Temperature control device and wafer cleaning equipment

Abstract

The utility model discloses a temperature control device and wafer cleaning equipment, the wafer cleaning equipment comprises a cleaning tank, a connecting pipeline and the temperature control device, the temperature control device is communicated with the cleaning tank through the connecting pipeline, and the connecting pipeline is used for establishing a circulation path for circulation of cleaning media between the temperature control device and the cleaning tank. And real-time heating and temperature control of the cleaning medium are realized through the circulating passage. The temperature control device comprises a shell and a temperature control unit, the temperature control unit is arranged in the shell, the shell is provided with a containing cavity, the containing cavity is used for containing a cleaning medium, and a refrigerating unit and a heating unit are arranged in the containing cavity. And the temperature control unit controls the refrigeration unit or the heating unit to start to refrigerate or heat the cleaning medium according to the received temperature signal. According to the technical scheme of the utility model, the real-time online temperature control of the cleaning liquid in the cleaning tank can be realized, so that the wafer can be better and more effectively cleaned.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer equipment, in particular to a temperature control device and a wafer cleaning device. Background Technique

[0002] In the wafer packaging process, wafer cleaning is an important procedure. In the existing process of realizing wafer cleaning, the temperature of the cleaning liquid cannot be controlled in real time, and thus more effective cleaning of the wafer cannot be achieved. Content of the Utility Model

[0003] One of the purposes of the utility model is to overcome the deficiencies in the prior art and provide a temperature control device and a wafer cleaning device for the problems existing in the prior art.

[0004] To achieve the above purposes, the utility model is realized through the following technical solutions:

[0005] In the first aspect, the utility model provides a temperature control device, which includes a housing and a temperature control unit. The temperature control unit is arranged in the housing. The housing has a cavity for accommodating a cleaning medium. A refrigeration unit and a heating unit are arranged in the cavity. The temperature control unit controls the refrigeration unit or the heating unit to start to refrigerate or heat the cleaning medium according to the received temperature signal.

[0006] In a preferred embodiment of the present application, the refrigeration unit includes a refrigeration controller and a refrigeration pipe. The refrigeration controller is arranged at the first end of the housing. The refrigeration pipe is connected to the refrigeration controller at the first end and extends into the cavity to contact the cleaning medium.

[0007] In a preferred embodiment of the present application, the heating unit includes a heating controller and a heating pipe. The heating controller is arranged at the second end of the housing. The heating pipe is connected to the heating controller at the second end and extends into the cavity to contact the cleaning medium.

[0008] In a preferred embodiment of the present application, a thermometer is arranged on the housing for measuring the temperature of the cleaning medium in the cavity. The temperature control unit selects to start the refrigeration unit for refrigeration or start the heating unit for heating according to the received temperature signal and the temperature measured by the thermometer.

[0009] In a preferred embodiment of the present application, the housing has a first end and a second end. A first liquid level detection unit and a second liquid level detection unit are arranged near the second end in the cavity. A connector is arranged near the first end in the cavity. The distance between the first liquid level detection unit and the second end is less than the distance between the second liquid level detection unit and the second end. The connector is communicatively connected to the first liquid level detection unit and the second liquid level detection unit respectively. When the connector receives the second liquid level signal sent by the second liquid level detection unit, it replenishes the cleaning medium into the cavity until it receives the first liquid level signal sent by the first liquid level detection unit and then stops replenishing the cleaning medium into the cavity.

[0010] In a preferred embodiment of the present application, the housing is placed obliquely, and an exhaust hole is provided at the highest point, and the exhaust hole is communicated with the cavity.

[0011] In a preferred embodiment of the present application, a plurality of reinforcing plates are fixedly arranged in the cavity. The plurality of reinforcing plates are arranged at intervals in a ring in the cavity. One of the refrigeration unit or the heating unit is fixedly connected to the plurality of reinforcing plates, and the other is surrounded by the plurality of reinforcing plates.

[0012] In a preferred embodiment of the present application, the housing is a straight cylindrical temperature control tube.

[0013] In a preferred embodiment of the present application, the cleaning medium is gas, plasma or cleaning liquid.

[0014] In a second aspect, the present utility model provides a wafer cleaning device, including a cleaning tank, a connecting pipeline and the temperature control device provided in the first aspect. The temperature control device is communicated with the cleaning tank through the connecting pipeline. The connecting pipeline is used to establish a circulation path for the cleaning medium to flow between the temperature control device and the cleaning tank, and the cleaning medium is heated and temperature-controlled in real time through the circulation path.

