Heat dissipation device
Through the combined structure of the heat conductor seat, heat conductor block, heat dissipation pipe and heat dissipation medium, the phase change and pressure difference of the heat dissipation medium are used to achieve circulating heat dissipation without additional aid, which solves the problem of limited heat diffusion of the fanless radiator and achieves efficient heat dissipation effect.
Patent Information
- Application Number
- CN202422345191.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-09-25
AI Technical Summary
The thermal diffusion of existing fanless radiators is limited by the structure, and increasing the AU will increase power consumption and affect the lifespan, making it difficult to maintain a good heat dissipation effect without increasing the power consumption.
The combined structure of a heat conductor seat, a heat conductor block, a heat dissipation tube, a heat dissipation fin set and a heat dissipation medium is adopted. The phase change and pressure difference of the heat dissipation medium are used to achieve circulating heat dissipation without additional assistance. The heat conductor heat is transmitted to the heat dissipation medium through the heat conductor. The heat dissipation medium circulates in the heat dissipation tube after the phase change and heat exchanges with the fin set.
It realizes that the heat source heat is effectively transmitted to the outside world without increasing power consumption, with good heat dissipation effect and no additional circulation assistance is required.
Smart Images
Figure CN223194895U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat dissipation device, in particular to a heat dissipation device applied to a heat source on a circuit board. Background Art
[0002] Generally speaking, the heat dissipation of fanless heat sinks currently on the market is often limited by structural limitations, resulting in poor performance. Furthermore, adding a pump to enhance convection circulation to improve heat dissipation increases the heat sink's power consumption and shortens its lifespan. Therefore, achieving optimal heat dissipation without increasing power consumption and maintaining heat sink lifespan is a topic of intense research in the field. Utility Model Content
[0003] The utility model provides a heat dissipation device, which has a good heat dissipation effect.
[0004] The utility model provides a heat dissipation device suitable for dissipating heat from a heat source, wherein the heat dissipation device includes a housing, a heat-conducting seat, a heat-conducting block, a plurality of heat-dissipating pipes, at least one first heat-dissipating fin group, and a heat-dissipating medium. The heat source is arranged in the housing. The heat-conducting seat is arranged in the housing, wherein the heat-conducting seat is thermally coupled to the heat source and has a groove and a side portion surrounding the groove. The heat-conducting block is arranged in the groove and thermally coupled to the heat-conducting seat. A plurality of heat-dissipating pipes are passed through the housing, each heat-dissipating pipe having a first end and a second end relative to the first end, the first end of each heat-dissipating pipe passing through the side portion and communicating with the groove, and the second end of each heat-dissipating pipe communicating with the groove. At least one first heat-dissipating fin group is arranged on the housing and partially covers the groove, wherein these heat-dissipating pipes are thermally coupled to at least one first heat-dissipating fin group. The heat-dissipating medium is stored in the groove and immerses at least a portion of the heat-conducting block.
[0005] Based on the above, in the heat dissipation device of the present invention, the heat generated by the heat source is transferred to the heat dissipation medium via the heat-conducting seat and the heat-conducting block. After the heat dissipation medium absorbs a certain amount of heat, it undergoes a phase change and transforms from a liquid to a gaseous state. Due to the pressure difference and temperature difference, the gaseous heat dissipation medium flows upward from the top opening through the second end into the multiple heat dissipation tubes, and exchanges heat with the first heat dissipation fin group during the process of flowing through the heat dissipation tubes. Finally, the heat dissipation medium flows out of the heat dissipation tubes from the first end and into the groove, completing the cycle. Accordingly, the heat dissipation device of the present invention can circulate the heat dissipation medium without the need for an additional pump, thereby effectively transferring the heat generated by the heat source to the outside world, thereby achieving a good heat dissipation effect.
