Conveying track for semiconductor intelligent goods shelf and semiconductor intelligent logistics system

Abstract

The utility model provides a conveying track for a semiconductor intelligent goods shelf and a semiconductor intelligent logistics system. The conveying track for the semiconductor intelligent goods shelf comprises a track assembly and a bearing structure. The track assembly is detachably connected to the fixing structure through the bearing structure. The track assembly comprises a plurality of detachable track sections, the plurality of track sections are combined to form a conveying path, and the conveying path is at least connected with two conveying stations; the track assembly is used for bearing and guiding a pulley to move between the at least two conveying stations along the conveying path so as to convey the semiconductor carriers. According to the utility model, the system thought that the current semiconductor manufacturing uses a crown block carrying system to solve the limitation of logistics carrying is avoided, the zenith height, the load bearing and the like of the dust-free room do not need to be constructed by being matched with a crown block structure, the additional height does not need to be reserved like the crown block carrying system, and the operation energy consumption and the construction cost are effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, and particularly relates to a conveying track for a semiconductor intelligent shelf and a semiconductor intelligent logistics system. Background Technique

[0002] In order to solve the problem of production handling of semiconductor products, the current solution is to adopt an expensive overhead crane handling system (AMHS, OHT). This system is laid on the top of a semiconductor manufacturing plant, so it is called an overhead crane.

[0003] The track of the overhead crane handling system is generally supported by the ceiling of the clean room. If the ceiling height, load-bearing, etc. of the clean room are not coordinated with the structure of the overhead crane during the initial design and planning stage of the clean room, the subsequent overhead crane handling system cannot be implanted. Further, due to the setting of the overhead crane handling system, the height of the clean room needs to be increased by about 4 meters. Taking a clean room with an area of 100 meters * 100 meters as an example, the volume of the clean room will increase by 40,000 cubic meters, greatly increasing the energy consumption and construction cost.

[0004] Although the overhead crane handling system solves the problem of handling semiconductor products, it can only transfer semiconductor products to the storage space (Stocker) planned by the overhead crane handling system, and cannot solve the problem of handling semiconductor products inside the storage space, nor can it transfer semiconductor products to a position close to the next semiconductor process equipment. It still needs to use a trolley for manual handling for a certain distance, spending extra manpower and time. In addition, the track layout of the overhead crane handling system is limited and fixed, and the dispatching system cannot ensure the sufficiency and smoothness of the transportation path, easily causing traffic jams and resulting in a decline in handling efficiency.

[0005] In addition, the installation plan of production equipment in a semiconductor manufacturing plant is gradually increased in stages according to customer orders and production capacity requirements. The replacement of equipment models during the later new product development will affect the re-planning of the production layout in the clean room. The overhead crane handling system cannot meet the requirements of system expansion, re-layout of the transportation path and extension for the actual changes in the later stage, lacking flexibility and ductility, resulting in a gradual decrease in the utilization rate of the overhead crane handling system and returning to the original state of more use of trolleys for manual handling. Content of the Utility Model

[0006] The purpose of the utility model is to provide a conveying track for a semiconductor intelligent shelf and a semiconductor intelligent logistics system to solve the problems that the overhead crane handling system in the prior art requires the cooperation of the factory building structure and is difficult to expand and change the layout in the later stage.

[0007] To solve the above technical problems, the utility model provides a conveying track for a semiconductor intelligent shelf, which includes: a track component and a bearing structure;

[0008] The track assembly is detachably connected to the fixed structure through the bearing structure;

[0009] The track assembly includes a plurality of detachable track segments, and the plurality of track segments are combined to form a conveying path, and the conveying path is connected to at least two conveying stations;

[0010] The track assembly is used to carry and guide the trolley to move along the conveying path between at least two of the conveying stations to convey the semiconductor carrier.

[0011] Optionally, the track assembly further includes a path switch;

[0012] The plurality of track segments are connected to the path switch in a three-way fork to form the conveying path, and the three-way fork of the conveying path is respectively connected to three of the conveying stations;

[0013] The path switch is configured to switch the connection direction of the conveying path to selectively connect two of the three conveying stations.

