Laser equipment

Abstract

The utility model discloses a laser device. The system comprises a heat dissipation module, a laser, a laser processing head and a laser main control board, the heat dissipation module is connected with the laser main control board; the laser is connected with the laser main control board in a control and acquisition mode. According to the utility model, each heating module and the laser processing head can be actively cooled or cooled in advance through the monitoring system according to the running state, so that the technical problems of overshoot and delay of temperature control, troublesome operation and higher comprehensive cost caused by the passive heat dissipation mode of the traditional laser are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser heat dissipation, in particular to a laser device. Background Art

[0002] During normal operation, the electro-optical and optical-optical conversion efficiencies of a laser cannot be 100%. Therefore, when converting electrical energy into laser output, the MOS transistor driver of the electrical module generates heat, and the laser output of the optical module also experiences significant energy loss. Heat accumulation, if not dissipated promptly, can damage the laser electrical and optical modules, necessitating cooling. A suitable operating temperature increases the laser's lifespan and spot quality, improving the system's dynamic stability and the consistency of the processing process.

[0003] Current lasers typically use passive water cooling with a chiller. This cooling system only starts when it detects a change in the cooling water temperature in the thermal cycle. Therefore, the temperature control of passive water cooling equipment is subject to overshoot and delay, which can easily lead to false temperature and humidity alarms in the laser, unstable temperature control, and low energy conversion efficiency. Utility Model Content

[0004] In order to solve at least one of the above-mentioned technical problems, the present invention provides a laser device to solve the technical problems of overshoot and delay in temperature control, complicated operation and high overall cost caused by the traditional passive heat dissipation method of lasers.

[0005] A laser device is proposed, comprising: a heat dissipation module, a laser, a laser processing head and a laser main control board;

[0006] The heat dissipation module is connected to the laser main control board through the IO port, analog-to-digital converter ADC, RS485 interface or CANopen protocol, digital-to-analog converter DAC or pulse width modulation, and is used to dissipate heat for each module of the laser and the laser processing head;

[0007] The laser is connected to the laser main control board through control and acquisition to generate laser.

[0008] In one embodiment, the heat dissipation module includes a refrigerant module, which includes a four-way valve, a refrigerant medium switch, a compressor, a condenser, an electronic expansion valve and an evaporator, and is used to provide refrigerant heat dissipation.

[0009] In one embodiment, a laser electrical module, a laser optical module, a laser beam combining module, and a multi-channel optical shutter;

[0010] The refrigerant module includes: electric water cooling plate, optical water cooling plate, beam combining water cooling plate and optical gate water cooling plate;

[0011] The laser electrical module includes a plurality of first laser single-mode master controllers, an electric water cooling plate and an electronic expansion valve in communication, and is used for actively cooling or heating the plurality of first laser single-modes;

[0012] The laser optical module includes multiple second laser single-mode master controllers, and the optical water cooling plate is connected to the electronic expansion valve for actively cooling or heating the multiple second laser single-modes;

[0013] The laser beam combining module includes a laser PD acquisition board. The beam combining water cooling plate is connected to the electronic expansion valve to actively dissipate heat or heat multiple laser PD acquisition boards.

[0014] The multi-channel optical shutter includes multiple output channels. The optical shutter water cooling plate is connected to the electronic expansion valve for cooling or heating the multiple output channels.

[0015] In one embodiment, the laser main control board is connected to the solenoid valve through the IO port to control the four-way valve and the refrigerant medium switch;

[0016] The laser main control board is connected to the inverter in the compressor through the RS485 interface or CANopen protocol to exchange status information and control the motor drive of the compressor;

[0017] The laser main control board is connected to the fan in the condenser through a digital-to-analog converter DAC or pulse width modulation PMW to control the speed of the fan and adjust the heat dissipation or cooling degree;

[0018] The laser main control board is connected to the electronic expansion valve through the digital-to-analog converter DAC or pulse width modulation PMW to control the flow of the electronic expansion valve;

[0019] The laser main control board is connected to the refrigerant module environment monitor through the analog-to-digital converter ADC. The refrigerant module environment monitor collects temperature, humidity and air pressure information of the refrigerant module and sends it to the laser main control board.

[0020] In one embodiment, the refrigerant module includes an external ambient temperature monitor for real-time collection of the external ambient temperature. The laser main control board is connected to the external ambient temperature monitor to adjust the opening of the electronic expansion valve, the fan speed of the condenser or the fan speed of the evaporator to achieve flow control of each water-cooled plate.

