Ultrathin chip mounting device

Abstract

The utility model discloses an ultrathin chip mounting device which comprises a positioning seat and a plurality of first positioning assemblies. The positioning seat is provided with a plurality of positioning columns and a plurality of first positioning holes, the first positioning holes are arranged at equal intervals in a matrix mode relative to the positioning seat, and the positioning columns are detachably and internally connected to the first positioning holes. The first positioning assembly comprises an L-shaped plate, a first positioning nail, a second positioning nail and a contact column, a first sliding groove is formed in one end of the L-shaped plate, the first positioning nail is internally connected to the first positioning hole through the first sliding groove, and the contact column is internally connected to the other end of the L-shaped plate through the second positioning nail. The ultrathin chip mounting device disclosed by the utility model has the beneficial effects that the positioning column and the first positioning hole can be combined to form an adjustable positioning structure, and the positioning structure is provided with the concave part and the convex part, so that the positioning structure and a matched ultrathin chip to be mounted can be mutually embedded; therefore, the ultrathin chip to be installed can be quickly positioned to the preset position of the positioning seat.

Description

Technical Field

[0001] The utility model belongs to the field of chip processing equipment, and in particular relates to an ultra-thin chip mounting device. Background Art

[0002] The publication number is CN213976048U, the subject name is a chip grabbing structure and chip processing equipment, and its IPC classification number is B65G47 / 91. Its technical solution discloses "a chip grabbing structure and chip processing equipment, comprising a base 1, a chip processor 2 is fixedly connected to the top left side of the base 1, a transport box 3 is fixedly connected to the bottom of the chip processor 2, and the bottom of the transport box 3 is fixedly connected to the top of the base 1, and the top of the base 1 near the right side of the transport box 3 is fixedly connected to The rotator 4 is fixedly connected to the top of the rotator 4 with an electric telescopic rod 5, the bottom of the electric telescopic rod 5 is fixedly connected to the electric telescopic rod 2 6, the bottom of the electric telescopic rod 2 6 is fixedly connected to the suction disk 7, the bottom outer surface of the electric telescopic rod 2 6 is fixedly connected to a rotating block 8, the rotating block 8 is hinged with a pull plate 9, the side of the pull plate 9 away from the rotating block 8 is hinged with a sliding sleeve 10, the sliding sleeve 10 is slidably connected to a splint 11 inside, and the side of the splint 11 close to the electric telescopic rod 2 6 is fixedly connected to a protective pad 12.

[0003] As can be seen, the above utility model patents have disclosed a technical solution for the prior process of chip installation (i.e., grasping the chip to a predetermined position). However, the technical solution disclosed in the above utility model patents does not further disclose how to fine-tune the chip to a precise position, thereby providing the necessary preparatory work for the subsequent chip installation process, and further improvement is needed. Utility Model Content

[0004] The present invention aims at the existing technical situation, overcomes the above-mentioned defects, and provides an ultra-thin chip mounting device.

[0005] The utility model adopts the following technical solutions, the ultra-thin chip mounting device includes:

[0006] A positioning seat, the positioning seat having a plurality of positioning posts and a plurality of first positioning holes, the first positioning holes being equally spaced relative to the positioning seat and arranged in a matrix, the positioning posts being detachably inscribed in the first positioning holes;

[0007] Several first positioning components, the first positioning component includes an L-shaped plate, a first positioning pin, a second positioning pin and a contact column, one end of the L-shaped plate has a first slide groove, the first positioning pin is connected to the first positioning hole through the first slide groove, the contact column is connected to the other end of the L-shaped plate through the second positioning pin, and an elastic hemisphere is provided on the side of the contact column away from the L-shaped plate, and the elastic hemisphere is in elastic contact with the ultra-thin chip to be installed.

[0008] As a preferred technical solution of the above technical solution, the ultra-thin chip mounting device also includes a second positioning component, the second positioning component includes a positioning plate, a third positioning pin, a fourth positioning pin, a contact block and a rotator, the positioning plate has a second slide groove, the third positioning pin is connected to the first positioning hole through the second slide groove, the contact block is embedded in and elastically connected to the end of the positioning plate, and the rotator is sleeved on the fourth positioning pin and rotates relative to the fourth positioning pin.

[0009] As a preferred technical solution of the above technical solution, the rotator is provided with an integrally formed rotating part, connecting rod part and holding part, the rotating part and the holding part are respectively located at the opposite ends of the connecting rod part, and the rotating part is sleeved on the fourth positioning pin.

