Fluid circulation system and semiconductor device

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides a fluid circulation system and a semiconductor device, the fluid circulation system comprises a storage unit, a working unit, a first temperature control unit and a first temperature detection unit; an outlet of the storage unit is connected with an inlet of the working unit through a conveying pipe, the first temperature detection unit is arranged at the inlet of the working unit, and the first temperature control unit is arranged on the conveying pipe and located at the position close to the inlet of the working unit. Through the configuration, the fluid circulation system is favorable for finely adjusting the temperature of the conveying medium at the inlet position of the working unit so as to improve the influence of an overlong conveying path on the temperature of the conveying medium, and is favorable for improving the temperature stability of the conveying medium conveyed into the working unit so as to improve the consistency of the quality of a manufacturing process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a fluid circulation system and semiconductor equipment. Background Art

[0002] Fluid media are commonly used in semiconductor manufacturing processes. For example, gaseous media are often required for semiconductor thermal oxidation growth and film deposition; liquid media such as etching solutions are required for etching processes; and fluid media such as organic solvents are required for wafer cleaning processes. When these fluid media are delivered to the process chamber, the temperature of the fluid must be controlled to maintain a stable environment throughout the manufacturing process, thereby ensuring consistent quality.

[0003] Taking the etching process as an example, etching refers to the process of removing material from the wafer, that is, removing material from the wafer substrate itself or from any thin films or material layers on the wafer. Currently, there are two main types of etching methods: dry etching and wet etching.

[0004] Wet etching generally uses a liquid medium to immerse the wafer. The material on the wafer not covered by the mask will be "etched away" by the liquid medium, while the material covered by the mask remains almost intact.

[0005] During the wet etching process, the medium needs to be continuously transported to the process chamber (etching chamber) through a fluid circulation system. The temperature of the medium in the process chamber directly affects the etching effect. The existing medium temperature control method is generally through a temperature sensor and a heater at the outlet of the chemical storage tank. The temperature feedback of the temperature sensor controls the heating power of the heater to ensure that the temperature of the medium at the outlet of the chemical storage tank is constant. However, the transportation path between the outlet of the chemical storage tank and the process chamber is long, and heat energy loss is likely to occur during the medium transportation process, resulting in poor temperature stability of the medium actually transported to the process chamber. This results in differences in etching rates between machines and poor consistency in etching effects.

[0006] To this end, the present invention provides a fluid circulation system and semiconductor equipment. The system is used to transport fluid media, which helps to improve the temperature stability of the media transported to the process chamber, thereby improving the consistency of the quality of the manufacturing process. Utility Model Content

[0007] The purpose of the utility model is to provide a fluid circulation system and semiconductor equipment, which are used for conveying fluid medium and help to improve the temperature stability of the medium conveyed to the process chamber, so as to improve the consistency of the quality of the manufacturing process.

[0008] The utility model provides a fluid circulation system, comprising: a storage unit, a working unit, a first temperature control unit and a first temperature detection unit;

[0009] The outlet of the storage unit is connected to the inlet of the working unit through a conveying pipe, the first temperature detection unit is arranged at the inlet of the working unit, and the first temperature control unit is arranged in the conveying pipe and is located near the inlet of the working unit.

[0010] Optionally, the first temperature control unit includes a vortex tube, a temperature control unit and a switching component, the cold air outlet and the hot air outlet of the vortex tube are connected to the temperature control unit, the temperature control unit is in contact with the outer wall of the delivery pipe, and the switching component is arranged on the temperature control unit and / or the vortex tube to control the on and off of the cold air outlet and the hot air outlet and the temperature control unit.

[0011] Optionally, the temperature control unit is a spiral tube, the spiral tube is wound around the delivery tube, and two ends of the spiral tube are respectively connected to the cold air outlet and the hot air outlet.

[0012] Optionally, the switching component includes a first valve and a second valve, the first valve is arranged at the cold air outlet, and the second valve is arranged at the hot air outlet.

[0013] Optionally, the first temperature control unit further includes an exhaust pipe, and the exhaust pipe is connected to the cold air outlet and the hot air outlet through the first valve and the second valve.

[0014] Optionally, the fluid circulation system further includes a second temperature control unit and a second temperature detection unit arranged in the delivery pipe, the second temperature control unit being arranged in the delivery pipe and located near the outlet of the storage unit, and the second temperature control unit being located between the second temperature detection unit and the outlet of the storage unit.

[0015] Optionally, the fluid circulation system further includes a third temperature detection unit, and the third temperature detection unit is arranged at the outlet of the storage unit.

[0016] Optionally, the fluid circulation system further includes a filter, which is disposed on the delivery pipe, and the first temperature control unit and the first temperature detection unit are located between the filter and the inlet of the working unit.