[0021] In one embodiment, the heat dissipation module includes a water cooling module and a TEC cooling plate. The water cooling module provides water cooling for the laser, and the TEC cooling plate provides water cooling for the laser processing head.

[0022] In one embodiment, the water cooling module includes an evaporation capillary, a water outlet, a water inlet, a water pump, a water tank, and a heat sink MOS;

[0023] The laser main control board is connected to the water tank through the analog-to-digital converter DAC, and the water volume information and water pressure information of the water tank are sent to the laser main control board;

[0024] The laser main control board is connected to the water pump through the digital-to-analog converter DAC to control the operation of the water pump;

[0025] The laser main control board is connected to the water tank through the IO port to collect water quality information in the water tank;

[0026] The laser main control board is connected to the cooling plate MOS through the IO port to control the operation of the water pump and control the TEC cooling plate through current.

[0027] In one embodiment, the water cooling module includes a turbidity sensor for detecting the water quality in the water tank. The water cooling module includes a transparent U-shaped tube, which is arranged outside the water tank for checking the water volume inside the water tank.

[0028] In one embodiment, the laser main control board is connected to the laser electrical module in a control and acquisition manner, controls the power of the laser electrical module and the switching of the laser, and collects status information and alarm information of the laser electrical module;

[0029] The laser main control board is connected to the laser beam combining module through control and acquisition, sets the alarm reference value of the laser beam combining module, and collects the forward light, output light power and return light power of the laser beam combining module;

[0030] The laser main control board is connected to the multi-channel optical gate through control and acquisition, setting the output channel and alarm reference value of the multi-channel optical gate, collecting the temperature and humidity inside the multi-channel optical gate to control the PD sensor and the in-position return to zero limit switch;

[0031] The laser main control board is connected to the laser processing head through control and acquisition, and collects contact information, temperature and water flow alarm information of the laser processing head.

[0032] In one embodiment, the heat dissipation module includes a power supply, and the laser main control board is connected to the power supply via an analog-to-digital converter ADC to receive status information of overvoltage, overcurrent, short circuit and leakage detection of the power supply.

[0033] The utility model is based on the forward-looking control technology. The laser synchronously controls the heat dissipation module while outputting the laser, realizing the synchronous control of light output and heat dissipation. The active heat dissipation method prevents the temperature of each module inside the laser from being overcharged or having a temperature rise delay, so that each module is at a suitable operating temperature, solving the problem of overshoot and delay in temperature control.

[0034] When the actual output power of the laser is the peak power of the output light multiplied by the duty cycle of the output light, the corresponding refrigerant compressor variable frequency control speed and the corresponding expansion valve opening, the speed of the heat conversion fan have a correlation function algorithm relationship. The main control processor realizes real-time synchronous control of internal data, and then collects the temperature of the refrigerant module, performs closed-loop control and dynamic compensation, and dynamically adjusts the temperature of the refrigerant module, solving the problems of cumbersome operation and high overall cost. Through the monitoring system, according to the operating status in advance, the refrigerant module can be used to dissipate heat or heat the laser, and the water cooling module can be used to dissipate heat from the laser output head.

[0035] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the drawings required for use in the embodiments of the present invention or the background technology will be described below.

[0037] The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present disclosure and, together with the specification, are used to illustrate the technical solutions disclosed in the present utility model.

[0038] Figure 1 A schematic diagram of a laser device provided in an embodiment of the present utility model;

[0039] Figure 2 A schematic diagram of a refrigerant module provided in an embodiment of the present utility model;

[0040] Figure 3 This is a schematic diagram of a water cooling module provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0042] The terms "first," "second," and so on, in the specification and claims of this utility model and the accompanying drawings are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0043] The term "and / or" herein simply describes an association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent the existence of three situations: A alone, A and B simultaneously, and B alone. Furthermore, the term "at least one" herein refers to any combination of at least two of any one or more of a plurality of items. For example, "at least one of A, B, and C" can represent any one or more elements selected from the set consisting of A, B, and C.

[0044] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0045] In addition, numerous specific details are provided in the following detailed description to better illustrate the present invention. Those skilled in the art will appreciate that the present invention can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art are not described in detail in order to highlight the main points of the present invention.