[0015] In a preferred embodiment of the present application, the connecting pipeline has a first loop and a second loop. The cleaning tank has a first inlet and a first outlet. The housing has a second inlet and a second outlet. The first loop connects the first inlet and the second outlet, and is used to transport the cleaning medium from the temperature control device to the cleaning tank. The second loop connects the first outlet and the second inlet, and is used to transport the cleaning medium from the cleaning tank to the temperature control device.

[0016] The temperature control device and the wafer cleaning device disclosed by the present utility model can realize real-time online temperature control of the cleaning liquid in the cleaning tank, so as to clean the wafer better and more effectively. Brief Description of the Drawings

[0017] The present utility model is described with the aid of the following drawings:

[0018] Figure 1 It is a schematic structural diagram of the wafer cleaning equipment in the embodiment of the present utility model;

[0019] Figure 2 It is a schematic connection diagram of each component of the wafer cleaning equipment in the embodiment of the present utility model;

[0020] Figure 3 It is a schematic structural diagram of the temperature control device in the embodiment of the present utility model;

[0021] Figure 4 It is an internal structure diagram of the temperature control device in the embodiment of the present utility model;

[0022] Figure 5 It is a sectional view taken along the line A-A of the temperature control device in the embodiment of the present utility model.

[0023] Reference Signs:

[0024] 1 - cleaning tank; 11 - first inlet; 12 - first outlet; 2 - connecting pipeline; 21 - first loop; 22 - second loop; 3 - temperature control device; 301 - second inlet; 302 - second outlet; 310 - housing; 311 - cavity; 312 - first end; 313 - second end; 314 - exhaust hole; 320 - temperature control unit; 330 - refrigeration unit; 331 - refrigeration controller; 332 - refrigeration pipe; 340 - heating unit; 341 - heating controller; 342 - heating pipe; 343 - pressure relief safety valve; 350 - temperature measuring instrument; 360 - reinforcing plate; 361 - annular connecting plate; 370 - first liquid level detection unit; 380 - second liquid level detection unit; 390 - connector. Detailed Embodiments

[0025] In order to better understand the technical solution of the present application, the embodiments of the present application will be described in detail below with reference to the drawings.

[0026] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0027] Such as Figure 1As shown in the figure, an embodiment of the present utility model provides a wafer cleaning device, which includes a cleaning tank 1, a connecting pipeline 2, and a temperature control device 3. The temperature control device 3 is connected to the cleaning tank 1 through the connecting pipeline 2. The connecting pipeline 2 is used to establish a circulation path for the cleaning medium to flow between the temperature control device 3 and the cleaning tank 1, and the real-time heating and temperature control of the cleaning medium are achieved through the circulation path. Among them, the cleaning tank 1 is a square tank, which is used to clean the wafer with the cleaning medium conveyed through the circulation path. The temperature control device 3 is a cylinder, which is used to control the temperature of the cleaning medium returned through the circulation path according to the received temperature signal. For example, if the temperature signal indicates that the cleaning medium in the cleaning tank 1 needs to be heated up, the temperature control device 3 heats the cleaning medium. If the temperature signal indicates that the cleaning medium in the cleaning tank 1 needs to be cooled down, the temperature control device 3 cools the cleaning medium, so as to ensure that the cleaning medium in the cleaning tank 1 can be maintained at a temperature suitable for cleaning the wafer and with good cleaning efficiency.

[0028] As Figure 2 shown, in the wafer cleaning device of this embodiment, the circulation path is realized through the connection of the connecting pipeline 2 with the cleaning tank 1 and the temperature control device 3. The connecting pipeline 2 is a common pipeline, which has a first loop 21 and a second loop 22. Some components such as valves, switches or pumps can be set on it as needed to control the conveyance of the cleaning medium in the connecting pipeline 2. The cleaning tank 1 has a first inlet 11 and a first outlet 12. The housing 310 of the temperature control device 3 has a second inlet 301 and a second outlet 302. The first loop 21 connects the first inlet 11 and the second outlet 302, and is used to convey the cleaning medium from the temperature control device 3 to the cleaning tank 1. The second loop 22 connects the first outlet 12 and the second inlet 301, and is used to convey the cleaning medium from the cleaning tank 1 to the temperature control device 3. Valves can also be set at the connections of the first loop 21 with the first inlet 11 and the second outlet 302, and the second loop 22 with the first outlet 12 and the second inlet 301, so as to control the conveyance of the cleaning medium in the connecting pipeline 2. In this embodiment, the cleaning medium can be gas, plasma or cleaning liquid. The gas is, for example, ozone (O3), and the cleaning liquid can be wet chemicals, such as deionized water (DIW), hydrofluoric acid (HF), SC1 cleaning liquid (composed of NH4OH (ammonia water), H2O2 (hydrogen peroxide) and H2O (water)), SC2 cleaning liquid (composed of HCl (hydrochloric acid), H2O2 (hydrogen peroxide) and H2O (water)) or other organic solvents.

