Parallel cooling device for domain controller, domain controller and vehicle

Abstract

The utility model discloses a parallel cooling device for a domain controller, which comprises a cooling medium distributor provided with a cooling medium supply inlet and a plurality of cooling medium distribution ports; cavities are formed in the cooling modules, the cooling modules are used for being arranged corresponding to the cooled elements so as to correspondingly exchange heat with the cooled elements, and each cooling module is provided with a cooling medium inlet, a cooling medium outlet and a cooling medium channel arranged between the cooling medium inlet and the cooling medium outlet; and the cooling medium inlets of the plurality of cooling modules are correspondingly connected with the plurality of cooling medium distribution ports respectively. According to the utility model, the cooling medium can be uniformly distributed to the plurality of chips, so that the rapid, simultaneous, uniform and effective heat dissipation of the plurality of chips can be realized.

Description

Technical Field

[0001] The utility model relates to a cooling device, in particular to a cooling device used for a domain controller. Background Art

[0002] With the development of domain controllers, more and more domain controllers require the integration of multiple high-computing chips. For these domain controllers, the computing power and number of chips will continue to increase, while their size will continue to decrease. This significantly increases the density of heat sources in the domain controllers. Therefore, it is particularly important to quickly and evenly dissipate heat from multiple heat sources simultaneously to meet the operating temperature requirements of each chip and ensure stable operation of the domain controller.

[0003] Currently, high-computing, multi-chip domain controllers mostly use single-channel sequential liquid cooling for heat dissipation. However, while this method offers high heat dissipation capabilities, when there are multiple high-power chip heat sources, the first chip through which the low-temperature liquid coolant flows will receive sufficient heat dissipation. This will cause the temperature of the low-temperature liquid coolant to rise, resulting in subsequent chips receiving a higher temperature than the previous ones. This can result in insufficient heat dissipation for the subsequent chips, leading to uneven heat dissipation across the chips and, consequently, unstable performance of the domain controller. Utility Model Content

[0004] One of the purposes of the present utility model is to provide a parallel cooling device for a domain controller, which can evenly distribute the cooling medium to multiple chips, thereby achieving rapid, simultaneous, uniform and effective heat dissipation of multiple chips, thereby providing a more uniform heat dissipation method for the domain controller to ensure and improve the performance of the domain controller.

[0005] In order to achieve the above objectives, the present invention proposes a parallel cooling device for a domain controller, which includes:

[0006] A cooling medium distributor having a cooling medium supply inlet and a plurality of cooling medium distribution ports;

[0007] Several cooling modules with cavities inside are used to be arranged corresponding to several cooled elements to perform heat exchange with each cooled element, wherein each cooling module has a cooling medium inlet and a cooling medium outlet, and a cooling medium channel arranged between the cooling medium inlet and the cooling medium outlet; the cooling medium inlets of the several cooling modules are respectively connected to the several cooling medium distribution ports.

[0008] Furthermore, the parallel cooling device described in the present invention also includes a cooling medium collector, which has a cooling medium discharge outlet and a plurality of cooling medium collecting ports, and the plurality of cooling medium collecting ports are respectively connected to the cooling medium outlets of the plurality of cooling modules.

[0009] Furthermore, the parallel cooling device described in the present invention further includes a plurality of heat transfer elements, which correspond to the plurality of cooling modules respectively, and are arranged between each cooling module and the corresponding cooled element.

[0010] Furthermore, in the parallel cooling device described in the present invention, the surface area of the first side of the heat transfer element is adapted to the bottom area of the cooling module, and the second side of the heat transfer element opposite to the first side has several heat conducting parts adapted to the top surface area of the cooled element.

[0011] Furthermore, in the parallel cooling device of the present invention, the surface area of the first side is larger than the surface area of the heat conducting portion.

[0012] Furthermore, in the parallel cooling device described in the present invention, a thermal interface material layer is provided between the heat transfer element and the cooled element.

[0013] Furthermore, in the parallel cooling device described in the present invention, at least one partition is provided in the cooling module to set the cooling medium channel to extend in a meandering manner between the cooling medium inlet and the cooling medium outlet.

[0014] Furthermore, in the parallel cooling device described in the present invention, guide vanes and / or spoiler columns are provided in the cooling module.

[0015] Another object of the present invention is to provide a domain controller having excellent heat dissipation performance and thus stable performance.