[0046] Current lasers typically use passive water cooling with a chiller. Water from the cooling tower's basin is pumped to the chiller's condenser to cool it. The water then flows back into the cooling tower, where it is cooled by fans atop the tower before returning to the basin. This repetitive cycle requires the installation of external water lines and chillers, resulting in high overall costs. The equipment is bulky and occupies a large footprint. Furthermore, cooling the condenser, which in turn cools the laser and output head, is inefficient and consumes more energy. Because it operates in a passive cooling mode, the chiller only activates to cool the laser when it detects a change in the circulating cooling water temperature. Consequently, passive water cooling systems experience overshoot and delay in temperature control, which can easily cause false temperature and humidity alarms, unstable temperature control, and low energy conversion efficiency. Water cooling requires a chiller and water tank to continuously circulate cooling water to dissipate heat from the cold plate. Currently, most chillers and water tanks are external to the laser, forcing the laser to be fixed and immovable, increasing its size and footprint. External water cooling equipment cannot be dynamically correlated with the laser's optical power and parameters, making integrated dynamic real-time monitoring of water cooling information impossible. Current laser welding systems with shutters rely on external chillers for heat dissipation. The laser, shutter, and laser welding output head all require separate external water pipes, resulting in complex water distribution, high maintenance costs, and cumbersome operation. Refrigerant equipment and laser equipment are separate products within different industry sectors, making modular integration difficult.

[0047] The utility model is based on forward-looking control technology. The laser master controls the heat dissipation module synchronously while outputting the laser, realizing synchronous control of light emission and heat dissipation. The active heat dissipation method prevents the temperature of the laser pump unit from being overcharged or having a temperature rise delay, so that the laser pump unit and the optical fiber are at a suitable operating temperature, solving the problem of overshoot and delay in temperature control. When the actual light output power of the laser is the peak power of the light output multiplied by the duty cycle of the light output, the corresponding refrigerant compressor variable frequency control speed and the corresponding expansion valve opening, the speed of the heat conversion fan have a related function algorithm relationship, the main control processor realizes real-time synchronous control of internal data, and then collects detailed parameters of the refrigerant module and each module of the laser to perform closed-loop control and dynamic compensation. Dynamic adjustment of the refrigerant module solves the problems of cumbersome operation and high overall cost. An optical shutter is integrated inside, which can proactively cool down or dissipate heat for each heating module based on the operating status in advance through the monitoring system. The refrigerant module is used to dissipate heat or heat the laser, and the water cooling module is used to dissipate heat for the laser output head. The system integrates the functions of refrigerant heat dissipation and laser functions, solving the technical problem of the passive water cooling method of chillers used in traditional lasers, which occupies a large area. Example

[0048] A laser device, such as Figure 1 As shown, it includes: a heat dissipation module, a laser and a laser main control board;

[0049] The heat dissipation module is connected to the laser main control board through an IO port, an analog-to-digital converter ADC, an RS485 interface or a CANopen protocol, a digital-to-analog converter DAC or a pulse width modulation, and is used to dissipate heat for a laser device;

[0050] The laser is connected to the laser main control board through control and acquisition to generate laser;

[0051] A laser device integrates the functions of refrigerant cooling, water cooling and laser, and is centrally processed and controlled by the MCU and FPGA of the main control board;

[0052] In one embodiment, the main control board processes the user interaction interface externally, and the PC monitoring software communicates with the laser main control board via Ethernet or RS232 to monitor the status of the refrigerant and the laser; the power interface simultaneously supplies power to the refrigerant and the laser, and the laser main control board detects overvoltage, overcurrent, short circuit, and leakage faults;

[0053] Users can control the laser light through external control signals, bus interface or mobile phone APP, and read the laser status in real time;

[0054] The laser main control board has a START green light indicator and a start button. In an emergency, press the emergency stop button to stop the laser from emitting light.

[0055] Preferably, the heat dissipation module comprises: a heat dissipation module power supply, a refrigerant module and a water cooling module;

[0056] Refrigerant module, such as Figure 2 , including a four-way valve, a refrigerant module environmental monitor, a refrigerant medium switch, a compressor, a condenser, an electronic expansion valve and an evaporator, which are used to provide refrigerant heat dissipation.

[0057] like Figure 3 The water cooling machine module includes an evaporation capillary, a water outlet, a water inlet, a water pump, a water tank, a MOS cooling plate, a TEC cooling plate and a laser processing head, which are used to provide water cooling heat dissipation.