[0014] Optionally, the path switch includes a turntable and three guide rails;

[0015] The guide rail includes a turntable end and a track end, and the turntable ends of the three guide rails are evenly distributed around the center of the turntable; the track ends of the three guide rails are respectively connected to three of the track segments;

[0016] The turntable has an arc-shaped connecting rail, and both ends of the arc-shaped connecting rail are distributed at 120° around the center of the turntable; the turntable is configured to rotate around its own center so that both ends of the arc-shaped connecting rail are selectively connected to different guide rails.

[0017] Optionally, the three track segments connected to the path switch in a three-way fork are arranged in a T shape, where two of the track segments are arranged in a straight line and the other track segment is perpendicular to the straight line.

[0018] Optionally, the track assembly further includes a connecting piece; adjacent track segments are combined and connected through the connecting piece;

[0019] The connecting piece has a female groove; the end of the track segment has a male plug, and the male plugs of adjacent track segments are respectively inserted into the female groove in a matching manner.

[0020] Optionally, the female groove penetrates axially along the track segment; after the male plugs of adjacent track segments are respectively inserted into the female groove, they abut against each other.

[0021] Optionally, the track assembly further includes a power supply rail, which extends axially along the track segment and is attached to the track segment for supplying power to the trolley.

[0022] Optionally, the track segment has at least two guide portions in the vertical direction, and the two guide portions are used to abut against different guide wheel sets of the pulley.

[0023] Optionally, the track segment includes a straight segment or an arc segment.

[0024] In order to solve the above technical problems, the utility model also provides a semiconductor intelligent logistics system, which includes the conveying track for the semiconductor smart shelf as described above, and also includes a pulley and a semiconductor smart shelf; wherein the semiconductor smart shelf is configured as the conveying station, and the pulley is movably arranged along the track assembly.

[0025] In summary, in the conveying track for semiconductor smart shelves and the semiconductor smart logistics system provided by the present invention, the conveying track for semiconductor smart shelves includes: a track assembly and a bearing structure; the track assembly is detachably connected to the fixed structure through the bearing structure; the track assembly includes a plurality of detachable track segments, and the plurality of track segments are combined to form a conveying path, and the conveying path connects at least two conveying stations; the track assembly is used to carry and guide the pulley to move along the conveying path between at least two conveying stations to convey semiconductor carriers.

[0026] This utility model breaks away from the current system thinking of using overhead crane transportation system to solve the limitations faced by logistics transportation in semiconductor manufacturing. The track components can be flexibly connected to different fixed structures such as columns, floors, ceilings or semiconductor smart shelves through the load-bearing structure. The ceiling height and load-bearing capacity of the clean room do not need to be coordinated with the overhead crane structure, nor do they need to reserve additional height like the overhead crane transportation system, effectively reducing operating energy consumption and construction costs.

[0027] Furthermore, the track components and conveying paths can be detachably rearranged according to work indicators or process flows. When work indicators or process flows change, the layout of the track components and conveying paths can be adaptively adjusted, thereby coping with the expansion or change of process layout caused by factors such as the initial, mid- and late-stage capacity ramp-up of semiconductor manufacturing plants, the gradual installation of equipment, and the development of new products, thereby helping to promote industrial upgrading of semiconductor production and manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Those skilled in the art will appreciate that the accompanying drawings are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.

[0029] Figure 1It is a schematic diagram of the semiconductor intelligent logistics system according to an embodiment of the present utility model.

[0030] Figure 2 It is a schematic diagram of the conveying path according to an embodiment of the present utility model.

[0031] Figure 3 It is a schematic diagram of a side view perspective direction of the conveying track for the semiconductor intelligent shelf according to an embodiment of the present utility model.

[0032] Figure 4 It is a schematic diagram of another side view perspective direction of the conveying track for the semiconductor intelligent shelf according to an embodiment of the present utility model.

[0033] Figure 5 It is a schematic diagram of a top view perspective direction of the conveying track for the semiconductor intelligent shelf according to an embodiment of the present utility model.