[0017] Optionally, the fluid circulation system further comprises a return pipe connected between the outlet of the working unit and the return port of the storage unit;

[0018] And or; the fluid circulation system further comprises a first circulation pipe, the first circulation pipe being connected between the reflux port of the storage unit and the delivery pipe, the position where the first circulation pipe is connected to the delivery pipe being located between the filter and the inlet of the working unit;

[0019] And or; the fluid circulation system also includes a second circulation pipe, which is connected between the reflux port of the storage unit and the delivery pipe, and the position where the second circulation pipe is connected to the delivery pipe is located between the filter and the inlet of the storage unit.

[0020] The utility model also provides a semiconductor device, which includes the fluid circulation system described above.

[0021] To summarize, the fluid circulation system includes: a storage unit, a working unit, a first temperature control unit, and a first temperature detection unit; the outlet of the storage unit is connected to the inlet of the working unit through a delivery pipe, the first temperature detection unit is arranged at the inlet of the working unit, and the first temperature control unit is arranged in the delivery pipe and is located near the inlet of the working unit.

[0022] In this configuration, the fluid circulation system is provided with a first temperature control unit and a first temperature detection unit at the inlet of the working unit. When the temperature detected by the first temperature detection unit is higher than the first target temperature, the temperature of the conveying medium in the conveying pipe can be lowered by the first temperature control unit. When the temperature detected by the first temperature detection unit is lower than the first target temperature, the temperature of the conveying medium in the conveying pipe can be raised by the first temperature control unit. This control method helps to fine-tune the temperature of the conveying medium at the inlet of the working unit, thereby improving the impact of an excessively long conveying path on the temperature of the conveying medium, and helps to improve the temperature stability of the conveying medium delivered to the working unit, thereby improving the consistency of the quality of the manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A system diagram of a fluid circulation system according to an embodiment of the present invention;

[0024] Figure 2 This is a structural diagram of a first temperature control unit according to an embodiment of the present invention;

[0025] Figure 3 The working principle of the vortex tube according to one embodiment of the present invention is as follows: Figure 1 ;

[0026] Figure 4 The working principle of the vortex tube according to one embodiment of the present invention is as follows: Figure 2 ;

[0027] Figure 5 This is a schematic diagram of airflow during cooling in a vortex tube according to an embodiment of the present invention;

[0028] Figure 6 FIG. 1 is a schematic diagram of airflow during heating of a vortex tube according to an embodiment of the present invention.

[0029] In the attached figure:

[0030] 10- storage unit;

[0031] 20-working unit;

[0032] 30 - first temperature control unit; 31 - vortex tube; 311 - cold air outlet; 312 - hot air outlet; 32 - temperature control unit; 33 - switching assembly; 331 - first valve; 332 - second valve; 34 - exhaust pipe; 341 - first exhaust pipe; 342 - second exhaust pipe; 35 - air compressor;

[0033] 40-first temperature detection unit;

[0034] 51-delivery pipe; 52-return pipe; 53-first circulation pipe; 54-second circulation pipe; 55-third valve; 56-fourth valve;

[0035] 60-second temperature control unit;

[0036] 70- second temperature detection unit;

[0037] 80-third temperature detection unit;

[0038] 90-circulation pump;

[0039] 100-filter;

[0040] 110-Controller. DETAILED DESCRIPTION

[0041] The fluid circulation system and semiconductor device proposed in the present invention are further described in detail below, with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are highly simplified and not to exact scale, and are intended solely to facilitate and clearly illustrate the embodiments of the present invention.

[0042] As used in the present invention, the singular forms "a", "an", and "the" include plural objects, the term "or" is generally used to include the meaning of "and / or", the term "several" is generally used to include the meaning of "at least one", and the terms "at least two" or "a plurality" are generally used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features. In addition, as used in the present invention, "installed", "connected", "connected", and one element is "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0043] In this embodiment, the fluid circulation system is described by taking the etching process as an example.

[0044] Please refer to Figure 1 As shown, the fluid circulation system includes: a storage unit 10 , a working unit 20 , a first temperature control unit 30 and a first temperature detection unit 40 .

[0045] The storage unit 10 serves as a container for storing the transport medium. The storage unit 10 may be, for example, a box-type structure, a tank-type structure, or a trough-type structure. The transport medium here refers to a chemical solvent used for etching, which is mainly used to remove impurities or unnecessary layers on the surface of the semiconductor. There are many types of transport media used for etching, the most common of which include nitric acid, hydrofluoric acid, dilute hydrochloric acid, etc. Different transport media are suitable for etching different materials. For example, nitric acid can be used to etch aluminum metal, and hydrofluoric acid can be used to etch silicon dioxide. The transport medium can be adaptively selected based on the material of the substrate to be etched.