[0058] Preferably, the refrigerant module, the water cooling module and the laser main control board are connected respectively:

[0059] In one embodiment, the laser main control board is connected to the solenoid valve through the IO port to control the four-way valve and the refrigerant medium switch;

[0060] In one embodiment, the laser main control board is connected to the inverter in the compressor via the RS485 interface or CANopen protocol to exchange status information and control the motor drive of the compressor;

[0061] In one embodiment, the laser main control board is connected to the fan in the condenser via a digital-to-analog converter (DAC) or a pulse width modulation (PWM) to control the fan speed and adjust the heat dissipation or cooling degree. The laser main control board is connected to the electronic expansion valve via a digital-to-analog converter (DAC) or a pulse width modulation (PMW) to control the flow rate of the electronic expansion valve.

[0062] In one embodiment, the laser main control board is connected to the refrigerant module environment monitor via an analog-to-digital converter (ADC). The refrigerant module environment monitor collects temperature, humidity, and air pressure information of the refrigerant module and sends it to the laser main control board.

[0063] In one embodiment, the refrigerant module dissipates heat for each electrical module and optical module in the laser; the frequency converter controls the operation of the compressor to form high-temperature and high-pressure gas, which is liquefied through the condenser to dissipate heat and take away the heat, outputting medium-temperature and high-pressure liquid, which enters the expansion valve to form low-temperature and low-pressure liquid vaporization, flows through the evaporator, and absorbs heat to dissipate heat for the laser.

[0064] The four-way valve on the cooling module switches between cooling and heating. When the laser is in a cold environment, the cooling module needs to switch to heating mode to keep the laser at a normal operating temperature. Optionally, an external ambient temperature sensor can be used to collect real-time ambient temperature data, helping to reduce the laser's overall power consumption and improve the wall-mount efficiency of the laser.

[0065] In one embodiment, the refrigerant switch controls the release and closing of the heat dissipation medium so that the compressor is not in a high-pressure and high-load state when starting, thereby controlling the safe flow of the heat dissipation medium. The laser main control board controls the inverter via RS485 or CANopen, and controls the fan speed via PWM or analog quantity to achieve fan cooling.

[0066] In one embodiment, the opening of the electronic expansion valve is controlled by PWM or analog quantity to achieve flow control, thereby controlling the temperature within a constant range and improving the cooling or heating accuracy.

[0067] Preferably, the water chiller module is connected to the laser main control board. The laser main control board is connected to the water tank via the analog-to-digital converter DAC, and the water volume information and water pressure information of the water tank are sent to the laser main control board; the laser main control board is connected to the water pump via the digital-to-analog converter DAC to control the operation of the water pump;

[0068] In one embodiment, the laser main control board connects to the water tank via an IO port to collect water quality information. The laser main control board also connects to the cooling plate MOS (metal assisted cooling system) via the IO port to control the operation of the water pump and the TEC (electrical control panel) cooling plate via current. The refrigerant, dissipated through the evaporative capillary copper tube, enters the water tank through the inlet, cools the water tank, and then outputs the heat to the compressor through the evaporative capillary outlet.

[0069] The water pump in the water tank outputs cooling water to the laser processing head for heat dissipation;

[0070] In one embodiment, the laser main control board collects temperature and humidity data from multiple points of the refrigerant module and the water cooling module in real time, detects the refrigerant heat dissipation temperature and the laser heat dissipation temperature, forms a closed-loop control, and generates a dew point slope alarm based on the condensation correlation data of temperature and humidity;

[0071] The FPGA collects the high and low pressure of the refrigerant through the ADC to confirm the normal operation of the refrigerant compressor and expansion valve, and there is no out-of-control abnormality, ensuring the normal operation of the expansion valve and compressor to avoid overpressure explosion.

[0072] In one embodiment, the controller controls the water tank pump through the DAC to realize water cooling circulation at the external output head end, and can control the water flow to realize temperature control of the output head.

[0073] In one embodiment, when the water quality in the water tank deteriorates, the turbidity sensor can detect the water quality and remind the user to replace the circulating water or the filter element.

[0074] In one embodiment, a transparent U-shaped tube is installed on the outside of the water tank to facilitate viewing of the water volume. The controller collects the AD value of the water volume sensor to generate alarm logic to remind the user to replenish circulating water.