[0034] Figure 6 It is a three-dimensional view of the track assembly and the trolley according to an embodiment of the present utility model.

[0035] Figure 7 It is a schematic diagram of a side view perspective direction of the track assembly and the trolley according to an embodiment of the present utility model.

[0036] Figure 8 It is an axial sectional view schematic diagram of the track assembly and the trolley according to an embodiment of the present utility model.

[0037] Figure 9 It is a schematic diagram of a switching state of the path switch according to an embodiment of the present utility model.

[0038] Figure 10 It is a schematic diagram of another switching state of the path switch according to an embodiment of the present utility model.

[0039] In the drawings:

[0040] 1 - Conveying track for semiconductor intelligent shelf; 10 - Track assembly; 11 - Track segment; 111 - Straight segment; 112 - Arc segment; 113 - Male plug; 114 - Power supply groove; 115 - Guide part; 12 - Connector; 121 - Female groove; 13 - Power supply rail; 14 - Path switch; 141 - Turntable; 142 - Guide rail; 143 - Arc connecting rail; 19 - Carrying structure; 2 - Trolley; 21 - Contact; 22 - Guide wheel set; 23 - Extended guide part; 3 - Semiconductor intelligent shelf; 4 - Semiconductor carrier; 5 - Handling device. Detailed implementation manners

[0041] To make the objectives, advantages and features of the present utility model clearer, the following further elaborates on the present utility model in conjunction with the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are in highly simplified forms and not drawn to scale, merely for the purpose of facilitating and clearly assisting in explaining the objectives of the embodiments of the present utility model. In addition, the structures shown in the accompanying drawings are often part of the actual structures. In particular, the accompanying drawings need to show different focuses and sometimes use different scales.

[0042] As used in the present utility model, the singular forms "a", "an", "one" and "the" include plural objects. The term "or" is generally used in the sense of including "and / or". The term "several" is generally used in the sense of including "at least one". The term "at least two" is generally used in the sense of including "two or more". In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third" may explicitly or implicitly include one or at least two of such features. "One end" and "the other end", as well as "proximal end" and "distal end" generally refer to corresponding two parts, which not only include the endpoints. In addition, as used in the present utility model, "mounted", "connected", "coupled", an element "disposed" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the two elements can be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate element, rather than being construed as indicating or implying the spatial position relationship between the two elements, that is, an element can be in any position such as inside, outside, above, below or on one side of another element, unless otherwise explicitly stated in the content. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as shown in the drawings, with upward or the upward direction facing the top of the corresponding drawing and downward or the downward direction facing the bottom of the corresponding drawing.

[0043] The objective of the present utility model is to provide a conveying track for a semiconductor intelligent shelf and a semiconductor intelligent logistics system to solve the problems in the prior art that the overhead crane handling system requires the cooperation of the factory building structure and it is difficult to expand and change the layout later. The following is a description with reference to the accompanying drawings.

[0044] Please refer to Figure 1 and Figure 2, an embodiment of the present utility model provides a semiconductor intelligent logistics system, which includes a conveying track 1 for semiconductor intelligent shelves, a trolley 2, and at least two semiconductor intelligent shelves 3. The conveying track 1 for semiconductor intelligent shelves is connected between at least two semiconductor intelligent shelves 3, and the trolley 2 moves along the conveying track 1 for semiconductor intelligent shelves to convey semiconductor carriers between at least two semiconductor intelligent shelves 3.

[0045] The conveying track 1 for semiconductor intelligent shelves includes: a track component 10 and a bearing structure 19; the track component 10 is detachably connected to a fixed structure (such as a column, the ground, the ceiling, a semiconductor intelligent shelf 3, or semiconductor process equipment) through the bearing structure 19; the track component 10 includes a plurality of detachable track segments 11, and the plurality of track segments 11 are combined to form a conveying path, and the conveying path is at least connected to two conveying stations; the track component 10 is used to carry and guide the trolley 2 to move along the conveying path between at least two conveying stations to convey the semiconductor carrier 4.

