Novel SMD (Surface Mount Device) chip inductor base structure

Abstract

The utility model discloses a novel SMD (Surface Mount Device) chip inductor base structure, which relates to the technical field of electronic components, comprises a base and a chip inductor body, and is characterized in that a placement area is formed on the base, and the chip inductor body is fixedly arranged through the placement area; the two horizontal sides of the base are each provided with a pin piece horizontally protruding outwards, the base and a PCB are welded and fixed through the pin pieces, the chip inductor body and the PCB can be electrically connected through the pin pieces, the chip inductor body is fixedly arranged in the containing area on the base, the pin pieces enable the chip inductor body to be electrically connected with the PCB, and therefore the chip inductor body can be electrically connected with the PCB. According to the chip inductor, the pin piece and the base are stably placed at the preset position of the PCB, so that the stability of the whole chip inductor is improved, the problem that the chip inductor shifts or falls off in the reflow soldering or other moving processes is solved, the manual welding efficiency is improved, and errors are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a novel SMD patch inductor base structure. Background Art

[0002] Chip mounting, also known as SMT, involves placing components on a printed PCB using a placement machine or by hand, and then soldering them in place. Chip inductors are a type of inductor designed specifically for surface mount technology and are widely used on the PCBs of modern electronic products. Compared to traditional through-hole inductors, chip inductors can be soldered directly to the surface of the circuit board without drilling. They offer advantages such as a small footprint, suitability for automated production, and suitability for high-frequency circuits. Chip inductors include stacked inductors, wirewound inductors, and ferrite beads.

[0003] Existing chip inductors all have pins directly connected to the solder paste on the PCB. Due to the small contact surface, the placement of the chip inductor is unstable. When the PCB is moved by automated equipment, the pins are easily separated from the solder paste, or the chip inductor is displaced, which affects the quality of the chip and increases the number of defective products.

[0004] At the same time, when performing manual soldering, since the directly led-out pin structure is relatively weak, the chip inductor needs to be stabilized at all times during the soldering process to avoid chip inductor offset, resulting in low soldering efficiency. Therefore, it is necessary to propose a new technical solution to solve the above problem. Utility Model Content

[0005] In order to overcome the above-mentioned shortcomings, the present invention aims to provide a technical solution that can solve the problems of easy displacement of chip inductors during reflow soldering and low manual soldering efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solutions: a novel SMD chip inductor base structure, comprising a base and a chip inductor body, wherein the base is formed with a placement area to secure the chip inductor body through the placement area; pins protruding horizontally outward are provided on both horizontal sides of the base, and the base is welded and fixed to the PCB board through the pins, and the chip inductor body and the PCB board can be electrically connected through the pins.

[0007] As a further solution of the present invention: the chip inductor body includes a coil, two coil terminals extending from the coil, a magnetic core wrapping the coil, and an inductor frame wrapping the coil and the magnetic core.

[0008] As a further solution of the present invention: the pin component includes a pin block, a return groove, an arc-shaped channel and a winding wire; at least two pin blocks protruding horizontally outward are respectively formed on the horizontal sides of the outer side of the base, and the two pin blocks in the same direction are a group, the pin block is provided with an inward-recessed return groove, and the pin block is also provided with an arc-shaped channel; a winding wire is wound on the return groove, and the two coil terminals are wound by the winding wire after passing through the two arc-shaped channels in the same direction.

[0009] As a further solution of the present invention: the winding wire and the coil terminal are welded by soldering.

[0010] As a further solution of the present invention: the return groove is sleeved outside the solder paste on the PCB board, and the bottom of the winding wire is in contact with the solder paste.

[0011] As a further solution of the present invention: the winding wire is a conductive metal wire.

[0012] As a further solution of the present invention: the lowest vertical point of the arc-shaped channel is lower than the return groove.

[0013] As a further solution of the present invention: vertical outer panels and horizontal outer panels that are arranged opposite to each other are formed on the base.

[0014] As a further solution of the present invention: the vertical outer plate is arranged in an arc shape, and the curvature is equal to the curvature of the coil.

[0015] Compared with the existing technology, the beneficial effects of this technical solution are:

[0016] (1) The chip inductor body is fixed in the placement area on the base, and the pins enable the chip inductor body to be electrically connected to the PCB board. The pins and the base are used to achieve stable placement at the preset position on the PCB board, thereby improving the stability of the overall chip inductor, avoiding the problem of the chip inductor shifting or falling off during reflow soldering or other movement, and improving the efficiency of manual soldering and reducing errors.