[0075] Preferably, the laser comprises: a laser electrical module, a laser optical module, a laser beam combining module, a multi-channel optical shutter and a laser processing head;

[0076] In one embodiment, the laser includes: a laser electrical module, a laser optical module, a laser beam combining module, and a multi-channel optical gate; the refrigerant module includes: an electric water cooling plate, an optical water cooling plate, a beam combining water cooling plate, and an optical gate water cooling plate; the laser electrical module includes multiple first laser single-mode master controls, and the electric water cooling plate is connected to an electronic expansion valve for actively dissipating heat or heating the multiple first laser single-mode master controls; the laser optical module includes multiple second laser single-mode master controls, and the optical water cooling plate is connected to an electronic expansion valve for actively dissipating heat or heating the multiple second laser single-mode master controls; the laser beam combining module includes a laser PD acquisition board, and the beam combining water cooling plate is connected to an electronic expansion valve for actively dissipating heat or heating the multiple laser PD acquisition board master controls; the multi-channel optical gate includes multiple output channels, and the optical gate water cooling plate is connected to an electronic expansion valve for actively dissipating heat or heating the multiple output channels.

[0077] In one embodiment, the laser optical module realizes multi-ring welding spot control; the laser main control board independently controls the multi-channel driving board to drive the optical module to output laser, and the beam combining module synthesizes the spot for composite welding application.

[0078] The laser main control board collects the voltage and sampling current of the driver board to form a closed-loop control. The optical module collects the laser's forward light and module output power, as well as the laser return power, to form a closed-loop control to protect the laser circuit and laser pump source.

[0079] The laser beam combining module collects the power of the laser beam and the return light power to generate an alarm.

[0080] The laser main control board sets the alarm reference values of the electrical module, optical module, and PD acquisition board, and adapts to the parameter configuration of different models;

[0081] The multi-channel shutter built into the welding machine laser collects shutter sensor information through the MCU and FPGA of the laser main control board, and completes motor control through the laser main control board to achieve switching of the output shutter channel;

[0082] The laser processing head collects water flow, installation contacts, water flow and output head temperature, and feeds them back to the main control board to form safety alarm control;

[0083] The laser main control board outputs voltage and a heat sink is installed at the output head. The laser main control board outputs different currents to control the heat dissipation and dissipate heat for the laser processing head.

[0084] Preferably, the laser is connected to the laser main control board through a control and acquisition method, including:

[0085] The laser main control board is connected to the laser electrical module through control and acquisition, controls the power of the laser electrical module and the laser switch, and collects the status information and alarm information of the laser electrical module;

[0086] The laser main control board is connected to the laser beam combining module through control and acquisition, sets the alarm reference value of the laser beam combining module, and collects the forward light, output light power and return light power of the laser beam combining module;

[0087] The laser main control board is connected to the multi-channel optical gate through control and acquisition, setting the output channel and alarm reference value of the multi-channel optical gate, collecting the temperature and humidity inside the multi-channel optical gate to control the PD sensor and the in-position return to zero limit switch;

[0088] The laser main control board is connected to the laser processing head through control and acquisition, and collects contact information, temperature and water flow alarm information of the laser processing head.

[0089] Preferably, the heat dissipation module, the laser and the laser main control board form a heat dissipation closed loop, including: real-time synchronization of the closed loop between the heat dissipation module and the laser;

[0090] The compressor compresses the medium-temperature and low-pressure gas into high-temperature and high-pressure gas;

[0091] The condenser condenses high-temperature and high-pressure gas into medium-temperature and high-pressure liquid;

[0092] The electronic expansion valve expands the medium-temperature and high-pressure liquid into a first low-temperature and low-pressure liquid;

[0093] an evaporator, converting the first low-temperature, low-pressure liquid into a first medium-temperature, low-pressure gas;

[0094] The evaporator, compressor, condenser and electronic expansion valve form a liquid-gas heat dissipation cycle in the refrigerant module, which is used for laser refrigerant heat dissipation;

[0095] The second low-temperature, low-pressure liquid enters the water tank through the first evaporation capillary tube, and the second low-temperature, low-pressure liquid evaporates into a second medium-temperature, low-pressure gas, which cools the water in the water tank;

[0096] The water inlet and outlet are physically connected to the electric water cooling plate, optical water cooling plate, beam combining water cooling plate, optical gate water cooling plate and laser processing head for water cooling and heat dissipation of the laser;

[0097] The TEC cooling sheet is physically connected to the laser processing head for cooling and heat dissipation.