[0046] The conveying stations here can be, for example, semiconductor intelligent shelves 3, or semiconductor process equipment, etc., and this embodiment is not limited thereto. The conveying path is set according to work indicators or process flows. Please refer to Figure 2 , in one embodiment, the track component 10 is connected between two semiconductor intelligent shelves 3 to form the simplest conveying path. The trolley 2 is movably arranged along the track component 10, so the trolley 2 can move along the track component 10 between two semiconductor intelligent shelves 3, so as to convey the semiconductor carrier 4 from one semiconductor intelligent shelf 3 to another semiconductor intelligent shelf 3. Of course, the conveying path is not limited to only connecting two conveying stations, and it can also connect multiple conveying stations. At this time, the trolley 2 can move and stop successively between multiple conveying stations along the track component 10 to realize the conveyance of the semiconductor carrier 4 station by station.

[0047] It should be noted that the connection between the track component 10 and the semiconductor intelligent shelf 3 means that when the trolley 2 moves to the position corresponding to the semiconductor intelligent shelf 3 on the track component 10, the trolley 2 can realize the transfer of the semiconductor carrier 4 with the semiconductor intelligent shelf 3. In some embodiments, the track component 10 and the semiconductor intelligent shelf 3 may be physically connected, for example, the end of the track component 10 directly extends into the semiconductor intelligent shelf 3 and is connected. In some other embodiments, the track component 10 may also be arranged at a position adjacent to the semiconductor intelligent shelf 3, and the two do not directly contact, but the transfer of the semiconductor carrier 4 is realized through a handling device 5. The handling device 5 can be, for example, a robotic arm and other devices well known to those skilled in the art, and this embodiment will not be elaborated.

[0048] Please refer to in combination Figure 1In practice, the track assembly 10 and the conveying path can be laid out according to work indicators or process flows. Figure 1 In the illustrated example, the semiconductor intelligent logistics system includes four semiconductor smart shelves 3, with the track assembly 10 configured in a ring, sequentially connecting the four semiconductor smart shelves 3. Furthermore, after the track assembly 10 is laid out, it can be connected to a suitable fixed structure via a load-bearing structure 19 according to actual conditions. For example, the track assembly 10 can be flexibly connected to a column, the ground, or the ceiling via the load-bearing structure 19. The track assembly 10 can also be connected to the semiconductor smart shelves 3 or semiconductor process equipment, but this embodiment is not limited to this. As a result, the ceiling height and load-bearing capacity of the clean room do not need to be built to match the overhead crane structure, nor does it require additional height to be reserved as required for an overhead crane transport system, effectively reducing operating energy consumption and construction costs. Furthermore, the track assembly 10 and conveying path can be removably reconfigured based on work indicators or process flows. When work indicators or process flows change, the layout of the track assembly 10 and conveying path can be adaptively adjusted. This can accommodate expansion or changes in process layout caused by factors such as initial, mid-, and late-stage capacity ramps, gradual equipment installation, and new product development in semiconductor manufacturing plants, helping to promote industrial upgrading of semiconductor production and manufacturing.

[0049] In one embodiment, the support structure 19 can be secured to the track segment 11 by, for example, bolting, thereby securing the track segment 11 to a suitable fixing structure. The arrangement density of the support structure 19 can be adjusted based on the length and stiffness of the track segment 11. This is understood by those skilled in the art based on existing knowledge and will not be further explained here.

[0050] Please refer to Figure 3 Optionally, the track segment 11 includes a straight segment 111 or an arc segment 112. The track segment 11 can be configured as a standard part, which preferably has a certain module. For example, in an exemplary embodiment of a straight segment 111, its length is based on a module of 0.5m, that is, the length of the straight segment 111 can be 0.5m, 1m, 1.5m, 2m, 2.5m, 3m and other values, which vary in increments of 0.5m. The length of each straight segment 111 does not exceed 6m, preferably does not exceed 3m. The arc segment 112 is preferably an arc, and in an exemplary embodiment of an arc segment 112, its arc center angle is based on a module of 45°, that is, the arc center angle of the arc segment 112 can vary in increments of 45°, for example, it can be 45°, 90°, 135°, etc. The radius of the arc segment 112 can be, for example, 2.2m or 5.2m, etc. Those skilled in the art can reasonably configure and combine the shapes and sizes of the track segments 11 according to actual conditions, and the present invention is not limited thereto.

