Electronic device

Abstract

The utility model provides electronic equipment, and belongs to the technical field of electronics. The electronic equipment comprises a main board, a metal elastic sheet and a radiation branch knot, the metal elastic sheet is located on the first working surface of the mainboard, and the radiation branch knot is connected with the metal elastic sheet in an abutting mode. The main board comprises a first metal layer, a second metal layer, a middle metal layer and at least two plated-through holes, and the first metal layer is located on the first working surface; the second metal layer is located on the second working surface of the mainboard, and the middle metal layer is located between the first metal layer and the second metal layer; the plated-through holes are located in the main board at intervals, at least one plated-through hole is electrically connected between the first metal layer and the second metal layer, and at least one plated-through hole is electrically connected between the first metal layer and the middle metal layer. According to the electronic equipment, the working bandwidth of the radiation branch knot can be improved, the WiFi 5G frequency band and the WiFi 6e frequency band are covered, and the WiFi communication requirement of the electronic equipment is met.

Description

Technical Field

[0001] The utility model relates to the technical field of electronics, in particular to an electronic device. Background Art

[0002] WiFi (Wireless Fidelity) communication has become an essential feature of electronic devices such as mobile phones. The quality of WiFi communication depends on the performance of the WiFi antenna inside the electronic device.

[0003] In related technologies, WiFi antennas are usually integrated on the frame of electronic devices and connected to the motherboard using metal shrapnel. The metal shrapnel is welded to one side of the motherboard and electrically connected to the metal layer on the other side of the motherboard using a metallized hole passing through the motherboard.

[0004] However, the bandwidth of the above-mentioned WiFi antenna is insufficient and cannot cover the WiFi 5G band and WiFi 6e band, and cannot meet the WiFi communication needs of electronic devices. Utility Model Content

[0005] The utility model provides an electronic device that can solve the problem that the bandwidth of the WiFi antenna is insufficient, the WiFi 5G frequency band and the WiFi 6e frequency band cannot be covered, and the WiFi communication requirements of the electronic device cannot be met.

[0006] The technical solution is as follows:

[0007] An electronic device, comprising: a mainboard, a metal shrapnel, and a radiation branch;

[0008] The metal spring is located on the first working surface of the mainboard, and the radiation branch is pressed and connected with the metal spring;

[0009] The mainboard includes a first metal layer, a second metal layer, at least one intermediate metal layer, and at least two metallized holes, wherein the first metal layer is located on the first working surface and is electrically connected to the metal spring; the second metal layer is located on the second working surface of the mainboard, and the at least one intermediate metal layer is located between the first metal layer and the second metal layer;

[0010] The at least two metallized holes are spaced apart and located in the mainboard, and at least one of the metallized holes is electrically connected between the first metal layer and the second metal layer, and at least one of the metallized holes is electrically connected between the first metal layer and the at least one intermediate metal layer.

[0011] In some embodiments, at least one metallized via electrically connecting the first metal layer and the second metal layer and at least one metallized via electrically connecting the first metal layer and the at least one intermediate metal layer are alternately arranged.

[0012] In some embodiments, the number of the intermediate metal layers is at least two, and each of the intermediate metal layers is electrically connected to the first metal layer through at least one metallized hole.

[0013] In some embodiments, the radiation branch includes an upper frame point, and the upper frame point is pressed and connected with the metal spring.

[0014] In some embodiments, the mainboard further includes at least one fracture structure, and the at least one fracture structure is located on at least one of the second metal layer and the intermediate metal layer.

[0015] In some embodiments, the second metal layer or the middle metal layer on both sides of the at least one fracture structure is electrically connected to the first metal layer through at least one metallized hole.

[0016] In some embodiments, the at least one fracture structure is located on the second metal layer.

[0017] In some embodiments, the mainboard further includes a trace extension line, and the trace extension line is located on the second working surface and electrically connected to the second metal layer.

[0018] In some embodiments, the mainboard further includes a dielectric layer, which is respectively located between the first metal layer and the at least one intermediate metal layer, between two adjacent intermediate metal layers, and between the second metal layer and the at least one intermediate metal layer.

[0019] In some embodiments, the electronic device includes a frame assembly, and the radiation branch is located on the frame assembly.

