Deposition coating system

Abstract

The utility model belongs to the technical field of deposition coating equipment, and relates to a deposition coating system which comprises a shell, a steam generating device, a spray head cavity, a nozzle cavity and a steam conveying pipeline, the steam generating device, the spray head cavity, the nozzle cavity and the steam conveying pipeline are arranged in the shell, and spray head holes are formed between the spray head cavity and the nozzle cavity and communicated with each other. And the to-be-deposited area of the substrate is positioned in the coating area outside the nozzle hole. A spray head gas uniformizing device is arranged in the spray head hole, a spray nozzle gas uniformizing device is arranged in the spray nozzle hole, a rectangular spray head gas uniformizing gap is formed in the spray head gas uniformizing device, and a rectangular spray nozzle gas uniformizing gap is formed in the spray nozzle gas uniformizing device; and the length directions of the spray head gas uniformizing gap and the nozzle gas uniformizing gap are respectively consistent with the deposition coating direction of the substrate. The gas uniformizing device is arranged in the spray head hole, the nozzle gas uniformizing device is arranged in the nozzle hole, deposition material steam flowing through the spray head hole and the nozzle hole is subjected to uniformizing treatment, and the uniformity of deposition materials on the surface of a substrate is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of deposition coating equipment, and in particular relates to a deposition coating system. Background Art

[0002] Deposition coating equipment typically features a gas homogenization mechanism to homogenize the deposition material vapor, ensuring uniform deposition on the substrate surface. Existing gas homogenization mechanisms employ various shapes, such as circular, square, and triangular, but this still makes it difficult to achieve uniform deposition of the deposition material vapor on the substrate surface. Furthermore, existing deposition coating equipment is suitable for deposition on small substrates and does not meet the requirements for deposition on large substrates. Utility Model Content

[0003] The technical problem to be solved by the present invention is to provide a deposition coating system, which improves the uniformity of the thickness of the thin film deposited on the substrate surface and is suitable for the deposition requirements of large-area substrate surfaces.

[0004] The present invention is implemented as follows: a deposition coating system is provided, comprising a housing, within which are disposed at least one vapor generating device for evaporating deposition material into vapor, a nozzle chamber, and a nozzle chamber, and a vapor delivery pipeline interconnecting each vapor generating device with the nozzle chamber. A nozzle hole is disposed between the nozzle chamber and the nozzle chamber for interconnection, a nozzle hole is disposed on the nozzle chamber directly opposite the nozzle hole, a substrate to be deposited is located outside the nozzle chamber, and the substrate's area to be deposited is located within the coating area where the nozzle hole is located. A plurality of nozzle uniformizing devices are disposed below the nozzle hole, a plurality of nozzle uniformizing devices are disposed within the nozzle hole, a rectangular nozzle uniformizing gap is disposed in the nozzle uniformizing device, and a rectangular nozzle uniformizing gap is disposed in the nozzle uniformizing device, wherein the length directions of the nozzle uniformizing gap and the nozzle uniformizing gap are respectively consistent with the deposition coating direction of the substrate.

[0005] Furthermore, each of the steam generating devices includes a crucible for evaporating the deposition material, a crucible heater for heating the crucible, a crucible steam pipe connected to the crucible, and a feeding hopper for feeding the crucible. The feeding hopper is arranged outside the shell, and the feeding hopper is connected to the crucible steam pipe through a feeding pipe, and a feeding valve is provided on the feeding pipe.

[0006] Furthermore, a weighing mechanism is provided directly below the crucible to monitor the weight of the evaporated deposition material in the crucible.

[0007] Furthermore, a control valve is provided in the nozzle chamber near the corresponding vapor delivery pipeline to control the flow rate of the deposition material vapor flowing through the nozzle hole.

[0008] Furthermore, the control valve includes a second valve body, a second valve plate, a valve shaft, a fixed plate, a valve hole and a fixing bolt. The fixed plate is fixed to the second valve plate by fixing bolts. The second valve plate is arranged at the valve hole. A deformation gap is provided between the fixed plate and the second valve plate. The fixed plate is also fixed to the valve shaft. A servo motor is arranged outside the shell, and the servo motor is connected to the valve shaft. The servo motor drives the valve shaft to rotate to achieve the sealing or opening of the valve hole by the second valve plate.

[0009] Furthermore, the nozzle cavity has an inclined outer side wall, and a heat insulating cover is provided near the nozzle hole, and the heat insulating cover extends obliquely upward to cover the outer side wall.

