Heat dissipation device for domain controller, domain controller and vehicle

Abstract

The utility model discloses a heat radiation device used for a domain controller, comprising a first cover plate which is provided with a cooling medium channel, and the cooling medium channel is provided with a cooling medium inlet and a cooling medium outlet; the second cover plate is connected with the first cover plate to form a cavity for accommodating a mainboard of the domain controller; the vapor chamber is arranged in the cavity, the vapor chamber comprises a vapor chamber body and at least one boss protruding from the vapor chamber body, the vapor chamber body is connected with the cooling medium channel in an attached mode, and the boss is used for being correspondingly connected with at least one electronic device on the first side of the main board in an attached mode. The area of the vapor chamber body is larger than the top area of the boss. According to the utility model, the heat of the heating device can be quickly diffused to the large-area heat dissipation component, and the purpose of quick heat dissipation is achieved through quick heat exchange between the large-area heat dissipation component and the cooling medium.

Description

Technical Field

[0001] The utility model relates to a heat dissipation device, especially a heat dissipation device for a domain controller. Background Art

[0002] With the development of domain controllers, the demand for high-computing-power chips is also increasing. The increase in computing power also brings an increase in chip power consumption, thus greatly increasing the requirements for the heat dissipation ability of domain controllers.

[0003] Currently, whether it is an autonomous driving domain controller or an intelligent cockpit domain controller, they are mostly independent domain control units. The mainstream heat dissipation methods are water cooling or air cooling, or passive heat dissipation.

[0004] With the integration of multiple domain controllers, such as the development and integration of autonomous driving domain controllers and intelligent cockpit domain controllers, the power consumption of domain controller units will continue to increase. The integration and miniaturization of the main computing power chips of multiple domains will reduce their volume continuously. Therefore, the heat source density of the chips increases greatly. Therefore, how to quickly dissipate the heat from the concentrated heat source to meet the working temperature requirements of the chips to ensure the stable operation of the domain controller becomes particularly important.

[0005] Especially in areas with high ambient temperatures, this problem becomes particularly prominent. Although the traditional water cooling method has high heat dissipation ability, it is increasingly difficult to meet the current heat dissipation requirements due to the thermal conductivity of the materials used. Content of the Utility Model

[0006] One of the purposes of the utility model is to provide a heat dissipation device for a domain controller, which has a simple structure and can quickly spread the heat source to a large-area heat dissipation component, and quickly exchange heat with the cooling medium through the large-area heat dissipation component to achieve the purpose of rapid heat dissipation.

[0007] To achieve the above purpose, the utility model proposes a heat dissipation device for a domain controller, which includes:

[0008] A first cover plate, on which a cooling medium channel is provided, and a cooling medium inlet and a cooling medium outlet are opened on the cooling medium channel;

[0009] A second cover plate, which is connected to the first cover plate to form a cavity for accommodating the main board of the domain controller;

[0010] A heat pipe is provided in the cavity. The heat pipe includes a heat pipe body and at least one boss protruding from the heat pipe body. The heat pipe body is connected to the cooling medium channel in a close-contact manner. The boss is used to be respectively and closely connected to at least one electronic device on the first side of the main board. The area of the heat pipe body is larger than the top area of the boss.

[0011] Further, in the heat dissipation device of the present utility model, a first heat conducting element is provided between the heat pipe body and the cooling medium channel, and the heat pipe body is connected to the cooling medium channel in a close-contact manner through the first heat conducting element.

[0012] Further, in the heat dissipation device of the present utility model, a second heat conducting element for correspondingly contacting at least one electronic device of the main board is provided on the top surface of the boss, and the boss is connected to the electronic device in a close-contact manner through the second heat conducting element.

[0013] Further, the heat dissipation device of the present utility model further includes a third heat conducting element, whose upper surface is in contact connection with the electronic devices on the second side of the main board opposite to the first side, and the lower surface of the third heat conducting element is in contact connection with the inner surface of the second cover plate.

[0014] Further, in the heat dissipation device of the present utility model, at least one of the first heat conducting element, the second heat conducting element, and the third heat conducting element is thermal grease.

[0015] Further, the heat dissipation device of the present utility model further includes a heat pipe bracket, which is provided in the cavity and connected to the first cover plate. The heat pipe is provided between the first cover plate and the heat pipe bracket to be fastened on the cooling medium channel by the heat pipe bracket.

[0016] Further, in the heat dissipation device of the present utility model, a hollow part is provided on the heat pipe bracket, and the protrusion of the heat pipe extends out from the hollow part.