[0046] Of course, the delivery medium varies depending on the equipment used. For example, when the fluid circulation system is used in a thermal oxidation growth or film deposition machine, the delivery medium may be the gas required for thermal oxidation growth or film deposition. When the fluid circulation system is used in a cleaning machine, the delivery medium may be an organic solvent required for cleaning.

[0047] The working unit 20 is a component for conveying medium, and corresponding to an etching machine, the working unit 20 is a component for semiconductor etching. The working unit 20 has a process chamber, and the conveying medium is conveyed into the process chamber to etch the semiconductor device placed in the process chamber.

[0048] like Figure 1 As shown, the outlet of the storage unit 10 is connected to the inlet of the working unit 20 via a delivery pipe 51 . The return port of the storage unit 10 is connected to the outlet of the working unit 20 via a return pipe 52 .

[0049] Typically, the storage unit 10 is located far from the working unit 20, so the transport distance between the outlet of the storage unit 10 and the inlet of the working unit 20 is long. During the transport process, the transport medium is prone to heat loss, resulting in poor temperature stability of the transport medium actually transported to the process chamber. This causes the temperature of the transport medium transported to the process chamber to be different between different machines, resulting in different etching rates between machines and poor consistency in etching effects. At the same time, the temperature of the transport medium transported to the process chamber of the same machine in different external environments is different, resulting in different etching rates of the same machine at different times and poor consistency in etching effects.

[0050] On this basis, in this embodiment, the first temperature detection unit 40 is disposed at the entrance of the working unit 20, and the first temperature control unit 30 is disposed in the delivery pipe 51 near the entrance of the working unit 20. When the first temperature control unit 30 is located in the middle of the delivery pipe 51, closer to the entrance of the working unit 20, it is considered that the first temperature control unit 30 is located in the delivery pipe 51 near the entrance of the working unit 20. In this embodiment, the first temperature control unit 30 is preferably less than 1 meter from the entrance of the working unit 20.

[0051] like Figure 1 As shown, the conveying medium flows from the storage unit 10 to the inside of the working unit 20 along the direction indicated by the arrow. The conveying medium first passes through the first temperature control unit 30 along its flow direction, and then passes through the first temperature detection unit 40 located at the entrance of the working unit 20.

[0052] The first temperature detection unit 40 can employ an existing temperature sensor. A temperature sensor is a sensor that senses the temperature of the conveying medium and converts it into a usable output signal. Temperature sensors can be categorized into contact and non-contact temperature sensors based on their measurement method, and into thermal resistor temperature sensors and thermocouple temperature sensors based on the sensor material and electronic component characteristics.

[0053] The contact temperature sensor is in direct contact with the conveying medium being measured. For example, a pressure temperature sensor, a resistance temperature sensor, a thermistor temperature sensor or a thermocouple temperature sensor can be used.

[0054] The non-contact sensor may not be in direct contact with the conveying medium being measured, for example, an infrared temperature sensor may be used.

[0055] The first temperature detection unit 40 can be selected based on usage requirements, for example, an existing temperature sensor can be selected based on its adaptability to usage requirements such as accuracy and corrosion resistance. The first temperature detection unit 40 uses an existing temperature sensor, and the structure and usage of the existing temperature sensor are both prior art and will not be further described here.

[0056] The first temperature control unit 30 is used to control the temperature of the conveying medium in the conveying pipe 51 near the inlet of the working unit 20 .

[0057] Please refer to Figure 2 As shown, in this embodiment, the first temperature control unit 30 includes a vortex tube 31, a temperature control unit 32 and a switching component 33. The cold air outlet 311 and the hot air outlet 312 of the vortex tube 31 are both connected to the temperature control unit 32. The temperature control unit 32 is in contact with the outer wall of the delivery pipe 51. The switching component 33 is arranged on the temperature control unit 32 and / or the vortex tube 31 to control the on / off between the cold air outlet 311 and the hot air outlet 312 and the temperature control unit 32.

[0058] The vortex tube 31 is typically composed of a nozzle, a vortex chamber, a separation orifice, a pipe, and a control valve. The vortex tube can generate a vortex in the high-speed airflow to separate the cold and hot airflows, with the cold airflow flowing out through the cold air outlet 311 and the hot airflow flowing out through the hot air outlet 312.