[0029] As Figure 3 , Figure 4 and Figure 5As shown, in the wafer cleaning equipment of this embodiment, the temperature control device 3 includes a housing 310 and a temperature control unit 320. The temperature control unit 320 is disposed in the housing 310. The housing 310 has a cavity 311, a first end 312 and a second end 313. The cavity 311 is used to accommodate the cleaning medium. The first end 312 and the second end 313 are two ends of the housing 310 arranged oppositely along its extending direction. A refrigeration unit 330 and a heating unit 340 are arranged in the cavity 311. The refrigeration unit 330 is a cooling coil, and the heating unit 340 is a capillary coil. The temperature control unit 320 controls the refrigeration unit 330 to start refrigerating the cleaning medium according to the received temperature signal, or controls the heating unit 340 to start heating the cleaning medium according to the received temperature signal. The temperature signal here can be a temperature instruction input by the operator during the monitoring operation, that is, manually input a refrigeration instruction or a heating instruction to the temperature control unit 320, so as to drive the temperature control unit 320 to start the refrigeration unit 330 or start the heating unit 340; it can also be the temperature data measured by the thermometer 350 provided on the cleaning tank 1 or the housing 310 and fed back to the temperature control unit 320. The temperature control unit 320 judges whether to start the refrigeration unit 330, the heating unit 340 or not to start the refrigeration unit 330 and the heating unit 340 by judging whether the temperature data deviates from the working temperature range. Among them, the housing 310 is a straight cylindrical temperature control tube.

[0030] In the temperature control device 3 of this embodiment, a thermometer 350 is provided on the housing 310 for measuring the temperature of the cleaning medium in the cavity 311. The temperature control unit 320 selects to start the refrigeration unit 330 for refrigeration or start the heating unit 340 for heating according to the received temperature signal and the temperature measured by the thermometer 350. Among them, the thermometer 350 can be provided at the first end 312 or the second end 313. In this embodiment, the thermometer 350 is provided at the second end 313 and is arranged closely adjacent to the heating unit 340. The number of the thermometers 350 provided can be one or more. Providing one thermometer 350 can reduce the cost and the equipment space occupied on the housing 310. Providing multiple thermometers 350 can make the measured real-time temperature of the cleaning medium more accurate. When providing multiple thermometers 350, the thermometers 350 can be arranged at the two ends and the middle part of the housing 310 respectively.

[0031] In the temperature control device 3 of this embodiment, a first liquid level detection unit 370 and a second liquid level detection unit 380 are arranged near the second end 313 in the cavity 311, and a connector 390 is arranged near the first end 312 in the cavity 311. The distance between the first liquid level detection unit 370 and the second end 313 is less than the distance between the second liquid level detection unit 380 and the second end 313. The connector 390 is communicatively connected to the first liquid level detection unit 370 and the second liquid level detection unit 380 respectively; when the connector 390 receives the second liquid level signal sent by the second liquid level detection unit 380, it replenishes the cleaning medium into the cavity 311 until the connector 390 receives the first liquid level signal sent by the first liquid level detection unit 370 and then stops replenishing the cleaning medium into the cavity 311. That is to say, the position of the first liquid level detection unit 370 in the cavity 311 is higher than that of the second liquid level detection unit 380. The first liquid level detection unit 370 is used to detect whether the cleaning medium in the cavity 311 is full. If it detects that the cleaning medium in the cavity 311 is full, it sends a first liquid level signal to the connector 390, and the connector 390 stops replenishing the cleaning medium. The second liquid level detection unit 380 is used to detect whether the cleaning medium in the cavity 311 has been reduced to the extent that it needs to be replenished. If it detects that the cleaning medium in the container 311 has been reduced to the extent that it needs to be replenished, it sends a second liquid level signal to the connector 390, and the connector 390 starts to replenish the cleaning medium.

