Chip inductance alloy powder filling buffer device

Abstract

The utility model provides a chip inductance alloy powder filling buffer device which comprises a powder feeding plate installed on a conveying arm, a powder control guide pipe vertically fixed on the powder feeding plate, a powder control box connected with the top of the powder control guide pipe, a powder guide cylinder movably sleeved below the powder feeding plate, and a synchronous plate connected with the synchronous plate. The synchronous plate is connected with the powder feeding plate through a limiting guide column, a negative pressure box is installed on the powder feeding plate, a negative pressure pipe is connected to the negative pressure box, a negative pressure suction nozzle is installed at the bottom of the powder feeding plate, and the negative pressure suction nozzle is connected with the negative pressure pipe. According to the scheme, after the speed of alloy powder is reduced through the powder guide plate, the alloy powder cannot be splashed out when entering the mold cavity, and the powder injection effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of inductors, in particular to a chip inductor alloy powder perfusion buffer device. Background Art

[0002] Most of the existing power inductors are formed by powder pressing. The existing implantation method is to drive a positioning arm plate through a telescopic arm, install a number of negative pressure suction cups at the bottom of the positioning arm plate, and suck the inductor coil by the negative pressure suction cups driven by an external negative pressure fan, then send it to the mold cavity, and then drive a powder tube to align with the mold cavity through the telescopic arm for powder injection. When injecting powder in this way, metal powder is likely to splash out of the mold cavity, and the impact force of the powder is relatively large, which is likely to push the coil to generate displacement. Summary of the Invention

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a chip inductor alloy powder perfusion buffer device with good powder injection effect.

[0004] To achieve the above purpose, the technical solution provided by the utility model is: a chip inductor alloy powder perfusion buffer device, which includes a powder feeding plate installed on a conveying arm. A powder control conduit is vertically fixed on the powder feeding plate. The top of the powder control conduit is connected to a powder control box. A powder guiding cylinder is movably sleeved below the powder feeding plate. The powder guiding cylinder is connected to a synchronous plate. The synchronous plate and the powder feeding plate are connected through a limiting guide post. A negative pressure box is installed on the powder feeding plate. A negative pressure tube is connected to the negative pressure box. A negative pressure suction nozzle is installed at the bottom of the powder feeding plate. The negative pressure suction nozzle is connected to the negative pressure tube.

[0005] The powder guiding cylinder is a vertically installed cylindrical shape. A limiting ring is meshed at the top of the powder guiding cylinder. An external thread is provided on the outer peripheral surface of the limiting ring. The external thread is meshed and connected with the synchronous plate. The inner cavity wall at the top of the powder guiding cylinder expands to form a stepped powder outlet cavity. The bottom of the powder outlet cavity gradually contracts to form a funnel shape with a large top and a small bottom. A powder guiding plate is provided on the lower cavity wall of the inner cavity of the powder guiding cylinder.

[0006] The number of the powder guiding cylinders is greater than 2. The adjacent powder guiding cylinders are connected through a synchronous plate. The negative pressure suction nozzle is located above the synchronous plate.

[0007] The lower part of the powder control conduit is movably sleeved in the powder guiding cylinder. The bottom of the powder control conduit is sealed by a sealing plate. A powder guiding hole penetrating through the inside and outside is provided on the upper side wall of the powder control conduit.

[0008] The powder guiding plate is spirally distributed from top to bottom in the lower part of the inner cavity of the powder guiding cylinder.

[0009] The powder guiding plate is multiple pieces. They are obliquely fixed on both sides of the lower part of the inner cavity of the powder guiding cylinder from top to bottom. The powder guiding plates on both sides are respectively distributed in a staggered manner up and down. One end of the powder guiding plate is connected to the inner cavity of the powder guiding cylinder, and the other end is suspended. The suspended end of the upper powder guiding plate is located above the supporting surface of the lower powder guiding plate.

[0010] After adopting the above solution, the alloy powder is placed in the powder control box. The conveying arm is driven by external power to move above the mold cavity, and the powder guiding cylinder extends to the mold cavity opening. When the alloy powder falls, it is guided successively by the powder guiding plates distributed up and down to achieve speed reduction and buffering. After the speed is reduced, it falls into the mold cavity. After the alloy powder in this solution is decelerated by the powder guiding plates, it will not splash out when entering the mold cavity, and the powder injection effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the present utility model.

[0012] Figure 2 It is a schematic diagram of the distribution of the powder guiding plates of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0013] The following further describes the present utility model in conjunction with all the drawings. The preferred embodiment of the present utility model is as follows. Referring to FIGS. Figure 1 and FIGS. Figure 2 A chip inductor alloy powder perfusion buffering device described in this embodiment includes a powder feeding plate 1 installed on a conveying arm. A powder control conduit 2 is vertically fixed on the powder feeding plate 1. The top of the powder control conduit 2 is connected to a powder control box 3. A powder guiding cylinder 4 is movably sleeved below the powder feeding plate 1. The lower part of the powder control conduit 2 is movably sleeved in the powder guiding cylinder 4. The bottom of the powder control conduit 2 is sealed by a sealing plate. A powder guiding hole 13 penetrating through the inside and outside is provided on the upper side wall of the upper part of the powder control conduit 2. The number of the powder guiding cylinders 4 is greater than 2. The adjacent powder guiding cylinders 4 are connected by a synchronous plate 8. A negative pressure suction nozzle 7 is located above the synchronous plate 8. The synchronous plate 8 and the powder feeding plate 1 are connected by a limiting guide post 12. A negative pressure box 5 is installed on the powder feeding plate 1. A negative pressure pipe 6 is connected to the negative pressure box 5. A negative pressure suction nozzle 7 is installed at the bottom of the powder feeding plate 1. The negative pressure suction nozzle 7 is connected to the negative pressure pipe 6.