[0059] Please combine Figure 2 and Figure 3 As shown, the working principle of the vortex tube 31 is as follows: the gas compressed by the air compressor 35 and cooled to room temperature enters the nozzle, the gas expands and accelerates to the speed of sound in the nozzle, so that the gas is injected into the vortex chamber from the tangential direction, forming a free vortex. Figure 4 As shown in the figure, the angular velocity of the free vortex is greater as it approaches the center. Due to the different angular velocities, friction is generated between the layers of the free vortex. Figure 4The blue gas in the middle has the largest angular velocity. As a result of friction, the energy is transferred to the airflow in the outer layer with lower angular velocity. The airflow in the center loses energy, has low kinetic energy, reduces speed, and reduces temperature. It is drawn out from one end through the orifice plate in the center of the vortex tube to obtain the cold airflow required for refrigeration. The cold airflow flows out through the cold air outlet 311. The airflow in the outer layer (see Figure 4 The orange gas in the middle gains momentum and increases its kinetic energy. At the same time, it rubs against the turbine tube wall, converting part of the kinetic energy into heat energy, which is then led out from the other end of the vortex tube through the control valve to form a hot air flow. Figure 3 As shown, the cold air flow is led out from the cold air outlet 311 of the vortex tube 31 ( Figure 3 The hot air flow is led out from the hot air outlet 312 of the vortex tube 31 ( Figure 3 The vortex tube 31 can adjust the flow rate and temperature of the hot and cold air flows by controlling the valve. The specific structure and working principle of the vortex tube 31 are prior art and will not be described in detail here.

[0060] Please continue to refer to Figure 2 As shown, the temperature control unit 32 is a spiral tube, and the spiral tube is wound around the delivery tube 51. Figure 2 In the embodiment, the left end of the spiral tube is connected to the cold air outlet 311, and the right end of the spiral tube is connected to the hot air outlet 312. The switching assembly 33 includes a first valve 331 and a second valve 332. The first valve 331 is disposed at the connection between the cold air outlet 311 and the temperature control unit 32, and is used to control the connection between the cold air outlet 311 and the spiral tube. The second valve 332 is disposed at the connection between the hot air outlet 312 and the temperature control unit 32, and is used to control the connection between the hot air outlet 312 and the spiral tube.

[0061] The first valve 331 and the second valve 332 can be ball valves, gate valves, butterfly valves, needle valves, diaphragm valves, etc., and can be selected based on the adaptability of use requirements.

[0062] In addition, the first temperature control unit 30 further includes an exhaust pipe 34 , and the exhaust pipe 34 is connected to the cold air outlet 311 and the hot air outlet 312 through the first valve 331 and the second valve 332 .

[0063] Please continue to refer to Figure 2 As shown, in this embodiment, the exhaust pipe 34 includes a first exhaust pipe 341 and a second exhaust pipe 342. The first exhaust pipe 341 is connected to the cold air outlet 311 through a first valve 331. The first valve 331 is a three-way valve. The first valve 331 can switch the cold air outlet 311 to communicate with the first exhaust pipe 341, switch the cold air outlet 311 to communicate with the left end of the spiral tube, or switch the first exhaust pipe 341 to communicate with the left end of the spiral tube.

[0064] The second exhaust pipe 342 is connected to the hot gas outlet 312 through the second valve 332. The second valve 332 is a three-way valve. The second valve 332 can switch the hot gas outlet 312 to be connected to the second exhaust pipe 342 or switch the hot gas outlet 312 to be connected to the right end of the spiral tube or the second exhaust pipe 342 to be connected to the right end of the spiral tube.

[0065] Please refer to Figure 5 As shown, when the temperature detected by the first temperature detection unit 40 is higher than the first target temperature, the temperature of the conveying medium in the conveying pipe 51 needs to be lowered by the first temperature control unit 30. At this time, the first exhaust pipe 341 is closed by the first valve 331, so that the cold air outlet 311 is connected to the left end of the spiral tube, and the hot air outlet 312 is connected to the second exhaust pipe 342 by the second valve 332, and the right end of the spiral tube is connected to the second exhaust pipe 342. At this time, the cold air flow in the vortex tube 31 ( Figure 5 The blue airflow) flows through the cold air outlet 311 and the spiral tube to the second exhaust pipe 342, and the hot air flow in the vortex tube 31 ( Figure 5 The medium orange airflow flows through the hot air outlet 312 into the second exhaust pipe 342 and merges with the cold airflow. The mixed gas is discharged through the second exhaust pipe 342. At this time, the cold airflow passes through the spiral tube to cool the conveying medium in the conveying pipe 51.

[0066] Please refer to Figure 6 As shown, when the temperature detected by the first temperature detection unit 40 is lower than the first target temperature, the temperature of the conveying medium in the conveying pipe 51 needs to be increased by the first temperature control unit 30. At this time, the cold air outlet 311 is connected to the first exhaust pipe 341 through the first valve 331, and the cold air outlet 311 is connected to the left end of the spiral tube; and the second exhaust pipe 342 is closed by the second valve 332, and the hot air outlet 312 is connected to the right end of the spiral tube. At this time, the hot air flow in the vortex tube 31 ( Figure 6 The orange airflow) flows through the hot air outlet 312 and the spiral tube into the first exhaust pipe 341, and the cold airflow ( Figure 6 The medium blue airflow flows through the cold air outlet 311 into the first exhaust pipe 341 and merges with the hot airflow. The mixed gas is discharged through the first exhaust pipe 341. At this time, the hot airflow passes through the spiral tube to heat the conveying medium in the conveying pipe 51.