[0051] Please refer to Figures 3 to 5, optionally, the track assembly 10 further includes a connecting member 12; adjacent track segments 11 are combined and connected through the connecting member 12; the connecting member 12 has a female groove 121; the end of the track segment 11 has a male plug 113, and the male plugs 113 of adjacent track segments 11 are respectively inserted into the female groove 121 in a matching manner. Preferably, the female groove 121 penetrates axially along the track segment 11; after the male plugs 113 of adjacent track segments 11 are respectively inserted into the female groove 121, they abut against each other.

[0052] Please refer to Figures 6 to 8 , preferably, the track assembly 10 further includes a power supply rail 13, the power supply rail 13 extends axially along the track segment 11 and is attached to the track segment 11 for supplying power to the trolley 2. In one exemplary embodiment, the track segment 11 has a power supply groove 114, and the power supply groove 114 can be opened, for example, on the side of the track segment 11, and its cross-section can be C-shaped opening towards the side. The cross-sectional shape of the power supply rail 13 is adapted to the cross-sectional shape of the power supply groove 114, so that the power supply rail 13 can penetrate axially into the power supply groove 114 and is restricted from having degrees of freedom other than the axial direction by the power supply groove 114. With such a configuration, the power supply rail 13 can be reliably stuck in the power supply groove 114 and can also contact the trolley 2 through the C-shaped opening of the power supply groove 114 to supply power to the trolley 2.

[0053] In one embodiment, the trolley 2 includes a motor (not shown) and a contact 21. The entire trolley 2 preferably straddles the track segment 11 of the track assembly 10. At this time, the contact 21 is exactly aligned with the C-shaped opening of the power supply groove 114 and contacts the power supply rail 13 in the power supply groove 114 to achieve electrical conduction. Thus, power can be supplied to the motor via the power supply rail 13 and the contact 21, thereby driving the trolley 2 to move on the track assembly 10.

[0054] Optionally, the track segment 111 has at least two guiding portions 115 in the vertical direction, and the two guiding portions 115 are used to abut against different guiding wheel sets 22 of the trolley 2. In an alternative exemplary embodiment, the track segment 111 has an upper guiding portion 115a and a lower guiding portion 115b in the vertical direction. The upper guiding portion 115a and the lower guiding portion 115b can be formed, for example, by changing the cross-sectional shape of the track segment 111. The upper guiding portion 115a is preferably a set of inclined surfaces facing outward relatively, and the lower guiding portion 115b is preferably a set of vertical surfaces facing outward relatively. Correspondingly, the trolley 2 has two sets of guiding wheel sets 22 arranged at intervals in the vertical direction, namely an upper guiding wheel set 22a and a lower guiding wheel set 22b. The upper guiding wheel set 22a includes two guiding wheels, and the two guiding wheels of the upper guiding wheel set 22a exactly abut against the inclined surfaces of the upper guiding portion 115a, so as to form a bearing and guiding function. The lower guiding wheel set 22b also includes two guiding wheels. The two guiding wheels of the lower guiding wheel set 22b are respectively arranged on both sides of the track segment 111 and respectively abut against the two vertical surfaces of the lower guiding portion 115b, so as to form a limiting function for yaw.

[0055] Optionally, please refer to Figure 6 and Figure 7 , the trolley 2 further includes an extended guiding portion 23 extending along the axial direction of the track segment 111. The extended guiding portion 23 can also form a sliding fit relationship with the track segment 111, which can further improve the movement stability of the trolley 2. At the same time, a bearing platform can be formed above the extended guiding portion 23, which can be used for placing the semiconductor carrier 4.