[0017] (2) When using the present invention, the base is placed at a preset position on the PCB board, the return groove is placed on the solder paste, and the viscosity of the solder paste itself is used to stick to the bottom of the winding wire, so that the pin block and the base are initially connected and positioned on the PCB board. The pin member and the base 1 are used to achieve stable placement at the preset position on the PCB board. At this time, the reflow soldering process is performed, and the solder paste is melted and then solidified to weld and fix the PCB board to the bottom of the winding wire. Since the coil terminal of the coil is wound by the winding wire after passing through the arc channel, the winding wire is used as a bridge to electrically connect the chip inductor body and the PCB board, thereby completing the chip assembly. The installation method is more secure, can reduce the assembly error rate, and improve stability.

[0018] (3) When manually soldering the chip inductor, the pins and base are used to achieve stable placement on the preset position of the PCB board, avoiding manual displacement during the process of soldering and fixing the winding wire and the PCB board, and also avoiding the offset of the chip inductor. The winding wire is conducive to soldering with the solder paste, which improves the efficiency of manual soldering.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0021] Figure 1 It is a structural stereogram of the utility model;

[0022] Figure 2 This is a three-dimensional diagram of the base structure of the utility model;

[0023] Figure 3 This is a three-dimensional diagram of the coil structure of the utility model;

[0024] The corresponding reference numerals in the accompanying drawings are described as follows:

[0025] 1. Base; 2. Chip inductor body; 3. Pin block; 4. Vertical outer plate; 5. Horizontal outer plate;

[0026] 101. Placement area;

[0027] 201, coil; 202, coil terminal; 203, magnetic core; 204, inductor frame;

[0028] 301. Reciprocating groove; 302. Arc channel; 303. Winding wire. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] See also Figure 1-3 A novel SMD chip inductor base structure includes a base 1 and a chip inductor body 2. The base 1 is formed with a placement area 101, so that the chip inductor body 2 is fixed through the placement area 101; both horizontal sides of the base 1 are provided with pins protruding horizontally outward, and the base 1 is welded and fixed to the PCB board through the pins, and the chip inductor body 2 and the PCB board can be electrically connected through the pins.

[0031] The chip inductor body 2 is fixedly mounted in the placement area 101 on the base 1, and the pins enable the chip inductor body 2 to be electrically connected to the PCB board. The pins and the base 1 are used to achieve stable placement at a preset position on the PCB board, thereby improving the stability of the entire chip inductor, avoiding the problem of the chip inductor shifting or falling off during reflow soldering or other movement processes, and improving the efficiency of manual soldering and reducing errors.

[0032] Specifically, refer to Figure 1-Figure 3 The chip inductor body 2 includes a coil 201, two coil terminals 202 extending from the coil 201, a magnetic core 203 wrapping the coil 201, and an inductor frame 204 wrapping the coil 201 and the magnetic core 203. The chip inductor body 2 is composed of the coil 201, the coil terminals 202, the magnetic core 203 and the inductor frame 204. The inductor frame 204 not only plays a protective role, but is also vertically hollowed out, which helps to dissipate heat from the chip inductor body 2.

[0033] Specifically, the pin component includes a pin block 3, a return groove 301, an arc-shaped channel 302 and a winding wire 303; at least two pin blocks 3 protruding horizontally outward are formed on the horizontal sides of the outside of the base 1, and the two pin blocks 3 in the same direction are a group, and the pin block 3 is provided with an inward-recessed return groove 301, and the pin block 3 is also provided with an arc-shaped channel 302; a winding wire 303 is wound around the return groove 301, and the two coil terminals 202 are wound around the winding wire 303 after passing through the two arc-shaped channels 302 in the same direction, the return groove 301 is sleeved on the outside of the solder paste on the PCB board, and the bottom of the winding wire 303 is in contact with the solder paste.

[0034] When using the present invention, the base 1 is placed at a preset position on the PCB board, the return groove 301 is placed on the solder paste, and the viscosity of the solder paste itself is used to stick to the bottom of the winding wire 303, so that the pin block 3 and the base 1 are initially connected and positioned on the PCB board. The pin parts and the base 1 are used to achieve stable placement at the preset position of the PCB board. At this time, the reflow soldering process is performed, and the solder paste is melted and then solidified to weld and fix the PCB board and the bottom of the winding wire 303. Since the coil terminal 202 of the coil 201 is wound by the winding wire 303 after passing through the arc channel 302, the winding wire 303 is used as a bridge to electrically connect the chip inductor body 2 and the PCB board, thereby completing the chip assembly. The installation method is more secure, can reduce the assembly error rate, and improve stability.