[0017] Further, in the heat dissipation device of the present utility model, a groove is provided on the heat pipe body, and the frame of the heat pipe bracket is correspondingly clamped in the groove.

[0018] Another object of the present utility model is to provide a domain controller, which can quickly exchange heat with the cooling medium to achieve the purpose of rapid heat dissipation and ensure the stable performance of the domain controller.

[0019] Based on the above object, the present utility model further provides a domain controller, which includes a main board with electronic devices provided thereon. The domain controller further includes the heat dissipation device as described above.

[0020] Another object of the present utility model is to provide a vehicle having a domain controller as described above.

[0021] The heat dissipation device described in the present utility model has a simple structure, which can quickly transfer the heat of high-power and high heat flux density electronic devices to a two-dimensional plane with a larger area and reduce the thermal resistance value on the heat conduction path, thereby improving the heat dissipation efficiency to ensure the performance stability of the domain controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Shows the external structure of the heat dissipation device described in the present utility model in one embodiment from one perspective.

[0023] Figure 2 Shows the external structure of the heat dissipation device described in the present utility model in one embodiment from another perspective.

[0024] Figure 3 Shows a schematic diagram of the split structure of the heat dissipation device and the domain controller described in the present utility model in one embodiment.

[0025] Figure 4 Shows a schematic diagram of the split structure of the heat sink plate and the first cover plate of the heat dissipation device described in the present utility model in one embodiment.

[0026] Figure 5 Shows a side sectional view of the domain controller described in the present utility model in one embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following will further explain and illustrate the heat dissipation device, domain controller and vehicle described in the present utility model in conjunction with the drawings in the specification and specific embodiments. However, such explanations and illustrations shall not unduly limit the technical solutions of the present utility model.

[0028] With the development of domain controllers, the demand for high-power chips is also increasing. The increase in computing power also brings an increase in chip power consumption. The integration and miniaturization of the main computing power chips in multiple domains will continuously reduce their volume. Therefore, the heat source density of the chips has increased significantly. Therefore, how to quickly dissipate the heat from the concentrated heat source to meet the working temperature requirements of the chips to ensure the stable operation of the domain controller has become particularly important.

[0029] Based on this, in one embodiment, the present utility model proposes a heat dissipation device for a domain controller, aiming to solve the above problems.

[0030] Figure 1 Shows the external structure of the heat dissipation device described in the present utility model in one embodiment from one perspective.

[0031] Figure 2 Shows the external structure of the heat dissipation device described in the present utility model from another perspective in one embodiment.

[0032] As Figure 1 and Figure 2 shown, in some embodiments, the heat dissipation device for a domain controller may include: a first cover plate 1 and a second cover plate 2 connected to each other to form a relatively enclosed housing, and the main board 3 of the domain controller is disposed in the cavity of the housing. As can be seen from Figure 1 , a plurality of data and electrical connection joints of the domain controller extend from the side wall of the housing, facilitating connection with external components.

[0033] Figure 3 Shows a schematic diagram of the split structure of the heat dissipation device described in the present utility model in one embodiment.

[0034] As Figure 3 shown, the first cover plate 1 is provided with a cooling medium channel 11, and the head and tail ends of the cooling medium channel have a cooling medium inlet 111 and a cooling medium outlet 112. In this way, the cooling medium can flow into the cooling medium channel from the cooling medium inlet 111, and after heat exchange, flow out from the cooling medium outlet 112. In addition, a plurality of holes 113 are formed on the side of the first cover plate 1 for allowing a plurality of data and electrical connection joints of the domain controller to extend out of the housing. The first cover plate 1 is further provided with a first cover plate threaded hole 114 for corresponding connection with a second cover plate threaded hole 21 on the second cover plate 2 through a first bolt 5 to realize the connection between the first cover plate 1 and the second cover plate 2.

[0035] In some more specific embodiments, the first cover plate 1 may be a die-cast component.

[0036] In some more specific embodiments, in order to increase the length of the flow path of the cooling medium, the cooling medium channel may be made to extend in a meandering manner, that is, having a plurality of elbow portions and straight pipe portions.

[0037] In addition, in some other more specific embodiments, in order to further streamline the structure of the heat dissipation device, the cooling medium channel 11 may also be arranged in a U shape as shown in Figure 1 and Figure 2 .

