Capacitor and inductor liquid cooling structure of high-voltage electronic water pump

Abstract

The utility model relates to a capacitor and inductor liquid cooling structure of a high-voltage electronic water pump. The water channel comprises a water channel body, a capacitor packaging cavity and an inductor packaging cavity, wherein the capacitor packaging cavity and the inductor packaging cavity are arranged in the water channel body; the IGBT cooling water channel is arranged in the water channel main body; the capacitor cooling water channel is arranged adjacent to the capacitor packaging cavity; the inductor cooling water channel is arranged adjacent to the inductor packaging cavity; the water channel body is further provided with a water channel water inlet hole and a water channel water outlet hole, the water channel water inlet hole is communicated with one end of the capacitor cooling water channel and one end of the IGBT cooling water channel, and the other end of the capacitor cooling water channel is communicated with one end of the inductor cooling water channel. The water channel water outlet holes are respectively communicated with the other end of the inductor cooling water channel and the other end of the IGBT cooling water channel. By reasonably designing the distribution of the cooling flow channels, when cooling liquid flows through the cooling flow channels, heat of the capacitor and the inductor can be rapidly taken away, and therefore the effect of cooling the capacitor and the inductor through the liquid is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic water pumps, in particular to a high-voltage electronic water pump capacitor and inductor liquid cooling structure. Background Art

[0002] The power modules in the controllers of high-voltage electronic water pumps generate significant heat during operation due to power loss. This is particularly true for IGBTs (insulated gate bipolar transistors), capacitors, and inductors. These components are prone to overheating under high-current, high-frequency operating conditions, which in turn affects system stability and lifespan.

[0003] Currently, most electronic water pump designs focus solely on IGBT cooling channels, using coolant to remove heat. However, heat dissipation for components like capacitors and inductors typically relies on external convection and internal heat conduction via thermally conductive adhesive. This cooling method is inefficient and makes it difficult to effectively control component temperatures, especially under high load conditions. Summary of the Invention

[0004] To this end, the utility model provides a high-voltage electronic water pump capacitor and inductor liquid cooling structure. On the basis of retaining the existing IGBT cooling water channel structure, the capacitor and inductor are encapsulated in the cavity on the back of the cooling channel. By rationally designing the distribution of the cooling channel, when the coolant flows through the cooling channel, it can quickly take away the heat of the capacitor and inductor, thereby achieving the effect of liquid cooling the capacitor and inductor.

[0005] In order to solve the above technical problems, the present invention provides a high-voltage electronic water pump capacitor and inductor liquid cooling structure, comprising a water channel body and:

[0006] A capacitor packaging cavity, used for packaging capacitors;

[0007] An inductor packaging cavity, used for packaging an inductor;

[0008] An IGBT cooling water channel is provided in the water channel body;

[0009] A capacitor cooling water channel is provided adjacent to the capacitor packaging cavity;

[0010] an inductor cooling water channel, disposed adjacent to the inductor packaging cavity;

[0011] The water channel body is further provided with a water channel inlet and a water channel outlet. The water channel inlet is respectively connected to one end of the capacitor cooling water channel and the IGBT cooling water channel, the other end of the capacitor cooling water channel is connected to one end of the inductor cooling water channel, and the water channel outlet is respectively connected to the other end of the inductor cooling water channel and the IGBT cooling water channel.

[0012] In one embodiment of the present invention, the capacitor is encapsulated in the capacitor packaging cavity by epoxy resin.

[0013] In one embodiment of the present invention, the inductor is encapsulated in the inductor packaging cavity through organic silicon.

[0014] In one embodiment of the present invention, the water channel body is provided with a plurality of holes intersecting horizontally and vertically to form the IGBT cooling water channel, and a process hole is formed between each of the holes and the side wall of the water channel body, and a sealing member is sealed on the process hole.

[0015] In one embodiment of the present invention, a water channel blocking plate is further included. The water channel body is provided with a water channel cavity on the side wall close to the inductor packaging cavity. The water channel blocking plate is welded to the water channel cavity to form the capacitor cooling water channel and the inductor cooling water channel.

[0016] In one embodiment of the present invention, the water channel inlet 5 and the water channel outlet are both arranged on the water channel blocking plate.

[0017] In one embodiment of the present invention, the capacitor cooling water channel and the inductor cooling water channel are arranged on the same plane.

[0018] In one embodiment of the present invention, the plane where the capacitor cooling water channel is located is perpendicular to the plane where the IGBT cooling water channel is located.

[0019] The above technical solution of the utility model has the following advantages compared with the prior art:

[0020] The utility model discloses a high-voltage electronic water pump capacitor and inductor liquid cooling structure, which diverts the coolant to the capacitor cooling water channel, the inductor cooling water channel and the IGBT cooling water channel through the water channel inlet hole, thereby improving the overall cooling efficiency and effectively ensuring the operating stability and service life of each electronic component.