[0067] The opening and closing of the first valve 331 and the second valve 332 may be manually controlled based on the temperature feedback detected by the first temperature detection unit 40 .

[0068] In this embodiment, in order to further realize the automatic control of temperature control, a controller 110 is provided. Figure 2As shown, the controller 110 is in communication with the first temperature detection unit 40, which is in communication with the air compressor 35. The first valve 331 and the second valve 332 can be solenoid valves. In this case, the controller 110 can be in communication with the first valve 331 and the second valve 332. The first temperature detection unit 40 transmits the detected first real-time temperature signal to the controller 110. The controller 110 controls the operation of the first valve 331 and the second valve 332 by comparing the first real-time temperature with the first target temperature to switch different paths. In addition, the controller 110 can also control the air supply of the air compressor 35 by comparing the first real-time temperature with the first target temperature to achieve temperature control of the cold and hot air flows.

[0069] In this embodiment, the controller 110 generally includes at least one processor, which may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0070] The at least one processor can communicate with a plurality of peripheral devices via the bus subsystem, such peripheral devices including an air compressor 35 , a first valve 331 , a second valve 332 , a storage system, a user interface input device, a user interface output device, and a network interface.

[0071] The network interface provides an interface to an external network and / or other devices. The network interface includes one or more interfaces known in the art, such as LAN, WLAN, Bluetooth, other wired and wireless interfaces, etc.

[0072] User interface input devices may include keyboards, pointing devices such as mice, trackballs, touchpads or graphics tablets, scanners, foot pedals, joysticks, touch screens embedded in displays, audio input devices such as voice recognition systems, microphones, and other types of input devices. Generally speaking, the term "input device" is intended to include a variety of conventional and proprietary devices and methods for inputting information into a controller. User interface input devices may be used to input information such as a first target temperature.

[0073] The user interface output device may include a display subsystem, a printer, a fax machine, or a non-visual display such as an audio output device. The display subsystem may be a flat panel device such as a liquid crystal display (LCD), a light emitting diode (LED) display, a touch screen display, etc. The display subsystem may also provide a non-visual display, such as via an audio output device. Generally speaking, the term "output device" is intended to include various conventional and proprietary devices and methods for outputting information from the controller 110 to the user.

[0074] The storage system can store the basic programming and data structures that implement the various functions of the present invention. For example, as described herein, the databases and modules that implement the functions of the present invention method can be stored in the storage system. These software modules are typically executed by a processor. In a distributed environment, the software modules can be stored on multiple computer systems and executed by the processors of the multiple computer systems. The storage system typically includes a memory subsystem and a file storage system. The memory subsystem typically includes multiple memories, including a main random access memory (RAM) for storing instructions and data during program execution and a read-only memory (ROM) in which fixed instructions are stored. The file storage subsystem provides permanent non-volatile storage for program and data files. The file storage system 60 may include a hard drive and associated removable media, a compact disc (CD) drive, an optical drive, a DVD, a solid-state memory, and / or other removable media. One or more of these drives may be located at a remote location on other connected computers at other locations connected to the controller 110. The modules that implement the functions of the present invention can be stored by the file storage system.

[0075] The bus subsystem provides a means for the various components and subsystems of the controller 110 to communicate with each other as intended. The various subsystems and components of the controller 110 do not need to be in the same physical location, but can be distributed at various locations within a distributed network. The bus subsystem can be a single bus or multiple buses can be provided based on the needs.

[0076] The controller 110 described above is intended to be used as an example only to illustrate only one embodiment of the present invention. Due to the ever-changing nature of computers and networks, in other alternative embodiments, the controller 110 may also have certain differences from the configuration of the controller described above, which will not be repeated here.

[0077] In other alternative embodiments, the first temperature control unit 30 may be an electric heater, which is installed on the conveying pipe 51 and is used to heat or keep the conveying medium warm. When the conveying medium passes through the heating chamber of the electric heater under pressure, the heat generated by the electric heater is evenly taken away, so that the temperature of the conveyed medium increases. For example, a resistive heater can be used, which uses the Joule effect of electric current to convert electrical energy into thermal energy to heat an object. Resistive heaters are generally divided into direct resistance heating and indirect resistance heating. The electric heater can also be an induction heater, which uses the thermal effect formed by the induced current (eddy current) generated by the conductor in an alternating electromagnetic field to make the conductor itself heat up. In addition, the electric heater can also use existing heating devices such as arc heaters and electron beam heaters. The structure, installation and use of the electric heater are all existing technologies and will not be described in detail here.

