Heating base heat conduction device

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By setting up a water collecting chamber structure and a vacuum exhaust system in the MPCVD device, the problem of incomplete contact of the cooling coil is solved, the temperature uniformity of the substrate table is achieved, and the growth quality of the diamond film is improved.

CN223201921UActive Publication Date: 2025-08-08SHAANXI BEIYUAN CHEM GROUP

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Patent Information

Application Number: CN202422322350.1
Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner
Filing Date: 2024-09-23
Publication Date: 2025-08-08
Estimated Expiration: 2034-09-23

AI Technical Summary

Technical Problem

In the existing MPCVD cooling device, the cooling coils are incompletely in contact with the bottom surface of the substrate table, resulting in uneven heat exchange and insufficient heat exchange, which affects the growth quality of the diamond film.

Method used

The water collecting chamber structure is adopted, and the copper water collecting chamber is used to set the coolant flow under the deposition base, vacuum is evacuated through the exhaust pipe to form a vacuum environment, and the coolant flow is controlled through the water inlet and outlet, increasing the contact area between the coolant and the substrate table and the heat exchange uniformity.

Benefits of technology

The uniform temperature of the substrate table is achieved, the cooling effect is improved, and the uniform growth quality of the diamond film is ensured.

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Abstract

The utility model relates to the technical field of device heat conduction improvement, in particular to a heating base heat conduction device which comprises a deposition shell, an exhaust pipe, a water collection cavity, a deposition base, a water inlet pipe, a water outlet pipe and a connecting hose. An exhaust pipe is arranged in the deposition shell, a water collecting cavity is formed in the upper end of the exhaust pipe, a deposition base is arranged above the water collecting cavity, a water inlet pipe is arranged on one side of the water collecting cavity, a water outlet pipe is arranged on one side of the water collecting cavity, a connecting hose is arranged at one end of the water inlet pipe, and a connecting hose is arranged at one end of the water outlet pipe; according to the utility model, by changing the heat conduction structure of the device, abandoning the original coil pipe cooling mode, arranging the water collecting cavity below the deposition base and introducing the flowing cooling liquid into the water collecting cavity, the temperature of the copper water collecting cavity is reduced, and the temperature of the upper surface of the water collecting cavity is uniform, so that the temperature of the deposition base is uniformly reduced; therefore, the heat exchange between the cooling liquid and the seed crystal is more uniform, and the seed crystal is cooled more uniformly.

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Description

Technical Field

[0001] The utility model relates to the technical field of device heat conduction improvement, in particular to a heat conduction device for a heating base. Background Art

[0002] Synthetic, high-quality diamond films boast numerous excellent properties comparable to those of natural diamonds, including high hardness, high thermal conductivity, low thermal expansion coefficient, and high light transmittance. They hold broad application prospects in acoustics, optics, and heat dissipation. Among the numerous methods for synthesizing diamond films, microwave plasma chemical vapor deposition (MPCVD) technology, with its advantages of high plasma density, excellent controllability, lack of discharge electrode contamination, and high-quality synthesized diamond films, has become the preferred method for producing high-quality diamond films.

[0003] Currently, diamond films are deposited on the surface of a seed crystal on a substrate stage during diamond production using MPCVD equipment. Therefore, the temperature uniformity of the substrate stage affects the growth of the diamond film. Uniform cooling of the substrate stage helps maintain the temperature uniformity of the seed crystal, thereby producing a high-quality diamond film. Existing cooling technologies often use cooling coils to conduct heat to the substrate stage. However, these coils do not fully contact the bottom surface of the substrate stage, resulting in uneven and insufficient heat exchange. This causes uneven heating and cooling of the substrate stage, failing to achieve the desired cooling effect and affecting the quality of crystal growth.

[0004] Therefore, in order to solve the above problems, a base heat conduction uniformity device can be designed to solve the problems of uneven heat conduction and poor cooling effect of the existing device. Utility Model Content

[0005] In order to overcome the problem, most MPCVD cooling devices use cooling coils to conduct heat to the substrate stage. However, this type of coil does not fully contact the bottom surface of the substrate stage, resulting in uneven and insufficient heat exchange, causing uneven heating and cooling of the substrate stage, failing to achieve the expected cooling effect, and affecting the quality of crystal growth.