[0038] As Figure 3 and Figure 4 shown, the heat dissipation device further includes a heat spreader 4 disposed in the cavity of the housing. The heat spreader 4 includes a heat spreader body 41 and a boss 421 protruding from the heat spreader body. In some embodiments, the first surface of the heat spreader body 41 (for example Figure 3The upper surface shown in [description] is connected to the outer wall of the cooling medium channel in a close - contact manner, so as to conduct heat exchange with the cooling medium. The second surface 42 of the heat spreader body 41, which is opposite to the first surface, has at least one boss 421 protruding from the second surface. The boss 421 is used to be respectively connected in a close - contact manner with at least one electronic device 311 on the first side 31 of the main board 3 of the domain controller, so as to conduct heat exchange with it. And the area of the heat spreader body 41 (that is, the area of the two - dimensional heat dissipation plane of the heat spreader) is larger than the top area of the boss 421 (that is, the projected area of the boss 421 on the main board 3).

[0039] In this way, the electronic devices 311 on the main board 3, especially high - power - consumption electronic devices, conduct heat to the heat spreader body 41 through the boss 421. Since the area of the heat spreader body (which can be understood as the area of the first surface or the second surface) is much larger than the area of the protrusion, the heat spreader 4 can quickly conduct heat to a larger two - dimensional heat dissipation plane to increase the heat exchange area and achieve rapid heat exchange with the first cover plate 1.

[0040] In some embodiments of the present utility model, the heat spreader can be a structure with a cavity filled with a phase - change liquid. When the heat spreader is heated, the phase - change liquid generates a vaporization phenomenon, and the cooling medium will quickly fill the entire cavity. Since the thermal resistance of the vapor is relatively low, the heat distribution of the heat spreader is relatively uniform. When the gaseous working medium contacts a cooler area, it will liquefy and release heat. The liquefied coolant will return to the heat source under the capillary action of the micro - structure on the inner wall of the heat spreader and continue to absorb heat, thus completing the entire heat cycle. Therefore, the heat conduction mode of the heat spreader is two - dimensional planar heat conduction.

[0041] In the present utility model, the electronic devices on the main board can be a system - on - chip (SOC), or other heat - generating and power - consuming electronic components, such as resistors, capacitors, inductors, diodes, and triodes.

[0042] It should be noted that in the present utility model, the cooling medium in the cooling medium channel 11 can be a liquid cooling medium, such as water, oil, chemical coolant or other coolants, or a gas cooling medium, such as dry ice.

[0043] In some more preferred embodiments, as Figure 3 shown, in order to further improve the heat exchange efficiency between the heat spreader 4 and the first cover plate, a first heat - conducting element 6 can also be provided between the heat spreader body 41 and the cooling medium channel. In this way, the heat spreader body 41 is connected to the cooling medium channel in a close - contact manner through the first heat - conducting element 6.

[0044] In some more specific embodiments, the first heat-conducting element may be thermal grease. Those skilled in the art can select the thermal conductivity of the thermal grease according to actual needs. Generally speaking, the higher the thermal conductivity of the thermal grease, the more beneficial it is for heat dissipation.

[0045] Of course, in other more specific embodiments, the first heat-conducting element may also be thermal clay, thermal gel, thermal double-sided tape, thermal graphite sheet or similar heat-conducting elements.

[0046] In some more specific embodiments, the thickness of the first heat-conducting element between the heat pipe and the first cover plate is extremely thin. For example, its thickness can be less than 0.1 mm.

[0047] Similarly, in order to further improve the heat exchange efficiency between the heat pipe 4 and the electronic device 311, in some preferred embodiments, as Figure 3 shown, at least one second heat-conducting element 7 is further provided between the top surface of the boss 421 of the heat pipe 4 and the electronic device, and the boss 421 is connected to the chip in a manner of being in contact with the second heat-conducting element 7.

[0048] In this way, the electronic device 311 on the main board 3, especially the high-power-consuming electronic device, can quickly conduct heat to the heat pipe body 41 through the boss 421 and the second heat-conducting element 7. Since the area of the heat pipe body 41 is much larger than the area of the boss 421, the heat pipe body 41 can quickly conduct heat to a larger two-dimensional heat dissipation plane to increase the heat exchange area. At the same time, the heat pipe body 41 realizes rapid heat exchange with the cooling medium in the cooling medium channel of the first cover plate through the first heat-conducting element 6.

[0049] In some more specific embodiments, the second heat-conducting element may be thermal grease. Those skilled in the art can select the thermal conductivity of the thermal grease according to actual needs. Generally speaking, the higher the thermal conductivity of the thermal grease, the more beneficial it is for heat dissipation.