[0010] Furthermore, a deposition material recovery device is provided directly below the nozzle hole, and the deposition material recovery device includes a cooling plate, a cooling liquid channel and a recovery cold plate. The cooling liquid channel is provided inside the cooling plate, and the recovery cold plate is provided above the cooling plate and directly below the nozzle hole.

[0011] Furthermore, the deposition coating system includes two steam generating devices, and each steam generating device is communicated with the nozzle cavity through a steam delivery pipeline.

[0012] Compared with the prior art, the deposition coating system of the present invention includes a shell and a steam generating device, a nozzle chamber, a nozzle chamber and a steam delivery pipeline arranged in the shell. A nozzle hole is arranged between the nozzle chamber and the nozzle chamber to communicate with each other, a nozzle hole is arranged on the nozzle chamber, and the area to be deposited on the substrate is located in the coating area outside the nozzle hole. A plurality of nozzle uniformizing devices are arranged below the nozzle hole, a plurality of nozzle uniformizing devices are arranged in the nozzle hole, a rectangular nozzle uniformizing gap is arranged in the nozzle uniformizing device, and a rectangular nozzle uniformizing gap is arranged in the nozzle uniformizing device. The length directions of the nozzle uniformizing gap and the nozzle uniformizing gap are respectively consistent with the deposition coating direction of the substrate. The present invention is provided with a nozzle chamber and a nozzle chamber, and the deposition material vapor entering the nozzle chamber is mixed twice in sequence. A uniformizing device is arranged in the nozzle hole, and a nozzle uniformizing device is arranged in the nozzle hole, and the deposition material vapor flowing through the nozzle hole and the nozzle hole is homogenized again, so that the thickness of the deposition material deposited on the substrate surface is uniform, thereby improving the uniformity of the thickness of the deposited film on the substrate surface. On the other hand, because the lengths of the nozzle and nozzle uniform air gaps align with the deposition and coating directions of the substrate, the deposition area of the substrate to be deposited can be widened as needed to meet the deposition requirements of large-area substrate surfaces. If a substrate conveyor mechanism is added, continuous deposition of large-area substrates can also be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic planar cross-sectional view of a partial structure of the deposition coating system of the present invention;

[0014] Figure 2 for Figure 1 A left view partially showing a cross-sectional schematic diagram of the assembly state of the shell, the nozzle chamber, the nozzle chamber and the deposition material recovery device;

[0015] Figure 3 for Figure 1 A top cross-sectional diagram of the steam delivery pipeline, control valve, and nozzle chamber assembly;

[0016] Figure 4 for Figure 1 A partial enlarged view of the shell and steam generating device on the middle right;

[0017] Figure 5 for Figure 1 Main view of the middle control valve;

[0018] Figure 6 for Figure 5 Cross-sectional view of the middle MM;

[0019] Figure 7 for Figure 2 A partial enlarged view of the middle shell and the deposition material recovery device.

[0020] Description of the drawings: 1. Shell; 2. Crucible; 21. Crucible heater; 22. Steam delivery pipeline; 23. Crucible steam pipe; 24. Feeding hopper; 25. Feeding valve; 26. Feeding pipe; 27. Steam delivery pipeline heater;

[0021] 3. Nozzle cavity; 31. Nozzle hole; 32. Nozzle air distribution device; 33. Nozzle air distribution gap; 34. Nozzle air distribution device mounting slot; 35. Nozzle cavity heater;

[0022] 4. Nozzle cavity; 41. Nozzle hole; 42. Nozzle gas uniformity device; 43. Nozzle gas uniformity gap; 44. Outer wall; 45. Insulation cover; 46. Insulation cover bolt;

[0023] 5. Deposition material recovery device; 51. Cooling plate; 52. Cooling liquid channel; 53. Recovery cold plate; 6. Weighing mechanism;

[0024] 7. Control valve; 71. Second valve body; 72. Second valve plate; 73. Valve shaft; 74. Fixing plate; 75. Deformation gap; 76. Valve hole; 77. Fixing bolt; 78. Servo motor;

[0025] 8. Substrate conveying device; 9. Carrier gas pipeline; 91. Carrier gas valve; A. Substrate; B. Deposition material. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] Please also refer to Figure 1 as well as Figure 2 As shown, a preferred embodiment of the deposition coating system of the present invention includes a housing 1, within which are disposed at least one steam generating device for evaporating deposition material into steam, a nozzle chamber 3, and a nozzle chamber 4, as well as a steam delivery pipeline 22 connecting each steam generating device to the nozzle chamber. The deposition coating system of this embodiment includes two steam generating devices, which are respectively disposed on the left and right sides of the nozzle chamber 3 and the nozzle chamber 4. The left and right steam generating devices are connected to the nozzle chamber 3 via steam delivery pipelines 22. The housing 1 is a sealed chamber, and evacuating the sealed chamber can form a vacuum chamber.