[0006] The technical solution of the utility model is: a heating base heat conduction device, including a deposition shell, an exhaust pipe, a water collecting chamber, a deposition base, a water inlet pipe, a water outlet pipe and a connecting hose; an exhaust pipe is provided inside the deposition shell, a water collecting chamber is provided at the upper end of the exhaust pipe, a deposition base is provided above the water collecting chamber, a water inlet pipe is provided on one side of the water collecting chamber, a water outlet pipe is provided on one side of the water collecting chamber, a connecting hose is provided at one end of the water inlet pipe, and a connecting hose is provided at one end of the water outlet pipe.

[0007] Preferably, a closed space is formed by setting up a deposition shell, and a vacuum exhaust device is connected to the deposition shell to evacuate the interior of the deposition shell. A connecting hose is used to connect the water collecting chamber, the water inlet pipe and the water outlet pipe, and the coolant is sent into the water collecting chamber from the water inlet pipe and flows out from the water outlet pipe. The water collecting chamber filled with coolant uniformly reduces the temperature of the deposition base.

[0008] Preferably, the exhaust pipe passes through the bottom of the deposition shell, and an exhaust hole is opened at one end of the exhaust pipe, and multiple groups of exhaust holes are provided; the exhaust holes facilitate the use of the exhaust pipe for vacuuming operations.

[0009] Preferably, the exhaust hole is arranged in an annular shape and passes through the exhaust pipe, and the lowest point of the exhaust hole is higher than the inner bottom of the deposition shell; the position of the exhaust hole allows the vacuum operation to only act on the interior of the deposition shell.

[0010] Preferably, the water collecting chamber is cylindrical and hollow inside, the water collecting chamber is made of copper, the deposition base is disc-shaped, and the diameter of the circular cross-section of the deposition base is larger than the diameter of the circular cross-section of the water collecting chamber; the deposition base is cooled by accommodating coolant in the water collecting chamber which is larger than the deposition base, and the cooling effect of the water collecting chamber can completely cover the deposition base.

[0011] Preferably, a water inlet is provided on one side of the water collecting chamber, and a water outlet is provided on one side of the water collecting chamber, and the water inlet and the water outlet are symmetrically arranged in the horizontal direction; the coolant is introduced through the water inlet connected to the water inlet pipe, and the coolant is led out through the water outlet connected to the water outlet pipe.

[0012] Preferably, the diameter of the water inlet is larger than the diameter of the water outlet, the water inlet is located in the middle of one side of the water collecting chamber, and the water outlet is located in the upper position of one side; the water inlet is larger than the diameter of the water outlet, so that the water inlet speed is greater than the water outlet speed, so that the water collecting chamber is filled with coolant.

[0013] Preferably, one end of the connecting hose is connected to the upper ends of the water inlet pipe and the water outlet pipe, and the other end of the connecting hose is connected to the water inlet and the water outlet; the connection of the connecting hose facilitates the flow of coolant into and out of the water collecting chamber.

[0014] Beneficial effects of the utility model:

[0015] 1. Compared with traditional MPCVD cooling devices, most use cooling coils to conduct heat to the substrate stage. However, this coil does not fully contact the bottom surface of the substrate stage, resulting in uneven and insufficient heat exchange. This causes uneven heating and cooling of the substrate stage, fails to achieve the expected cooling effect, and affects the quality of crystal growth. This device changes the heat conduction structure of the device, abandons the original coil cooling method, and sets a water collection chamber under the deposition base. Flowing coolant is introduced into the water collection chamber to reduce the temperature of the copper water collection chamber and make the temperature of the upper surface of the water collection chamber uniform, thereby uniformly reducing the temperature of the deposition base and making the heat exchange between the coolant and the seed crystal more uniform.

[0016] 2. When the device is in use, the coolant independently enters the water inlet pipe on the right side of the exhaust pipe from the lower end of the water inlet pipe, passes through the connecting hose from the water inlet pipe, and enters the interior of the water collecting chamber from the water inlet. The coolant flows in all directions in the middle of the water collecting chamber until it fills the water collecting chamber. At the same time, a heat exchange process occurs with the deposition base at the upper end of the water collecting chamber. Since the diameter of the water inlet is larger than the diameter of the water outlet, the water collecting chamber will be filled with coolant. Then the coolant flows from the water outlet to the connecting hose and is discharged from the lower end of the water outlet pipe. In the above process, the coolant diffuses from the middle of the water collecting chamber to the surrounding areas, so that the coolant is spread over a large area, increasing the contact area between the coolant and the upper end of the water collecting chamber, thereby increasing the contact area between the coolant and the seed crystal, making the heat exchange between the coolant and the seed crystal more uniform, so as to solve the problem that most MPCVD cooling devices use cooling coils to conduct heat with the substrate stage, but this coil method does not fully contact the bottom surface of the substrate stage, resulting in uneven and insufficient heat exchange, causing uneven heating and cooling of the substrate stage, failing to achieve the expected cooling effect, and affecting the quality of crystal growth;