[0010] As a preferred technical solution of the above technical solution, the outer periphery of the rotating part has a flat side edge and a curved side edge.

[0011] As a preferred technical solution of the above technical solution, the positioning seat also has several second positioning holes, the aperture of the second positioning holes is different from the aperture of the first positioning holes; the positioning seat also has several third positioning holes, the depth of the third positioning holes is different from the depth of the first positioning holes.

[0012] The ultra-thin chip mounting device disclosed in the present utility model has the following beneficial effects:

[0013] 1. The positioning column and the first positioning hole can be combined to form an adjustable positioning structure, which has a recessed portion and a protruding portion, so that the positioning structure and the matching ultra-thin chip to be installed can be interlocked, so that the ultra-thin chip to be installed can be quickly positioned to the preset position of the positioning seat.

[0014] 2. The position of the first positioning pin remains fixed, and the stroke of the first slide groove of the L-shaped plate relative to the first positioning pin is adjusted in reverse, thereby changing the relative position of the first positioning component relative to the positioning seat, forcing the ultra-thin chip to be installed to change its position or shape accordingly.

[0015] 3. The contact block is squeezed by the rotator, thereby fine-tuning the distance between the contact block and the rotator, forcing the ultra-thin chip to be installed to change its position or shape accordingly. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is the main view of this application.

[0017] Figure 2 It is a side view of the present application.

[0018] Figure 3 It is a stereogram from one viewing angle of this application.

[0019] Figure 4 yes Figure 3 A partial enlarged view of area A in the middle.

[0020] Figure 5 It is a stereoscopic diagram from another perspective of this application.

[0021] Figure 6 yes Figure 5 A partial enlarged view of area B in the middle.

[0022] Figure 7 It is a top view of this application.

[0023] The reference numerals include: 100-positioning seat; 110-positioning column; 120-first positioning hole; 130-second positioning hole; 140-third positioning hole; 200-first positioning assembly; 210-L-shaped plate; 211-first slide groove; 220-first positioning pin; 230-second positioning pin; 240-contact column; 241-elastic hemisphere; 300-second positioning assembly; 310-positioning plate; 311-second slide groove; 320-third positioning pin; 330-fourth positioning pin; 340-contact block; 350-rotator; 351-rotating part; 3511-flat side; 3512-curved side; 352-connecting rod part; 353-gripping part. DETAILED DESCRIPTION

[0024] The utility model discloses an ultra-thin chip mounting device, which is described in conjunction with the preferred embodiment (embodiment 1) and the accompanying drawings. Figure 1-7 , the specific implementation methods of the utility model are further described.

[0025] See attached figure Figures 1 to 7 , Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 and Figure 7 The ultra-thin chip mounting device is shown in different viewing angles. Figure 4 and Figure 6 Partial structures of the ultra-thin chip mounting device are shown respectively.

[0026] Example 1 (the positioning post 110 is detachably (partially) internally connected to the first positioning hole 120).

[0027] Preferably, the ultra-thin chip mounting device comprises:

[0028] The positioning base 100 has a plurality of positioning posts 110 and a plurality of first positioning holes 120. (Most) of the first positioning holes 120 are arranged in a matrix at equal intervals relative to the positioning base 100. The positioning posts 110 are detachably (partially) inscribed in the first positioning holes 120, so that the positioning posts 110 and the first positioning holes 120 can be combined to form an adjustable positioning structure. The positioning structure has a recessed portion (corresponding to the first positioning holes 120) and a protruding portion (corresponding to the positioning posts 110), so that the positioning structure and the matching ultra-thin chip to be installed can be interlocked, so that the ultra-thin chip to be installed can be quickly positioned to a preset position (rough positioning) of the positioning base 100.

[0029] Several first positioning components 200, the first positioning components 200 include an L-shaped plate 210, a first positioning pin 220, a second positioning pin 230 and a contact column 240, one end of the L-shaped plate 210 has a first slide 211, the first positioning pin 220 is connected to the first positioning hole 120 through the first slide 211, the contact column 240 is connected to the other end of the L-shaped plate 210 through the second positioning pin 230, and the side of the contact column 240 away from the L-shaped plate 210 is provided with an elastic hemisphere 241, so that the elastic hemisphere 241 is in contact with the ultra-thin The chip is in elastic contact, so that the first positioning component 200 can not only apply force to the ultra-thin chip to be installed, but also fine-tune the relative position of the first positioning pin 220 relative to the first slide groove 211; in other words, as part of fine positioning, the position of the first positioning pin 220 remains fixed, and the stroke of the first slide groove 211 of the L-shaped plate relative to the first positioning pin 220 is reversely adjusted, thereby changing the relative position of the first positioning component 200 relative to the positioning seat 100, thereby forcing the ultra-thin chip to be installed to change its position or shape accordingly).