[0032] In the temperature control device 3 of this embodiment, the refrigeration unit 330 includes a refrigeration controller 331 and a refrigeration pipe 332. The refrigeration controller 331 is arranged at the first end 312 of the housing 310. The refrigeration pipe 332 is connected to the refrigeration controller 331 at the first end 312 and extends into the cavity 311 to contact the cleaning medium. When it is necessary to refrigerate the cleaning medium, the temperature control unit 320 controls the refrigeration controller 331 to start. The refrigeration controller 331 inputs the coolant into the refrigeration pipe 332, so that the cleaning medium can be cooled to the set working temperature range suitable for cleaning the wafer before flowing out of the cavity 311 to the first loop 21 of the communication pipeline.

[0033] In the temperature control device 3 of this embodiment, the heating unit 340 includes a heating controller 341, a heating pipe 342, and a pressure relief safety valve 343. The heating controller 341 and the pressure relief safety valve 343 are arranged at the second end 313 of the housing 310. The heating pipe 342 is connected to the heating controller 341 at the second end 313 and extends into the cavity 311 to contact the cleaning medium. When it is necessary to heat the cleaning medium, the temperature control unit 320 controls the start of the heating controller 341. The heating controller 341 heats the heating pipe 342 so that the cleaning medium can be heated to the set working temperature range suitable for cleaning the wafer before flowing out of the cavity 311 to the first loop 21 of the connecting pipeline. When the air pressure generated in the cavity 311 due to heating is too high, the pressure relief safety valve 343 is opened to release the excess air pressure, so as to maintain the pressure difference between the air pressure in the cavity 311 and the outside atmosphere from being too large and causing damage to the housing 310.

[0034] It should be noted that the refrigeration unit 330 and the heating unit 340 do not work simultaneously. On the one hand, starting refrigeration and heating simultaneously has no meaning for temperature control. On the other hand, it wastes energy. When the thermometer 350 detects that the temperature of the cleaning medium is at the set working temperature, the temperature control unit 320 controls the stop of the operation of the refrigeration unit 330 or the heating unit 340 until the thermometer 350 measures again that the temperature of the cleaning medium deviates from the working temperature range and then starts refrigeration or heating. Of course, the refrigeration controller 331 and the heating controller 341 can also be arranged at the same end, such as the first end 312 or the second end 313.

[0035] See Figure 1 and in combination with Figure 4 and Figure 5 In the temperature control device 3 of this embodiment, the housing 310 is placed obliquely, and an exhaust hole 314 is provided at the highest point. The exhaust hole 314 is connected to the cavity 311. Since gas is generated during the process of heating the cleaning medium in the cavity 311, if it cannot be discharged in time, the gas will be transported to the cleaning tank 1 along the connecting pipeline, thus affecting the process of cleaning the wafer. Therefore, the exhaust hole 314 is provided at the highest point of the housing 310, so that the gas can be discharged from the cavity 311 in time. An exhaust valve can also be provided at the exhaust hole 314 to control the exhaust valve to close when the cleaning medium is refrigerated and open when the cleaning medium is heated, so as to avoid the exhaust hole 314 communicating with the outside and affecting the refrigeration effect of the cleaning medium.

[0036] See Figure 4 and Figure 5, in the temperature control device 3 of this embodiment, a plurality of reinforcing plates 360 are fixedly arranged in the cavity 311. The plurality of reinforcing plates 360 are arranged at intervals in a ring in the cavity 311. One of the refrigeration unit 330 or the heating unit 340 is fixedly connected to the plurality of reinforcing plates 360, and the other is surrounded by the plurality of reinforcing plates 360. The reinforcing plates 360 can be fixedly connected to both ends of the housing 310 or can be fixedly connected to the inner wall of the housing 310. The number of the reinforcing plates 360 can be set to four, and they are arranged in a ring at intervals of 90° between two. The four reinforcing plates 360 can be further fixedly connected through a ring connecting plate 361. At least two ring connecting plates 361 can be provided, and they are respectively arranged close to the first end 312 and the second end 313. In this embodiment, the refrigeration pipes 332 of the refrigeration unit 330 are fixedly arranged in a spiral and ring-shaped manner on the four reinforcing plates 360. The heating pipes 342 of the heating unit 340 are multiple groups of U-shaped pipes, and the bent parts of the U-shaped pipes extend into the central space formed by the surrounding of the four reinforcing plates 360. That is to say, the spiral refrigeration pipes 332 surround the heating pipes 342 of the multiple groups of U-shaped pipes. In this way, not only can the space in the cavity 311 be efficiently utilized, but also when the cleaning medium flows in the cavity 311, it can fully contact the refrigeration pipes 332 or the heating pipes 342 at various positions, further improving the efficiency and effect of refrigeration or heating.