[0016] Based on the above purpose, the present invention also provides a domain controller, which includes a housing and a printed circuit board arranged in the housing, and a plurality of main chips are provided on the printed circuit board. In addition, it also includes the parallel cooling device as described above, and the parallel cooling device is arranged in the housing. The plurality of cooling modules are arranged corresponding to the plurality of main chips serving as cooled elements to perform heat exchange with each main chip.

[0017] The present invention also provides a vehicle, which has the domain controller as described above.

[0018] The parallel cooling device described in the present invention can distribute the cooling medium evenly to multiple cooling modules at the same time, so that the cooling medium can flow through multiple chips with high computing power and high heat flux density at the same time, ensuring that multiple chips receive heat dissipation from cooling media of basically the same temperature at the same time, thereby keeping the temperature rise of multiple chips relatively stable, thereby ensuring the stability of the domain controller performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic structural diagram of a parallel cooling device according to the present invention in one embodiment is shown from a top view.

[0020] Figure 2 The figure shows the arrangement of the partitions of the parallel cooling device described in the present invention in another embodiment.

[0021] Figure 3 A schematic structural diagram of a parallel cooling device according to the present invention in one embodiment is shown from a frontal perspective.

[0022] Figure 4 A schematic diagram of the split structure of the domain controller described in the present utility model in one embodiment is shown.

[0023] Figure 5 The diagram shows a parallel cooling device and a printed circuit board installed together in one embodiment of the domain controller of the present invention.

[0024] Figure 6 A heat transfer element of a domain controller according to the present invention is shown in one embodiment. DETAILED DESCRIPTION

[0025] The parallel cooling device, domain controller and vehicle described in the present invention will be further explained and illustrated below in combination with the drawings and specific embodiments of the specification. However, such explanation and illustration do not constitute an undue limitation on the technical solution of the present invention.

[0026] For domain controllers (DCs) that integrate multiple high-computing chips, the density of heat sources is increasing as the computing power and number of chips continue to increase, while the size of printed circuit boards (PCBs) continues to decrease. Therefore, it is crucial to quickly and evenly dissipate heat from these multiple heat sources simultaneously to meet the operating temperature requirements of each chip and ensure stable operation of the DC.

[0027] The currently widely used single-channel sequential liquid cooling method can only ensure that the chip through which the cooling medium flows first is fully cooled. However, the cooling needs of the chips that flow through later cannot be fully guaranteed because the temperature of the cooling medium received by the chips is higher than that of the previous chips. This leads to uneven heat dissipation of each chip, resulting in unstable performance of the domain controller.

[0028] In one embodiment, the present invention proposes a parallel cooling device, which aims to solve the above-mentioned problem of uneven cooling.

[0029] Figure 1 A schematic structural diagram of a parallel cooling device according to the present invention in one embodiment is shown from a top view.

[0030] It should be noted that for the sake of simplicity in the graphic expression, Figure 1 The diagram only schematically shows two cooling modules, which does not mean that the present invention is limited to two cooling modules. Those skilled in the art can set multiple cooling modules according to the number of domain controller chips, such as two, three, four, five, or more.

[0031] like Figure 1 As shown, in some embodiments, the parallel cooling device may include:

[0032] The cooling medium distributor 1 has a cooling medium supply inlet 101 and several cooling medium distribution ports 102, 103. Several cooling modules 2, 3, each having an internal cavity, are respectively configured to correspond to a plurality of cooled components, thereby performing heat exchange with each cooled component. Each cooling module has a cooling medium inlet 201, 301 and a cooling medium outlet 202, 302, as well as a cooling medium channel provided between the cooling medium inlet 201, 301 and the cooling medium outlet 202, 302, through which the cooling medium flows. The cooling medium inlets 201, 301 of the cooling modules are respectively connected to the several cooling medium distribution ports 102, 103 of the cooling medium distributor 1.

[0033] In this way, the cooling medium distributor 1 distributes the cooling medium F supplied thereto to each cooling module 2, 3 evenly and simultaneously through the cooling medium distribution ports 102, 103. Each cooling module 2, 3 then performs heat exchange with the corresponding cooled element, such as a chip, thereby ensuring that each cooled element can be cooled simultaneously, avoiding the phenomenon of uneven and asynchronous cooling of multiple cooled elements.

[0034] It should be noted that, in the present invention, the cooling medium F can be a liquid cooling medium, such as water, oil or other coolants, or a gaseous cooling medium, such as dry ice.

[0035] In some embodiments, the parallel cooling device may further include a cooling medium collector 4 having a cooling medium discharge port 401 and several cooling medium collection ports 402, 403, wherein the several cooling medium collection ports 402, 403 are respectively connected to the cooling medium outlets 202, 302 of several cooling modules to uniformly collect and discharge the cooling medium of each cooling module.