[0030] The ultra-thin chip mounting device further includes a second positioning assembly 300, which includes a positioning plate 310, a third positioning pin 320, a fourth positioning pin 330, a contact block 340 and a rotator 350. The positioning plate 310 has a second slide groove 311, and the third positioning pin 320 is connected to the first positioning hole 120 through the second slide groove 311. The contact block 340 is (partially) embedded in and elastically connected to the end of the positioning plate 310. The rotator 350 is sleeved on the fourth positioning pin 330 and rotates relative to the fourth positioning pin 330. One side of the contact block 340 is always in contact with the rotator 350, and the other side of the contact block 340 is always in contact with the ultra-thin chip to be mounted. In other words, as part of fine positioning, the contact block 340 is squeezed by the rotator 350, thereby fine-tuning the distance between the contact block 340 and the rotator 350, thereby forcing the ultra-thin chip to be mounted to change its position or shape accordingly.

[0031] The rotator 350 includes an integrally formed rotating portion 351 , a connecting rod portion 352 and a gripping portion 353 . The rotating portion 351 and the gripping portion 353 are respectively located at opposite ends of the connecting rod portion 352 . The rotating portion 351 is sleeved on the fourth positioning pin 330 .

[0032] The outer periphery of the rotating portion 351 has a flat side 3511 and a curved side 3512 , so that the distance between the contact block 340 and the rotator 350 is adjustable during the rotation of the rotator 350 relative to the fourth positioning pin 330 .

[0033] The positioning seat 100 further has a plurality of second positioning holes 130, the diameter of which is different from that of the first positioning holes 120. If necessary, the second positioning holes 130 can replace part or all of the first positioning holes 120 to form a new positioning structure.

[0034] The positioning seat 100 further has a plurality of third positioning holes 140, the depth of which is different from that of the first positioning holes 120. If necessary, the third positioning holes 140 can replace part or all of the first positioning holes 120 to form a new positioning structure.

[0035] Example 2 (the positioning post 110 is fixed (partially) inscribed in the first positioning hole 120 ).

[0036] Preferably, the ultra-thin chip mounting device comprises:

[0037] The positioning base 100 has a plurality of positioning posts 110 and a plurality of first positioning holes 120. (Most) of the first positioning holes 120 are arranged in a matrix at equal intervals relative to the positioning base 100. The positioning posts 110 are fixedly (partially) inscribed in the first positioning holes 120, so that the positioning posts 110 and the first positioning holes 120 can be combined to form an adjustable positioning structure. The positioning structure has a recessed portion (corresponding to the first positioning holes 120) and a protruding portion (corresponding to the positioning posts 110), so that the positioning structure and the matching ultra-thin chip to be installed can be interlocked, so that the ultra-thin chip to be installed can be quickly positioned to a preset position (rough positioning) of the positioning base 100.

[0038] Several first positioning components 200, the first positioning components 200 include an L-shaped plate 210, a first positioning pin 220, a second positioning pin 230 and a contact column 240, one end of the L-shaped plate 210 has a first slide 211, the first positioning pin 220 is connected to the first positioning hole 120 through the first slide 211, the contact column 240 is connected to the other end of the L-shaped plate 210 through the second positioning pin 230, and the side of the contact column 240 away from the L-shaped plate 210 is provided with an elastic hemisphere 241, so that the elastic hemisphere 241 is in contact with the ultra-thin The chip is in elastic contact, so that the first positioning component 200 can not only apply force to the ultra-thin chip to be installed, but also fine-tune the relative position of the first positioning pin 220 relative to the first slide groove 211; in other words, as part of fine positioning, the position of the first positioning pin 220 remains fixed, and the stroke of the first slide groove 211 of the L-shaped plate relative to the first positioning pin 220 is reversely adjusted, thereby changing the relative position of the first positioning component 200 relative to the positioning seat 100, thereby forcing the ultra-thin chip to be installed to change its position or shape accordingly).