[0050] Of course, in other more specific embodiments, the second heat-conducting element may also be thermal clay, thermal gel, thermal double-sided tape, thermal graphite sheet or similar heat-conducting elements.

[0051] In some more preferred embodiments, as Figure 3 shown, the heat dissipation device may further include a third heat-conducting element 8 disposed between the second cover plate 2 and the main board 3. The upper surface of the third heat-conducting element 8 faces the second side of the main board that is opposite to the first side (such as Figure 3 shown upper surface), for example Figure 3The electronic devices on the lower surface as shown are in contact connection. The lower surface of the third heat-conducting element 8 is in contact connection with the inner surface of the second cover plate. Through this setting method, the heat-generating electronic devices on the lower surface of the main board 3 transfer heat from the electronic devices to the second cover plate 2 through the third heat-conducting element, so as to perform natural heat dissipation and cooling. This downward transfer of heat reduces the pressure of all heat transferring to the first cover plate, and overall improves the heat dissipation capacity of the heat dissipation device.

[0052] In some more specific embodiments, the third heat-conducting element can be heat-conducting silicone grease. Those skilled in the art can select the heat conductivity of the heat-conducting silicone grease according to actual needs. Generally speaking, the higher the heat conductivity of the heat-conducting silicone grease, the more beneficial it is to heat dissipation.

[0053] Of course, in other more specific embodiments, the third heat-conducting element can also be heat-conducting clay, heat-conducting gel, heat-conducting double-sided tape, heat-conducting graphite sheet or similar heat-conducting elements.

[0054] In some more preferred embodiments, as Figure 3 and Figure 4 shown, the heat dissipation device can also include a heat pipe bracket 9, which is also arranged in the cavity of the housing. The heat pipe 4 is arranged between the first cover plate 1 and the heat pipe bracket 9, and the heat pipe bracket 9 can be connected to the first cover plate through the second bolt 10, so as to fasten the heat pipe on the cooling medium channel.

[0055] In this embodiment, the utility model presses and buckles the heat pipe 4 on the first cover plate 1 through the heat pipe bracket 9, reduces the gap between the heat pipe 4 and the first cover plate 1, thereby reducing the thermal resistance of the first heat-conducting element 6, and further greatly improving the heat conduction efficiency between the two components. Moreover, the heat pipe bracket 9 can also help to maintain the shape of the heat pipe 4, avoid stress deformation of the heat pipe after long-term thermal cycling, resulting in deformation of the capillary structure inside the heat pipe and reducing the heat transfer ability of the phase change material inside the heat pipe. Therefore, by maintaining the shape of the heat pipe by the heat pipe bracket, the performance stability of the heat pipe life cycle can be greatly improved.

[0056] As Figure 4 shown, in some more specific embodiments, the heat pipe bracket 9 is provided with a hollow part, so that the boss 421 of the heat pipe can extend out from the hollow part 91 to contact the electronic devices on the main board. Moreover, several rods 92 forming the hollow part also play the role of reinforcing ribs, thus ensuring its structural strength on the basis of the lightweight design of the heat pipe bracket.

[0057] As Figure 4 shown, the second surface 42 of the heat pipe 4 has a groove 422, and the frame 93 of the heat pipe bracket is correspondingly clamped in the groove 422, which further helps the heat pipe bracket 9 to maintain the shape of the heat pipe 4.

[0058] In another embodiment of the present utility model, a domain controller is further provided.

[0059] As Figure 3 and Figure 5 shown, the domain controller includes a main board 3 and the heat dissipation device as described above. Electronic devices 311 are provided on at least one surface of the main board 3, and the heat dissipation device dissipates heat and cools the electronic devices 311.

[0060] In the present utility model, the main board of the domain controller may be a printed circuit board integrated with various electronic devices. The domain controller may be a vehicle domain controller, which is used for controlling the driving state and monitoring the state of the vehicle, including but not limited to an in-vehicle mobile data center, a hardware monitor (HMI) that realizes the function of a human-machine interaction controller, an in-vehicle infotainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU).