[0021] The utility model integrates the capacitor packaging cavity, the inductor packaging cavity and the corresponding cooling water channels in the water channel body, making the overall structure more compact, reducing the complexity of external connections, lowering the difficulty of maintenance, and saving installation space.

[0022] The capacitor and inductor of the utility model are respectively encapsulated with epoxy resin and organic silicon. This encapsulation method not only enhances the heat dissipation performance of the components, but also improves their ability to resist moisture, aging and external environmental influences.

[0023] The utility model welds the water channel blocking plate and the water channel cavity by a plane friction welding process, so that the capacitor cooling water channel and the inductor cooling water channel can be packaged and integrated into one, thereby improving the sealing and reliability of the package, and also enhancing the mechanical strength of the overall structure, ensuring the long-term durability of the cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0025] Figure 1 It is a cross-sectional view of the capacitor and inductor liquid cooling structure of the high-voltage electronic water pump of the present invention.

[0026] Figure 2 yes Figure 1 Cross-sectional view along the AA direction.

[0027] Figure 3 yes Figure 1 Cross-sectional view along direction BB.

[0028] Description of the accompanying drawings:

[0029] 1. Water channel body; 2. Water channel plate; 3. Capacitor packaging cavity; 4. Inductor packaging cavity; 5. Water channel inlet hole; 6. Capacitor cooling water channel; 7. Inductor cooling water channel; 8. IGBT cooling water channel; 9. Water channel outlet hole; 10. Seal. DETAILED DESCRIPTION

[0030] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0031] In the present invention, if there is a description of directions (up, down, left, right, front and back), it is only for the convenience of describing the technical solution of the present invention, and does not indicate or imply that the technical features referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0032] In this utility model, "several" means one or more, "multiple" means more than two, "greater than," "less than," "exceeds," etc. are understood to exclude the number itself; "above," "below," "within," etc. are understood to include the number itself. In the description of this utility model, the use of "first" or "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0033] In this utility model, unless otherwise expressly defined, terms such as "disposed," "installed," and "connected" should be interpreted broadly. For example, they may refer to direct connection or indirect connection through an intermediate medium; fixed connection or detachable connection or integral molding; mechanical connection or electrical connection or mutual communication; and internal connection between two components or interaction between two components. Those skilled in the art can reasonably determine the specific meanings of these terms in this utility model based on the specific content of the technical solution.

[0034] Reference Figures 1 to 3 As shown, a high-voltage electronic water pump capacitor and inductor liquid cooling structure of the present invention includes a water channel body 1 and the following components disposed in the water channel body 1:

[0035] Capacitor packaging cavity 3, used for packaging capacitors;

[0036] Inductor packaging cavity 4, used for packaging the inductor;

[0037] IGBT cooling water channel 8, arranged in the water channel body 1;

[0038] A capacitor cooling water channel 6 is provided adjacent to the capacitor packaging cavity 3;

[0039] An inductor cooling water channel 7 is provided adjacent to the inductor packaging cavity 4;

[0040] Among them, the water channel body 1 is also provided with a water channel inlet hole 5 and a water channel outlet hole 9. The water channel inlet hole 5 is respectively connected to one end of the capacitor cooling water channel 6 and the IGBT cooling water channel 8, and the other end of the capacitor cooling water channel 6 is connected to one end of the inductor cooling water channel 7. The water channel outlet hole 9 is respectively connected to the other end of the inductor cooling water channel 7 and the IGBT cooling water channel 8.

[0041] Through the above arrangement, the coolant is drained from the water channel inlet hole 5 to the capacitor cooling water channel 6, the inductor cooling water channel 7 and the IGBT cooling water channel 8 respectively, so that the coolant is divided into two branches to cool the capacitor cooling water channel 6, the inductor cooling water channel 7 and the IGBT cooling water channel 8 respectively, avoiding the coolant flowing to the capacitor cooling water channel 6 and the inductor cooling water channel 7 after passing through the IGBT cooling water channel 8, or flowing to the IGBT cooling water channel 8 after passing through the capacitor cooling water channel 6 and the inductor cooling water channel 7, thereby improving the cooling effect.

[0042] By integrating multiple structures, including the capacitor packaging cavity 3, inductor packaging cavity 4, capacitor cooling water channel 6, inductor cooling water channel 7, and IGBT cooling water channel 8, within the water channel body 1, the overall structure is more compact. This integrated design not only reduces occupied space but also reduces the complexity of external connections and installation, thereby improving the reliability and production efficiency of the overall design.

[0043] In one embodiment, the capacitor is encapsulated in the capacitor encapsulation cavity 3 using epoxy resin, while the inductor is encapsulated in the inductor encapsulation cavity 4 using silicone. Using epoxy resin and silicone materials to encapsulate the capacitor and inductor, respectively, not only improves heat dissipation but also enhances component protection. This encapsulation method effectively protects the components from moisture, aging, and environmental influences, thereby improving the long-term stability of the system.

