module body 1, a shell 101 of the optical module body 1 is made of a heat-insulating material, and cavities 2 are opened inside the two side walls of the shell 101, and thermal copper plates 3 are fixedly installed in the two cavities 2. A heat dissipation ring 7 is fixedly installed at one end of the shell 101 away from the plug interface of the optical module body 1, and the thermal copper plate 3 is fixedly connected to the inside of the heat dissipation ring 7. A thermal conductive silicone sheet 4 and a thermal conductive ring 5 are fixedly installed on the inner bottom wall of the shell 101. The top of the thermal conductive silicone sheet 4 is coated with thermal conductive silicone grease and contacts the bottom of the circuit board 102. The surface of the thermal conductive ring 5 contacts the bottom of the optical signal module 103. A thermal conductive copper sheet 6 connected to the corresponding thermal conductive silicone sheet 4 and thermal conductive ring 5 is fixedly installed on the inner bottom wall of the shell 101. The thermal conductive copper sheet 6 extends to the inside of the cavity 2 and is fixedly connected to the thermal conductive copper plate 3.
[0024] The use of the thermally conductive silicone sheet 4 and the thermally conductive ring 5 ensures that the heat generated by the circuit board 102 and the optical signal module 103 can be efficiently transferred to the thermally conductive copper sheet 6, and then transferred to the thermally conductive copper plate 3 through the thermally conductive copper sheet 6, thereby forming a complete heat conduction path. Through the efficient thermal conductivity of the thermally conductive copper plate 3, the heat generated by the circuit board 102 and the optical signal module 103 is quickly conducted to the heat dissipation ring 7. Since the heat dissipation ring 7 is located at the end away from the plug interface of the optical module body 1, that is, located outside the switch, effective heat diffusion and heat dissipation are achieved, ensuring that the heat inside the optical module body 1 can be dissipated in time, avoiding problems such as temperature increase, performance degradation, and even damage caused by heat accumulation.
[0025] In a specific implementation, the housing 101 can be made of a composite of aluminum alloy and thermal insulation materials such as aerogel.
[0026] Embodiment 2 of the present invention is an optical module that facilitates heat dissipation. Based on embodiment 1, a plurality of contact pieces 8 are fixedly mounted on the side and front of the heat dissipation ring 7 .
[0027] The addition of the contact sheet 8 can significantly increase the contact area between the heat dissipation ring 7 and the surrounding environment. A larger contact area means more efficient heat transfer because heat can be dissipated into the air through more paths. At the same time, the contact sheet 8 can also form more convection channels with the air, promoting air flow, thereby accelerating heat dissipation, and helping to establish more effective heat exchange between the inside of the heat dissipation ring 7 and the external environment, thereby reducing the temperature of the heat dissipation ring 7.
[0028] Example 3 of the present invention is an optical module that is convenient for heat dissipation. Based on Example 1 or 2, air vents 9 are fixedly installed on both side walls of the shell 101 corresponding to the cavity 2, and second air holes connecting the air vents 9 and the cavity 2 are opened on both side walls of the shell 101 corresponding to the cavity 2.
[0029] The ventilation chamber 9 forms a convection channel, which, in combination with the second ventilation hole, allows air to circulate inside and outside the cavity 2, helping to dissipate the heat in the cavity 2 to the external environment through air convection, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.
[0030] Embodiment 4 of the present invention is an optical module that facilitates heat dissipation. Based on embodiment 3, a second dustproof net 12 is fixedly installed on the second air vent.
[0031] The second dustproof net 12 effectively prevents dust and other impurities from entering the cavity 2 through the air holes. The second dustproof net 12 can block most dust particles.
[0032] Example 5 of the present invention is an optical module that facilitates heat dissipation. Based on Example 3, a plurality of heat dissipation fins 13 are fixedly mounted on the surface of the heat-conducting copper plate 3 facing the second air holes.
[0033] The addition of the heat dissipation fins 13 further enhances the heat dissipation effect. The heat dissipation fins 13 can increase the contact area with the air, so that the heat can be transferred to the air faster, which can significantly improve the heat dissipation efficiency.
