Heat exchange part, heat exchange module and electronic equipment

Abstract

The embodiment of the utility model discloses a heat exchange piece, a heat exchange module and electronic equipment, the heat exchange piece comprises a substrate layer and a cover plate layer which are arranged in a stacked mode, a runner groove is formed in the side, close to the cover plate layer, of the substrate layer, the substrate layer comprises a liquid cooling layer and a bonding layer arranged on the liquid cooling layer, and the liquid cooling layer is arranged on the bonding layer. The liquid cooling layer and the bonding layer jointly form the side wall of the flow channel groove, and the cover plate layer is connected with the liquid cooling layer in a sealed mode through the bonding layer, so that the cover plate layer and the substrate layer define a flow channel at the position of the flow channel groove. Therefore, bonding sealing of the liquid cooling layer and the cover plate layer can be achieved through the bonding layer, the sealing technology can be simplified, and therefore the machining difficulty of the heat exchange piece is lowered.

Description

Technical Field

[0001] The utility model relates to the technical field of heat transfer, and more specifically, to a heat exchange component, a heat exchange module and an electronic device. Background Art

[0002] As electronic devices become increasingly integrated, heat dissipation becomes a key factor restricting their performance. Liquid cooling plates, as highly efficient heat dissipation components, are widely used in various high-power density electronic devices.

[0003] Current liquid cooling plate structures typically seal the flow channel layer and the sealing layer through a hot pressing process. However, due to the complexity and diversity of the flow channels within the flow channel layer, a positioning mold is often required to position the flow channel layer and the sealing layer, making the liquid cooling plate manufacturing process more complicated. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a new type of heat exchange component, heat exchange module and electronic equipment.

[0005] According to one aspect of the present utility model, a heat exchange element is provided.

[0006] The heat exchange element comprises:

[0007] A substrate layer and a cover layer are stacked, and a flow channel is provided on one side of the substrate layer close to the cover layer. The substrate layer includes a liquid cooling layer and an adhesive layer arranged on the liquid cooling layer. The liquid cooling layer and the adhesive layer together form the side wall of the flow channel. The cover layer is sealed to the liquid cooling layer through the adhesive layer, so that the cover layer and the substrate layer form a flow channel at the flow channel.

[0008] Optionally, the depth of the flow channel groove ranges from 0.08 mm to 0.17 mm.

[0009] Optionally, along the thickness direction of the heat exchange element, the ratio of the size of the flow channel groove to the size of the substrate layer ranges from 1:6 to 5:6.

[0010] Optionally, the adhesive layer includes at least one layer of adhesive, and the liquid cooling layer and the cover plate layer are adhesively connected via the adhesive layer.

[0011] Optionally, the adhesive is applied by dispensing or screen printing to form the adhesive layer.

[0012] Optionally, the adhesive includes POE, polyurethane, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot-melt composite adhesive film, hot-melt adhesive or thermosetting adhesive.

[0013] Optionally, the cover layer includes at least one of a polymer material layer and a metal layer.

[0014] Optionally, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

[0015] Optionally, the thickness of the adhesive layer ranges from 0.025 mm to 0.05 mm.

[0016] Optionally, the ratio of the thickness of the cover layer to the thickness of the adhesive layer ranges from 0.6 to 2.

[0017] Optionally, along the thickness direction of the heat exchange element, an edge of the adhesive layer is flush with an edge of the liquid cooling layer.

[0018] Optionally, the adhesive layer has a guide portion on a side close to the flow channel groove, and the guide portion is used to guide the flow of the working medium in the flow channel.

[0019] Optionally, the cover layer is a single-layer structure or a multi-layer structure.

[0020] According to another aspect of the present invention, a heat exchange module is provided, comprising a micro pump and the above-mentioned heat exchange element.

[0021] Optionally, the heat exchange element has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet, the first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.

[0022] According to another aspect of the present invention, an electronic device is provided, comprising the above-mentioned heat exchange element or the above-mentioned heat exchange module.

[0023] One technical effect of the embodiments of the present disclosure is:

[0024] The heat exchanger comprises a stacked base layer and a cover layer. A flow channel is defined on one side of the base layer, adjacent to the cover layer. The base layer comprises a liquid cooling layer and an adhesive layer disposed on the liquid cooling layer. The liquid cooling layer and the adhesive layer together form the sidewalls of the flow channel. The cover layer is sealed to the liquid cooling layer via the adhesive layer, forming a flow channel between the cover layer and the base layer at the flow channel. This allows the adhesive layer to achieve a bonded seal between the liquid cooling layer and the cover layer, simplifying the sealing process and reducing the difficulty of manufacturing the heat exchanger.