[0078] In other alternative embodiments, the first temperature control unit 30 may utilize a medium heat exchange method to achieve temperature control of the conveying medium. For example, a heat exchanger may be disposed on the periphery of the conveying pipe 51, and a refrigerant or heating medium may be introduced into the heat exchanger to achieve temperature control of the conveying medium, such as increasing, maintaining, or decreasing the temperature. The first temperature control unit 30 may also utilize other existing devices capable of achieving temperature control of the conveying medium, which will not be further detailed here.

[0079] In this embodiment, the temperature control unit 32 utilizes a spiral tube structure. In alternative embodiments, the temperature control unit 32 may utilize a sleeve-type structure, a plate-type structure, or the like. The specific structure of the temperature control unit 32 can be adjusted based on actual usage requirements, as long as the temperature control unit 32 can fit snugly with the delivery pipe 51 to achieve heat exchange.

[0080] In the present embodiment, the two valves of the switching assembly are installed at the two ends of the vortex tube. In other alternative embodiments, the two valves of the switching assembly can also be installed at the two ends of the temperature control unit.

[0081] In this embodiment, the switching component 33 is implemented by two valves. In other alternative embodiments, the switching component 33 can be implemented by a multi-way hydraulic valve or a multi-way electromagnetic valve to switch the passages.

[0082] Please continue to refer to Figure 1 As shown, in this embodiment, the fluid circulation system further includes a third temperature detection unit 80, a circulation pump 90, a second temperature control unit 60, a second temperature detection unit 70, a filter 100, and a third valve 55 and a fourth valve 56. All of the above components are arranged on the delivery pipe 51.

[0083] The circulation pump 90 can be a centrifugal pump, a rotor pump, etc. The circulation pump 90 can be selected based on requirements such as corrosion resistance and delivery temperature. The structure and use of the circulation pump 90 are both prior art and will not be described in detail here.

[0084] Filter 100 can be an existing mesh filter, wire gap filter, sintered filter, magnetic filter, etc. It can be selected based on the adaptability of the use requirements. The structure and use of filter 100 are both existing technologies and will not be described in detail here.

[0085] The third valve 55 and the fourth valve 56 are both three-way valves, which can be selected based on actual use requirements, such as ball valves, butterfly valves, etc.

[0086] like Figure 1 As shown, from the outlet of the storage unit 10 to the inlet of the working unit 20, the third temperature detection unit 80, the circulation pump 90, the second temperature control unit 60, the second temperature detection unit 70, the third valve 55, the filter 100 and the fourth valve 56 are connected in sequence.

[0087] In the above-mentioned circulation device, the conveying medium in the storage unit 10 flows from the outlet of the storage unit 10 to the inlet of the working unit 20, and passes through the third temperature detection unit 80, the circulation pump 90, the second temperature control unit 60, the second temperature detection unit 70, the third valve 55, the filter 100, the fourth valve 56, the first temperature control unit 30 and the first temperature detection unit 40 in sequence.

[0088] The return pipe 52 is directly connected between the outlet of the working unit 20 and the return port of the storage unit 10. The first circulation pipe 53 is connected between the return pipe 52 and the fourth valve 56. The second circulation pipe 54 is connected between the return pipe 52 and the third valve 55. This structure allows the conveying medium in the working unit 20 to return to the storage unit 10 through the return pipe 52. Furthermore, through the control of the third valve 55 and the fourth valve 56, the conveying medium in the storage unit 10 can be returned to the storage unit 10 through the third valve 55, the filter 100, the fourth valve 56, and the first circulation pipe 53, forming a self-circulation. Alternatively, the conveying medium in the storage unit 10 can be returned to the storage unit 10 through the third valve 55 and the second circulation pipe 54, forming a self-circulation.

[0089] The above-mentioned circulation structure is set up so that the entire fluid circulation system has multiple working modes;

[0090] In the first mode, the first circulation pipe 53 and the second circulation pipe 54 are closed by the third valve 55 and the fourth valve 56 , and the conveying medium in the storage unit 10 is pressurized by the circulation pump 90 and conveyed to the process chamber of the working unit 20 .

[0091] In the second operating mode, the third valve 55 controls the opening of the second circulation pipe 54, the closing of the delivery pipe 51, and the closing of the first circulation pipe 53 via the fourth valve 56. In this mode, the transport medium within the storage unit 10 is pressurized by the circulation pump 90 and transported through the delivery pipe 51. It then flows back into the storage unit 10 through the third valve 55 and the second circulation pipe 54. In this mode, the transport medium is not input into the process chamber of the working unit 20. This circulation structure ensures the self-circulating flow of the transport medium within the storage unit 10, thereby reducing the occurrence of localized crystallization within the storage unit 10 and within the circulation path.