[0036] In some other embodiments, the cooling medium collector 4 may not be provided. In this case, the used cooling medium passes through the cooling medium outlets 202 and 302 of each cooling module to be processed in subsequent steps.

[0037] like Figure 1 As shown, in some embodiments, at least one partition 203, 303 is provided in each of the cooling modules 2, 3, thereby separating the cooling medium inlet 201, 301 and the cooling medium outlet 202, 302 in two cavities connected to each other to form a winding cooling medium channel (or called a cooling medium flow path).

[0038] It should be noted that for each cooling module, although Figure 1 Only one partition is shown, but multiple partitions can also be provided for a single cooling module, for example Figure 2 As shown, three partitions 203, 303 are provided to increase the path through which the cooling medium flows, that is, to increase the length of the cooling medium channel, thereby further increasing the cooling time or improving the cooling effect.

[0039] Figure 3 A schematic structural diagram of a parallel cooling device according to the present invention in one embodiment is shown from a frontal perspective.

[0040] like Figure 3 As shown, in some more preferred embodiments, to further enhance the heat dissipation effect, the parallel cooling device of the present invention may further include a plurality of heat transfer elements 5, 6, which correspond to the plurality of cooling modules 2, 3. Each heat transfer element 5, 6 is disposed between a corresponding cooling module 2, 3 and its corresponding cooled element 901, 902.

[0041] Continue reading Figure 3In some more specific embodiments, the heat transfer elements 5 and 6 have a first side 502 and 602 adapted to the bottom surface area of the cooling modules 2 and 3. A second side of the heat transfer elements 5 and 6, opposite the first side, is provided with a plurality of heat conducting portions 501 and 601. These heat conducting portions adapt to the top surface area of the cooled elements 901 and 902. This arrangement allows the heat transfer elements 5 and 6 to adapt to the areas of the cooling modules 2 and 3 and the cooled elements 901 and 902, respectively, and to contact both, thereby further enhancing the cooling effect.

[0042] In some more specific embodiments, the first sides of the heat transfer elements 5 , 6 may be connected to the corresponding cooling modules 2 , 3 by welding or gluing.

[0043] In some more specific embodiments, the surface area of the first side 502, 602 of the heat transfer element 5, 6 (i.e., the area of the contact surface with the cooling module) is larger than the surface area of the heat conducting portion 501, 601 (i.e., the area of the contact surface with the cooled element). In other words, the bottom area of the cooling module is larger than the surface area of the cooled element. This arrangement is beneficial for improving the cooling effect on the cooled element by increasing the bottom area of the cooling module.

[0044] like Figure 3 As shown, in some more preferred embodiments, in order to further improve the efficiency of heat exchange, thermal interface material layers 7, 8 can be provided between the heat transfer elements 5, 6 and the cooled elements 901, 902, and the upper and lower surfaces of the thermal interface material layers 7, 8 are directly in contact with the heat transfer elements 5, 6 and the cooled elements 901, 902, respectively.

[0045] In this embodiment, by providing the thermal interface material layers 7 and 8, the contact thermal resistance between the heat transfer elements 5 and 6 and the cooled elements 901 and 902 can be reduced, thereby improving the heat energy transfer efficiency.

[0046] In some more specific embodiments, the thermal interface material can be aluminum oxide, silicon nitride, aluminum nitride, and graphene or similar materials.

[0047] In some more preferred embodiments, guide vanes and / or spoiler columns may be further provided in the cooling modules 2 and 3 so that the cooling medium can flow fully in the cooling modules 2 and 3 to further improve the cooling effect.

[0048] In some embodiments, the present invention further provides a domain controller having the above-mentioned parallel cooling device.

[0049] Figure 4 A schematic diagram of the split structure of the domain controller described in the present utility model in one embodiment is shown.

[0050] Figure 5 The diagram shows a parallel cooling device and a printed circuit board installed together in one embodiment of the domain controller of the present invention.

[0051] like Figure 4 and Figure 5 As shown, in some embodiments, the domain controller includes a housing, a printed circuit board 9 disposed in the housing, and a parallel cooling device.

[0052] In some more specific embodiments, to facilitate assembly, the housing includes a bottom cover 10 and an upper cover 11, which are snap-fitted to the upper cover 11 and then fastened by bolts to form a cavity for accommodating a printed circuit board 9, cooling modules 2, 3 of a parallel cooling device, a cooling medium distributor 1, and an optional cooling medium collector 4.