[0098] Preferably, the heat dissipation module power supply is connected to the laser main control board via an analog-to-digital converter ADC to receive status information of overvoltage, overcurrent, short circuit and leakage detection of the heat dissipation module power supply.

[0099] Optionally, the refrigerant module also includes a throttling device, which indirectly controls the changes of the evaporator, compressor, condenser and electronic expansion valve through the throttling device, so that the parameters such as the temperature and pressure of the refrigerant can change more smoothly, thereby avoiding the adverse effects of sudden changes in the refrigerant parameters on the various modules inside the laser.

[0100] Optionally, when the external environment temperature changes suddenly, for example, when the external environment changes from low temperature to high temperature, the controllable heat dissipation medium module and the water cooling module are preheated at a lower temperature for a predetermined time, and then heated to a high temperature through a higher temperature threshold to prevent the temperature from changing too much, causing damage to the wires, optical lenses and other precision components inside the laser. Example

[0101] The present application also discloses a laser device, which includes a laser and a laser processing head, wherein a multi-channel optical gate, a water cooling machine module and a refrigerant module are all integrated inside the laser housing, thereby realizing high modularization and integration of the laser device, reducing the footprint and equipment volume, and reducing after-sales maintenance costs.

[0102] Furthermore, the optical shutter in this case can be integrated into the laser housing, a modular design that facilitates disassembly and installation, facilitating the integration of different product forms into the overall BOM. Optionally, the optical shutter and laser can share the same laser host computer monitoring software or mobile terminal monitoring app to monitor their status and enable remote upgrades, greatly simplifying operation and creating a chain protection mechanism for enhanced safety.

[0103] 1. The laser module, control board and heat dissipation module are integrated into the laser housing to realize the integrated cooling design of the laser equipment, reduce the total volume, weight and occupied space of the laser equipment, and improve the mobility of the laser equipment.

[0104] 2. The cooling system combines a refrigerant direct cooling system with a water cooling system to achieve multiple working modes. The refrigerant plate cools and dissipates heat to the laser module. Compared with the traditional water cooling solution, it has higher heat dissipation efficiency and lower heat dissipation temperature. It can quickly remove the heat generated inside the laser module and has higher heat dissipation efficiency. The refrigerant provided by the refrigerant cooling system cools and dissipates heat to the laser module.

[0105] 3. The cooling system can realize intelligent cooling control through the main control module, so that the cooling system can switch freely in different working modes to adapt to the cooling needs of different scenarios. It can also actively and adaptively adjust the operation of compressors, fans, etc. according to the temperature, laser output power, duration, etc. monitored in real time by the laser module and water tank to provide a cooling environment and temperature that meets the requirements.

[0106] 4. The refrigerant plate is set inside the sealed laser module, making the optical path module inside the laser less likely to be exposed to the external environment, avoiding the occurrence of condensation.

[0107] 5. The laser module is directly cooled by a refrigerant plate, which reduces the number of external interfaces of the laser module, makes it easier to seal, and improves the sealing performance.

[0108] In some embodiments, the functions or modules included in the device provided by the disclosed embodiments of the present invention can be used to execute the method described in the above method embodiment. Its specific implementation can refer to the description of the above method embodiment. For the sake of brevity, it will not be repeated here.

[0109] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0110] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here. Those skilled in the art will also clearly understand that the descriptions of the various embodiments of the present invention have different focuses. For the convenience and brevity of description, the same or similar parts may not be repeated in different embodiments. Therefore, for parts not described or not described in detail in a certain embodiment, reference can be made to the descriptions of other embodiments.

[0111] In the several embodiments provided by the present invention, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0112] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0113] Those skilled in the art will appreciate that all or part of the process steps in the above-described method embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program can include the process steps in the above-described method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A laser device, characterized in that: include: Heat dissipation module, laser, laser processing head and laser main control board; The heat dissipation module is connected to the laser main control board through an IO port, an analog-to-digital converter ADC, an RS485 interface or a CANopen protocol, a digital-to-analog converter DAC or a pulse width modulation, and is used to dissipate heat for each module of the laser and the laser processing head; The laser is connected to the laser main control board in a control and acquisition manner to generate laser light.

2. The laser device according to claim 1, characterized in that The heat dissipation module includes a refrigerant module, which includes a four-way valve, a refrigerant medium switch, a compressor, a condenser, an electronic expansion valve and an evaporator, and is used to provide refrigerant heat dissipation.