[0039] The ultra-thin chip mounting device further includes a second positioning assembly 300, which includes a positioning plate 310, a third positioning pin 320, a fourth positioning pin 330, a contact block 340 and a rotator 350. The positioning plate 310 has a second slide groove 311, and the third positioning pin 320 is connected to the first positioning hole 120 through the second slide groove 311. The contact block 340 is (partially) embedded in and elastically connected to the end of the positioning plate 310. The rotator 350 is sleeved on the fourth positioning pin 330 and rotates relative to the fourth positioning pin 330. One side of the contact block 340 is always in contact with the rotator 350, and the other side of the contact block 340 is always in contact with the ultra-thin chip to be mounted. In other words, as part of fine positioning, the contact block 340 is squeezed by the rotator 350, thereby fine-tuning the distance between the contact block 340 and the rotator 350, thereby forcing the ultra-thin chip to be mounted to change its position or shape accordingly.

[0040] The rotator 350 includes an integrally formed rotating portion 351 , a connecting rod portion 352 and a gripping portion 353 . The rotating portion 351 and the gripping portion 353 are respectively located at opposite ends of the connecting rod portion 352 . The rotating portion 351 is sleeved on the fourth positioning pin 330 .

[0041] The outer periphery of the rotating portion 351 has a flat side 3511 and a curved side 3512 , so that the distance between the contact block 340 and the rotator 350 is adjustable during the rotation of the rotator 350 relative to the fourth positioning pin 330 .

[0042] The positioning seat 100 further has a plurality of second positioning holes 130, the diameter of which is different from that of the first positioning holes 120. If necessary, the second positioning holes 130 can replace part or all of the first positioning holes 120 to form a new positioning structure.

[0043] The positioning seat 100 further has a plurality of third positioning holes 140, the depth of which is different from that of the first positioning holes 120. If necessary, the third positioning holes 140 can replace part or all of the first positioning holes 120 to form a new positioning structure.

[0044] It is worth mentioning that the technical features such as the specific elastic connection structure of the contact block 340 and the positioning plate 310 involved in this utility model patent application should be regarded as prior art. The specific structure, working principle and possible control method and spatial arrangement method of these technical features can be selected according to conventional methods in the field and should not be regarded as the inventive point of this utility model patent. This utility model patent will not be further elaborated.

[0045] For those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned embodiments, or to replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model should be included in the scope of protection of the present utility model.

Claims

1. An ultra-thin chip mounting device, characterized in that: include: A positioning seat, the positioning seat having a plurality of positioning posts and a plurality of first positioning holes, the first positioning holes being equally spaced relative to the positioning seat and arranged in a matrix, the positioning posts being detachably inscribed in the first positioning holes; Several first positioning components, the first positioning component includes an L-shaped plate, a first positioning pin, a second positioning pin and a contact column, one end of the L-shaped plate has a first slide groove, the first positioning pin is connected to the first positioning hole through the first slide groove, the contact column is connected to the other end of the L-shaped plate through the second positioning pin, and an elastic hemisphere is provided on the side of the contact column away from the L-shaped plate, and the elastic hemisphere is in elastic contact with the ultra-thin chip to be installed.

2. The ultra-thin chip mounting device according to claim 1, wherein: The ultra-thin chip mounting device also includes a second positioning assembly, which includes a positioning plate, a third positioning pin, a fourth positioning pin, a contact block and a rotator. The positioning plate has a second slide groove, the third positioning pin is connected to the first positioning hole through the second slide groove, the contact block is embedded in and elastically connected to the end of the positioning plate, and the rotator is sleeved on the fourth positioning pin and rotates relative to the fourth positioning pin.

3. The ultra-thin chip mounting device according to claim 2, wherein: The rotator is provided with an integrally formed rotating part, a connecting rod part and a holding part. The rotating part and the holding part are respectively located at the opposite ends of the connecting rod part, and the rotating part is sleeved on the fourth positioning pin.

4. The ultra-thin chip mounting device according to claim 3, wherein: The outer periphery of the rotating portion has a flat side edge and a curved side edge.

5. The ultra-thin chip mounting device according to claim 1, wherein: The positioning seat also has a plurality of second positioning holes, the aperture of the second positioning holes is different from the aperture of the first positioning holes; the positioning seat also has a plurality of third positioning holes, the depth of the third positioning holes is different from the depth of the first positioning holes.

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