[0056] Please refer to Figure 9 and Figure 10 Optionally, the track assembly 10 further includes a path switch 14; a plurality of the track segments 111 are connected to the path switch 14 in a three-way fork to form the conveying path in combination, and the three-way fork of the conveying path is respectively connected to three of the conveying stations; the path switch 14 is configured to switch the connection direction of the conveying path to selectively connect two of the three conveying stations.

[0057] In some scenarios, according to the process flow, the semiconductor carrier 4 may need to be conveyed from a certain conveying station to different conveying stations, or be assembled from different conveying stations to a certain conveying station. In some embodiments, different track assemblies 10 can be respectively arranged to form different conveying paths, but this requires laying more track assemblies 10 additionally. When the process flow is relatively complex, it may cause the track assemblies 10 to cross and block each other. Therefore, preferably, the arrangement of the track assembly 10 can be simplified by setting the path switch 14, and the conveying direction of the semiconductor carrier 4 can be selected by switching the connection direction of the conveying path.

[0058] In an alternative exemplary embodiment, the path switch 14 includes a turntable 141 and three guide rails 142; the guide rail 142 includes a turntable end 142a and a rail end 142b, and the turntable ends 142a of the three guide rails 142 are evenly distributed around the center of the turntable 141; the rail ends 142b of the three guide rails 142 are respectively connected to the three rail segments 111; the turntable 141 has an arc-shaped connecting rail 143, and the two ends of the arc-shaped connecting rail 143 are distributed at 120° around the center of the turntable 141; the turntable 141 is configured to rotate around its own center so that the two ends of the arc-shaped connecting rail 143 are selectively connected to different guide rails 142.

[0059] It can be understood that based on the setting that the two ends of the arc-shaped connecting rail 143 are distributed at 120°, each time the turntable 141 rotates 120°, the two ends of the arc-shaped connecting rail 143 can be connected to the turntable ends 142a of different guide rails 142, thereby switching the connection direction of the conveying path.

[0060] The following combination Figure 9 and Figure 10 The example of the switching process of the path switch 14 is explained as an example. Figure 9 and Figure 10 In the example shown, three semiconductor smart racks 3 are provided as three delivery stations, which are named as delivery station A, delivery station B and delivery station C for the convenience of description. Figure 9 In the state shown, the transport station A and the transport station B are directly connected through the path switch 14. At this time, the semiconductor carrier 4 can be directly transported from the transport station A to the transport station B. Then, when it is necessary to transport the semiconductor carrier 4 from the transport station A to the transport station C, the turntable 141 of the path switch 14 can be driven to rotate 120 degrees counterclockwise, and the connection direction of the transport path is switched to the following state: Figure 10 At this time, the transport station A and the transport station C are directly connected via the path switch 14 , so that the semiconductor carrier 4 can be directly transported from the transport station A to the transport station C.

[0061] Preferably, the three track segments 111 connected to the path switch 14 in a trifurcated manner are arranged in a T-shape, wherein two of the track segments 111 are arranged along a straight line, and the other track segment 111 is perpendicular to the straight line. To facilitate the arrangement of the track segments 111, the track segments 111 are generally arranged in an orthogonal manner in a clean room. At this time, the path switch 14 forms a T-shaped connection with the three track segments 111. It is understandable that at this time, the two guide rails 142 corresponding to the straight line arrangement in the path switch 14 preferably have a certain curvature to adapt to the angle change between the turntable end 142a and the track end 142b.