[0037] The temperature control device and the wafer cleaning equipment disclosed by the present invention can realize the real-time online temperature control of the cleaning liquid in the cleaning tank, so as to better and more effectively clean the wafer.

[0038] It should be understood that the above description of the specific embodiments of the present invention is only for explaining the technical route and characteristics of the present invention. The purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. However, the present invention is not limited to the above specific embodiments. Any changes or modifications made within the scope of the claims of the present invention should be covered by the protection scope of the present invention.

Claims

1. A temperature control device, characterized in that: The device comprises a shell and a temperature control unit, wherein the temperature control unit is arranged in the shell, the shell has a cavity, the cavity is used to accommodate a cleaning medium, a refrigeration unit and a heating unit are arranged in the cavity, and the temperature control unit controls the refrigeration unit or the heating unit to start cooling or heating the cleaning medium according to a received temperature signal.

2. The temperature control device according to claim 1, characterized in that The refrigeration unit includes a refrigeration controller and a refrigeration pipe. The refrigeration controller is arranged at the first end of the shell. The refrigeration pipe is connected to the refrigeration controller at the first end and extends into the cavity to contact the cleaning medium.

3. The temperature control device according to claim 1, characterized in that The heating unit includes a heating controller and a heating pipe. The heating controller is arranged at the second end of the shell. The heating pipe is connected to the heating controller at the second end and extends into the cavity to contact the cleaning medium.

4. The temperature control device according to claim 1, characterized in that The housing is provided with a thermometer for measuring the temperature of the cleaning medium in the cavity. The temperature control unit selects to start the refrigeration unit for cooling or to start the heating unit for heating according to the received temperature signal and the temperature measured by the thermometer.

5. The temperature control device according to claim 1, characterized in that The shell has a first end and a second end, a first liquid level detection unit and a second liquid level detection unit are arranged in the cavity near the second end, a connector is arranged in the cavity near the first end, a distance between the first liquid level detection unit and the second end is smaller than a distance between the second liquid level detection unit and the second end, and the connector is communicatively connected with the first liquid level detection unit and the second liquid level detection unit respectively; when the connector receives the second liquid level signal sent by the second liquid level detection unit, the cleaning medium is replenished in the cavity, and the replenishment of the cleaning medium into the cavity is stopped until the connector receives the first liquid level signal sent by the first liquid level detection unit.

6. The temperature control device according to claim 1, characterized in that The shell is placed obliquely, and an exhaust hole is provided at the highest point, and the exhaust hole is communicated with the cavity.

7. The temperature control device according to claim 1, characterized in that A plurality of reinforcing plates are fixedly provided in the cavity. The plurality of reinforcing plates are arranged in an annular manner in the cavity. One of the refrigeration unit or the heating unit is fixedly connected to the plurality of reinforcing plates, and the other is surrounded by the plurality of reinforcing plates.

8. The temperature control device according to claim 1, characterized in that The shell is a straight temperature control tube.

9. The temperature control device according to claim 1, characterized in that The cleaning medium is gas, plasma or cleaning liquid.

10. A wafer cleaning device, characterized in that: It comprises a cleaning tank, a connecting pipe and a temperature control device as described in any one of claims 1 to 9, wherein the temperature control device and the cleaning tank are connected through the connecting pipe, and the connecting pipe is used to establish a circulation path for the circulation of the cleaning medium between the temperature control device and the cleaning tank, and the real-time heating and temperature control of the cleaning medium are achieved through the circulation path.

11. The wafer cleaning equipment according to claim 10, characterized in that: The connecting pipeline has a first circuit and a second circuit, the cleaning tank has a first inlet and a first outlet, and the shell has a second inlet and a second outlet. The first circuit connects the first inlet and the second outlet and is used to transport the cleaning medium from the temperature control device to the cleaning tank. The second circuit connects the first outlet and the second inlet and is used to transport the cleaning medium from the cleaning tank to the temperature control device.

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