[0020] The beneficial effects of the technical solution provided by the utility model include at least:

[0021] In the electronic device of the present invention, the radiating branch is connected to the mainboard by means of metal shrapnel. The first working surface of the mainboard is provided with a first metal layer, the second working surface is provided with a second metal layer, and at least one intermediate metal layer is provided between the first metal layer and the second metal layer. The metal shrapnel is electrically connected to the first metal layer, and the first metal layer is electrically connected to the second metal layer and at least one intermediate metal layer respectively by means of metallized holes, so that a pair of coupling capacitors can be formed between the second metal layer and the intermediate metal layer. The coupling capacitor can effectively improve the working bandwidth of the radiating branch, thereby covering the WiFi 5G frequency band and the WiFi 6e frequency band, and meeting the WiFi communication requirements of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 This is a schematic diagram of a partial structure of an electronic device provided by an embodiment of the present utility model;

[0024] Figure 2 This is a partial structural diagram of an electronic device provided by another embodiment of the present utility model;

[0025] Figure 3 This is a partial structural diagram of an electronic device provided by another embodiment of the present utility model;

[0026] Figure 4 This is a partial structural diagram of an electronic device provided by another embodiment of the present utility model;

[0027] Figure 5 This is a schematic diagram of the overall structure of an electronic device provided by another embodiment of the present utility model;

[0028] Figure 6 This is a return loss test effect diagram of an electronic device provided by related technology;

[0029] Figure 7 This is a diagram showing the return loss test results of an electronic device provided by an embodiment of the present utility model.

[0030] The reference numerals in the figures represent respectively:

[0031] 1. Motherboard;

[0032] 101. First working surface; 102. Second working surface;

[0033] 11. First metal layer; 12. Second metal layer; 13. Intermediate metal layer; 14. Metallized hole; 15. Dielectric layer; 16. Fracture structure; 17. Trace extension line;

[0034] 2. Metal shrapnel;

[0035] 3. Radiating branches;

[0036] 31. Upper frame point;

[0037] 4. Border component. DETAILED DESCRIPTION

[0038] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with certain aspects of the present invention, as detailed in the appended claims.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate directions or positional relationships based on the attached figures. Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0040] It should be understood that in the present invention, "electrical connection" can be understood as the physical contact and electrical conduction of components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals. "Communication connection" can refer to electrical signal transmission, including wireless communication connection and wired communication connection. Wireless communication connection does not require a physical medium and does not belong to a connection relationship that limits the product structure. "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship, that is, A and B are connected or A and B are connected, which means that there is a fastening component (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and A and B are difficult to separate.

[0041] Unless otherwise defined, all technical terms used in the embodiments of the present invention have the same meanings as commonly understood by those skilled in the art.

[0042] In order to make the purpose, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0043] Combine Figure 1 As shown, this embodiment provides an electronic device, which includes: a mainboard 1, a metal spring 2, and a radiation branch 3.

[0044] The metal spring 2 is located on the first working surface 101 of the mainboard 1 , and the radiation branch 3 is pressed and connected to the metal spring 2 .

[0045] The mainboard 1 includes a first metal layer 11, a second metal layer 12, at least one intermediate metal layer 13 and at least two metallized holes 14. The first metal layer 11 is located on the first working surface 101 and is electrically connected to the metal spring 2; the second metal layer 12 is located on the second working surface 102 of the mainboard 1, and at least one intermediate metal layer 13 is located between the first metal layer 11 and the second metal layer 12.

[0046] At least two metallized holes 14 are spaced apart in the mainboard 1 , and at least one metallized hole 14 is electrically connected between the first metal layer 11 and the second metal layer 12 , and at least one metallized hole 14 is electrically connected between the first metal layer 11 and at least one intermediate metal layer 13 .

[0047] In the electronic device of this embodiment, the radiation branch 3 is connected to the mainboard 1 by means of a metal shrapnel 2. The first working surface 101 of the mainboard 1 is provided with a first metal layer 11, and the second working surface 102 is provided with a second metal layer 12. There is also at least one intermediate metal layer 13 between the first metal layer 11 and the second metal layer 12. The metal shrapnel 2 is electrically connected to the first metal layer 11, and the first metal layer 11 is electrically connected to the second metal layer 12 and at least one intermediate metal layer 13 respectively by means of metallized holes 14, so that a pair of coupling capacitors can be formed between the second metal layer 12 and the intermediate metal layer 13. The coupling capacitor can effectively improve the working bandwidth of the radiation branch 3, so that it can cover the WiFi 5G frequency band and the WiFi 6e frequency band, and meet the WiFi communication requirements of the electronic device.

[0048] For example, the number of the intermediate metal layers 13 may be one, two, three, etc. In this embodiment, the first metal layer 11 , the intermediate metal layer 13 and the second metal layer 12 are stacked in sequence.

[0049] In another exemplary embodiment, the motherboard 1, also known as the main board or system board, is one of the core components of electronic devices such as mobile phones. The motherboard 1 also integrates electronic components such as the CPU, memory, storage chips, and communication modules.

[0050] Among them, WiFi 5G and WiFi 6e are two different standards of wireless network technology, which have significant differences in frequency bands, speeds and performance.

[0051] The frequency band of WiFi 5G is mainly in the 5GHz band, supports MU-MIMO (Multi-User Multiple Input Multiple Output), can communicate with multiple devices at the same time, can provide higher speed and lower latency, and is suitable for high-definition video streaming and online games.

