Chip loading and unloading equipment

By designing chip loading and unloading equipment, and using a chip tray connected to the silo slide rail and slider to quickly replace and supplement the chip tray, the problem of high cost of MEMS chip testing equipment is solved, and the production efficiency and economic benefits are improved.

CN223193785UActive Publication Date: 2025-08-05SUZHOU YONGCHUANG INTELLIGENT TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422183080.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-06
Publication Date
2025-08-05
Estimated Expiration
2034-09-06

AI Technical Summary

Technical Problem

The existing MEMS chip test equipment has high manufacturing costs and is difficult to promote on a large scale, resulting in an increase in manufacturing costs and testing cycles for MEMS chip manufacturers, affecting economic benefits.

Method used

A chip loading and unloading equipment is designed, including a frame, loading box, unloading box, X-direction drive module, Y-direction drive module, Z-axis drive module and suction nozzle. It is connected to the slider through the silo slide rail to achieve rapid replacement and replenishment of the chip material tray, and the precise handling and classification of the chip is combined with the visual bracket and light source.

Benefits of technology

It improves chip production efficiency, realizes rapid replacement and replenishment of MEMS chip material trays, reduces production costs, and improves economic benefits.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223193785U_ABST
    Figure CN223193785U_ABST
Patent Text Reader

Abstract

The utility model discloses chip feeding and discharging equipment which comprises a rack, at least one feeding box, at least one discharging box, an X-direction driving module, a Y-direction driving module, a Z-axis driving module and a plurality of suction nozzles used for picking up chips. A plurality of chip trays arranged in the vertical direction are arranged in the upper material box and the lower material box, the partition plates are installed on the upper surface of the bottom substrate at intervals, and a material box area where the upper material box or the lower material box can be embedded is formed between the adjacent partition plates and the bottom substrate. The bottom face of each upper material box and the bottom face of each lower material box are connected with the upper surface of the bottom base plate in the corresponding material box area in a sliding mode through at least one set of material bin sliding rails and material bin sliding blocks. According to the utility model, the chip trays stacked in the upper material box and the lower material box can be quickly replaced and supplemented while a plurality of chips in the chip trays are taken, placed and carried at the same time, so that the production efficiency is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to chip loading and unloading equipment. Background Art

[0002] In recent years, the trend toward miniaturization of MEMS chips has become increasingly evident, and the demand for MEMS chip testing is also increasing. There are many types of MEMS, with hundreds of millions consumed worldwide each year. These MEMS chips are widely used in smartphones, automotive electronics, smart manufacturing, and other fields. Furthermore, the market share of MEMS chips depends largely on their quality. Quality testing of MEMS chips typically requires the use of corresponding test sockets to ensure quality control. However, existing MEMS chip testing products are too expensive to manufacture and cannot be effectively promoted and applied on a larger scale. This significantly increases the manufacturing costs and testing cycles of MEMS chip manufacturers, hindering their economic benefits. Utility Model Content

[0003] The purpose of the utility model is to provide a chip loading and unloading device, which can realize the rapid replacement and replenishment of the stacked chip trays in the loading box and the unloading box while realizing the simultaneous placement and transportation of multiple chips in the chip tray, thereby improving production efficiency.

[0004] To achieve the above-mentioned objectives, the technical solution adopted by the present invention is: a chip loading and unloading device, comprising: a frame, at least one loading box, at least one unloading box, an X-axis driving module installed on the frame, a Y-axis driving module movably installed on the X-axis driving module, a Z-axis driving module movably installed on the Y-axis driving module and a plurality of suction nozzles for picking up chips, the vertically arranged suction nozzles are movably installed on the Z-axis driving module, and the loading box and the unloading box are each provided with a plurality of chip trays arranged in the vertical direction, and also include: a bottom substrate and a plurality of partitions installed at intervals on the upper surface of the bottom substrate, a material box area for the loading box or the unloading box to be embedded is formed between adjacent partitions and the bottom substrate, and the bottom surface of each of the loading box and the unloading box is slidably connected to the upper surface of the bottom substrate in the corresponding material box area by at least one set of material bin slide rails and a material bin slider.

