Lead copper frame

Abstract

The utility model relates to the technical field of semiconductor electronic components, and discloses a lead copper frame, which comprises two rows of copper-based frames, each row of copper-based frames comprises a plurality of copper-based units which are connected side by side, and each copper-based unit comprises a radiating fin, a slide glass, an inner pin and an outer pin which are integrally formed in sequence from top to bottom. The inner pins are provided with welding pins, the slide glass is a solid copper plate, the two groups of outer pins of the two copper-based units in each row are crosswise connected together, the end parts of the outer pins in different rows are in point connection with each other, and the adjacent columns are connected through a connecting part. According to the utility model, the copper-based frame is designed in a double-row and symmetrical manner, so that the yield of a single piece is improved, and the yield and quality of products can be ensured at the same time. The copper-based frame is fully covered with copper, the heat dissipation effect is enhanced, the reliability of the product is better, the two symmetrical copper-based units are connected through points, and processing after production is more convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor electronic components, in particular to a lead copper frame. Background Art

[0002] As the chip carrier of the integrated circuit, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the chip's internal circuit lead-out terminals and external leads to form an electrical circuit. It acts as a bridge to connect with external wires. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry. At present, semiconductor electronic components are usually assembled from chips, plastic packaging parts, gold wire or aluminum wire, and lead frames. In order to improve the efficiency of automated production, the lead frame is generally composed of multiple identical copper-based units, and each copper-based unit includes a heat sink, a carrier, inner leads, and outer leads that are sequentially connected into one. The carrier is used to carry the chip of the electronic component. The chip is encapsulated on the carrier after being encapsulated by the plastic packaging body.

[0003] Existing lead frames are usually made up of multiple individual copper-based units connected in a row. This connection method is relatively simple and has low production output. Utility Model Content

[0004] The utility model aims to provide a lead copper frame, which has a double-row design, high single-piece output, high structural strength and good stability.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a lead copper frame, comprising two rows of copper-based frames, each row of the copper-based frames comprising a plurality of copper-based units connected side by side, the copper-based units comprising a heat sink, a carrier, inner pins and outer pins integrally formed from top to bottom, the inner pins being provided with solder feet, the carrier being a solid copper plate, the two groups of outer pins of the two copper-based units in each row being cross-connected together, the ends of the outer pins in different rows being point-connected to each other, and adjacent columns being connected by connecting parts.

[0006] Preferably, at least two rows of first grooves are provided between the inner pins and the solder feet.

[0007] Preferably, the heat sink and the carrier are provided with a first bending portion, a second bending portion is provided between the carrier and the inner pin, and the first bending portion, the second bending portion and the carrier form a sunken second groove.

[0008] Preferably, a third groove is provided on the slide.

[0009] Preferably, the third groove array is provided with a plurality of V-shaped grooves.

[0010] Preferably, the width of the second bent portion gradually narrows from the carrier to the outer lead.

[0011] Preferably, the connecting portion is provided between two adjacent external pins.

[0012] Preferably, the length of the connecting portion is the same as the length of the external pin.

[0013] Preferably, the connecting portion and the copper-based unit are formed integrally.

[0014] Preferably, the connecting portion is provided with a plurality of through holes along its length direction.

[0015] The beneficial effects of this utility model are: the copper-based frame is designed in a double row and symmetrically, which increases the single-piece production while ensuring product yield and quality. The copper-based frame is fully covered with copper, which enhances heat dissipation and improves product reliability. The two symmetrical copper-based units are connected by points, making post-production processing more convenient.

[0016] Other features and advantages of the present invention will be described in detail in the subsequent detailed description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 A schematic structural diagram of a lead copper frame according to an embodiment of the present invention is shown;

[0019] Figure 2 Shows the utility model Figure 1 A in the middle is an enlarged schematic diagram;

[0020] Figure 3 A side view of a copper-based unit according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0021] The following is a detailed description of the specific embodiments of the present invention in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention and are not intended to limit the present invention.

[0022] Please refer to Figure 1-Figure 3The present embodiment discloses a lead copper frame, comprising two rows of copper-based frames 1, each row of copper-based frames 1 comprising a plurality of copper-based units 11 connected side by side, the copper-based units 11 comprising a heat sink 111, a carrier 112, inner pins 113 and outer pins 114 integrally formed from top to bottom, the inner pins 113 being provided with solder feet 115, the carrier 112 being a solid copper plate, the two groups of outer pins 114 of the two copper-based units 11 in each row being cross-connected together, the ends of the outer pins 114 in different rows being point-connected to each other, and adjacent columns being connected via a connecting portion 12.