[0028] A nozzle hole 31 is provided between the nozzle chamber 3 and the nozzle chamber 4 to communicate with each other. A nozzle hole 41 is provided on the nozzle chamber 4 directly opposite the nozzle hole 31. The substrate A to be deposited is located outside the nozzle chamber 4, and the area to be deposited on the substrate A is located within the coating area where the nozzle hole 41 is located. The nozzle hole 41 is located directly below the nozzle hole 31, and the substrate A to be deposited is located directly below the nozzle hole 41. The deposition material flowing out of the nozzle hole 41 is continuously deposited on the surface of the substrate A to form a deposited film layer with a certain film thickness.

[0029] Please also refer to Figure 2 、 Figure 3 as well as Figure 4 As shown, a nozzle uniform air device 32 is arranged below the nozzle hole 31, a nozzle uniform air device 42 is arranged in the nozzle hole 41, a rectangular nozzle uniform air gap 33 is arranged in the nozzle uniform air device 32, and a rectangular nozzle uniform air gap 43 is arranged in the nozzle uniform air device 42. The length directions of the nozzle uniform air gap 33 and the nozzle uniform air gap 43 are respectively consistent with the deposition coating direction of the substrate A.

[0030] The substrate A is moved by the substrate conveying device 8 provided in the housing 1, and the moving direction is as follows: Figure 2 As shown by the arrow in the middle line, substrate A is deposited by nozzle chamber 4 as it moves, with the width of the deposited area corresponding to the length of nozzle orifice 41. The deposition process continues as substrate A moves continuously. The length of nozzle orifice 41 is set based on the deposition width of substrate A, making it easy to achieve continuous deposition on large substrates.

[0031] The nozzle uniformizing device 32 and the nozzle uniformizing device 42 are provided to respectively divide and guide the vapor of the deposition material, so as to optimize the ventilation volume and improve the uniformity of the deposited coating.

[0032] The size of the nozzle uniform air gap 33 and the nozzle uniform air gap 43 corresponds to the flow rate of the deposition material vapor flowing through. The larger the gap, the greater the flow rate, and the smaller the gap, the smaller the flow rate. The size of the nozzle uniform air gap 33 and the nozzle uniform air gap 43 is adjusted according to the required deposition film thickness.

[0033] The nozzle air-homogenizing device 32 and the nozzle air-homogenizing device 42 can each be cylindrical or rectangular. By replacing nozzle air-homogenizing devices 32 and nozzle air-homogenizing devices 42 of different sizes, the sizes of the nozzle air-homogenizing gap 33 and nozzle air-homogenizing gap 43 can be adjusted more easily. In actual use, the sizes of the nozzle air-homogenizing gap 33 and nozzle air-homogenizing gap 43 can also be adjusted by adjusting the number of nozzle air-homogenizing devices 32 and nozzle air-homogenizing devices 42.

[0034] The nozzle uniforming gap 33 is of varying sizes in different areas within the nozzle orifice 31 to provide a primary uniform treatment for the deposition material vapor exiting the nozzle cavity 3. The nozzle uniforming gap 43 is also of varying sizes in different areas within the nozzle orifice 41 to provide a secondary uniform treatment for the deposition material vapor exiting the nozzle cavity 4, thereby depositing a uniform thin film of a predetermined thickness on the surface of the substrate A and ensuring uniform film thickness across the entire width of the coating.

[0035] Please also refer to Figure 1 as well as Figure 4 As shown, each of the vapor generating devices includes a crucible 2 for evaporating the deposition material, a crucible heater 21 for heating the crucible 2, a crucible vapor pipe 23 communicating with the crucible 2, and a feeding hopper 24 for feeding material into the crucible 2. The feeding hopper 24 is disposed outside the housing 1 and is connected to the crucible vapor pipe via a delivery pipe 26, which is provided with a feeding valve 25. The crucible vapor pipe 23 is located at the top of the crucible 2.

[0036] A steam delivery pipeline heater 27 is provided outside the steam delivery pipeline 22 and a nozzle cavity heater 35 is provided outside the nozzle cavity 3 in order to keep the temperature of the deposition material vapor consistent during the flow process.