[0006] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figures 1A to 1CSchematic diagrams of a heat dissipation device according to an embodiment of the present invention at different viewing angles;
[0008] Figure 2 yes Figure 1A Exploded view of the heat sink;
[0009] Figure 3 yes Figure 1B A cross-sectional view of the heat dissipation device along line AA;
[0010] Figure 4 yes Figure 1B A cross-sectional view of the heat dissipation device along line BB;
[0011] Figure 5 yes Figure 1C A cross-sectional view of the heat dissipation device along line CC;
[0012] Figures 6A to 6C yes Figure 3 Schematic diagram of the heat conducting block at different viewing angles;
[0013] Figure 7 yes Figure 6C Cross-sectional view of the heat conductive block along line DD.
[0014] Description of reference numerals:
[0015] 10: heat source;
[0016] 20: circuit board;
[0017] 100: heat dissipation device;
[0018] 110: housing;
[0019] 120: thermal seat;
[0020] 121: groove;
[0021] 123: side;
[0022] 130: heat conducting block;
[0023] 131: top surface;
[0024] 132: second heat dissipation fin group;
[0025] 133: first side;
[0026] 134: second side;
[0027] 135: third side;
[0028] 136: fourth side;
[0029] 137: third heat sink fin group;
[0030] 138: fourth heat sink fin group;
[0031] 139: tapered hole;
[0032] 140: heat pipe;
[0033] 141: first end;
[0034] 143: second end;
[0035] 150: first heat dissipation fin group;
[0036] 151: first fin;
[0037] 160: heat dissipation medium;
[0038] 161: liquid level;
[0039] 170: cover plate;
[0040] 1211: headspace;
[0041] 1213: lateral space;
[0042] 1215: top opening;
[0043] 1217: bottom;
[0044] 1311: Depression;
[0045] 1321: second fin;
[0046] 1371: third fin;
[0047] 1381: fourth fin;
[0048] 1391: Opening;
[0049] 1391a: aperture;
[0050] 1393: Bottom;
[0051] 1411: communication port;
[0052] 1411a: center;
[0053] D1: distance;
[0054] H1: height;
[0055] S1: first slit;
[0056] S2: second slit;
[0057] S3: the third slit;
[0058] X, Y, Z: axial directions. DETAILED DESCRIPTION
[0059] Figures 1A to 1C Schematic diagrams of a heat dissipation device according to an embodiment of the present invention at different viewing angles. Figure 2 yes Figure 1A Exploded view of the heat sink. Figure 3 yes Figure 1B Cross-sectional view of the heat sink along line AA. Figures 1A to 3 The heat dissipation device 100 of this embodiment is suitable for Figure 3 The heat source 10 is disposed on the circuit board 20 to dissipate heat. The heat source 10 is, for example, a central processing unit (CPU) or a graphics processing unit (GPU), but is not limited thereto. The structure of the heat dissipation device 100 is described in detail below.
[0060] Figure 4 yes Figure 1B Cross-sectional view of the heat sink along line BB. Figure 1A 、 Figure 2 、 Figure 3 and Figure 4 The heat dissipation device 100 includes a housing 110, a heat conducting base 120, a heat conducting block 130, a plurality of heat dissipation pipes 140, at least one first heat dissipation fin group 150 (two are shown) and a heat dissipation medium 160. The heat source 10 is disposed in the housing 110. The heat conducting base 120 is disposed in the housing 110. The heat conducting base 120 is thermally coupled to the heat source 10 and has a groove 121 and a side portion 123 surrounding the groove 121. The heat conducting block 130 is as shown in FIG. Figure 4 As shown, the heat pipes 140 are arranged in the groove 121 and are thermally coupled to the heat conducting seat 120. Figure 3 As shown, the heat dissipation pipes 140 are arranged through the housing 110. Figure 3 The heat pipe 140 is shown as having a first end 141 and a second end 143 opposite to the first end 141. The first end 141 of each heat pipe 140 is disposed through the side portion 123 and communicates with the groove 121. The second end 143 of each heat pipe 140 communicates with the top opening 1215 of the groove 121. At least one first heat sink fin assembly 150 is disposed on the housing 110 and partially covers the groove 121. The heat pipes 140 are thermally coupled to the at least one first heat sink fin assembly 150. A heat dissipation medium 160 is stored in the groove 121 and submerges at least a portion of the heat conductive block 130.