[0005] The further improved scheme in the above technical scheme is as follows:

[0006] 1. In the above solution, a baffle is connected between one end of each of the plurality of partitions.

[0007] 2. In the above solution, at least two sets of mutually cooperating guide posts and guide sleeves are provided between each of the loading box, the unloading box and the baffle.

[0008] 3. In the above solution, a vision bracket is installed on the Y-axis driving module and located on one side of the Z-axis driving module. A camera and a light source located directly below the camera are installed on the surface of the vision bracket that is movable along the Y-axis and is opposite to the driving module.

[0009] 4. In the above solution, there is one loading box and four unloading boxes.

[0010] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0011] The chip loading and unloading equipment of the present invention also includes: a bottom substrate and a plurality of partitions installed at intervals on the upper surface of the bottom substrate, a material box area for a loading box or a unloading box to be embedded is formed between adjacent partitions and the bottom substrate, and the bottom surface of each loading box and unloading box and the upper surface of the bottom substrate in the corresponding material box area are slidably connected by at least one set of material bin slide rails and material bin sliders. While realizing the simultaneous placement and transportation of multiple chips in the chip material tray, the stacked chip material trays in the loading box and the unloading box can be quickly replaced and replenished, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Attachment Figure 1 This is a schematic diagram of the overall structure of the chip loading and unloading equipment of the present invention;

[0013] Attachment Figure 2 for Figure 1 A magnified view of the local structure at center A;

[0014] Attachment Figure 3 This is a schematic diagram of the partial structure of the chip loading and unloading equipment of the utility model Figure 1 ;

[0015] Attachment Figure 4 for Figure 3 A magnified view of the structure at B in the middle;

[0016] Attachment Figure 5 This is a schematic diagram of the partial structure of the chip loading and unloading equipment of the utility model Figure 2 ;

[0017] Attachment Figure 6 for Figure 5 Enlarged view of the structure at point C in the middle.

[0018] In the above drawings: 100, rack; 200, chip; 300, chip tray; 1, X-axis drive module; 2, Y-axis drive module; 21, visual bracket; 22, camera; 23, light source; 3, Z-axis drive module; 4, suction nozzle; 5, loading box; 6, unloading box; 7, bottom plate; 8, partition; 9, box area; 101, hopper slide rail; 102, hopper slider; 11, baffle; 111, guide column; 112, guide sleeve. DETAILED DESCRIPTION

[0019] The present invention can be further understood through the following specific embodiments, but they are not intended to limit the present invention.

[0020] Example 1: A chip loading and unloading device, comprising: a frame 100, at least one loading box 5, at least one unloading box 6, an X-axis driving module 1 mounted on the frame 100, a Y-axis driving module 2 movably mounted on the X-axis driving module 1, a Z-axis driving module 3 movably mounted on the Y-axis driving module 2, and a plurality of suction nozzles 4 for picking up chips 200, wherein the vertically arranged suction nozzles 4 are movably mounted on the Z-axis driving module 3, the loading box 5 and the unloading box 6 are each provided with a number of chip trays 300 arranged in a vertical direction, and also include: a bottom substrate 7 and a number of partitions 8 installed at intervals on the upper surface of the bottom substrate 7, a material box area 35 for the loading box 5 or the unloading box 6 to be embedded is formed between adjacent partitions 8 and the bottom substrate 7, and the bottom surface of each of the loading box 5 and the unloading box 6 is slidably connected to the upper surface of the bottom substrate 7 in the corresponding material box area 35 through at least one set of hopper slide rails 361 and hopper sliders 362.

[0021] A baffle 11 is connected between one end of each of the plurality of partitions 8 .

[0022] There is one loading box 5 and four unloading boxes 6 .

[0023] Example 2: A chip loading and unloading device, comprising: a frame 100, at least one loading box 5, at least one unloading box 6, an X-axis driving module 1 mounted on the frame 100, a Y-axis driving module 2 movably mounted on the X-axis driving module 1, a Z-axis driving module 3 movably mounted on the Y-axis driving module 2, and a plurality of suction nozzles 4 for picking up chips 200, wherein the vertically arranged suction nozzles 4 are movably mounted on the Z-axis driving module 3, the loading box 5 and the unloading box 6 are each provided with a number of chip trays 300 arranged in a vertical direction, and also include: a bottom substrate 7 and a number of partitions 8 installed at intervals on the upper surface of the bottom substrate 7, a material box area 35 for the loading box 5 or the unloading box 6 to be embedded is formed between adjacent partitions 8 and the bottom substrate 7, and the bottom surface of each of the loading box 5 and the unloading box 6 is slidably connected to the upper surface of the bottom substrate 7 in the corresponding material box area 35 through at least one set of hopper slide rails 361 and hopper sliders 362.

