High-insulation pressure-resistant rigid-flex board

Abstract

The utility model discloses a high-insulation pressure-resistant rigid-flex board, which comprises a rigid board and a flexible board, and is characterized in that the rigid board comprises a first functional bonding pad and a first tensile bonding pad; the flexible board comprises a second functional bonding pad matched with the first functional bonding pad in position; the first tensile bonding pad is provided with a first side surface facing the flexible board; the first functional bonding pad is provided with a second side face facing the soft board, and the first side face is located between one end face of the hard board and the second side face; and / or the second tensile bonding pad is provided with a third side surface far away from the hard board; the second functional pad has a fourth side away from the hard board, and the third side is located between one end face of the soft board and the fourth side. Through the structure of the utility model, one side of the functional bonding pad is provided with the tensile bonding pad extending out of the functional bonding pad, so that the voltage endurance capability of the soft and hard combined plate is improved.

Description

Technical Field

[0001] The utility model relates to a hard-flexible board, in particular to a hard-flexible board with high insulation and withstand voltage. Background Art

[0002] The description in this section merely provides background information related to the disclosure of the present utility model and does not constitute prior art.

[0003] In the application of automotive electronic technology, there is often a need to combine flexible circuit boards (hereinafter referred to as: soft boards) and rigid circuit boards (hereinafter referred to as: rigid boards) to achieve electrical connection. Traditional flexible and rigid board welding often uses the hot press HOTBAR process, which consists of steps such as product positioning, applying flux, and hot press welding. Among them, product positioning is mainly used to accurately align the flexible board and rigid board to be welded and fix them in the welding tool or fixture to ensure the accuracy of the welding position and prevent displacement during the welding process. The main purpose of applying flux is to apply an appropriate amount of flux to the welding area. The main function of flux is to remove the oxide layer on the welding surface, enhance the wettability of the solder, and improve the welding quality. Hot press welding directly uses a hot press to weld the flexible board and rigid board together through heat and pressure.

[0004] In existing operations, when the welding area is too large, multiple operations are required to complete the welding of flexible and rigid boards. At the same time, this process can easily lead to serious flux residue at the product welding point, posing hidden dangers of leakage current and insufficient insulation for products with voltage resistance requirements. At the same time, with the increasing demand for high quality and high performance of products, new challenges have been posed to welding quality. There are higher demands for the insulation layer voltage resistance, inter-PIN voltage resistance, and salt spray corrosion resistance of flexible and rigid boards, and the ability to simplify the process and achieve efficient production.

[0005] Currently, there is no high-insulation and high-voltage rigid-flex PCB that can solve the above problems. Utility Model Content

[0006] The purpose of the utility model is to provide a high-insulation and high-voltage rigid-flexible board, which can improve the voltage resistance of the rigid-flexible board by arranging a tensile pad extending from the functional pad on one side of the functional pad.

[0007] In order to achieve the above-mentioned object, the present invention discloses the following high-insulation and high-voltage rigid-flexible board; the high-insulation and high-voltage rigid-flexible board comprises:

[0008] A hard board and a soft board, wherein the hard board has a first end connected to the soft board and a second end facing away from the first end; the hard board includes a first functional pad and a first tensile pad;

[0009] The flexible board has a third end connected to the rigid board and a fourth end facing away from the third end; the flexible board includes a second functional pad matching the position of the first functional pad, and a second tensile pad matching the position of the first tensile pad;

[0010] The first tensile pad has a first side surface facing the end surface of the first end of the rigid board; the first functional pad has a second side surface facing the end surface of the first end of the rigid board, and the first side surface of the first tensile pad is located between the end surface of the first end of the rigid board and the second side surface of the first functional pad;

[0011] And / or, the second tensile pad has a third side surface facing the end surface of the fourth end of the soft board; the second functional pad has a fourth side surface facing the end surface of the fourth end of the soft board, and the third side surface of the second tensile pad is located between the end surface of the fourth end of the soft board and the fourth side surface of the second functional pad.

[0012] Furthermore, the first functional pad and the second functional pad match in size, and the first tensile pad and the second tensile pad match in size.

[0013] Furthermore, the first tensile pad extends from the first functional pad along the second end toward the first end by more than 0.3 mm, and the second tensile pad extends from the second functional pad along the third end toward the fourth end by more than 0.3 mm.

[0014] Furthermore, the second functional pad has a lead extending from the fourth end toward the third end.

[0015] Furthermore, it includes two combinations of the first tensile pad and the second tensile pad, and the two combinations of the first tensile pad and the second tensile pad are respectively arranged perpendicular to the second end and parallel to the first end on both sides of the combination of the first functional pad and the second functional pad.