3. The laser device according to claim 2, characterized in that The laser includes: a laser electrical module, a laser optical module, a laser beam combining module, and a multi-channel optical gate; The refrigerant module includes: an electric water cooling plate, an optical water cooling plate, a beam combining water cooling plate and an optical gate water cooling plate; The laser electrical module includes a plurality of first laser single-mode master controllers, and the electric water cooling plate is connected to the electronic expansion valve for actively cooling or heating the plurality of first laser single-modes; The laser optical module includes a plurality of second laser single-mode master controllers, and the optical water cooling plate is connected to the electronic expansion valve for actively cooling or heating the plurality of second laser single-mode master controllers; The laser beam combining module includes a laser PD acquisition board, and the beam combining water cooling plate is connected to the electronic expansion valve for actively dissipating heat or heating the multiple laser PD acquisition boards; The multi-channel optical shutter comprises a plurality of output channels, and the optical shutter water cooling plate is in communication with the electronic expansion valve for cooling or heating the plurality of output channels.

4. The laser device according to claim 2, characterized in that The laser main control board is connected to the solenoid valve through the IO port to control the four-way valve and the refrigerant medium switch; The laser main control board is connected to the frequency converter in the compressor via the RS485 interface or CANopen protocol to exchange status information and control the motor drive of the compressor; The laser main control board is connected to the fan in the condenser through a digital-to-analog converter DAC or a pulse width modulation PMW to control the speed of the fan and adjust the heat dissipation or cooling degree; The laser main control board is connected to the electronic expansion valve via a digital-to-analog converter DAC or a pulse width modulation PMW to control the flow rate of the electronic expansion valve; The laser main control board is connected to the refrigerant module environment monitor via an analog-to-digital converter ADC. The refrigerant module environment monitor collects temperature, humidity and air pressure information of the refrigerant module and sends the information to the laser main control board.

5. The laser device according to claim 2, characterized in that The refrigerant module includes an external ambient temperature monitor for real-time collection of the external ambient temperature. The laser main control board is connected to the external ambient temperature monitor to adjust the opening of the electronic expansion valve, the fan speed of the condenser or the fan speed of the evaporator to achieve flow control of each water-cooled plate.

6. The laser device according to claim 1, characterized in that The heat dissipation module includes a water cooling module and a TEC refrigeration plate. The water cooling module provides water cooling for the laser, and the TEC refrigeration plate provides water cooling for the laser processing head.

7. The laser device according to claim 6, characterized in that The water cooling module includes an evaporation capillary, a water outlet, a water inlet, a water pump, a water tank, and a heat sink MOS; The laser main control board is connected to the water tank via an analog-to-digital converter DAC, and the water volume information and water pressure information of the water tank are sent to the laser main control board; The laser main control board is connected to the water pump via a digital-to-analog converter DAC to control the operation of the water pump; The laser main control board is connected to the water tank via the IO port to collect the water quality status in the water tank; The laser main control board is connected to the cooling plate MOS through the IO port to control the operation of the water pump and control the TEC cooling plate through current.

8. The laser device according to claim 7, characterized in that The water cooling module includes a turbidity sensor for detecting the water quality in the water tank. The water cooling module includes a transparent U-shaped tube, which is arranged outside the water tank for checking the water volume inside the water tank.

9. The laser device according to claim 3, characterized in that The laser main control board is connected to the laser electrical module in a control and acquisition manner, controls the power of the laser electrical module and the laser switch, and collects status information and alarm information of the laser electrical module; The laser main control board is connected to the laser beam combining module in a control and acquisition manner, sets an alarm reference value of the laser beam combining module, and collects the forward light, output light power, and return light power of the laser beam combining module; The laser main control board is connected to the multi-channel optical gate in a control and acquisition manner, sets the output channel and alarm reference value of the multi-channel optical gate, and collects the temperature and humidity inside the multi-channel optical gate to control the PD sensor and the in-position return to zero limit switch; The laser main control board is connected to the laser processing head in a control and acquisition manner to collect contact information, temperature and water flow alarm information of the laser processing head.

10. The laser device according to claim 2, characterized in that The heat dissipation module includes a power supply, and the laser main control board is connected to the power supply via an analog-to-digital converter ADC to receive status information of overvoltage, overcurrent, short circuit and leakage detection of the power supply.

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