[0017] 3. Before using the device, the exhaust pipe is connected to the external exhaust equipment to extract the air in the deposition shell from the exhaust hole, and the deposition shell is turned into a vacuum environment to facilitate vapor deposition. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a schematic diagram of the three-dimensional structure of a heating base heat conduction device of the present invention;

[0019] Figure 2 Shown is a schematic diagram of the three-dimensional structure of the exhaust pipe of a heating base heat conduction device of the present invention;

[0020] Figure 3 Shown is a schematic diagram of the three-dimensional structure of a water collecting chamber of a heating base heat conducting device of the present invention;

[0021] Figure 4 Shown is a schematic diagram of the three-dimensional structure of a connecting hose of a heating base heat conduction device of the present invention.

[0022] Explanation of the accompanying symbols: 1. Sedimentation shell; 2. Exhaust pipe; 201. Exhaust hole; 3. Water collecting chamber; 301. Water inlet; 302. Water outlet; 4. Sedimentation base; 5. Water inlet pipe; 6. Water outlet pipe; 7. Connecting hose. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] See also Figure 1 The utility model provides an embodiment: a heating base heat conduction device, including a deposition shell 1, an exhaust pipe 2, a water collecting chamber 3, a deposition base 4, a water inlet pipe 5, a water outlet pipe 6 and a connecting hose 7; the exhaust pipe 2 is provided inside the deposition shell 1, the upper end of the exhaust pipe 2 is provided with a water collecting chamber 3, the deposition base 4 is provided above the water collecting chamber 3, a water inlet pipe 5 is provided on one side of the water collecting chamber 3, a water outlet pipe 6 is provided on one side of the water collecting chamber 3, a connecting hose 7 is provided at one end of the water inlet pipe 5, and a connecting hose 7 is provided at one end of the water outlet pipe 6.

[0025] See also Figure 2 In this embodiment, the exhaust pipe 2 passes through the bottom of the deposition shell 1, and an exhaust hole 201 is opened at one end of the exhaust pipe 2. There are multiple groups of exhaust holes 201. The exhaust holes 201 are convenient for using the exhaust pipe 2 to perform vacuum operation. The exhaust holes 201 are arranged in a ring shape and pass through the exhaust pipe 2. The lowest point of the exhaust holes 201 is higher than the inner bottom of the deposition shell 1. The position of the exhaust holes 201 enables the vacuum operation to only act on the inside of the deposition shell 1.

[0026] See also Figure 3 In this embodiment, the water collection chamber 3 is cylindrical and hollow inside. The water collection chamber 3 is made of copper. The deposition base 4 is disc-shaped. The diameter of the circular cross-section of the deposition base 4 is larger than the diameter of the circular cross-section of the water collection chamber 3. The deposition base 4 is cooled by accommodating coolant in the water collection chamber 3, which is larger than the deposition base 4. The cooling effect of the water collection chamber 3 can completely cover the deposition base 4. A water inlet 301 is provided on one side of the water collection chamber 3, and a water outlet 302 is provided on one side of the water collection chamber 3. The water inlet 301 and the water outlet 302 are symmetrically arranged in the horizontal direction. The coolant is introduced by connecting the water inlet 301 to the water inlet pipe 5, and the coolant is led out by connecting the water outlet 302 to the water outlet pipe 6. The diameter of the water inlet 301 is larger than the diameter of the water outlet 302. The water inlet 301 is located in the middle position of one side of the water collecting chamber 3, and the water outlet 302 is located in the upper position of one side. The water inlet 301 is larger than the diameter of the water outlet 302, so that the water inlet speed is greater than the water outlet speed, so that the water collecting chamber 3 is filled with coolant.

[0027] See also Figure 4In this embodiment, one end of the connecting hose 7 is connected to the upper ends of the water inlet pipe 5 and the water outlet pipe 6, and the other end of the connecting hose 7 is interconnected with the water inlet 301 and the water outlet 302. The connection of the connecting hose 7 facilitates the coolant to enter and exit the water collecting chamber 3.

