Heat dissipation device for power supply and cooking equipment

Abstract

The utility model belongs to the technical field of kitchen appliances, and discloses a heat dissipation device for a power supply and cooking equipment. The heat dissipation device for the power supply comprises a heat dissipation fan, a bottom plate and a water tank. The cooling fan is used for driving air in the cooling air duct to flow through the power supply; the bottom plate is arranged above the inner container; the water tank is arranged above the bottom plate, a partial heat dissipation air channel is formed between the water tank and the bottom plate, and the power source is arranged between the bottom plate and the water tank and electrically connected with the microwave solid-state source. When the heat dissipation device for the power supply is applied to the cooking equipment, the manufacturing cost and the manufacturing difficulty of the cooking equipment can be reduced, meanwhile, all structures of the cooking equipment can be reasonably arranged to form a heat dissipation air channel, and therefore the utilization rate of the space in the cooking equipment can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of kitchen appliances, in particular to a heat dissipation device for a power supply and a cooking device. Background Art

[0002] Semiconductor microwave heating technology is a commonly used heating technology in kitchen appliances. Among them, the "microwave solid-state source" semiconductor is very popular among users because of its easy installation, simple control, and more efficient and uniform heating effect.

[0003] In the existing technology, the microwave solid-state source heating module mainly includes a solid-state source module, an antenna / waveguide system, a temperature detection feedback system, a power supply and a control module. The power supply is used to provide electrical energy to ensure the normal operation of each structure, and the control module can control various parameters such as power, time and temperature to flexibly meet the user's heating needs.

[0004] However, when the above structure is in use, a cooling and heat dissipation mechanism needs to be separately provided for the power supply to ensure that the power supply can operate continuously and stably. However, the internal space of the cooking device is limited, and the added cooling and heat dissipation mechanism requires a more difficult spatial layout to be implemented, which not only increases the cost of the entire cooking device, but also increases the difficulty of production. Utility Model Content

[0005] The purpose of the present utility model is to provide a heat dissipation device for a power supply and a cooking device, which solves the problem in the prior art that when a cooling and heat dissipation mechanism is set up separately for the power supply, the layout of the cooling and heat dissipation mechanism is difficult due to the limited internal space of the cooking device, which not only increases the manufacturing cost of the cooking device, but also increases the production difficulty.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a heat dissipation device for a power supply, which includes:

[0008] A heat dissipation fan, used to drive the air in the heat dissipation duct to flow through the power supply;

[0009] A bottom plate is arranged above the inner tank;

[0010] A water tank is arranged above the bottom plate, and a part of the heat dissipation duct is formed between the water tank and the bottom plate. A power supply is arranged between the bottom plate and the water tank and is electrically connected to the microwave solid-state source.

[0011] Optionally, the heat dissipation duct includes an air inlet section and an air outlet section, the air inlet section, the heat dissipation fan and the air outlet section are distributed along the air flow path in the heat dissipation duct, and the power supply is located in the air inlet section.

[0012] Optionally, an air inlet connected to the air inlet section is formed between the control panel and the door body, and the control panel has a mounting port for mounting a water tank.

[0013] Optionally, the power supply is spaced apart from the base plate to form a lower heat dissipation space that constitutes part of the heat dissipation duct.

[0014] Optionally, a plurality of support portions are spaced apart in the lower heat dissipation space, and the support portion is connected to one of the bottom plate and the power supply and abuts against the other.

[0015] Optionally, the bottom plate protrudes downward to form a heat dissipation groove, the power supply is located in the heat dissipation groove, and the lower heat dissipation space is formed between the power supply and the bottom wall of the heat dissipation groove.

[0016] Optionally, a heat dissipation hole is formed through the bottom wall of the heat dissipation groove.

[0017] Optionally, the support portion includes an integrally connected support section and a plug-in section, wherein along the radial direction, the cross-sectional area of the plug-in section is smaller than the cross-sectional area of the support section, the support section is connected to the base plate, and the power supply has a plug-in slot that is plugged into the plug-in section.

[0018] Optionally, the power supply and the water tank are spaced apart to form an upper heat dissipation space that constitutes part of the heat dissipation duct.

[0019] In a second aspect, the present invention provides a cooking device comprising:

[0020] liner;

[0021] A microwave solid-state source is arranged in the inner container;

[0022] a power supply electrically connected to the microwave solid-state source;

[0023] The heat dissipation device for a power supply according to any one of the first aspects is arranged in the inner tank.