[0052] In addition to the 2.4GHz and 5GHz bands, WiFi 6e also adds a 6GHz band, which has higher bandwidth and less interference, suitable for high-density environments; it supports a higher number of device connections and improves overall network performance.

[0053] Figure 6 This is a return loss test effect diagram of an electronic device provided by related technology; Figure 7 This is a diagram showing the return loss test results of an electronic device provided by an embodiment of the present utility model.

[0054] from Figure 6 It can be seen that the frequency range in which the return loss of the electronic device provided by the related art is lower than -4dB is 5.2-5.8GHz, which means that the electronic device provided by the related art can only cover 5.2-5.8GHz.

[0055] On the other hand Figure 7 The return loss of the electronic device provided in this embodiment is lower than -4dB in the frequency range of 4.4-7GHz, indicating that the electronic device provided in this embodiment can cover 4.4-7GHz and the working bandwidth is greatly improved.

[0056] Combine Figure 1 As shown, in some embodiments, at least one metallization hole 14 electrically connecting the first metal layer 11 and the second metal layer 12 and at least one metallization hole 14 electrically connecting the first metal layer 11 and at least one intermediate metal layer 13 are alternately arranged.

[0057] Through the above arrangement, the metallized holes 14 connected to the second metal layer 12 and the metallized holes 14 connected to the intermediate metal layer 13 are arranged alternately, so that multiple coupling capacitors can be formed between the second metal layer 12 and the intermediate metal layer 13, further improving the working bandwidth of the coupling branch.

[0058] Combine Figure 1As shown, in some embodiments, the number of the intermediate metal layers 13 is at least two, and each intermediate metal layer 13 is electrically connected to the first metal layer 11 through at least one metallization hole 14 .

[0059] Through the above arrangement, the number of intermediate metal layers 13 is at least two, and each intermediate metal layer 13 is electrically connected to the first metal layer 11 through the metallization hole 14, so that different intermediate metal layers 13 form coupling capacitances with each other, which is beneficial to further improve the working bandwidth of the radiation branch 3.

[0060] Combine Figure 1 As shown, in some embodiments, the radiation branch 3 includes an upper frame point 31 , and the upper frame point 31 is pressed and connected with the metal spring 2 .

[0061] In this embodiment, the radiating branch 3 is pressed against the metal spring 2 via the upper frame point 31 , so that the mainboard 1 can feed the radiating branch 3 with power by using the metal spring 2 and the upper frame point 31 .

[0062] Combine Figure 2 As shown, in some embodiments, the mainboard 1 further includes at least one fracture structure 16 , and the at least one fracture structure 16 is located on at least one of the second metal layer 12 and the intermediate metal layer 13 .

[0063] Through the above arrangement, the fracture structure 16 can separate the second metal layer 12 or the intermediate metal layer 13 into at least two parts, and the second metal layers 12 or the intermediate metal layers 13 on both sides can respectively form different coupling capacitors, further improving the working bandwidth of the radiation branch 3.

[0064] Combine Figure 2 As shown, in some embodiments, the second metal layer 12 or the intermediate metal layer 13 on both sides of at least one fracture structure 16 is electrically connected to the first metal layer 11 through at least one metallization hole 14 .

[0065] Through the above arrangement, the second metal layer 12 or the intermediate metal layer 13 on both sides of the fracture structure 16 are electrically connected to the first metal layer 11 using the metallized holes 14 respectively. The second metal layer 12 separated by the fracture structure 16 or the intermediate metal layer 13 separated by the fracture structure 16 can respectively form multiple coupling capacitors, which is beneficial to improving the working bandwidth of the radiation branch 3.

[0066] Combine Figure 2 As shown, in some embodiments, at least one fracture structure 16 is located on the second metal layer 12 .

[0067] Through the above arrangement, the fracture structure 16 is located on the second metal layer 12. The two parts of the second metal layer 12 separated by the fracture structure 16 can respectively form coupling capacitors with the corresponding areas of the corresponding intermediate metal layer 13. The two parts of the second metal layer 12 can also form coupling capacitors with each other, which is beneficial to improving the working bandwidth of the radiation branch 3.

[0068] Combine Figure 3 and Figure 4 As shown, in some embodiments, the mainboard 1 further includes a trace extension line 17 . The trace extension line 17 is located on the second working surface 102 and is electrically connected to the second metal layer 12 .

[0069] In the electronic device of this embodiment, a routing extension line 17 is arranged on the second working surface 102 . The routing extension line 17 is electrically connected to the second metal layer 12 . The routing extension line 17 can form a coupling branch, thereby improving the working bandwidth of the radiation branch 3 .

[0070] Exemplarily, the shape of the routing extension line 17 includes but is not limited to a straight line, a curve, or a spiral line, etc.