[0092] The third working mode is to control the closure of the second circulation pipe 54 through the third valve 55, and to control the opening of the first circulation pipe 53 through the fourth valve 56, and the delivery pipe 51 is closed. At this time, the conveying medium in the storage unit 10 is conveyed by the delivery pipe 51 through the pressurization of the circulation pump 90, and flows back to the interior of the storage unit 10 through the three valves 55, the filter 100, the fourth valve 56, and the first circulation pipe 53. At this time, the conveying medium will not be input into the process chamber of the working unit 20. This circulation structure is to ensure the self-circulation flow of the conveying medium inside the storage unit 10, so as to improve the phenomenon of local crystallization inside the storage unit 10 and in the circulation path. The circulation path of the second working mode is different from the circulation path of the third working mode. The circulation path of the third working mode passes through the filter 100 and the fourth valve 56.

[0093] In the fourth operating mode, the second circulation pipe 54 is opened via the third valve 55, the first circulation pipe 53 is opened via the fourth valve 56, and the delivery pipe 51 is closed. In this mode, the conveying medium within the storage unit 10 is pressurized by the circulation pump 90 and delivered through the delivery pipe 51. It then flows back into the storage unit 10 through the three valves 55, the filter 100, the fourth valve 56, and the first circulation pipe 53. Furthermore, the conveying medium also flows back into the storage unit 10 through the three valves 55 and the second circulation pipe 54.

[0094] By setting the above circulation structure, the fluid circulation system can switch the flow path of the conveying medium through flexible and changeable control methods to meet the needs of various usage scenarios.

[0095] In this embodiment, the provision of the reflux pipe 52 allows the transport medium to be recycled. For example, when the transport medium is an organic solvent, it will not undergo a chemical reaction inside the working unit 20. Generally, it only needs to control the particle size of the organic solvent for reuse. In this case, the transport medium can be used normally after filtering through the filter 100. When the transport medium undergoes a chemical reaction inside the working unit 20, resulting in a change in the concentration or composition of the transport medium, it is necessary to connect an external fluid replenishment mechanism to the storage unit 10, for example, to replenish the transport medium or replenish water. By re-allocation, the transport medium in the storage unit 10 can meet the use requirements, and combined with the filtration of the filter 100, the particulate matter in the transport medium can be removed to meet the use requirements.

[0096] In other alternative embodiments, the positions of the third valve 55 and the fourth valve 56 can be adjusted to adjust the connection positions of the first circulation pipe 53 and the second circulation pipe 54 with the delivery pipe 51, thereby adjusting the self-circulation path of the delivery medium. It is sufficient to ensure that the connection position of the first circulation pipe 53 and the delivery pipe 51 is between the filter 100 and the inlet of the working unit 20, and that the connection position of the second circulation pipe 54 and the delivery pipe 51 is between the filter 100 and the inlet of the storage unit 10.

[0097] In other alternative embodiments, only one or two of the reflux pipe 52, the first circulation pipe 53, and the second circulation pipe 54 may be retained. They can be adaptively adjusted based on actual usage requirements. For example, only the reflux pipe 52 may be retained, which can correspond to the transportation of the conveying medium that does not produce crystallization. For another example, only the first circulation pipe 53 may be retained, and the circulation flow of the conveying medium in the storage unit 10 may be realized through the first circulation pipe 53. At this time, the conveying medium inside the working unit 20 will not be recycled into the storage unit 10, and the external discharge pipe of the working unit 20 will directly discharge the conveying medium. The reflux pipe 52, the first circulation pipe 53, and the second circulation pipe 54 can be selected based on actual usage requirements, and will not be described in detail here.

[0098] In this embodiment, the second temperature control unit 60 is disposed in the delivery pipe 51 near the outlet of the storage unit 10. The second temperature control unit 60 is located between the second temperature detection unit 70 and the outlet of the storage unit 10. The third temperature detection unit 80 is disposed at the outlet of the storage unit 10. The second temperature control unit 60 is preferably an electric heater, and the second and third temperature detection units 70 and 80 can employ sensors similar to the first temperature detection unit 40. Both can be selected based on existing equipment. Their structures, installation methods, and usage are all prior art and will not be further described here.

[0099] With the above structure, the third temperature detection unit 80 can detect the second real-time temperature of the conveying medium at the outlet of the storage unit 10 and compare this real-time temperature with the second target temperature to control the heating power of the second temperature control unit 60, thereby bringing the temperature of the conveying medium closer to the second target temperature. At the same time, the second temperature detection unit 70 detects the third real-time temperature of the conveying medium after being heated by the second temperature control unit 60, and the difference between the third real-time temperature and the second target temperature is used to determine whether the temperature of the conveying medium meets the requirements.