[0053] The cooling medium supply inlet 101 of the cooling medium distributor 1 extends outside the housing through a first through-hole 1101 of the upper cover 11, allowing connection to a cooling medium supply line, such as a vehicle's cooling medium supply line. Thus, the cooling medium is distributed to the cooling modules 2, 3 via the cooling medium inlets 201, 301 of the cooling modules 2, 3, connected to the respective cooling medium distribution ports 102, 103.

[0054] The printed circuit board 9 is provided with several cooled components 901, 902 (e.g., main chips). Several cooling modules 2, 3 are positioned corresponding to these components 901, 902 (e.g., main chips) to exchange heat with each main chip. This allows multiple main chips to be cooled simultaneously at the same cooling medium temperature, solving the problem of uneven heat dissipation across multiple chips and ensuring stable operation of the domain controller.

[0055] It should be noted that for the sake of simplicity in the graphic expression, Figure 4 and Figure 5 The illustration of two cooling modules cooling two main chips is merely schematic. This does not mean that the present invention is limited to two cooling modules or that only two main chips are provided on the printed circuit board. Those skilled in the art may configure multiple cooling modules, such as two, three, four, five, or more, depending on the number of domain controller main chips.

[0056] In some more specific embodiments, Figure 4 and Figure 5As shown, the parallel cooling device of the domain controller may further include a cooling medium collector 4, whose plurality of cooling medium collection ports 402, 403 are respectively connected to the cooling medium outlets 202, 302 of the plurality of cooling modules 2, 3. This allows the cooling medium after absorbing heat to be collected from the cavities of the cooling modules 2, 3 and output through the cooling medium outlet 401 of the cooling medium collector 4. The cooling medium outlet 401 of the cooling medium collector 4 can extend outside the housing through the second through hole 1102 in the upper cover 11 to facilitate connection to a cooling medium outlet pipeline, such as the cooling medium outlet pipeline of a vehicle.

[0057] like Figure 4 As shown, in some more specific embodiments, the bottom cover 10 may be provided with a plurality of mounting posts 1001, and the printed circuit board 9 may be provided with a plurality of escape holes 903. The escape holes 903 on the printed circuit board 9 are passed through the mounting posts 1001 on the bottom cover 10, and then the printed circuit board 9 is fixed to the bottom cover 10 using bolts. The cooling modules 2 and 3 are fixed to the bottom cover 10 using the mounting holes 206 and corresponding bolts.

[0058] In some more specific embodiments, in order to facilitate assembly and replacement and maintenance of the cooling medium, the cooling module 2 may include a cooling module body 220, 320 and a corresponding cooling module cover 210, 310 that are separately arranged and connected together (for example, by welding or gluing), thereby forming a cavity for accommodating the cooling medium therein.

[0059] In some more specific embodiments, Figure 4 As shown, the cooling medium inlet 201, 301 and the cooling medium outlet 202, 302 can be correspondingly arranged on the respective cooling module cover plates 210, 310, and the cooling module body 220, 320 is provided with an inward-concave cavity, and a partition 203, 303 is provided in the cavity to form a winding cooling medium channel between the cooling medium inlet 201, 301 and the cooling medium outlet 202, 302.

[0060] In some more preferred embodiments, a plurality of guide vanes 204 and / or a plurality of spoiler columns 205 may be further provided in the cavity of the cooling modules 2 , 3 , so that the cooling medium can flow sufficiently in the cavity of the cooling modules 2 , 3 .

[0061] In the present invention, a guide vane refers to a sheet-like structure having a certain extension length on the flow path of the cooling medium, and a spoiler column refers to a columnar structure having a certain extension height.

[0062] In some more preferred embodiments, Figure 4 、 Figure 5 and Figure 6As shown, the bottom surfaces 207, 305 of the cooling modules 2, 3 are connected to the first sides 502, 602 of the heat transfer elements 5, 6 by welding or gluing. Meanwhile, heat conducting portions 501, 601 are provided on the second sides of the heat transfer elements 5, 6. Thermal interface material layers 7, 8 are provided between the heat conducting portions 501, 601 of the heat transfer elements 5, 6 and the main chips 901, 902 on the printed circuit board 9, thereby connecting the heat conducting portions 501, 601 of the heat transfer elements 5, 6 to the upper surfaces of the main chips 901, 902 on the printed circuit board 9, thereby further improving the heat dissipation effect of the chips.