[0061] As described above, in the heat dissipation device 100 of this embodiment, the heat generated by the heat source 10 is transferred to the heat dissipation medium 160 via the heat conductive base 120 and the heat conductive block 130. After the heat dissipation medium 160 absorbs a certain amount of heat, it undergoes a phase change, transforming from a liquid to a gaseous state. Due to pressure and temperature differences, the gaseous heat dissipation medium 160 flows upward from the top opening 1215 through the second end 143 into the plurality of heat dissipation tubes 140, and exchanges heat with the first heat dissipation fin assembly 150 while flowing through the heat dissipation tubes 140. Finally, the heat dissipation medium 160 flows out of the heat dissipation tubes 140 from the first end 141 and into the groove 121, completing the cycle. Accordingly, the heat dissipation device 100 of the present invention can circulate the heat dissipation medium 160 without the need for an additional pump, thereby effectively transferring the heat generated by the heat source 10 to the outside world, thereby achieving a good heat dissipation effect.
[0062] In this embodiment, the circuit board 20 is disposed within the housing 110, and the heat source 10 is located between the thermal base 120 and the circuit board 20. In this embodiment, the first heat dissipation fin assembly 150 includes a plurality of first fins 151. Each first heat dissipation fin assembly 150 has twelve first fins 151. Each first fin 151 extends along the axial direction X and the axial direction Z (i.e., each first fin 151 is parallel to the XZ plane). These first fins 151 are spaced apart along the axial direction Y. However, the present invention does not limit the orientation or number of the first fins 151. In this embodiment, the heat dissipation medium 160 is, for example, water, but this is not a limitation of the present invention.
[0063] The distribution and position of the heat dissipation medium 160 in the groove 121 are described in detail below.
[0064] Figure 5 yes Figure 1C Cross-sectional view of the heat sink along CC line. Figure 5 The thermal block 130, Figure 5 The number of the second heat dissipation fin group 132 and the fourth heat dissipation fin group 138 is shown schematically. Figure 3 and Figure 5 The heat conducting seat 120 includes a top opening 1215 communicating with the groove 121, a top space 1211 is formed between the heat conducting block 130 and the top opening 1215, and a side space 1213 is formed between the heat conducting block 130 and the side portion 123. Figure 3 As shown, the top opening 1215 is connected, and the top space 1211 and the side space 1213 are connected. Figure 5 In this embodiment, the liquid heat dissipation medium 160 is stored in the lower area of the lateral space 1213 and is connected to the lateral space 1213. Figure 3 and Figure 5The gaseous heat dissipation medium 160 is located in the upper area of the lateral space 1213 and the top space 1211. In more detail, the gaseous heat dissipation medium 160 is located at the liquid level 161 of the liquid heat dissipation medium 160 (see Figure 3 ) above.
[0065] See also Figure 3 In order to achieve a good heat dissipation effect for the heat dissipation device 100 of this embodiment, the first end 141 of each heat dissipation pipe 140 of this embodiment includes a communication port 1411, and a distance D1 from the center 1411a of the communication port 1411 to the bottom 1217 of the groove 121 is as follows: Figure 3 The height H1 of the liquid heat dissipation medium 160 is shown to be less than the height H1 between the liquid surface 161 and the bottom 1217 of the liquid heat dissipation medium 160 in the lateral space 1213. In other embodiments, the distance D1 between the center 1411a and the bottom 1217 may also be equal to the height H1 of the liquid surface 161 and the bottom 1217, and the present invention is not limited to this. In this embodiment, the heat dissipation device 100 increases the latent heat available for the heat dissipation medium 160 to absorb thermal energy by having the height H1 of the liquid heat dissipation medium 160 be greater than the distance D1 between the center 1411a and the bottom 1217, thereby further improving the heat dissipation performance of the heat dissipation device 100.