[0023] The copper-based frame 1 of the lead copper frame of this embodiment is designed in a double-row, symmetrical manner to increase the single-piece output while ensuring product yield and quality. The copper-based frame 1 is fully covered with copper, which enhances the heat dissipation effect and improves the reliability of the product. The two symmetrical copper-based units 11 are connected by points, making post-production processing more convenient. The copper-based units 11 in the same column are connected together by cross-shaped external pins 114, which reduces the total area of the entire lead copper frame. In the same production area, more copper frames can be placed, further improving the output, and subsequent separation is also more convenient and simple.

[0024] Please refer to Figure 2 At least two rows of first grooves 101 are provided between the inner pins 113 and the solder feet 115, so as to increase the friction between the jumper and the copper frame, enhance the stability of the jumper placement position, and avoid offset position.

[0025] Please refer to Figure 2 and Figure 3 The heat sink 111 and the carrier 112 are provided with a first bending portion 1111, and a second bending portion 1121 is provided between the carrier 112 and the inner pin 113. The first bending portion 1111, the second bending portion 1121 and the carrier 112 form a sunken second groove 102. When in use, the chip can be placed in the second groove 102. The second groove 102 is provided to accommodate the chip so that the chip is placed more stably and the chip is reduced from offset during the production process. Furthermore, a third groove 103 is provided on the carrier 112. The shape of the third groove 103 matches the chip to better protect the chip. Specifically, the third groove 103 array is provided with a plurality of V-grooves 1031, which increase the friction between the chip and the third groove 103 and further improve the stability of the chip.

[0026] Preferably, the width of the second bent portion 1121 gradually narrows from the carrier 112 to the outer pin 114, which can improve the overall strength of the copper-based unit 11 and make it more stable during production.

[0027] In this embodiment, the connection portion 12 is disposed between two adjacent external pins 114, thereby improving the stability of the connection between the external pins 114. Specifically, the length of the connection portion 12 is the same as the length of the external pins 114. The connection portion 12 is integrally formed with the copper-based unit 11, making production more convenient. Specifically, the connection portion 12 is provided with a plurality of through holes 121 along its length to facilitate the subsequent separation of adjacent chips.

[0028] In summary, the copper-based frame 1 of this embodiment adopts a double-row, symmetrical design, which improves the single-chip production while ensuring product yield and quality. The copper-based frame 1 is fully covered with copper, which enhances the heat dissipation effect and improves the reliability of the product. The two symmetrical copper-based units 11 are connected by points, making post-production processing more convenient.

[0029] The preferred embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, and these simple modifications all fall within the scope of protection of the present invention. It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0030] In addition, the various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A lead copper frame, characterized in that: It includes two rows of copper-based frames, each row of the copper-based frames includes multiple copper-based units connected side by side, the copper-based units include a heat sink, a carrier, inner pins and outer pins integrally formed from top to bottom, the inner pins are provided with solder feet, the carrier is a solid copper plate, the two groups of outer pins of the two copper-based units in each row are cross-connected together, the ends of the outer pins in different rows are point-connected to each other, and adjacent columns are connected by connecting parts.

2. The lead copper frame according to claim 1, characterized in that: At least two rows of first grooves are provided between the inner pins and the solder feet.

3. The lead copper frame according to claim 1, characterized in that: A first bending portion is provided on the heat sink and the carrier, a second bending portion is provided between the carrier and the inner pin, and the first bending portion, the second bending portion and the carrier form a second inwardly sunken groove.

4. The lead copper frame according to claim 3, characterized in that: A third groove is provided on the slide.

5. The lead copper frame according to claim 4, characterized in that: The third groove array is provided with a plurality of V-shaped grooves.

6. The lead copper frame according to claim 3, characterized in that: The second bent portion gradually narrows in width from the carrier to the outer lead.

7. The lead copper frame according to claim 1, characterized in that: The connecting portion is arranged between two adjacent external pins.

8. The lead copper frame according to claim 7, characterized in that: The length of the connecting portion is the same as the length of the outer pin.

9. The lead copper frame according to claim 7, characterized in that: The connecting portion is integrally formed with the copper-based unit.

10. The lead copper frame according to claim 8, characterized in that: The connecting portion is provided with a plurality of through holes along its length direction.

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