[0024] Beneficial effects of the utility model:

[0025] First, by providing a heat dissipation duct on the top wall of the inner container, partially forming a heat dissipation duct between the water tank and the bottom plate, and positioning the power supply between the bottom plate and the water tank, during operation of the power supply, the cooling fan only needs to be continuously operated to allow air to flow through the heat dissipation duct, whereupon the air can contact the power supply and dissipate heat. Thus, during manufacture of the heat dissipation device for the power supply, the heat dissipation duct is formed by the layout of the corresponding structures, and the power supply can be placed within the heat dissipation duct to achieve cooling and heat dissipation of the power supply. This eliminates the need for additional structures to form the heat dissipation duct, effectively reducing the manufacturing difficulty and cost of the heat dissipation device for the power supply. When used in a cooking device, this can reduce the manufacturing cost and difficulty of the cooking device. Furthermore, the various structures of the cooking device can be rationally arranged to form the heat dissipation duct, thereby improving the utilization of the space within the cooking device.

[0026] Secondly, when in use, the cooking device can utilize its own structural layout to form a heat dissipation duct for the power supply, so as to continuously dissipate heat from the power supply during the use of the cooking device, and there is no need to set up a separate heat dissipation space for the power supply, thereby effectively reducing the manufacturing cost of the cooking device, and facilitating the reasonable layout of various structures within the cooking device, reducing the manufacturing difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic structural diagram of a cooking device according to an embodiment of the present invention;

[0028] Figure 2 is a side view of a cooking device according to an embodiment of the present invention;

[0029] Figure 3 is a top view of a cooking device according to an embodiment of the present invention;

[0030] Figure 4 This is a schematic structural diagram of the bottom plate and power supply of the heat dissipation device for power supply in an embodiment of the present utility model;

[0031] Figure 5 This is a structural diagram of the bottom plate, power supply, heat dissipation slots and heat dissipation holes of the heat dissipation device for power supply in an embodiment of the utility model;

[0032] Figure 6 yes Figure 5 An enlarged view of section A in the illustrated implementation;

[0033] Figure 7 This is a structural cross-sectional view of the bottom plate, power supply, and heat dissipation groove of the heat dissipation device for power supply in an embodiment of the utility model.

[0034] In the picture:

[0035] 1. Cooling fan; 11. Air inlet section;

[0036] 2. Bottom plate; 21. Lower heat dissipation space; 22. Heat dissipation slot; 23. Heat dissipation hole;

[0037] 3. Water tank;

[0038] 4. Power supply; 41. Plug slot; 42. Upper heat dissipation space;

[0039] 5. Inner liner;

[0040] 6. Microwave solid-state source;

[0041] 7. Control panel;

[0042] 8. Support part; 81. Support section; 82. Connecting section. DETAILED DESCRIPTION

[0043] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0044] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0045] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0046] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0047] The embodiment of the utility model discloses a heat dissipation device for a power supply and cooking equipment.

[0048] Reference Figures 1 to 4 The power supply heat dissipation device includes a heat dissipation fan 1, a base plate 2, and a water tank 3. The heat dissipation fan 1 is used to drive air in the heat dissipation duct to flow through the power supply 4; the base plate 2 is arranged above the inner tank 5; the water tank 3 is arranged above the base plate 2, and a portion of the heat dissipation duct is formed between the water tank 3 and the base plate 2. The power supply 4 is arranged between the base plate 2 and the water tank 3 and is electrically connected to the microwave solid-state source 6.

[0049] Specifically, the structures arranged on the top wall of the inner tank 5 can be enclosed together to form a heat dissipation duct. The heat dissipation duct can be linear or curved. In the present embodiment, the heat dissipation duct is L-shaped and extends along two adjacent side walls of the inner tank 5. The heat dissipation fan 1 can be arranged in the middle of the heat dissipation duct. The heat dissipation fan 1 can be a fan that is matched with the microwave solid-state source 6, and there is no need to add an additional fan. A bottom plate 2 is arranged on the top wall of the inner tank 5. The setting method can be bolt connection, welding or bonding. A water tank 3 is arranged above the bottom plate 2. The water tank 3 can store clean water for generating steam, and can also store cleaning liquid for cleaning the inner wall of the inner tank 5. A part of the heat dissipation duct is formed between the bottom plate 2 and the water tank 3, and a space for accommodating the power supply 4 is formed between the two. The power supply 4 is fixedly installed in this space. The fixing method can be plugging, snapping, welding or bonding.