[0071] Combine Figures 1 to 4 As shown, in some embodiments, the mainboard 1 further includes a dielectric layer 15 , which is respectively located between the first metal layer 11 and at least one intermediate metal layer 13 , between two adjacent intermediate metal layers 13 , and between the second metal layer 12 and at least one intermediate metal layer 13 .

[0072] Through the above arrangement, the first metal layer 11 , the middle metal layer 13 and the second metal layer 12 are insulated from each other by the dielectric layer 15 .

[0073] Combine Figure 5 As shown, in some embodiments, the electronic device includes a frame assembly 4, and the radiation branch 3 is located on the frame assembly 4. Through the above arrangement, the radiation branch 3 is located on the frame assembly 4 of the electronic device, forming a frame antenna.

[0074] In some possible implementations, the electronic device may be any of various types of computer system devices that are mobile or portable and perform wireless communication.

[0075] Exemplarily, the electronic device can be a mobile phone or smart phone (e.g., an iPhone™-based, Android™-based phone), a portable gaming device (e.g., a Nintendo DS™, a PlayStation Portable™, a Gameboy Advance™, an iPhone™), a laptop, a PDA, a portable Internet device, a music player, and a data storage device, other handheld devices, and devices such as headphones, etc. The electronic device can also be other wearable devices that need to be charged (e.g., a head-mounted device (HMD) such as an electronic bracelet, an electronic necklace, an electronic device, or a smart watch).

[0076] The electronic device can also be any one of a plurality of electronic devices, including but not limited to cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, other media recorders, radios, medical devices, vehicle transportation instruments, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal digital assistants (PDAs), portable multimedia players (PMPs), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, portable medical devices, and digital cameras and combinations thereof.

[0077] In some cases, the electronic device can perform multiple functions (e.g., play music, display video, store pictures, and receive and send phone calls). If desired, the electronic device can be a cellular phone, a media player, other handheld device, a wristwatch device, a pendant device, an earpiece device, or other compact portable device.

[0078] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0079] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0080] In the description of this specification, the reference terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention.

[0081] The above description is merely an embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that: The electronic device comprises: a mainboard (1), a metal shrapnel (2), and a radiation branch (3); The metal spring (2) is located on the first working surface (101) of the main board (1), and the radiation branch (3) is pressed and connected to the metal spring (2); The mainboard (1) comprises a first metal layer (11), a second metal layer (12), at least one intermediate metal layer (13) and at least two metallized holes (14); the first metal layer (11) is located on the first working surface (101) and is electrically connected to the metal spring (2); the second metal layer (12) is located on the second working surface (102) of the mainboard (1), and the at least one intermediate metal layer (13) is located between the first metal layer (11) and the second metal layer (12); The at least two metallized holes (14) are respectively spaced apart and located in the mainboard (1), and at least one of the metallized holes (14) is electrically connected between the first metal layer (11) and the second metal layer (12), and at least one of the metallized holes (14) is electrically connected between the first metal layer (11) and the at least one intermediate metal layer (13).

2. The electronic device according to claim 1, wherein At least one metallized hole (14) electrically connecting the first metal layer (11) and the second metal layer (12) and at least one metallized hole (14) electrically connecting the first metal layer (11) and the at least one intermediate metal layer (13) are alternately arranged.

3. The electronic device according to claim 1, wherein The number of the intermediate metal layers (13) is at least two, and each intermediate metal layer (13) is electrically connected to the first metal layer (11) via at least one metallized hole (14).

4. The electronic device according to claim 1, wherein: The radiation branch (3) comprises an upper frame point (31), and the upper frame point (31) is pressed and connected with the metal spring (2).

5. The electronic device according to claim 1, wherein The main board (1) further comprises at least one fracture structure (16), wherein the at least one fracture structure (16) is located on at least one of the second metal layer (12) and the intermediate metal layer (13).

6. The electronic device according to claim 5, characterized in that The second metal layer (12) or the intermediate metal layer (13) on both sides of the at least one fracture structure (16) is electrically connected to the first metal layer (11) through at least one metallized hole (14).

7. The electronic device according to claim 6, wherein: The at least one fracture structure (16) is located on the second metal layer (12).

8. The electronic device according to any one of claims 1 to 7, characterized in that: The mainboard (1) further includes a wiring extension line (17), wherein the wiring extension line (17) is located on the second working surface (102) and is electrically connected to the second metal layer (12).

9. The electronic device according to claim 1, wherein: The mainboard (1) further comprises a dielectric layer (15), wherein the dielectric layer (15) is respectively located between the first metal layer (11) and the at least one intermediate metal layer (13), between two adjacent intermediate metal layers (13), and between the second metal layer (12) and the at least one intermediate metal layer (13).

10. The electronic device according to claim 1, wherein The electronic device comprises a frame assembly (4), and the radiation branch (3) is located on the frame assembly (4).

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