[0044] The above arrangement increases the heat dissipation area, thereby improving the cooling effect on the capacitor and inductor.

[0045] In one embodiment, the water channel body 1 is provided with a plurality of intersecting channels, both horizontally and vertically, to form the IGBT cooling water channel 8. Process holes are formed between each of the channels and the sidewalls of the water channel body 1, and a seal 10 is provided on each of the process holes. It should be noted that the IGBT cooling water channel 8 is formed by punching through a process. The IGBT and the IGBT cooling water channel 8 are insulated by a ceramic sheet. The IGBT is attached to the ceramic sheet using thermally conductive adhesive, and the ceramic sheet is attached to the sidewalls of the IGBT cooling water channel 8 using thermally conductive adhesive.

[0046] In one embodiment, a water channel baffle plate 2 is further included. The water channel main body 1 is provided with a water channel cavity on the side wall near the inductor packaging cavity 4. The water channel baffle plate 2 is welded (by plane friction welding) to the water channel cavity to form the capacitor cooling water channel 6 and the inductor cooling water channel 7; so that the capacitor cooling water channel 6 and the inductor cooling water channel 7 are packaged and integrated into one; the water channel water inlet hole 5 and the water channel water outlet hole 9 are both provided on the water channel baffle plate 2.

[0047] In one embodiment, the capacitor cooling water channel 6 and the inductor cooling water channel 7 are arranged on the same plane.

[0048] In one embodiment, the plane where the capacitor cooling water channel 6 is located is perpendicular to the plane where the IGBT cooling water channel 8 is located.

[0049] Working process: After the coolant enters the water channel body 1 from the water channel inlet hole 5, it is divided into two branches and enters the capacitor cooling water channel 6 and the IGBT cooling water channel 8 respectively. The coolant in the capacitor cooling water channel 6 then flows through the inductor cooling water channel 7 to the water channel outlet hole 9, and the coolant in the IGBT cooling water channel 8 flows directly to the water channel outlet hole 9.

[0050] Finally, it should be noted that the above specific implementation methods are only used to illustrate the technical solution of the utility model and are not limiting. Although the utility model is described in detail with reference to examples, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A high-voltage electronic water pump capacitor and inductor liquid cooling structure, characterized in that: It comprises a water channel body (1) and arranged in the water channel body (1): A capacitor packaging cavity (3) for packaging a capacitor; An inductor packaging cavity (4), used for packaging the inductor; An IGBT cooling water channel (8) is arranged in the water channel body (1); A capacitor cooling water channel (6) is provided adjacent to the capacitor packaging cavity (3); An inductor cooling water channel (7) is provided adjacent to the inductor packaging cavity (4); The water channel body (1) is further provided with a water channel inlet hole (5) and a water channel outlet hole (9), the water channel inlet hole (5) is respectively connected to one end of the capacitor cooling water channel (6) and the IGBT cooling water channel (8), the other end of the capacitor cooling water channel (6) is connected to one end of the inductor cooling water channel (7), and the water channel outlet hole (9) is respectively connected to the other end of the inductor cooling water channel (7) and the IGBT cooling water channel (8).

2. A high-voltage electronic water pump capacitor and inductor liquid cooling structure according to claim 1, characterized in that: The capacitor is encapsulated in the capacitor encapsulation cavity (3) by epoxy resin.

3. The high-voltage electronic water pump capacitor and inductor liquid cooling structure according to claim 1, characterized in that: The inductor is encapsulated in the inductor encapsulation cavity (4) through organic silicon.

4. The high-voltage electronic water pump capacitor and inductor liquid cooling structure according to claim 1, characterized in that: The water channel body (1) is provided with a plurality of holes intersecting horizontally and vertically to form the IGBT cooling water channel (8), and a process hole is formed between each of the holes and the side wall of the water channel body (1), and a sealing member (10) is sealed on the process hole.

5. The high-voltage electronic water pump capacitor and inductor liquid cooling structure according to claim 1, characterized in that: It also includes a water channel baffle (2), the water channel body (1) is provided with a water channel cavity on the side wall close to the inductor packaging cavity (4), and the water channel baffle (2) is welded to the water channel cavity to form the capacitor cooling water channel (6) and the inductor cooling water channel (7).

6. The high-voltage electronic water pump capacitor and inductor liquid cooling structure according to claim 5, characterized in that: The water channel inlet hole (5) and the water channel outlet hole (9) are both arranged on the water channel baffle plate (2).

7. The high-voltage electronic water pump capacitor and inductor liquid cooling structure according to claim 1, characterized in that: The capacitor cooling water channel (6) and the inductor cooling water channel (7) are arranged on the same plane.

8. The high-voltage electronic water pump capacitor and inductor liquid cooling structure according to claim 1, characterized in that: The plane where the capacitor cooling water channel (6) is located is perpendicular to the plane where the IGBT cooling water channel (8) is located.

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