[0034] Example 6 of the present invention is an optical module that facilitates heat dissipation. Based on Example 3, first air holes 10 connecting the air chamber 9 and the shell 101 are opened on the two side walls of the shell 101 corresponding to the two ends of the cavity 2.
[0035] The design of the first air vent 10 enables air to circulate inside and outside the shell 101, which helps 101 to dissipate the heat in the shell into the air vent 9 through air convection, and then dissipate it to the external environment through the convection channel of the air vent 9, thereby improving the heat dissipation efficiency.
[0036] Example 7 of the present invention is an optical module that facilitates heat dissipation. Based on Example 6, a first dustproof net 11 is fixedly installed on the first air hole 10.
[0037] The first dustproof net 11 effectively prevents dust and other impurities from entering the interior of the housing 101. The first dustproof net 11 can block most dust particles, ensure the cleanliness of the interior of the housing 101, and avoid poor heat dissipation or equipment failure caused by dust accumulation.
[0038] Example 8 of the present utility model is an optical module that is easy to dissipate heat. On the basis of any one of Examples 1 to 7, a plurality of positioning posts 14 are fixedly installed on the inner bottom wall of the shell 101, and the circuit board 102 is detachably installed inside the shell 101 through the plurality of positioning posts 14.
[0039] The detachable design allows the circuit board 102 to be easily removed from the housing 101 when repair or replacement is required. Furthermore, the positioning posts 14 serve as reference points for the installation of the circuit board 102, ensuring precise alignment of the circuit board 102 during installation. This helps reduce performance issues or failures caused by inaccurate installation positioning, thereby improving overall product reliability and stability.
[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. An optical module that facilitates heat dissipation, characterized in that: The invention comprises an optical module body (1), a shell (101) of the optical module body (1) is made of a heat-insulating material, and cavities (2) are provided inside both side walls of the shell (101), and heat-conducting copper plates (3) are fixedly installed in the two cavities (2), a heat-dissipating ring (7) is fixedly installed on one end of the shell (101) away from the plug-in interface of the optical module body (1), and the heat-conducting copper plate (3) is fixedly connected to the inside of the heat-dissipating ring (7), and a heat-dissipating ring (7) is fixedly installed on the inner bottom wall of the shell (101). A heat-conducting silicone sheet (4) and a heat-conducting ring (5), wherein the top of the heat-conducting silicone sheet (4) is coated with heat-conducting silicone grease and contacts the bottom of the circuit board (102), and the surface of the heat-conducting ring (5) contacts the bottom of the optical signal module (103); a heat-conducting copper sheet (6) connected to the corresponding heat-conducting silicone sheet (4) and the heat-conducting ring (5) is fixedly mounted on the inner bottom wall of the housing (101), and the heat-conducting copper sheet (6) extends into the interior of the cavity (2) and is fixedly connected to the heat-conducting copper plate (3).
2. The optical module for facilitating heat dissipation according to claim 1, characterized in that: A plurality of contact pieces (8) are fixedly mounted on the side and front of the heat dissipation ring (7).
3. The optical module for facilitating heat dissipation according to claim 1, characterized in that: Air vents (9) are fixedly mounted on both side walls of the shell (101) corresponding to the cavity (2), and second air holes communicating with the air vents (9) and the cavity (2) are opened on both side walls of the shell (101) corresponding to the cavity (2).
4. The optical module for facilitating heat dissipation according to claim 3, characterized in that: A second dustproof net (12) is fixedly mounted on the second air vent.
5. The optical module for facilitating heat dissipation according to claim 3, characterized in that: A plurality of heat dissipation fins (13) are fixedly mounted on a surface of the heat-conducting copper plate (3) facing the second air vent.
6. The optical module for facilitating heat dissipation according to claim 3, characterized in that: The shell (101) has two side walls corresponding to the two ends of the cavity (2) provided with first air holes (10) communicating with the air chamber (9) and the shell (101).
7. The optical module for facilitating heat dissipation according to claim 6, characterized in that: A first dustproof net (11) is fixedly mounted on the first air vent (10).
8. The optical module for facilitating heat dissipation according to claim 1, characterized in that: A plurality of positioning columns (14) are fixedly mounted on the inner bottom wall of the housing (101), and the circuit board (102) is detachably mounted inside the housing (101) via the plurality of positioning columns (14).