[0025] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0027] Figure 1 It is a schematic diagram of a heat exchange component according to an embodiment of the present disclosure.

[0028] Description of reference numerals:

[0029] 1. Cover layer; 2. Base layer; 21. Runner groove; 22. Liquid cooling layer; 23. Adhesive layer. DETAILED DESCRIPTION

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.

[0032] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0033] In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0034] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0035] An embodiment of the present utility model provides a heat exchange component, which can be used in heat exchange of electronic devices such as tablet computers, laptop computers, VR (Virtual Reality) products, AR (Augmented Reality) products, and watches.

[0036] like Figure 1 As shown, the heat exchange element provided by the embodiment of the present utility model includes:

[0037] A substrate layer 2 and a cover layer 1 are stacked, and a flow channel 21 is provided on the side of the substrate layer 2 close to the cover layer 1. The substrate layer 2 includes a liquid cooling layer 22 and an adhesive layer 23 arranged on the liquid cooling layer 22. The liquid cooling layer 22 and the adhesive layer 23 together form the side wall of the flow channel 21. The cover layer 1 is sealed to the liquid cooling layer 22 through the adhesive layer 23, so that the cover layer 1 and the substrate layer 2 form a flow channel at the flow channel 21.

[0038] like Figure 1 As shown, in the embodiment of the present invention, a flow channel 21 is provided on one side of the substrate layer 2 near the cover layer 1. That is, the flow channel 21 is a groove on the substrate layer 2, allowing the working fluid to flow smoothly within the flow channel at the flow channel 21 and fully contact the liquid cooling layer 22, thereby achieving efficient heat conduction. Moreover, because the flow channel 21 is a groove on the substrate layer 2, the substrate layer 2 itself can also form a one-sided seal on the flow channel at the flow channel 21, thereby reducing the difficulty of assembling the heat exchange component and improving assembly efficiency.

[0039] Depending on the actual design, the shape of the flow channel 21 includes, but is not limited to, linear, serpentine, and spiral shapes to optimize the flow path and heat exchange efficiency of the working fluid. Connectors or interfaces can also be provided at the inlet and outlet of the flow channel to facilitate connection to external heat exchange systems such as water micropumps and radiators, thereby forming a complete heat exchange cycle.

[0040] In this embodiment, the substrate layer 2 includes a liquid cooling layer 22 and an adhesive layer 23. During the processing of the flow channel 21, the adhesive layer 23 and the liquid cooling layer 22 can be first stacked to form the substrate layer 2, and then the substrate layer 2 can be cut to form the flow channel 21. In this way, the adhesive layer 23 and the liquid cooling layer 22 can jointly form the sidewalls of the flow channel 21, facilitating the formation of the flow channel 21 while also enhancing the sealing of the sidewalls of the flow channel 21. This can ensure the sealing of the flow channel formed on the heat exchange component, thereby ensuring the heat exchange effect.

[0041] The liquid cooling layer 22 may be made of metal material, polymer material, or a composite of metal material and polymer material, so as to meet different application requirements.

[0042] In this embodiment, adhesive layer 23 is located between liquid cooling layer 22 and cover plate layer 1. Adhesive layer 23 is used to seal the connection between liquid cooling layer 22 and cover plate layer 1. Adhesive layer 23 can be made of an adhesive or film material with excellent sealing and thermal conductivity. On the one hand, adhesive layer 23 firmly connects cover plate layer 1 and liquid cooling layer 22, thereby forming the overall structure of the heat exchanger. On the other hand, adhesive layer 23 also ensures the sealing of flow channel 21, preventing leakage of working fluid that could lead to poor heat exchange performance.

[0043] During the production and assembly process, the cover layer 1 forms a sealed connection with the liquid cooling layer 22 through the adhesive layer 23, and the cover layer 1 and the substrate layer 2 form a closed flow channel at the flow channel groove 21. The working medium flows in the flow channel, thereby realizing the heat exchange function of the heat exchange component. In this way, the adhesive layer 23 can be used to achieve the bonding and sealing of the liquid cooling layer 22 and the cover layer 1, which can simplify the sealing process and thus reduce the processing difficulty of the heat exchange component. Among them, the surface of the cover layer 1 in contact with the adhesive layer 23 can be specially treated, such as surface roughening, to enhance the bonding strength between the cover layer 1 and the adhesive layer 23.