[0016] Furthermore, it also includes a double-sided adhesive layer, which is arranged between the soft board and the hard board, and the double-sided adhesive layer has an avoidance portion so that the double-sided adhesive layer avoids the regional setting of the first functional pad and the first tensile pad.

[0017] Furthermore, the hard board further includes a first positioning hole, the soft board further includes a second positioning hole, and the double-sided adhesive layer further includes a third positioning hole, and the positions of the first positioning hole, the second positioning hole and the third positioning hole match.

[0018] Furthermore, the number of the first positioning hole, the second positioning hole and the third positioning hole is multiple, and the number of the multiple first positioning holes, the second positioning holes and the third positioning holes matches.

[0019] By means of the above technical solution, the beneficial effects of the present invention are as follows:

[0020] The high-insulation and voltage-resistant rigid-flexible board of the present invention can be matched with the first tensile pad on the hard board and the second tensile pad combination on the soft board. In the direction from the hard board to the soft board, a certain additional amount exceeding the combination of the first functional pad and the second functional pad is provided, so that when pulling occurs between the soft board and the hard board, the above-mentioned extra tensile pad amount can effectively resist the pulling force to avoid the pulling force directly destroying the connection between the first functional pad and the second functional pad, so that the rigid-flexible board of the present invention has higher tensile protection ability and stronger voltage resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 This is a schematic diagram of a combination of a flexible board and a rigid board of a high insulation and voltage withstand flexible and rigid board provided in an embodiment of this specification;

[0023] Figure 2 This is a schematic diagram of a rigid board of a high-insulation and voltage-resistant rigid-flex board provided in an embodiment of this specification;

[0024] Figure 3 This is a schematic diagram of a flexible board of a high-insulation and voltage-resistant rigid-flex board provided in an embodiment of this specification;

[0025] In the figure: 1. Hard board; 11. First functional pad; 12. First tensile pad; 13. First positioning hole; 2. Flexible board; 21. Second functional pad; 22. Second tensile pad; 23. Lead; 24. Second positioning hole; 3. Double-sided adhesive layer; 31. Avoidance part; 32. Third positioning hole; A. Protruding size. DETAILED DESCRIPTION

[0026] To help those skilled in the art better understand the technical solutions in this specification, the following will provide a clear and complete description of the technical solutions in the embodiments of this specification, in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this specification, not all of them. All other embodiments derived by those skilled in the art based on the embodiments in this specification without creative effort shall fall within the scope of protection of this specification.

[0027] In the description of the present invention, it should be noted that the terms "upper", "middle", "lower", "inside", "outside", "front", "back", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention. The terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following describes the implementation of the present invention based on its overall structure.

[0028] See Figure 1-3 , is a high insulation and voltage-resistant rigid-flexible board of this embodiment; wherein the high insulation and voltage-resistant rigid-flexible board includes:

[0029] A rigid board 1 and a flexible board 2, wherein the rigid board 1 has a first end connected to the flexible board 2 and a second end facing away from the first end; the rigid board 1 includes a first functional pad 11 and a first tensile pad 12;

[0030] The flexible board 2 has a third end connected to the rigid board 1 and a fourth end facing away from the third end; the flexible board 2 includes a second functional pad 21 that matches the position of the first functional pad 11, and a second tensile pad 22 that matches the position of the first tensile pad 12;

[0031] The first tensile pad 12 has a first side surface facing the end surface of the first end of the rigid board 1; the first functional pad 11 has a second side surface facing the end surface of the first end of the rigid board 1, and the first side surface of the first tensile pad 12 is located between the end surface of the first end of the rigid board 1 and the second side surface of the first functional pad 11;

[0032] And / or, the second tensile pad 22 has a third side surface facing the end surface of the fourth end of the flexible board 2; the second functional pad 21 has a fourth side surface facing the end surface of the fourth end of the flexible board 2, and the third side surface of the second tensile pad 22 is located between the end surface of the fourth end of the flexible board 2 and the fourth side surface of the second functional pad 21.

[0033] For the above structure, the operator only needs to prepare the hard board 1 and the soft board 2 of matching sizes in advance, wherein the first functional pad 11 on the hard board 1 matches the size and position of the second functional pad 21 on the soft board 2, and the first tensile pad 12 on the hard board 1 matches the size of the second tensile pad 22 on the soft board 2. After completing other necessary operations, the first functional pad 11 on the hard board 1 is welded to the second functional pad 21 on the soft board 2, and the first tensile pad 12 on the hard board 1 is welded to the second functional pad 21 on the soft board 2, thereby completing the docking of the hard board 1 and the soft board 2.