[0063] In the present invention, the main chip can be understood as a chip with greater computing power and higher heat dissipation requirements compared to other chips.

[0064] It should also be noted that, for a single heat transfer element, it may have one or more heat transfer parts. When multiple heat transfer parts are provided, it can also cool other chips within its range. For example, Figure 6 As shown, beside the heat conducting portion 501 , 601 with a relatively large area, there may be a plurality of heat conducting portions 501 , 601 with relatively small areas. These heat conducting portions may cool other chips on the printed circuit board.

[0065] In this way, the parallel cooling device described in the present invention can distribute the cooling medium evenly to multiple cooling modules at the same time, so that the cooling medium can flow through multiple chips with high computing power and high heat flux density at the same time, ensuring that multiple chips receive heat dissipation from cooling media of basically the same temperature at the same time, thereby keeping the temperature rise of multiple chips relatively stable, thereby ensuring the stability of the domain controller performance.

[0066] In another embodiment, the present invention further provides a vehicle having the vehicle-mounted domain controller as described above. Since the present invention does not improve other components of the vehicle, the other components of the vehicle will not be described in detail here.

[0067] It should be noted that the existing technology in the scope of protection of the present utility model is not limited to the embodiments given in the present utility model documents. All existing technologies that do not contradict the solutions of the present utility model, including but not limited to prior patent documents, prior public publications, prior public uses, etc., can be included in the scope of protection of the present utility model.

[0068] In addition, the combination of the various technical features in this case is not limited to the combination described in the claims of this case or the combination described in the specific embodiments. All technical features recorded in this case can be freely combined or combined in any way unless there is a contradiction between them.

[0069] It should also be noted that the above-listed embodiments are merely specific embodiments of the present invention. Obviously, the present invention is not limited to the above-listed embodiments, and similar variations or modifications that can be directly derived from or easily conceived by those skilled in the art based on the disclosure of the present invention are intended to fall within the scope of protection of the present invention.

Claims

1. A parallel cooling device for a domain controller, characterized in that: include: A cooling medium distributor (1) having a cooling medium supply inlet (101) and a plurality of cooling medium distribution ports (102, 103); A plurality of cooling modules (2, 3) having cavities therein are used to be arranged corresponding to a plurality of cooled elements so as to perform heat exchange correspondingly with each cooled element, wherein each cooling module has a cooling medium inlet (201, 301) and a cooling medium outlet (202, 302), and a cooling medium channel arranged between the cooling medium inlet and the cooling medium outlet; the cooling medium inlets of the plurality of cooling modules are respectively connected to a plurality of cooling medium distribution ports.

2. The parallel cooling device according to claim 1, characterized in that: It also includes a cooling medium collector (4), which has a cooling medium discharge outlet (401) and a plurality of cooling medium collecting ports (402, 403), and the plurality of cooling medium collecting ports are respectively connected to the cooling medium outlets of the plurality of cooling modules.

3. The parallel cooling device according to claim 1, characterized in that: It also comprises a plurality of heat transfer elements (5, 6), which respectively correspond to the plurality of cooling modules and are arranged between each cooling module and the corresponding cooled element.

4. The parallel cooling device according to claim 3, characterized in that: The surface area of the first side (502, 602) of the heat transfer element matches the bottom area of the cooling module, and the second side of the heat transfer element opposite to the first side has a heat conduction portion (501, 601) matching the top area of the cooled element.

5. The parallel cooling device according to claim 4, characterized in that: The surface area of the first side (502, 602) is greater than the surface area of the heat conducting portion (501, 601).

6. The parallel cooling device according to claim 3, characterized in that: A heat-conducting interface material layer (7, 8) is provided between the heat transfer element and the cooled element.

7. The parallel cooling device according to claim 1, characterized in that: At least one partition (203, 303) is provided in the cooling module to set the cooling medium channel to extend in a meandering manner between the cooling medium inlet and the cooling medium outlet.

8. The parallel cooling device according to claim 1, wherein: A guide plate (204) and / or a spoiler column (205) are provided in the cooling module.

9. A domain controller comprising a housing and a printed circuit board (9) arranged in the housing, wherein the printed circuit board is provided with a plurality of main chips, characterized in that: It also includes a parallel cooling device as described in any one of claims 1 to 8, wherein the parallel cooling device is arranged in the housing, and the plurality of cooling modules are arranged corresponding to the plurality of main chips as cooled elements to perform heat exchange with each main chip.

10. A vehicle, characterized in that: It has a domain controller as claimed in claim 9.

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