[0014] The powder guiding cylinder 4 is a vertically installed cylindrical shape. A limiting ring 9 is engaged at the top of the powder guiding cylinder 4. An external thread is provided on the outer peripheral surface of the limiting ring 9. The external thread is engaged and connected with the synchronous plate 8. The inner cavity wall at the top of the powder guiding cylinder 4 expands to form a stepped powder outlet cavity 10. The bottom of the powder outlet cavity 10 gradually contracts to form a funnel shape with a large upper part and a small lower part. A powder guiding plate 11 is provided on the lower cavity wall of the inner cavity of the powder guiding cylinder 4. The powder guiding plate 11 is spirally distributed from top to bottom in the lower part of the inner cavity of the powder guiding cylinder 4. The powder guiding plate 11 is in multiple pieces and is obliquely fixed on both sides of the lower part of the inner cavity of the powder guiding cylinder 4 from top to bottom. The powder guiding plates 11 on both sides are respectively distributed in a vertically staggered manner. One end of the powder guiding plate 11 is connected to the inner cavity of the powder guiding cylinder 4, and the other end is suspended in the air. The suspended end of the upper layer powder guiding plate 11 is located above the supporting surface of the lower layer powder guiding plate 11.

[0015] After adopting the above solution, the negative pressure box is driven by the external negative pressure fan. In the original state, the negative pressure box does not generate suction. The synchronous plate and the powder guide cylinder descend to the bottom of the limit guide pillar under their own weight (limited by the limit guide pillar). At this time, the outlet of the powder guide hole is blocked by the inner wall of the limit ring.

[0016] The alloy powder is placed in the powder control box, and the conveying arm is driven by external power to move downward to the top of the mold cavity, and the powder guide cylinder is extended to the mold cavity opening;

[0017] The negative pressure box is driven by an external negative pressure fan to generate suction through the negative pressure suction nozzle. The synchronous plate rises under the action of the suction force. As the synchronous plate rises, it drives the powder guide cylinder to rise (the powder feeding plate does not move). When the powder guide cylinder rises, the powder guide hole is located in the powder discharge chamber. At this time, the powder guide hole outlet is opened, and the alloy powder leaks out of the powder guide hole and falls through the powder discharge chamber.

[0018] When the alloy powder falls, it is guided in sequence by the powder guide plates distributed above and below to achieve speed reduction and buffering. After the speed reduction, the alloy powder falls into the mold cavity. This solution is used for powder discharge. After the alloy powder is decelerated by the powder guide plates, it will no longer splash when entering the mold cavity, and will not impact the coil, resulting in a good powder injection effect.

[0019] The embodiments described above are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, any changes made based on the shape and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip inductor alloy powder pouring buffer device, comprising a powder feeding plate (1) mounted on a conveying arm, characterized in that: A powder control tube (2) is vertically fixed on the powder feeding plate (1), and a powder control box (3) is connected to the top of the powder control tube (2). A powder guide cylinder (4) is movably mounted below the powder feeding plate (1), and the powder guide cylinder (4) is connected to the synchronous plate (8). The synchronous plate (8) and the powder feeding plate (1) are connected via a limiting guide column (12). A negative pressure box (5) is installed on the powder feeding plate (1), and a negative pressure pipe (6) is connected to the negative pressure box (5). A negative pressure nozzle (7) is installed at the bottom of the powder feeding plate (1), and the negative pressure nozzle (7) is connected to the negative pressure pipe (6).

2. The chip inductor alloy powder pouring buffer device according to claim 1, characterized in that: The powder guide cylinder (4) is in the shape of a vertically mounted cylinder. A limit ring (9) is engaged at the top of the powder guide cylinder (4). An external thread is provided on the outer peripheral surface of the limit ring (9). The external thread is engaged and connected with the synchronous plate (8). The inner cavity wall of the top of the powder guide cylinder (4) expands to form a stepped powder outlet cavity (10). The bottom of the powder outlet cavity (10) gradually contracts to form a funnel shape with a larger upper portion and a smaller lower portion. A powder guide plate (11) is provided on the lower cavity wall of the inner cavity of the powder guide cylinder (4).

3. The chip inductor alloy powder pouring buffer device according to claim 1, characterized in that: The number of the powder guide cylinders (4) is greater than 2, and adjacent powder guide cylinders (4) are connected via a synchronization plate (8), and the negative pressure suction nozzle (7) is located above the synchronization plate (8).

4. The chip inductor alloy powder pouring buffer device according to claim 1, characterized in that: The lower portion of the powder control conduit (2) is movably sleeved in the powder guide cylinder (4), the bottom of the powder control conduit (2) is sealed by a sealing plate, and a powder guide hole (13) penetrating inside and outside is provided on the upper side wall of the powder control conduit (2).

5. The chip inductor alloy powder pouring buffer device according to claim 2, characterized in that: The powder guide plate (11) is spirally distributed from top to bottom in the lower part of the inner cavity of the powder guide cylinder (4).

6. The chip inductor alloy powder pouring buffer device according to claim 2, characterized in that: The powder guide plates (11) are multiple pieces, which are fixed on both sides of the lower part of the inner cavity of the powder guide cylinder (4) from top to bottom. The powder guide plates (11) on both sides are staggered and distributed up and down. One end of the powder guide plate (11) is connected to the inner cavity of the powder guide cylinder (4), and the other end is suspended. The suspended end of the upper powder guide plate (11) is located above the supporting surface of the lower powder guide plate (11).

Images