[0044] In addition, heat dissipation fins can be provided on the cover layer 1 to increase the heat exchange area and promote air convection, further improving the heat exchange effect of the heat exchange element. Alternatively, a more efficient working fluid (such as a low-viscosity, high-thermal-conductivity liquid) or a phase change material can be used to further improve the heat exchange effect of the high-temperature heat exchange element.

[0045] The heat exchange element provided in this embodiment can be widely used in heat exchange for electronic devices such as tablets, laptops, smart glasses, smart watches, and smart headsets. It can effectively reduce the operating temperature of electronic devices and improve their operational stability and service life. Its thinness, light weight, high heat exchange efficiency, and ease of processing and installation suggest promising market applications.

[0046] Optionally, the depth of the flow channel groove 21 ranges from 0.08 mm to 0.17 mm.

[0047] In this embodiment, by setting the depth range of the flow channel groove 21 on the substrate layer 2 between 0.08 mm and 0.17 mm, the opening process of the flow channel groove 21 on the substrate layer 2 can be controlled, so that while forming the flow channel groove 21 to facilitate the flow of the working medium to achieve heat exchange, the self-strength and sealing of the substrate layer 2 can be guaranteed, thereby improving the structural reliability of the heat exchange component.

[0048] Optionally, along the thickness direction of the heat exchange element, the ratio of the size of the flow channel groove 21 to the size of the substrate layer 2 is in a range of 1:6 to 5:6.

[0049] In this embodiment, by setting the ratio of the depth of the flow channel groove 21 to the thickness of the substrate layer 2 between 1:6 and 5:6, the process of opening the flow channel groove 21 on the substrate layer 2 can be controlled, so that while forming a flow channel groove 21 of a certain depth to facilitate the flow of the working medium to achieve heat exchange, the strength and sealing of the substrate layer 2 itself can be guaranteed, thereby improving the structural reliability of the heat exchange component.

[0050] Among them, the ratio of the depth of the flow channel 21 to the thickness of the substrate layer 2 is preferably 1 / 5, which can achieve a better heat exchange effect while ensuring the sealing of the connection between the substrate layer 2 and the cover layer 1, thereby improving the structural reliability of the heat exchange component.

[0051] Optionally, the adhesive layer 23 includes at least one layer of adhesive, and the liquid cooling layer 22 and the cover plate layer 1 are adhesively connected via the adhesive layer 23 .

[0052] Specifically, according to actual design requirements, the adhesive layer 23 can include one, two or even multiple layers of adhesive to achieve different bonding effects. The adhesive layer 23 can include the same type of adhesive or different types of adhesive to meet different application requirements.

[0053] In this embodiment, the liquid cooling layer 22 is bonded to the cover plate layer 1 via the adhesive layer 23, forming the overall structure of the heat exchanger. Furthermore, the adhesive layer 23 ensures the tightness of the flow channel 21, preventing poor heat exchange due to leakage of the working fluid.

[0054] Optionally, the adhesive is applied by dispensing or screen printing to form the adhesive layer 23 .

[0055] In this embodiment, the adhesive application amount and distribution position can be precisely controlled during the dispensing and screen printing processes, ensuring that the adhesive layer 23 has a uniform thickness on the liquid cooling layer 22 and covers only the areas requiring bonding. This helps reduce unnecessary material waste and improves bonding strength and sealing. The adhesive application pattern and spacing can be adjusted as needed to accommodate liquid cooling layers 22 and cover plates of varying shapes and sizes. This helps optimize the structure of the adhesive layer 23, increasing the contact area and adhesion of the bonding interface, and thus enhancing the overall bonding performance and sealing effect of the heat exchanger.

[0056] Optionally, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot-melt composite adhesive film, hot-melt adhesive or thermosetting adhesive.

[0057] In this embodiment, by designing the adhesive to be any one of polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot-melt composite adhesive film, hot melt glue and thermosetting glue, the liquid cooling layer 22 and the cover layer 1 can be bonded and sealed, thereby simplifying the molding process of the heat exchange component and reducing the processing difficulty of the heat exchange component.

[0058] Among them, the preferred adhesive is a pressure-sensitive hot-melt composite adhesive film. Using the pressure-sensitive hot-melt composite adhesive film to achieve bonding between the liquid cooling layer 22 and the cover layer 1 can improve the reliability of the bonding seal and also improve its density, thereby improving the structural stability of the heat exchange component.