[0062] In summary, in the conveying track for semiconductor smart shelves and the semiconductor smart logistics system provided by the present invention, the conveying track for semiconductor smart shelves includes: a track assembly and a bearing structure; the track assembly is detachably connected to a fixed structure through the bearing structure; the track assembly includes a plurality of detachable track segments, and a plurality of the track segments are combined to form a conveying path, and the conveying path connects at least two conveying stations; the track assembly is used to carry and guide the pulley to move along the conveying path between at least two conveying stations to convey semiconductor carriers. The present invention breaks away from the current system thinking of using an overhead crane transport system to solve the limited logistics handling faced by semiconductor manufacturing. The track assembly can be flexibly connected to different fixed structures such as columns, floors, ceilings or semiconductor smart shelves through the bearing structure. The ceiling height and load-bearing capacity of the clean room do not need to be built in conjunction with the overhead crane structure, nor do they need to reserve additional height like the overhead crane transport system, effectively reducing operating energy consumption and construction costs. Furthermore, the track components and conveying paths can be detachably rearranged according to work indicators or process flows. When work indicators or process flows change, the layout of the track components and conveying paths can be adaptively adjusted, thereby coping with the expansion or change of process layout caused by factors such as the initial, mid- and late-stage capacity ramp-up of semiconductor manufacturing plants, the gradual installation of equipment, and the development of new products, thereby helping to promote industrial upgrading of semiconductor production and manufacturing.

[0063] It should be noted that the above embodiments can be combined with each other. The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention. Any changes or modifications made by ordinary technicians in the field of the present invention based on the above disclosure are within the scope of protection of the present invention.

Claims

1. A conveyor track for semiconductor smart shelves, characterized in that: include: track components and load-bearing structures; The track assembly is detachably connected to the fixed structure via the bearing structure; The track assembly includes a plurality of detachable track segments, and the plurality of track segments are combined to form a conveying path, and the conveying path connects at least two conveying stations; The track assembly is used to carry and guide the trolley to move along the conveying path between at least two conveying stations to convey semiconductor carriers.

2. The semiconductor intelligent shelf conveyor track according to claim 1, characterized in that: The track assembly also includes a path switch; A plurality of track segments are connected to the path switch in a trifurcated manner to form the conveying path, and the trifurcated portions of the conveying path are respectively connected to the three conveying stations; The path switch is configured to switch the communication direction of the transport path so as to selectively connect two of the three transport stations.

3. The conveyor track for semiconductor smart shelves according to claim 2, characterized in that: The path switcher includes a turntable and three guide rails; The guide rail includes a turntable end and a track end, and the turntable ends of the three guide rails are evenly distributed around the center of the turntable; the track ends of the three guide rails are respectively connected to the three track segments; The turntable has an arc-shaped connecting rail, and the two ends of the arc-shaped connecting rail are distributed at 120 degrees around the center of the turntable; the turntable is configured to rotate around its own center so that the two ends of the arc-shaped connecting rail can be selectively connected to different guide rails.

4. The semiconductor intelligent shelf conveyor track according to claim 2, characterized in that: The three track segments connected to the path switch in a trifurcated manner are arranged in a T-shape, wherein two of the track segments are arranged along a straight line, and the other track segment is perpendicular to the straight line.

5. The conveyor track for semiconductor smart shelves according to claim 1, characterized in that: The track assembly further includes a connecting piece; adjacent track segments are connected in combination via the connecting piece; The connecting piece has a female groove; the end of the track segment has a male plug, and the male plugs of adjacent track segments are respectively adapted to be inserted into the female groove.

6. The conveyor track for semiconductor smart shelves according to claim 5, characterized in that: The female groove passes through the track segment along the axial direction; the male plugs of adjacent track segments are respectively inserted into the female grooves and abut against each other.

7. The semiconductor intelligent shelf conveyor track according to claim 1, characterized in that: The track assembly further includes a power supply rail, which extends along the axial direction of the track segment and is attached to the track segment for supplying power to the trolley.

8. The conveyor track for semiconductor smart shelves according to claim 1, characterized in that: The track segment has at least two guide portions in the vertical direction, and the two guide portions are used to abut against different guide wheel sets of the pulley.

9. The conveyor track for semiconductor smart shelves according to claim 1, characterized in that: The track segment includes a straight segment or an arc segment.

10. A semiconductor intelligent logistics system, characterized in that: It comprises a conveying track for a semiconductor smart shelf according to any one of claims 1 to 9, and also comprises a pulley and a semiconductor smart shelf; wherein the semiconductor smart shelf is configured as the conveying station, and the pulley is movably arranged along the track assembly.

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