[0037] A weighing mechanism 6 is provided directly below the crucible 2 to monitor the weight of the evaporated deposition material in the crucible 2. The weighing mechanism 6 monitors the weight of the deposition material in the crucible 2 in real time. When the weight is detected to be lower than the set minimum weight value, a signal is sent to the control module of the deposition coating system. The control module controls the feeding valve 25 to open the feed pipe 26, and the deposition material in the feeding hopper 24 enters the crucible 2 through the feed pipe 26. When the weight reaches the set value for filling the crucible 2, the feed pipe 26 is closed and the feeding stops, realizing automatic addition of deposition material to ensure continuous filling during continuous deposition production. In addition, the evaporation rate of the crucible 2 can be measured by the weighing mechanism 6 and the evaporation rate of the crucible 2 can be adjusted as needed.

[0038] Please also refer to Figure 1 、 Figure 5 as well as Figure 6 As shown, a control valve 7 is provided in the nozzle chamber 3 near the corresponding vapor delivery pipeline 22 to control the flow rate of the deposition material vapor flowing through the nozzle hole.

[0039] The control valve 7 includes a second valve body 71, a second valve plate 72, a valve shaft 73, a fixed plate 74, a valve hole 76 and a fixing bolt 77. The fixed plate 74 is fixed to the second valve plate 72 by the fixing bolt 77. The second valve plate 72 is arranged at the valve hole 76. There is a deformation gap 75 between the fixed plate 74 and the second valve plate 72. The fixed plate 74 is also fixed to the valve shaft 73. A servo motor 78 is arranged outside the shell 1. The servo motor 78 is connected to the valve shaft 73. The servo motor 78 drives the valve shaft 73 to rotate to realize the sealing or opening of the valve hole 76 by the second valve plate 72.

[0040] The servo motor 78 controls the opening angle and closing torque of the second valve plate 72, adjusts the gas flow through the valve hole 76, increases the closing stability of the second valve plate 72 to the valve hole 76, and avoids damage to parts caused by over-closure of the valve.

[0041] Please also refer to Figure 1 as well as Figure 2 As shown, the nozzle chamber 4 has an inclined outer wall 44, and an insulating cover 45 is provided near the nozzle hole 41. The insulating cover 45 extends upwardly to cover the outer wall 44 of the nozzle chamber 4, and the angle between the insulating cover 45 and the horizontal plane is smaller than the angle between the outer wall 44 and the horizontal plane.

[0042] The heat insulating cover 45 is fixed to the outer side wall 44 by heat insulating cover bolts 46. The heat insulating cover 45 is provided to reduce the heat transfer from the nozzle chamber 4 to the substrate A, so as to maintain the temperature of the substrate A stable.

[0043] Please also refer to Figure 1 、 Figure 2 as well as Figure 7As shown, a deposition material recovery device 5 is provided directly below the nozzle hole 41. The deposition material recovery device 5 includes a cooling plate 51, a coolant channel 52, and a recovery cold plate 53. The coolant channel 52 is provided inside the cooling plate 51. The recovery cold plate 53 is provided above the cooling plate 51 and directly below the nozzle hole 41.

[0044] A recovery cold plate 53 is provided, allowing excess deposition material vapor to condense and deposit on the relatively cool surface of the recovery cold plate 53, preventing condensation on other equipment components. Using the recovery cold plate 53 to collect deposition material vapor that has not been deposited on substrate A helps maintain a lower temperature on substrate A. Controlling the condensation point of excess deposition material vapor facilitates equipment maintenance, dust control within the housing 1, reduces maintenance time, increases uptime, and extends the life of deposition coating system components.

[0045] Please also refer to Figure 1 as well as Figure 4 As shown, the deposition coating system of the present invention has a carrier gas pipeline 9 connected to each vapor delivery pipeline 22, and a carrier gas valve 91 is provided on the carrier gas pipeline 9. Depending on the performance requirements of the thin film deposited on the substrate A, different types of carrier gases need to be introduced into the deposition coating system, and the deposition coating system of the present invention meets this requirement.

[0046] During the deposition process, the deposition material in crucible 2 is limited. To ensure continuous deposition without downtime, this embodiment employs a two-cruciform structure. The two crucibles 2 can contain the same deposition material or different deposition materials. When the two crucibles 2 contain different deposition materials, they each generate different vapors, which can be deposited on the surface of substrate A after superposition or reaction.