[0061] From Figure 5 it can be seen the heat conduction paths of the electronic devices on the main board 3 of the domain controller. For example, the heat generated by the electronic devices 311 located on the first side (such as the upper surface as Figure 5 shown) of the main board 3 is transferred to the heat sink body 41 through the bosses 421 and the second guiding element 7, and then through the two-dimensional heat conduction characteristic of the heat sink body 41, the heat is quickly dispersed to a two-dimensional plane with the same area as the heat sink body. The heat on the heat sink body is transferred to the first cover plate 1 through the first heat conducting element 6, and then the heat dissipated is taken away by the cooling medium in the cooling medium channel. At the same time, the heating electronic devices 311 on the second side (such as the lower surface as Figure 5 shown) of the main board 3 transfer the heat from the electronic devices to the second cover plate 2 through the third heat conducting element 8, so as to perform natural heat dissipation cooling, thereby reducing the pressure that all the heat is transferred to the first cover plate, and overall improving the heat dissipation capacity of the domain controller.

[0062] The domain controller described in the present utility model can be used in a vehicle. For example, it can be applied to the automated driving of an intelligent vehicle. Among them, the intelligent vehicle may include an electric vehicle or a gasoline-driven vehicle that supports unmanned driving, driver assistance (ADAS), intelligent driving, connected driving, intelligent network driving, and car sharing.

[0063] Therefore, in one embodiment, the present invention further provides a vehicle having the domain controller as described above. Since the present invention does not improve other components and control systems of the vehicle, the other components of the vehicle will not be described in detail here.

[0064] It should be noted that the existing technology in the scope of protection of the present utility model is not limited to the embodiments given in the present utility model documents. All existing technologies that do not contradict the solutions of the present utility model, including but not limited to prior patent documents, prior public publications, prior public uses, etc., can be included in the scope of protection of the present utility model.

[0065] In addition, the combination of the various technical features in this case is not limited to the combination described in the claims of this case or the combination described in the specific embodiments. All technical features recorded in this case can be freely combined or combined in any way unless there is a contradiction between them.

[0066] It should also be noted that the above-listed embodiments are merely specific embodiments of the present invention. Obviously, the present invention is not limited to the above-listed embodiments, and similar variations or modifications that can be directly derived from or easily conceived by those skilled in the art based on the disclosure of the present invention are intended to fall within the scope of protection of the present invention.

Claims

1. A heat dissipation device for a domain controller, characterized in that: include: A first cover plate (1) is provided with a cooling medium channel (11), wherein the cooling medium channel is provided with a cooling medium inlet (111) and a cooling medium outlet (112); a second cover plate (2) connected to the first cover plate to form a cavity for accommodating a mainboard of the domain controller; A heat spreader (4) is arranged in the cavity, the heat spreader includes a heat spreader body (41) and at least one boss (421) protruding from the heat spreader body, the heat spreader body is closely connected to the cooling medium channel, the boss is used to be closely connected to at least one electronic device on the first side of the mainboard, and the area of the heat spreader body is larger than the top area of the boss.

2. The heat dissipation device according to claim 1, wherein: A first heat conducting element (6) is provided between the heat spreader body and the cooling medium channel, and the heat spreader body is closely connected to the cooling medium channel via the first heat conducting element.

3. The heat dissipation device according to claim 2, wherein: The first heat-conducting element is thermal grease.

4. The heat dissipation device according to claim 1, wherein: The top surface of the boss is provided with a second heat-conducting element (7) for correspondingly contacting at least one electronic component of the mainboard, and the boss is closely connected to the electronic component via the second heat-conducting element.

5. The heat dissipation device according to claim 4, wherein: The second heat-conducting element is thermal grease.

6. The heat dissipation device according to claim 1, wherein: It also includes a third heat-conducting element (8), the upper surface of which is in contact with the electronic device on the second side of the mainboard opposite to the first side, and the lower surface of the third heat-conducting element is in contact with the inner surface of the second cover.

7. The heat dissipation device according to claim 6, wherein: The third heat-conducting element is thermal grease.

8. The heat dissipation device according to claim 1, wherein: It also includes a heat spreader bracket (9), which is arranged in the cavity and connected to the first cover plate. The heat spreader is arranged between the first cover plate and the heat spreader bracket to be fastened to the cooling medium channel by the heat spreader bracket.

9. The heat dissipation device according to claim 8, wherein: The heat spreader bracket is provided with a hollow portion (91), and the protrusion of the heat spreader extends from the hollow portion.

10. The heat dissipation device according to claim 8, wherein: The heat spreader body is provided with a groove (422), and the frame (93) of the heat spreader bracket is correspondingly clamped in the groove.

11. A domain controller comprising a mainboard (3) on which an electronic device (311) is provided, characterized in that: The domain controller further includes a heat dissipation device as described in any one of claims 1-10.

12. A vehicle, characterized in that: It has a domain controller as claimed in claim 11.

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