[0066] The structure of the heat conducting block 130 is described in detail below.
[0067] Figures 6A to 6C yes Figure 3 Schematic diagram of the heat transfer block at different viewing angles. Figure 3 and Figure 6A , the heat conducting block 130 has the following Figure 3 The top surface 131 faces the top opening 1215, and the top surface 131 has at least one recess 1311. Figure 3 As shown, it is connected to the top space 1211. The heat conducting block 130 is as shown. Figure 6A As shown, at least one second heat dissipating fin set 132 (two shown) is provided on the top surface 131, and at least one second heat dissipating fin set 132 is located on one side of the recess 1311. In this embodiment, there are three recesses 1311, with the left second heat dissipating fin set 132 located to the left of the leftmost recess 1311, and the right second heat dissipating fin set 132 located to the right of the rightmost recess 1311. However, the number of recesses 1311, the number of second heat dissipating fin sets 132, and their placement are not limited to the above.
[0068] For more details, see Figure 6A At least one second heat dissipation fin group 132 includes a plurality of second fins 1321 arranged in parallel, and a first slit S1 between two adjacent second fins 1321 is formed from the first slit S1. Figure 5The lateral space 1213 shown in FIG. 1 extends toward the recess 1311. Accordingly, the gaseous heat dissipation medium 160 located in the lateral space 1213 can move along the first slit S1 to the recess 1311, and then move to the recess 1311. Figure 3 In the top space 1211 shown. In this embodiment, each second fin 1321 is perpendicular to the top surface 131 and extends along the axial direction Y (i.e., each second fin 1321 is parallel to the YZ plane). These second fins 1321 are spaced apart along the axial direction X, and the first slit S1 is parallel to the axial direction Y, but the present invention is not limited thereto.
[0069] See also Figures 6A to 6C The heat conducting block 130 also has a direction such as Figure 5 The lateral space 1213 shown includes a first side surface 133, a second side surface 134 relative to the first side surface 133, a third side surface 135, and a fourth side surface 136 relative to the third side surface 135. Figure 5 The heat conducting block 130 is shown surrounding the first side surface 133, the second side surface 134, the third side surface 135, and the fourth side surface 136. A third heat dissipating fin assembly 137 is provided on at least one of the first side surface 133 and the second side surface 134. In this embodiment, the heat conducting block 130 is provided with the third heat dissipating fin assembly 137 on both the first side surface 133 and the second side surface 134, but the present invention is not limited thereto.
[0070] For more details, see Figure 6A The third heat dissipation fin group 137 includes a plurality of third fins 1371 arranged in parallel, and each third fin 1371 is perpendicular to the first side surface 133 or the second side surface 134. Figure 6B As shown, the recess 1311 extends from the first side surface 133 to the second side surface 134 and passes through the first side surface 133 and the second side surface 134. At least a portion of the third fins 1371 of the third heat dissipation fin group 137 spans one side of the recess 1311. Accordingly, the gaseous heat dissipation medium 160 located in the lateral space 1213 can move along the second slit S2 between the two third fins 1371 to the recess 1311, and then move to the side surface 1311. Figure 3 In the top space 1211 shown. In this embodiment, each third fin 1371 extends along the axial direction X and the axial direction Y (ie, each third fin 1371 is parallel to the XY plane), these third fins 1371 are spaced apart along the axial direction Z, and the second slit S2 is parallel to the axial direction Y, but not limited thereto.
[0071] See also Figures 6A to 6C , the heat conducting block 130 is as follows Figure 6AAs shown, at least one fourth heat dissipation fin group 138 (two are shown) is also provided on the top surface 131, and the recess 1311 is located between the at least one second heat dissipation fin group 132 and the at least one fourth heat dissipation fin group 138. Accordingly, at least a portion of the gaseous heat dissipation medium 160 that moves to the recess 1311 through the first slit S1 and the second slit S2 can move along the third slit S3 to the middle recess 1311. In this embodiment, the number of the fourth heat dissipation fin group 138 is not limited thereto. In other embodiments, the number of the fourth heat dissipation fin group 138 can also be, for example, one or three, or the heat conductive block 130 may not have the fourth heat dissipation fin group 138. In addition, in this embodiment, the fourth heat dissipation fin group 138 is parallel to the second heat dissipation fin group 132, and the direction of each fourth fin 1381 is the same as the direction of the second fin 1321. The third slit S3 is parallel to the axial direction Y.