[0047] The following example illustrates how to switch between different material sources, using two crucibles 2 containing the same deposition material. When the deposition material in the left crucible 2 is nearing depletion, the right crucible 2 is heated to an evaporating state. The right control valve 7 is opened, while the left control valve 7 is closed. The deposition coating system then continues coating the right crucible 2. Simultaneously, the temperature of the left crucible 2 is lowered to a non-evaporating temperature, and the corresponding feed valve 25 is opened to fill the left crucible 2. When the material reaches the set weight, the corresponding feed valve 25 is closed, completing the filling of the left crucible 2. If the deposition material in the right crucible 2 is depleted, the system switches to the left crucible 2 and automatically fills the right crucible 2, following the aforementioned steps. This system allows continuous production during component maintenance cycles without requiring downtime for cooling and refilling, increasing equipment utilization and productivity.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A deposition coating system, characterized in that: The invention comprises a shell (1), wherein at least one steam generating device for evaporating a deposition material into steam, a nozzle chamber (3) and a nozzle chamber (4) are arranged in the shell (1), and a steam delivery pipeline (22) for connecting each steam generating device with the nozzle chamber, a nozzle hole (31) is arranged between the nozzle chamber (3) and the nozzle chamber (4) for connecting with each other, a nozzle hole (41) is arranged at a position on the nozzle chamber (4) facing the nozzle hole (31), a substrate (A) to be deposited is located outside the nozzle chamber (4), and the substrate (A) to be deposited is located outside the nozzle chamber (4). The accumulation area is located in the coating area where the nozzle hole (41) is located; a plurality of nozzle uniform air devices (32) are arranged below the nozzle hole (31), a plurality of nozzle uniform air devices (42) are arranged in the nozzle hole (41), a rectangular nozzle uniform air gap (33) is arranged in the nozzle uniform air device (32), and a rectangular nozzle uniform air gap (43) is arranged in the nozzle uniform air device (42), and the length directions of the nozzle uniform air gap (33) and the nozzle uniform air gap (43) are respectively consistent with the deposition coating direction of the substrate (A).

2. A deposition coating system according to claim 1, characterized in that: Each of the steam generating devices comprises a crucible (2) for evaporating deposition material, a crucible heater (21) for heating the crucible (2), a crucible steam pipe (23) in communication with the crucible (2), and a feeding hopper (24) for feeding material into the crucible (2). The feeding hopper (24) is arranged outside the shell (1), and the feeding hopper (24) is connected to the crucible steam pipe (23) through a feeding pipe (26). A feeding valve (25) is provided on the feeding pipe (26).

3. A deposition coating system according to claim 2, characterized in that: A weighing mechanism (6) is provided directly below the crucible (2) to monitor the weight of the evaporated deposition material in the crucible (2).

4. The deposition coating system according to claim 1, characterized in that: A control valve (7) is provided in the nozzle chamber (3) near the corresponding vapor delivery pipeline (22) to control the flow rate of the deposition material vapor flowing through the nozzle hole (31).

5. The deposition coating system according to claim 4, characterized in that: The control valve (7) includes a second valve body (71), a second valve plate (72), a valve shaft (73), a fixed plate (74), a valve hole (76) and a fixing bolt (77). The fixed plate (74) is fixed to the second valve plate (72) by the fixing bolt (77). The second valve plate (72) is arranged at the valve hole (76). A deformation gap (75) is provided between the fixed plate (74) and the second valve plate (72). The fixed plate (74) is also fixed to the valve shaft (73). A servo motor (78) is provided outside the housing (1). The servo motor (78) is connected to the valve shaft (73). The servo motor (78) drives the valve shaft (73) to rotate so as to achieve the blocking or opening of the valve hole (76) by the second valve plate (72).

6. The deposition coating system according to claim 1, characterized in that: The nozzle chamber (4) has an inclined outer side wall (44), and a heat insulating cover (45) is provided near the nozzle hole (41), and the heat insulating cover (45) extends obliquely upward to cover the outer side wall (44).

7. The deposition coating system according to claim 1, characterized in that: A deposition material recovery device (5) is provided directly below the nozzle hole (41), and the deposition material recovery device (5) comprises a cooling plate (51), a cooling liquid channel (52), and a recovery cold plate (53). The cooling liquid channel (52) is provided inside the cooling plate (51), and the recovery cold plate (53) is provided above the cooling plate (51) and directly below the nozzle hole (41).

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