[0035] Or when manually soldering the chip inductor, the pin and base 1 are used to achieve stable placement on the preset position of the PCB board, avoiding manual displacement during the process of soldering and fixing the winding wire 303 and the PCB board, and also avoiding the chip inductor offset. The winding wire 303 is conducive to soldering with solder paste, thereby improving the efficiency of manual soldering.

[0036] Preferably, the winding wire 303 and the coil terminal 202 are welded by soldering. After the winding wire 303 is wrapped around the coil terminal 202, the winding wire 303 and the coil terminal 202 can be welded and fixed by soldering, which can prevent the coil terminal 202 from loosening and improve the stable transmission of current.

[0037] Furthermore, the winding wire 303 is a conductive metal wire. The winding wire 303 can be made of copper, silver and gold, so that the winding wire 303 has good conductivity and welding performance, ensuring a reliable electrical connection between the chip inductor body 2 and the PCB board.

[0038] Furthermore, the lowest vertical point of the arc-shaped channel 302 is lower than the circular groove 301 , which enables the coil terminal 202 to be located below the winding wire 303 and facilitates the placement of the coil terminal 202 .

[0039] Specifically, the base 1 is formed with a vertical outer plate 4 and a horizontal outer plate 5 that are arranged opposite to each other. The vertical outer plate 4 and the horizontal outer plate 5 can be used to determine the placement position of the chip inductor body 2 on the placement area 101.

[0040] Furthermore, the vertical outer plate 4 is arranged in an arc shape, and the curvature is equal to the curvature of the coil 201. The vertical outer plate 4 is arranged in an arc shape that matches the coil 201, which is conducive to reducing the overall size of the base 1, and there is no need to make the two vertical outer plates 4 convex.

[0041] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A novel SMD chip inductor base structure, comprising a base (1) and a chip inductor body (2), characterized in that: The base (1) is formed with a placement area (101) so that the chip inductor body (2) can be fixedly mounted through the placement area (101); Both horizontal sides of the base (1) are provided with pins protruding horizontally outward, and the base (1) is welded and fixed to the PCB board through the pins, and the chip inductor body (2) is electrically connected to the PCB board through the pins; The chip inductor body (2) comprises a coil (201) and two coil terminals (202) extending from the coil (201); The pin member comprises a pin block (3), a return groove (301), an arc-shaped channel (302) and a winding wire (303); At least two pin blocks (3) protruding horizontally outward are formed on the two horizontal sides of the outer side of the base (1), and the two pin blocks (3) in the same direction form a group. The pin blocks (3) are provided with a return groove (301) in an inwardly recessed manner, and the pin blocks (3) are also provided with an arc-shaped channel (302); A winding wire (303) is wound on the circular groove (301), and the two coil terminals (202) are wound by the winding wire (303) after passing through two arc-shaped channels (302) in the same direction.

2. The novel SMD chip inductor base structure according to claim 1 is characterized in that: The patch inductor body (2) comprises a magnetic core (203) enclosing the coil (201), and an inductor frame (204) enclosing the coil (201) and the magnetic core (203).

3. The novel SMD chip inductor base structure according to claim 2 is characterized in that: The winding wire (303) and the coil terminal (202) are welded by soldering.

4. The novel SMD chip inductor base structure according to claim 2 is characterized in that: The return groove (301) is sleeved outside the solder paste on the PCB board, and the bottom of the winding wire (303) is in contact with the solder paste.

5. The novel SMD chip inductor base structure according to claim 2 is characterized in that: The winding wire (303) is a conductive metal wire.

6. The novel SMD chip inductor base structure according to claim 2 is characterized in that: The lowest vertical point of the arc-shaped channel (302) is lower than the return groove (301).

7. The novel SMD chip inductor base structure according to claim 2, characterized in that: The base (1) is formed with a vertical outer plate (4) and a horizontal outer plate (5) that are arranged opposite to each other.

8. The novel SMD chip inductor base structure according to claim 7, characterized in that: The vertical outer plate (4) is arranged in an arc shape, and the arc is equal to the arc of the coil (201).

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