[0072] In this embodiment, the spacing between two adjacent second fins 1321, the spacing between two adjacent third fins 1371, and the spacing between two adjacent fourth fins 1381, that is, the width of the first slit S1, the second slit S2, and the third slit S3, respectively, are less than or equal to 0.5 mm, but not limited thereto.
[0073] The heat dissipation device 100 of this embodiment is configured with the second heat dissipation fin group 132 , the third heat dissipation fin group 137 and the fourth heat dissipation fin group 138 , so that the second heat dissipation fin group 132 , the third heat dissipation fin group 137 and the fourth heat dissipation fin group 138 can exchange heat with the heat dissipation medium 160 , thereby further improving the heat dissipation effect of the heat dissipation device 100 .
[0074] Figure 7 yes Figure 6C Cross-sectional view of the heat conducting block along line DD. Figure 6A and Figure 7 The heat conducting block 130 is provided with at least one tapered hole 139 on at least one of the third side surface 135 and the fourth side surface 136. In this embodiment, six tapered holes 139 are provided on each of the third side surface 135 and the fourth side surface 136, but the number of tapered holes 139 is not limited thereto. The opening 1391 of at least one tapered hole 139 is as follows: Figure 3 The openings 1391 are shown facing the first ends 141 of the heat pipes 140. For example, the right opening 1391 faces the first ends 141 of the right heat pipe 140, and the left opening 1391 faces the first ends 141 of the left heat pipe 140.
[0075] See also Figure 7At least one tapered hole 139 further comprises a bottom surface 1393 opposite to the opening 1391, and the aperture 1391a of the opening 1391 gradually decreases from the opening 1391 toward the bottom surface 1393. The heat dissipation device 100 of this embodiment, through the configuration of the tapered hole 139 and the gradually decreasing aperture 1391a, can increase the return speed of the liquid heat dissipation medium 160 from the heat pipe 140.
[0076] See also Figure 6A , the heat conducting block 130 is located as follows Figure 3 The surfaces within the recess 121 are shown as being provided with a capillary structure layer. For example, the capillary structure layer is provided on the top surface 131, first side surface 133, second side surface 134, third side surface 135, fourth side surface 136, second heat sink fin assembly 132, third heat sink fin assembly 137, fourth heat sink fin assembly 138, and the inner wall of the tapered hole 139 of the heat conductive block 130, but the present invention is not limited thereto. Accordingly, the heat dissipation device 100 of this embodiment can guide the liquid heat dissipation medium 160 back to the lateral space 1213 of the recess 121 through the capillary structure layer, while ensuring that the gaseous and liquid heat dissipation medium 160 are separated from each other. In addition, the heat dissipation device 100 can also ensure that the liquid heat dissipation medium 160 can flow along the first slit S1, the second slit S2, and the third slit S3 through the capillary structure layer, so that the heat dissipation medium 160 can exchange heat with the second heat dissipation fin group 132, the third heat dissipation fin group 137 and the fourth heat dissipation fin group 138, and flow back to the lateral space 1213.
[0077] See also Figure 3 The heat dissipation device 100 of this embodiment further includes a cover plate 170. The cover plate 170 is disposed on one side of at least one first heat dissipation fin assembly 150 and, together with the at least one first heat dissipation fin assembly 150, seals the top opening 1215. The second end 143 of each heat dissipation tube 140 is disposed through the cover plate 170. The cover plate 170 is positioned opposite the recess 1311; that is, the recess 1311 is within the projection of the cover plate 170. Accordingly, the heat dissipation device 100 of this embodiment seals the top opening 1215 by means of the cover plate 170 and the first heat dissipation fin assembly 150, thereby preventing the gaseous heat dissipation medium 160 within the groove 121 from dissipating. Furthermore, the cover plate 170 is positioned opposite the recess 1311, allowing the gaseous heat dissipation medium 160 to smoothly flow from the top space 1211 to the second end 143 of the heat dissipation device 100. In this embodiment, the cover plate 170 is disposed between the two first heat dissipation fin assemblies 150, but this is not limiting.