[0034] Through the above structure, after the rigid-flex board of this embodiment is installed, when the rigid board 1 and the flexible board 2 are pulled, the base part of the flexible board 2 away from the rigid board 1 is pulled up, so that the junction of the flexible board 2 and the rigid board 1 generates a force in the direction of 0-90 degrees from the first end to the second end. At this time, please refer to Figure 2 Since the end of the combination of the first tensile pad 12 and the second tensile pad 22 along the direction from the first end to the second end extends a certain protruding dimension A longer than the combination of the first functional pad 11 and the second functional pad 21, the protruding part must be subjected to force first. The possibility of the connection between the combination of the first functional pad 11 and the second functional pad 21 being subjected to external force is avoided by the protruding part, thereby ensuring that the combination of the hard board 1 and the soft board 2 still maintains a better functional connection, and the accident of functional disconnection between the hard board 1 and the soft board 2 will not occur.

[0035] Furthermore, if Figure 1-3 As shown, the first functional pads 11 in the hard board 1 are set as regular rectangular geometric copper-plated pads, which have good conductivity and solderability, and the number of the first functional pads 11 is a plurality of first functional pads 11 arranged equidistantly in the direction perpendicular to the first end to the second end. Specifically, in this embodiment, there are two rows of first functional pads 11, and the second functional pads 21 of the soft board 2 also match the size, number and position of the first functional pads 11, so that the electrical connection between the hard board 1 and the soft board 2 meets the usage requirements. At the same time, the first tensile pad 12 matches the size of the second tensile pad 22, and the first tensile pad 12 and the second tensile pad 22 are set to be copper-plated regular rectangular geometric bodies of the same matching size. In this embodiment, the thickness of the first tensile pad 12 and the second tensile pad 22 perpendicular to the direction from the first end to the second end and the length of the dimension parallel to the direction from the first end to the second end are slightly larger than the first functional pad 11 and the second functional pad 21, so that the first tensile pad 12 and the second tensile pad 22 have a certain metal welding body strength margin when subjected to force, thereby avoiding the possibility of breakage and separation between the hard board 1 and the soft board 2.

[0036] Furthermore, the first tensile pad 12 extends from the first functional pad 11 by more than 0.3 mm along the direction from the first end to the second end, and the second tensile pad 22 extends from the second functional pad 21 by more than 0.3 mm along the direction from the third end to the fourth end. In other words, the actual dimension of the aforementioned extension A is greater than 0.3 mm. Under the conditions of this embodiment, the first tensile pad 12 and the second tensile pad 22 can be pulled apart in various scenarios and at various levels, and the first tensile pad 12 and the second tensile pad 22 can be prevented from separating.

[0037] Furthermore, if Figure 3 As shown, the second functional pad 21 has a lead 23 extending from the fourth end toward the third end. The provision of the lead 23 extending from the fourth end toward the third end provides greater fixation stability when the first functional pad 11 and the second functional pad 21 are subjected to external forces in a direction parallel to the first end to the second end. This also alleviates stress concentration on the solder joint caused by thermal expansion and contraction, mechanical stress, or vibration, thereby increasing the reliability and durability of the solder joint.

[0038] Furthermore, in this embodiment, two first tensile pads 12 and second tensile pads 22 are included, and the two first tensile pads 12 and second tensile pads 22 are respectively arranged perpendicular to the direction from the first end to the second end and parallel to the two sides of the first functional pad 11 and second functional pad 21. Specifically, the two first tensile pads 12 and second tensile pads 22 are respectively arranged at the upper and lower ends of the first functional pad 11 and second functional pad 21, and the positions of the two first tensile pads 12 and second tensile pads 22 along the direction from the first end to the second end are also the same, which is more regular and easier to process. Moreover, when the flexible circuit board 2 is subjected to multiple external forces, the first tensile pads 12 and second tensile pads 22 can more evenly and effectively offset the external forces.

[0039] Furthermore, it also includes a double-sided adhesive layer 3, which is arranged between the soft board 2 and the hard board 1, and the double-sided adhesive layer 3 has an avoidance portion 31, so that the double-sided adhesive layer 3 avoids the regional setting of the first functional pad 11 and the first tensile pad 21. The double-sided adhesive layer 3 is used to form an insulating thin layer between the soft board 2 and the hard board 1, and its material can be selected from acrylic-based adhesive, polyimide adhesive, epoxy resin adhesive, etc., which can be selected according to actual needs. Through the setting of the double-sided adhesive layer 3, a mechanical bond can be provided between the soft board 2 and the hard board 1, and the soft board 2 and the hard board 1 can be firmly bonded together to ensure the structural stability of the entire circuit board and avoid separation when subjected to mechanical stress or vibration. At the same time, the double-sided adhesive layer 3 is naturally flexible and can provide flexibility and elasticity to a certain extent, thereby resolving excessive stress generated when the soft board 1 is pulled externally. At the same time, it can also play a buffering effect on the thermal expansion and contraction of the circuit board material itself.