[0059] Optionally, the cover layer 1 includes at least one of a polymer material layer and a metal layer.

[0060] In this embodiment, the cover layer 1 may include a polymer material layer and / or a metal layer, depending on actual design requirements. For example, the cover layer 1 may include a metal layer to improve the overall strength and thermal conductivity of the heat exchanger, thereby ensuring the stability of electronic equipment equipped with the heat exchanger in complex working environments and reducing the operating temperature of the electronic equipment. The cover layer 1 may also include a polymer material layer to meet the lightweight design requirements of the heat exchanger, thereby facilitating the portability and use of the electronic equipment equipped with the heat exchanger. The cover layer 1 may also include a polymer material layer and a metal layer to combine the characteristics of both layers to improve the overall performance of the heat exchanger.

[0061] Optionally, the liquid cooling layer 22 includes at least one of a polymer material layer and a metal layer.

[0062] In this embodiment, the liquid cooling layer 22 may include a polymer material layer and / or a metal layer, depending on actual design requirements. For example, the liquid cooling layer 22 may include a metal layer to improve the strength and thermal conductivity of the liquid cooling layer 22, thereby improving the heat exchange efficiency of the heat exchange element, reducing the operating temperature of the electronic device having the heat exchange element, and facilitating a reduction in the thickness of the liquid cooling layer 22. The liquid cooling layer 22 may also include a polymer material layer to meet the lightweight design requirements of the heat exchange element, thereby facilitating the portability and use of the electronic device having the heat exchange element. The liquid cooling layer 22 may also include a polymer material layer and a metal layer to combine the characteristics of both layers to improve the overall performance of the heat exchange element.

[0063] For example, the liquid cooling layer 22 can be made of a metal material with high thermal conductivity and corrosion resistance, such as copper, aluminum or stainless steel alloy. The liquid cooling layer 22 can also be made of a polymer material such as PET (polyethylene terephthalate) or PBT (polybutylene terephthalate).

[0064] Optionally, the thickness of the adhesive layer 23 ranges from 0.025 mm to 0.05 mm.

[0065] In this embodiment, the thickness of the adhesive layer 23 can be precisely controlled to be between 0.025 mm and 0.05 mm during the dispensing or screen printing process, so that while the liquid cooling layer 22 and the cover plates on both sides are connected by the adhesive layer 23, the thickness of the adhesive layer 23 can also be reduced, thereby reducing the overall thickness of the heat exchange component, thereby meeting the requirements of lightweight and thin electronic equipment using the heat exchange component.

[0066] When the heat exchanger needs to be thinner as a whole, the thickness of the adhesive layer 23 can be set to 0.025 mm; when there is a higher requirement for the connection strength of the heat exchanger, the thickness of the adhesive layer 23 can be set to 0.05 mm.

[0067] The overall thickness of the heat exchange element is in the range of 0.2 mm to 0.4 mm, the thickness of the cover layer 1 is in the range of 0.03 mm to 0.05 mm, the thickness of the adhesive layer 23 is in the range of 0.025 mm to 0.05 mm, and the thickness of the liquid cooling layer 22 is in the range of 0.145 mm to 0.3 mm.

[0068] Optionally, the ratio of the thickness of the cover layer 1 to the thickness of the adhesive layer 23 is in a range of 0.6 to 2.

[0069] Among them, the thickness ratio of the cover layer 1 and the adhesive layer 23 can be adjusted according to the connection strength and size requirements of the heat exchanger, and the problem of glue overflow caused by the adhesive layer 23 being too thick can be avoided, thereby improving the reliability of the heat exchanger.

[0070] Optionally, along the thickness direction of the heat exchange element, the edge of the adhesive layer 23 is flush with the edge of the liquid cooling layer 22. Figure 1 As shown, aligning the edge of the adhesive layer 23 with the liquid cooling layer 22 can reduce the resistance of the working medium flow in the flow channel, thereby ensuring the heat exchange effect of the heat exchange element.

[0071] Optionally, the adhesive layer 23 has a guide portion on a side close to the flow channel groove 21 , and the guide portion is used to guide the flow of the working medium in the flow channel.

[0072] In this embodiment, a guide portion, such as one or more rounded corners, may be provided on the side of the adhesive layer 23 near the flow channel groove 21. This can reduce the flow resistance of the working medium in the flow channel through a smooth transition, helping to reduce energy loss, and also reducing the pressure drop in the flow channel, further improving the fluidity of the working medium, thereby ensuring the heat exchange effect of the heat exchange element.