[0050] By providing a heat dissipation duct on the top wall of the inner pot 5, partially forming a heat dissipation duct between the water tank 3 and the bottom plate 2, and simultaneously arranging the power supply 4 between the bottom plate 2 and the water tank 3, during the operation of the power supply 4, only the heat dissipation fan 1 needs to be continuously operated, and air can flow in the heat dissipation duct, so that the air can contact the power supply 4 and dissipate heat from the power supply 4. In this way, when manufacturing the heat dissipation device for the power supply 4, the heat dissipation duct is formed by the layout of the corresponding structures, and the power supply 4 can be arranged in the heat dissipation duct, thereby achieving the effect of cooling and dissipating heat from the power supply 4. No additional structures are required to form the heat dissipation duct, effectively reducing the manufacturing difficulty and cost of the heat dissipation device for the power supply 4. When applied to a cooking device, the manufacturing cost and difficulty of the cooking device can be reduced. At the same time, the various structures of the cooking device can be rationally arranged to form the heat dissipation duct, thereby improving the utilization rate of the space within the cooking device.

[0051] Optionally, the heat dissipation duct includes an air inlet section 11 and an air outlet section. The air inlet section 11 , the heat dissipation fan 1 and the air outlet section are distributed along the air flow path in the heat dissipation duct, and the power supply 4 is located in the air inlet section 11 .

[0052] Specifically, by setting the cooling fan 1 between the air inlet section 11 and the air outlet section, the position of the cooling fan 1 does not need to be fixed at the two end positions of the cooling air duct, and the position of the cooling fan 1 can be flexibly adjusted according to the specific shape of the cooling air duct. At this time, the air intake of the cooling fan 1 is toward the air inlet section 11, and the air outlet is toward the air outlet section.

[0053] By distributing the air inlet section 11, the heat dissipation fan 1, and the air outlet section along the air flow path, air is first drawn into the air inlet section 11 by the heat dissipation fan 1 and then discharged through the air outlet section. During the air flow process, the air can fully contact the various structures that form the heat dissipation duct, thereby achieving heat dissipation for each structure. Depending on the heat dissipation requirements, structures with higher heat dissipation requirements can be arranged in the air inlet section 11, with the power supply 4 being located in the air inlet section 11. This allows the air to first contact the power supply 4 upon entering the air inlet section 11 for efficient heat dissipation, while other structures with lower heat dissipation requirements are arranged in the air outlet duct to improve the overall heat dissipation effect for each structure.

[0054] Optionally, an air inlet communicating with the air inlet section 11 is formed between the control panel 7 and the door body, and the control panel 7 has a mounting port for mounting the water tank 3 .

[0055] Specifically, the control panel 7 is arranged on the front side of the inner liner 5, and a door body is hinged on the front side of the inner liner 5 for closing or opening the inner liner 5. When the door body is closed, an air inlet is formed between the door body and the control panel 7, and the air inlet is connected to the air inlet section 11.

[0056] By forming an air inlet between the control panel 7 and the door, the air inlet is always connected to the outside during the cooking process, so that external air can be smoothly drawn into the air inlet section 11, thereby ensuring that the power supply 4 can continuously dissipate heat during operation. The air inlet is formed by utilizing the structure of the cooking device itself, which can further improve the space utilization within the cooking device.

[0057] Reference Figures 5 to 7 Optionally, the power supply 4 is spaced apart from the base plate 2 to form a lower heat dissipation space 21 that constitutes part of the heat dissipation duct.

[0058] Specifically, a supporting structure can be set on the top wall of the base plate 2 to support the power supply 4 and form a lower heat dissipation space 21 between the base plate 2. A concave slot-like structure can also be set on the top wall of the base plate 2 to form the lower heat dissipation space 21.

[0059] By forming the lower heat dissipation space 21 , the power supply 4 is separated from the base plate 2 , and air can flow through the lower heat dissipation space 21 , so that the air can fully contact the power supply 4 during the flow process, thereby improving the heat dissipation effect of the power supply 4 .