[0024] At least two sets of mutually cooperating guide posts 111 and guide sleeves 112 are provided between each of the loading box 5 , the unloading box 6 and the baffle 11 .

[0025] A visual bracket 21 is installed on the Y-axis driving module 2 and located on one side of the Z-axis driving module 3. The visual bracket 21 which can move along the Y direction is installed with a camera 22 and a light source 23 located directly below the camera 22 on the surface opposite to the driving module 22.

[0026] When testing the chip, the nozzle of the loading and unloading assembly picks up the chip tray on the top layer from the loading box and picks up the chip to be tested. Then, the loading and unloading assembly moves along the X, Y, and Z axes to move the chip to the test area.

[0027] After the chip test is completed, the nozzle of the loading and unloading assembly is used to pick up the tested chip from the chip holder, and then the combined movement of the X, Y and Z axes in the loading and unloading assembly is used to transport the tested chip to the top of the hopper assembly. According to the grade classification of the chips obtained during the test process, chips of different grades are placed in chip trays in different unloading boxes. When all the tested chips in the test assembly are moved to the chip tray in the unloading box, the nozzle of the loading and unloading assembly is used to pick up the chip tray on the top layer from the loading box of the hopper assembly to pick up the chip to be tested. Then, through the combined movement of the X, Y and Z axes in the loading and unloading assembly, the chip to be tested is transported to the test area for the next round of testing, and this cycle is repeated.

[0028] When the chip loading and unloading equipment is used, it can realize the simultaneous placement and transportation of multiple chips in the chip tray, and can also realize the rapid replacement and replenishment of the stacked chip trays in the loading box and the unloading box, thereby improving production efficiency.

[0029] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those familiar with the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications based on the spirit of the present invention are intended to be included in the scope of protection of the present invention.

Claims

1. A chip loading and unloading device, comprising: A frame (100), at least one loading box (5), at least one unloading box (6), an X-axis driving module (1) mounted on the frame (100), a Y-axis driving module (2) movably mounted on the X-axis driving module (1), a Z-axis driving module (3) movably mounted on the Y-axis driving module (2), and a plurality of suction nozzles (4) for picking up chips (200), wherein the vertically arranged suction nozzles (4) are movably mounted on the Z-axis driving module (3), and the loading box (5) and the unloading box (6) are both provided with A plurality of chip trays (300) arranged in a vertical direction are characterized in that they further comprise: a bottom substrate (7) and a plurality of partitions (8) installed at intervals on the upper surface of the bottom substrate (7); a material box area (9) for embedding a loading box (5) or a loading box (6) is formed between adjacent partitions (8) and the bottom substrate (7); the bottom surface of each loading box (5) or loading box (6) is slidably connected to the upper surface of the bottom substrate (7) in the corresponding material box area (9) via at least one set of hopper slide rails (101) and hopper sliders (102).

2. The chip loading and unloading equipment according to claim 1, characterized in that: A baffle (11) is connected between one end of each of the plurality of partitions (8).

3. The chip loading and unloading equipment according to claim 2, characterized in that: At least two sets of mutually cooperating guide columns (111) and guide sleeves (112) are provided between each of the loading box (5), the unloading box (6) and the baffle (11).

4. The chip loading and unloading equipment according to claim 1, characterized in that: A visual support (221) is installed on the Y-axis driving module (2) and located on one side of the Z-axis driving module (3). A camera (222) and a light source (223) located directly below the camera (222) are installed on the surface of the visual support (221) that is movable along the Y direction and is opposite to the driving module (22).

5. The chip loading and unloading equipment according to claim 1, characterized in that: One loading box (5) is provided, and four unloading boxes (6) are provided.