[0073] Optionally, the cover layer 1 is a single-layer structure or a multi-layer structure.

[0074] In this embodiment, the cover layer 1 can be provided with a single or multiple sealing layers, and the cover layer 1 forms an adhesive seal with the liquid cooling layer 22 through the adhesive layer 23; the cover layer 1 also includes a sealing layer and a barrier layer, and the barrier layer is arranged close to the flow channel groove 21, and the cover layer 1 forms an adhesive seal with the liquid cooling layer 22 through the adhesive layer 23. At the same time, the barrier layer can also form a barrier to foreign matter such as water and dust.

[0075] The present invention also provides a heat exchange module including a micro pump and the aforementioned heat exchange element. Corresponding connectors or interfaces can be provided at the inlet and outlet of the flow channel to facilitate connection with the micro pump and form a complete heat exchange cycle.

[0076] Optionally, the heat exchange element has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet. In this way, the working fluid can enter the flow channel through the second working fluid outlet and the first working fluid inlet, flow, and return to the micropump from the flow channel through the first working fluid outlet and the second working fluid inlet, thereby achieving working fluid circulation.

[0077] The present invention also provides an electronic device including the aforementioned heat exchange element or the aforementioned heat exchange module. The electronic device may be a small electronic device such as a tablet computer, a laptop computer, smart glasses, a smart watch, a smart headset, etc.

[0078] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0079] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will appreciate that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A heat exchange element, characterized in that: include: A substrate layer (2) and a cover layer (1) are stacked, a flow channel (21) is provided on one side of the substrate layer (2) close to the cover layer (1), the substrate layer (2) comprises a liquid cooling layer (22) and an adhesive layer (23) arranged on the liquid cooling layer (22), the liquid cooling layer (22) and the adhesive layer (23) jointly forming a side wall of the flow channel (21), the cover layer (1) is sealed to the liquid cooling layer (22) via the adhesive layer (23), so that the cover layer (1) and the substrate layer (2) form a flow channel at the flow channel (21).

2. The heat exchange element according to claim 1, characterized in that: The depth of the flow channel groove (21) ranges from 0.08 mm to 0.17 mm.

3. The heat exchange element according to claim 1, characterized in that: Along the thickness direction of the heat exchange element, the ratio of the size of the flow channel groove (21) to the size of the substrate layer (2) ranges from 1:6 to 5:

6.

4. The heat exchange element according to claim 1, characterized in that: The bonding layer (23) comprises at least one layer of adhesive, and the liquid cooling layer (22) and the cover plate layer (1) are bonded together via the bonding layer (23).

5. The heat exchange element according to claim 4, characterized in that: The adhesive is applied by dispensing or screen printing to form the adhesive layer (23).

6. The heat exchange element according to claim 4, characterized in that: The adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot-melt composite adhesive film, hot-melt adhesive or thermosetting adhesive.

7. The heat exchange element according to claim 1, characterized in that: The cover plate layer (1) comprises at least one of a polymer material layer and a metal layer.

8. The heat exchange element according to claim 1, characterized in that: The liquid cooling layer (22) includes at least one of a polymer material layer and a metal layer.

9. The heat exchange element according to claim 1, characterized in that: The thickness of the adhesive layer (23) ranges from 0.025 mm to 0.05 mm.

10. The heat exchange element according to claim 1, characterized in that: The ratio of the thickness of the cover plate layer (1) to the thickness of the adhesive layer (23) ranges from 0.6 to 2.

11. The heat exchange element according to claim 1, characterized in that: Along the thickness direction of the heat exchange element, the edge of the adhesive layer (23) is flush with the edge of the liquid cooling layer (22).

12. The heat exchange element according to claim 1, characterized in that: The adhesive layer (23) has a guide portion on one side close to the flow channel groove (21), and the guide portion is used to guide the flow of the working medium in the flow channel.

13. The heat exchange element according to claim 1, characterized in that: The cover plate layer (1) is a single-layer structure or a multi-layer structure.

14. A heat exchange module, characterized in that: The heat exchange device comprises a micro pump and the heat exchange element according to any one of claims 1 to 13.

15. The heat exchange module according to claim 14, characterized in that: The heat exchange element has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.

16. An electronic device, characterized in that: The heat exchange component comprises any one of claims 1 to 13 or the heat exchange module according to any one of claims 14 to 15.

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