[0040] Furthermore, the hard board 1 also includes a first positioning hole 13, the soft board 2 also includes a second positioning hole 24, and the double-sided adhesive layer 3 also includes a third positioning hole 32. The positions of the first positioning hole 13, the second positioning hole 24, and the third positioning hole 32 match. At the same time, the number of the first positioning hole 13, the second positioning hole 24, and the third positioning hole 32 is multiple, and the number of the multiple first positioning holes 13, the second positioning holes 24, and the third positioning holes 32 match. Specifically, during installation, the operator first affixes the double-sided adhesive layer 3 to one side of the hard board 1. At this time, the first positioning hole 13 of the hard board 1 is matched with the third positioning hole 32 of the double-sided adhesive layer 3 to achieve precise alignment of the two. Similarly, when installing the soft board 2 in the next step, the second positioning hole 24 is also used to position the hard board 1, the soft board 2, and the double-sided adhesive layer 3 to achieve high-precision positioning. This facilitates the double-sided adhesive layer 3 to provide good support for the hard board 1 and the soft board 2 after subsequent welding, and facilitates the installation operator to quickly get started, with good installation efficiency.

[0041] Although different specific embodiments are mentioned in this application, this application is not limited to the situations described in industry standards or embodiments. Some industry standards or slightly modified implementations based on customized methods or implementations described in the embodiments can also achieve the same, equivalent, or similar implementation effects as the above embodiments, or predictable implementation effects after modification. Examples that apply these modified or modified data acquisition, processing, output, judgment methods, etc. can still fall within the scope of optional implementation schemes of this application.

[0042] Although the present application has been described through embodiments, those skilled in the art will appreciate that there are many modifications and variations to the present application without departing from the spirit of the present application. It is intended that the appended embodiments include these modifications and variations without departing from the present application.

Claims

1. A high insulation and voltage-resistant rigid-flexible board; characterized in that: The high insulation and voltage-resistant rigid-flexible board comprises: A hard board and a soft board, wherein the hard board has a first end connected to the soft board and a second end facing away from the first end; the hard board includes a first functional pad and a first tensile pad; The flexible board has a third end connected to the rigid board and a fourth end facing away from the third end; the flexible board includes a second functional pad matching the position of the first functional pad, and a second tensile pad matching the position of the first tensile pad; The first tensile pad has a first side surface facing the end surface of the first end of the rigid board; the first functional pad has a second side surface facing the end surface of the first end of the rigid board, and the first side surface of the first tensile pad is located between the end surface of the first end of the rigid board and the second side surface of the first functional pad; And / or, the second tensile pad has a third side surface facing the end surface of the fourth end of the soft board; the second functional pad has a fourth side surface facing the end surface of the fourth end of the soft board, and the third side surface of the second tensile pad is located between the end surface of the fourth end of the soft board and the fourth side surface of the second functional pad.

2. The high insulation and voltage withstand rigid-flex PCB according to claim 1, characterized in that: The first functional pad and the second functional pad are matched in size, and the first tensile pad and the second tensile pad are matched in size.

3. The high insulation and voltage withstand rigid-flex PCB according to claim 1, characterized in that: The first tensile pad extends from the first functional pad along the second end toward the first end by more than 0.3 mm, and the second tensile pad extends from the second functional pad along the third end toward the fourth end by more than 0.3 mm.

4. The high insulation and voltage-resistant rigid-flex PCB according to claim 1, characterized in that: The second functional pad has a lead extending from the fourth end toward the third end.

5. The high insulation and voltage withstand rigid-flex PCB according to claim 1, characterized in that: It includes two combinations of the first tensile pad and the second tensile pad, and the two combinations of the first tensile pad and the second tensile pad are respectively arranged perpendicular to the second end and parallel to the first end on both sides of the combination of the first functional pad and the second functional pad.

6. The high insulation and voltage-resistant rigid-flex PCB according to claim 1, characterized in that: It also includes a double-sided adhesive layer, which is arranged between the soft board and the hard board, and has an avoidance portion so that the double-sided adhesive layer avoids the regional arrangement of the first functional pad and the first tensile pad.

7. The high insulation and voltage-resistant rigid-flex PCB according to claim 6, characterized in that: The hard board further includes a first positioning hole, the soft board further includes a second positioning hole, and the double-sided adhesive layer further includes a third positioning hole. The positions of the first positioning hole, the second positioning hole, and the third positioning hole match.

8. The high insulation and voltage withstand rigid-flex PCB according to claim 7, characterized in that: There are multiple first positioning holes, multiple second positioning holes, and multiple third positioning holes, and the numbers of the multiple first positioning holes, multiple second positioning holes, and multiple third positioning holes match each other.

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