[0060] Optionally, a plurality of support portions 8 are spaced apart in the lower heat dissipation space 21 , and the support portion 8 is connected to one of the base plate 2 and the power supply 4 and abuts against the other one.

[0061] Specifically, in one embodiment, a plurality of support portions 8 may be protruded from the top wall of the base plate 2. The support portions 8 may be truncated or multi-sided, with their top walls abutting against the bottom wall of the power supply 4. The power supply 4 is in a cubic shape, and a support portion 8 is provided at each corner of the power supply 4 to ensure that the power supply 4 is stably supported on the base plate 2, thereby smoothly forming the lower heat dissipation space 21.

[0062] By distributing a plurality of support parts 8 in a ring, the power supply 4 can be suspended above the base plate 2, so that a lower heat dissipation space 21 is formed between the bottom wall of the power supply 4 and the supporting base plate 2, so that the air can fully contact the bottom wall of the power supply 4 during the flow process and dissipate heat efficiently.

[0063] Optionally, the bottom plate 2 protrudes downward to form a heat dissipation groove 22 , the power supply 4 is located in the heat dissipation groove 22 , and the lower heat dissipation space 21 is formed between the power supply 4 and the bottom wall of the heat dissipation groove 22 .

[0064] Specifically, the bottom plate 2 is partially convex downward, forming a heat dissipation groove 22 on its top wall. The length and width of the heat dissipation groove 22 are both larger than the power supply 4, allowing the power supply 4 to be at least partially located within the heat dissipation groove 22. The two opposing sides of the heat dissipation groove 22 along the air flow direction are both arc-shaped to facilitate smooth air flow into the heat dissipation groove 22. The height of the support portion 8 is less than the depth of the heat dissipation groove 22, allowing the bottom wall of the power supply 4 to be located within the heat dissipation groove 22, thereby facilitating sufficient air contact with the power supply 4 during air flow and dissipating heat from the power supply 4.

[0065] Optionally, a heat dissipation hole 23 is formed through the bottom wall of the heat dissipation groove 22 .

[0066] Specifically, a plurality of heat dissipation holes 23 may be provided at intervals, so that the space within the heat dissipation slot 22 is open, so that air can flow quickly through the heat dissipation slot 22 , thereby improving the heat dissipation effect on the power supply 4 .

[0067] Optionally, the bottom plate 2 and the inner container 5 are spaced apart.

[0068] Specifically, a certain distance is maintained between the bottom wall of the base plate 2 and the top wall of the inner tank 5 so that air can also enter the heat dissipation groove 22 from the heat dissipation hole 23, thereby increasing the space for air flow and thereby improving the heat dissipation effect of the air on the power supply 4 during the flow process.

[0069] Optionally, the support portion 8 includes an integrally connected support section 81 and a plug-in section 82. Along the radial direction, the cross-sectional area of the plug-in section 82 is smaller than the cross-sectional area of the support section 81. The support section 81 is connected to the base plate 2, and the power supply 4 has a plug-in slot 41 that is plugged into the plug-in section 82.

[0070] Specifically, the support portion 8 is a stepped shaft, wherein the section with a larger diameter is the support section 81, and the section with a smaller diameter is the plug-in section 82. The support section 81 and the base plate 2 can be an integral structure, or they can be fixedly connected by welding or bonding. A plug-in slot 41 is provided at the edge of the power supply 4, and the plug-in slot 41 is sleeved with the plug-in section 82, and the bottom wall of the power supply 4 can abut against the top wall of the support section 81. The plug-in section 82 can be a cylindrical or square column, and the present invention does not limit this.

[0071] By providing the support section 81 and the plug-in section 82, when the power supply 4 is installed, the plug-in section 82 is inserted into the plug-in slot 41 to limit the horizontal movement of the power supply 4, and the bottom wall of the power supply 4 abuts against the top wall of the support section 81, so that the power supply 4 can be smoothly supported in the heat dissipation slot 22, so that the power supply 4 remains suspended.

[0072] Optionally, the power supply 4 and the water tank 3 are spaced apart to form an upper heat dissipation space 42 constituting part of a heat dissipation air duct.