[0100] Alternatively, in the above structure, the heating power of the second temperature control unit 60 can be controlled by detecting the second temperature detection unit 70 , and feedback from the second temperature detection unit 70 can be used to determine whether the temperature of the conveying medium meets the requirements.

[0101] Preferably, the second target temperature is slightly higher than the first target temperature (so that the temperature of the conveying medium controlled by the second temperature control unit 60 is slightly higher than the temperature of the conveying medium controlled by the first temperature control unit 30). After the conveying medium is regulated to the second target temperature by the second temperature control unit 60, it is transported to the entrance of the working unit 20 over a long distance. Through natural heat energy loss, the temperature of the conveying medium delivered to the first temperature control unit 30 is naturally reduced to close to the first target temperature, thereby simplifying the temperature control process of the first temperature control unit 30.

[0102] In this embodiment, the temperature of the conveying medium can be controlled more flexibly and accurately by the mutual verification of the third temperature detection unit 80 and the second temperature detection unit 70. In other embodiments, the temperature of the conveying medium can be controlled only by the cooperation of the second temperature control unit 60 and the second temperature detection unit 70.

[0103] This embodiment further provides a semiconductor device comprising the aforementioned fluid circulation system. The semiconductor device in this embodiment may be an etching device. The etching device differs from conventional etching devices in the aforementioned fluid circulation system; the remaining components remain the same as conventional etching devices. Further details will not be given here.

[0104] In other alternative embodiments, the semiconductor equipment may be a high-temperature furnace equipment related to thermal oxidation growth, a low-pressure chemical vapor deposition equipment (LPCVD) related to film deposition, or a cleaning equipment for wafer cleaning, etc.

[0105] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0106] The above description is only a description of the preferred embodiment of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A fluid circulation system, characterized in that: include: A storage unit, a working unit, a first temperature control unit, and a first temperature detection unit; The outlet of the storage unit is connected to the inlet of the working unit through a conveying pipe, the first temperature detection unit is arranged at the inlet of the working unit, and the first temperature control unit is arranged in the conveying pipe and is located near the inlet of the working unit.

2. The fluid circulation system according to claim 1, wherein: The first temperature control unit includes a vortex tube, a temperature control unit and a switching component. The cold air outlet and the hot air outlet of the vortex tube are both connected to the temperature control unit. The temperature control unit is in contact with the outer wall of the delivery pipe. The switching component is arranged on the temperature control unit and / or the vortex tube to control the connection and disconnection of the cold air outlet and the hot air outlet with the temperature control unit.

3. The fluid circulation system according to claim 2, wherein: The temperature control unit is a spiral tube, which is wound around the delivery tube. Both ends of the spiral tube are connected to the cold air outlet and the hot air outlet respectively.

4. The fluid circulation system according to claim 2, wherein: The switching assembly includes a first valve and a second valve, wherein the first valve is arranged at the cold air outlet, and the second valve is arranged at the hot air outlet.

5. The fluid circulation system according to claim 4, wherein: The first temperature control unit further includes an exhaust pipe connected to the cold air outlet and the hot air outlet through the first valve and the second valve.

6. The fluid circulation system according to claim 1, wherein: The fluid circulation system also includes a second temperature control unit and a second temperature detection unit arranged in the delivery pipe, the second temperature control unit is arranged in the delivery pipe and is located near the outlet of the storage unit, and the second temperature control unit is located between the second temperature detection unit and the outlet of the storage unit.

7. The fluid circulation system according to claim 6, wherein: The fluid circulation system further includes a third temperature detection unit, which is disposed at an outlet of the storage unit.

8. The fluid circulation system according to claim 1, wherein: The fluid circulation system further includes a filter, which is disposed on the delivery pipe. The first temperature control unit and the first temperature detection unit are located between the filter and the inlet of the working unit.

9. The fluid circulation system according to claim 8, wherein: The fluid circulation system further includes a return pipe connected between the outlet of the working unit and the return port of the storage unit; And or; the fluid circulation system further comprises a first circulation pipe, the first circulation pipe being connected between the reflux port of the storage unit and the delivery pipe, the position where the first circulation pipe is connected to the delivery pipe being located between the filter and the inlet of the working unit; and or; The fluid circulation system further includes a second circulation pipe connected between the reflux port of the storage unit and the delivery pipe. The connection position of the second circulation pipe to the delivery pipe is located between the filter and the inlet of the storage unit.

10. A semiconductor device, characterized in that: The semiconductor device includes the fluid circulation system according to any one of claims 1 to 9.

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