[0078] The heat dissipation mechanism of the heat dissipation device 100 of this embodiment is described in detail below.
[0079] When the heat source 10 generates heat, first, the heat of the heat source 10 is conducted to the heat conducting block 130 through the heat conducting base 120. Then, the heat is conducted to the heat conducting block 130 through the heat conducting base 120. Figure 6A The surface of the heat conducting block 130, the second heat dissipating fin set 132, the third heat dissipating fin set 137, and the fourth heat dissipating fin set 138 shown in FIG. 1 exchange heat with the heat dissipating medium 160, whereby the heat is absorbed by the heat dissipating medium 160 and converted into latent heat of the heat dissipating medium 160. When the heat source 10 is in low power mode, the above-described heat dissipation mechanism enables the heat dissipation device 100 to achieve good heat dissipation performance.
[0080] When the heat source 10 is in high power mode, after the heat generated by the heat source 10 exceeds the latent heat that the liquid heat dissipation medium 160 can absorb, the liquid heat dissipation medium 160 begins to undergo a phase change and transforms from liquid to gas. Figure 3 The lateral space 1213 shown is as shown in FIG. Figure 6A As shown, the first slit S1 in the second heat sink fin assembly 132, the second slit S2 in the third heat sink fin assembly 137, and the third slit S3 in the fourth heat sink fin assembly 138 move into the recess 1311. The gaseous heat sink 160 then exits the recess 121 from the recess 1311, passes through the top space 1211 and the top opening 1215, enters the second end 143 of the heat sink 140, and moves toward the first end 141. The gaseous heat sink 160 in the heat sink 140 then exchanges heat with the first heat sink fin assembly 150 connected to the heat sink 140, converting the heat sink 160 from a high-pressure gas state to a low-pressure gas state or liquid state. Because the inner wall of the heat sink 140 is smooth, the converted low-pressure gaseous or liquid heat sink 160 continues to flow toward the first end 141 of the heat sink 140 and back into the recess 121, completing the cycle and re-engaging heat exchange with the heat conductive block 130.
[0081] That is, the heat dissipation device 100 of this embodiment enables the heat dissipation medium 160 to circulate as described above without the need for an additional pump because the pressure and temperature of the gaseous heat dissipation medium 160 located in the recess 1311 are higher than the pressure and temperature of the heat dissipation medium 160 located at the second end 143 of the heat dissipation pipe 140.
[0082] In summary, in the heat dissipation device of the present invention, the heat generated by the heat source will be transferred to the heat dissipation medium through the heat-conducting seat and the heat-conducting block. After the heat dissipation medium absorbs a certain amount of heat, the heat dissipation medium will undergo a phase change and change from liquid to gas. Due to the pressure difference and temperature difference, the gaseous heat dissipation medium will flow upward from the top opening through the second end into the multiple heat dissipation pipes, and exchange heat with the first heat dissipation fin group in the process of flowing through the heat dissipation pipes. Finally, the heat dissipation medium flows out of the heat dissipation pipe from the first end and flows into the groove, completing the cycle. Accordingly, the heat dissipation device of the present invention can circulate the heat dissipation medium without an additional pump, so as to effectively transfer the heat generated by the heat source to the outside world, thereby achieving a good heat dissipation effect. In addition, in one embodiment, the heat-conducting block has a second heat dissipation fin group, a third heat dissipation fin group and a fourth heat dissipation fin group, which can further enhance the heat dissipation effect of the heat dissipation device.