[0073] Specifically, the bottom wall of the water tank 3 is recessed to form an escape space, and the power supply 4 is installed in the escape space, and the top wall of the power supply 4 is spaced apart from the bottom wall of the water tank 3 to form an upper heat dissipation space 42, so that the air can not only contact the bottom wall of the power supply 4 during the flow process, but also fully contact the top wall of the power supply 4, thereby further improving the heat dissipation effect of the power supply 4.

[0074] Optionally, the power supply 4 is located on a side of the air inlet section 11 close to the air inlet.

[0075] Specifically, the power supply 4 is located above the inner container 5 and is disposed close to the control panel 7 so that the power supply 4 is close to the air inlet of the air inlet section 11. As a result, after entering the air inlet section 11, the air can preferentially contact the power supply 4 for heat dissipation, thereby further improving the heat dissipation effect of the power supply 4.

[0076] The cooking device includes an inner pot 5, a microwave solid-state source 6, a power supply 4, and a heat sink for the power supply 4 as described in the above embodiment. The microwave solid-state source 6 is disposed in the inner pot 5; the power supply 4 is electrically connected to the microwave solid-state source 6; and the heat sink for the power supply 4 is disposed in the inner pot 5.

[0077] When in use, the cooking device can utilize the layout of its own structure to form a heat dissipation duct for dissipating heat from the power supply 4, so as to continuously dissipate heat from the power supply 4 during the use of the cooking device. In addition, there is no need to set up a separate heat dissipation space for the power supply 4, thereby effectively reducing the cost of manufacturing the cooking device, facilitating the reasonable layout of various structures within the cooking device, and reducing the difficulty of manufacturing.

[0078] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation device for a power supply, characterized in that: include: a heat dissipation fan (1), configured to drive air in the heat dissipation duct to flow through the power supply (4); A bottom plate (2) is arranged above the inner container (5); A water tank (3) is arranged above the bottom plate (2), and a portion of the heat dissipation duct is formed between the water tank (3) and the bottom plate (2). A power supply (4) is arranged between the bottom plate (2) and the water tank (3) and is electrically connected to the microwave solid-state source (6).

2. The heat dissipation device for power supply according to claim 1, characterized in that: The heat dissipation duct comprises an air inlet section (11) and an air outlet section, the air inlet section (11), the heat dissipation fan (1) and the air outlet section are distributed along the air flow path in the heat dissipation duct, and the power supply is located in the air inlet section (11).

3. The heat dissipation device for power supply according to claim 2, characterized in that: An air inlet communicating with the air inlet section (11) is formed between the control panel (7) and the door body, and the control panel (7) has a mounting port for mounting the water tank (3).

4. The heat dissipation device for a power supply according to claim 1, wherein: The power supply (4) and the bottom plate (2) are spaced apart to form a lower heat dissipation space (21) constituting part of a heat dissipation air duct.

5. The heat dissipation device for power supply according to claim 4, characterized in that: A plurality of support portions (8) are spaced apart in the lower heat dissipation space (21), and the support portion (8) is connected to one of the bottom plate (2) and the power source (4) and abuts against the other.

6. The heat dissipation device for power supply according to claim 4, characterized in that: The bottom plate (2) protrudes downward to form a heat dissipation groove (22), the power supply (4) is located in the heat dissipation groove (22), and the lower heat dissipation space (21) is formed between the power supply (4) and the bottom wall of the heat dissipation groove (22).

7. The heat dissipation device for a power supply according to claim 6, wherein: A heat dissipation hole (23) is formed through the bottom wall of the heat dissipation groove (22).

8. The heat dissipation device for a power supply according to claim 5, wherein: The support portion (8) comprises an integrally connected support section (81) and a plug section (82); along the radial direction, the cross-sectional area of the plug section (82) is smaller than the cross-sectional area of the support section (81); the support section (81) is connected to the base plate (2); and the power supply (4) has a plug slot (41) that is plugged into and matched with the plug section (82).

9. The heat dissipation device for a power supply according to any one of claims 1 to 8, characterized in that: The power supply (4) and the water tank (3) are spaced apart to form an upper heat dissipation space (42) constituting part of a heat dissipation air duct.

10. Cooking equipment, characterized in that include: Liner (5); A microwave solid-state source (6) is disposed in the inner container (5); a power supply (4), electrically connected to the microwave solid-state source (6); The heat dissipation device for a power supply according to any one of claims 1 to 9, arranged in the inner tank (5).

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