[0028] Before the device is used, the exhaust pipe 2 is connected to an external exhaust device to extract the air in the deposition housing 1 from the exhaust hole 201, and the deposition housing 1 is turned into a vacuum environment to facilitate vapor deposition.

[0029] When the device is in use, the coolant independently enters the water inlet pipe 5 on the right side of the exhaust pipe 2 from the lower end of the water inlet pipe 5, passes through the connecting hose 7 from the water inlet pipe 5, and enters the interior of the water collecting chamber 3 from the water inlet 301. The coolant flows in all directions in the middle of the water collecting chamber 3 until it fills the water collecting chamber 3. At the same time, a heat exchange process occurs with the deposition base 4 at the upper end of the water collecting chamber 3. Since the diameter of the water inlet 301 is larger than the diameter of the water outlet 302, the water collecting chamber 3 will be filled with coolant. After that, the coolant flows from the water outlet 302 to the connecting hose 7, and then is discharged from the lower end of the water outlet pipe 6. In the above process, the coolant diffuses to the surrounding areas in the middle of the water collecting chamber 3, so that the coolant is dispersed over a large area, increasing the contact area between the coolant and the upper end of the water collecting chamber 3, and then increasing the contact area between the coolant and the seed crystal, making the heat exchange between the coolant and the seed crystal more uniform.

[0030] Through the above steps, a closed space is formed by setting up the deposition shell 1, the vacuum exhaust equipment is connected by the exhaust pipe 2, the deposition shell 1 is evacuated, the water collecting chamber 3, the water inlet pipe 5 and the water outlet pipe 6 are connected by the connecting hose 7, the coolant is sent into the water collecting chamber 3 from the water inlet pipe 5 and flows out from the water outlet pipe 6, and the water collecting chamber 3 filled with coolant causes the temperature of the deposition base 4 to be uniformly reduced.

[0031] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the purpose of the present invention.

Claims

1. A heating base heat conduction device, comprising a deposition shell (1); characterized in that: The invention also comprises an exhaust pipe (2), a water collecting chamber (3), a sedimentation base (4), a water inlet pipe (5), a water outlet pipe (6) and a connecting hose (7); the exhaust pipe (2) is arranged inside the sedimentation shell (1); the upper end of the exhaust pipe (2) is arranged with a water collecting chamber (3); the sedimentation base (4) is arranged above the water collecting chamber (3); the water inlet pipe (5) is arranged on one side of the water collecting chamber (3); the water outlet pipe (6) is arranged on one side of the water collecting chamber (3); one end of the water inlet pipe (5) is arranged with a connecting hose (7); and one end of the water outlet pipe (6) is arranged with a connecting hose (7).

2. A heating base heat conducting device according to claim 1, characterized in that: The exhaust pipe (2) passes through the bottom of the deposition shell (1), and one end of the exhaust pipe (2) is provided with an exhaust hole (201), and the exhaust holes (201) are provided in multiple groups.

3. The heat conducting device of the heating base according to claim 2, characterized in that: The exhaust hole (201) is arranged in a ring shape, and the exhaust hole (201) passes through the exhaust pipe (2). The lowest point of the exhaust hole (201) is higher than the inner bottom of the deposition shell (1).

4. The heat conducting device of the heating base according to claim 2, characterized in that: The water collecting chamber (3) is cylindrical and hollow inside. The water collecting chamber (3) is made of copper. The deposition base (4) is disc-shaped. The diameter of the circular cross section of the deposition base (4) is larger than the diameter of the circular cross section of the water collecting chamber (3).

5. The heat conducting device of the heating base according to claim 2, characterized in that: A water inlet (301) is provided on one side of the water collecting chamber (3), and a water outlet (302) is provided on one side of the water collecting chamber (3). The water inlet (301) and the water outlet (302) are symmetrically arranged in the horizontal direction.

6. The heat conducting device of the heating base according to claim 2, characterized in that: The diameter of the water inlet (301) is greater than the diameter of the water outlet (302). The water inlet (301) is located in the middle of one side of the water collecting chamber (3), and the water outlet (302) is located at an upper position on one side.

7. The heat conducting device of the heating base according to claim 2, characterized in that: One end of the connecting hose (7) is connected to the upper ends of the water inlet pipe (5) and the water outlet pipe (6), and the other end of the connecting hose (7) is connected to the water inlet (301) and the water outlet (302).