[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A heat dissipation device, suitable for dissipating heat from a heat source, characterized in that: The heat dissipation device comprises: a housing, wherein the heat source is disposed within the housing; a heat conducting seat disposed in the housing, wherein the heat conducting seat is thermally coupled to the heat source and has a groove and a side surrounding the groove; a heat conducting block, disposed in the groove and thermally coupled to the heat conducting seat; a plurality of heat dissipation pipes passing through the housing, each heat dissipation pipe having a first end and a second end opposite to the first end, the first end of each heat dissipation pipe passing through the side portion and communicating with the groove, and the second end of each heat dissipation pipe communicating with the groove; at least one first heat dissipation fin group, disposed on the housing and partially covering the groove, wherein the plurality of heat dissipation pipes are thermally coupled to the at least one first heat dissipation fin group; and The heat dissipation medium is stored in the groove and submerges at least a portion of the heat conducting block.
2. The heat dissipation device according to claim 1, characterized in that: The thermal seat includes a top opening connected to the groove, a top space is formed between the thermal block and the top opening, a lateral space is formed between the thermal block and the side portion, the top space and the lateral space are connected to each other, and the liquid heat dissipation medium is stored in the lateral space.
3. The heat dissipation device according to claim 2, characterized in that: The first end of each heat dissipation pipe includes a communication port, and the distance from the center of the communication port to the bottom of the groove is less than or equal to the height from the liquid level of the heat dissipation medium to the bottom.
4. The heat dissipation device according to claim 2, characterized in that: The heat conducting block has a top surface facing the top opening, and the top surface has at least one recess. The at least one recess is communicated with the top space, and the top space is communicated with the top opening.
5. The heat dissipation device according to claim 4, characterized in that: At least one second heat dissipation fin group is provided on the top surface of the heat conducting block, and the at least one second heat dissipation fin group is located on one side of the at least one recess.
6. The heat dissipation device according to claim 5, characterized in that: The heat conducting block has a first side surface facing the lateral space and a second side surface opposite to the first side surface, and at least one of the first side surface and the second side surface is provided with a third heat dissipation fin group.
7. The heat dissipation device according to claim 6, characterized in that: At least one fourth heat dissipation fin group is further provided on the top surface of the heat conducting block, and the at least one recess is located between the at least one second heat dissipation fin group and the at least one fourth heat dissipation fin group.
8. The heat dissipation device according to claim 6, characterized in that: The third heat dissipation fin group includes a plurality of fins arranged in parallel, and each of the fins is perpendicular to the first side surface or the second side surface.
9. The heat dissipation device according to claim 8, characterized in that: The at least one recess extends from the first side surface toward the second side surface and passes through the first side surface and the second side surface. At least a portion of the plurality of fins of the third heat dissipation fin group spans one side of the at least one recess.
10. The heat dissipation device according to claim 5, characterized in that: The at least one second heat dissipation fin group includes a plurality of fins arranged in parallel, and a slit between two adjacent fins extends from the lateral space toward the at least one recess.
11. The heat dissipation device according to claim 4, characterized in that: The heat dissipation device further comprises: The cover plate is arranged on one side of the at least one first heat dissipation fin group and closes the top opening together with the at least one first heat dissipation fin group, wherein the second end of each heat dissipation pipe is passed through the cover plate, and the cover plate is located opposite to the at least one recess.
12. The heat dissipation device according to claim 2, characterized in that: The heat conductive block has a first side surface, a second side surface relative to the first side surface, a third side surface, and a fourth side surface relative to the third side surface, and the lateral space surrounds the first side surface, the second side surface, the third side surface, and the fourth side surface. The heat conductive block is provided with at least one tapered hole on at least one of the third side surface and the fourth side surface, and the opening of the at least one tapered hole faces the first ends of the plurality of heat pipes. The at least one tapered hole has a bottom surface relative to the opening, and the aperture of the opening gradually decreases from the opening to the bottom surface.
13. The heat dissipation device according to claim 1, wherein: A capillary structure layer is provided on the surface of the heat conducting block located in the groove.