Electric appliance box and air conditioner

Abstract

The utility model relates to an electric appliance box and an air conditioner, the electric appliance box comprises a heating element, the electric appliance box comprises a heat dissipation structure, the heat dissipation structure comprises a heat dissipation element, the heat dissipation element is attached to the heating element, and heat of the heating element can be conducted to the heat dissipation element; wherein the heat dissipation element is provided with a cavity, a refrigerant is arranged in the cavity, and the refrigerant can exchange heat with the heating element. The heat dissipation structure is attached to the heating element, the electric appliance box has the advantages of being simple in structure and good in heat dissipation effect, the heat dissipation structure conducts heat exchange through refrigerants, heat accumulation is effectively avoided, the temperature rise problem of the electric appliance box is solved, the performance of the electric appliance box is improved, and a powerful guarantee is provided for stable operation of the air conditioner.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to an electrical appliance box and an air conditioner. Background Art

[0002] In a multi-split outdoor unit system, the electrical box is a key component, integrating a variety of precision electronic components such as control circuit boards, sensors, and relays. Its operational stability and lifespan directly impact the performance and reliability of the entire air conditioning system. However, outdoor units are exposed to the outdoors for extended periods, making them susceptible to external factors such as dust, small organisms (such as insects), and moisture. If these factors infiltrate through the ventilation holes in the electrical box, dust will accumulate on the surface of the electronic components, affecting their heat dissipation efficiency. Increased humidity can also cause them to become damp, leading to serious problems such as short circuits, excessive surface temperatures, and even damage to the electronic components.

[0003] To address the above issues, the industry has widely adopted a design solution that fully seals the electrical box. This solution effectively isolates the intrusion of external pollutants by completely sealing the ventilation holes of the electrical box, significantly reducing the failure rate of electronic components caused by environmental factors. However, while this design solution brings protection advantages, it also raises a new technical problem. The electronic components inside the electrical box generate a large amount of heat during operation, and the fully sealed design blocks the way for heat to be dissipated to the outside through natural convection or forced ventilation, causing heat to continue to accumulate inside the electrical box. Prolonged high temperature environments will accelerate the aging process of electronic components, reduce their working efficiency, and even directly damage electronic components, thereby affecting the normal operation and service life of the entire air conditioning system.

[0004] Technical solutions in related technologies often require a balance between sealing and heat dissipation, aiming to prevent the ingress of external contaminants while ensuring good heat dissipation within the electrical box to protect electronic components from high-temperature damage. Therefore, how to effectively address internal heat accumulation while protecting the electrical box from external environmental damage has become a pressing technical challenge in the field of multi-split outdoor units. Utility Model Content

[0005] The present application provides an electrical appliance box and an air conditioner, which can balance sealing and heat dissipation, effectively improve the temperature rise problem, and avoid heat accumulation inside the electrical appliance box.

[0006] In a first aspect, the present application provides an electrical box, comprising a heating element, the electrical box comprising a heat dissipation structure, the heat dissipation structure comprising a heat dissipation element, the heat dissipation element being disposed in contact with the heating element, and heat from the heating element being able to be transferred to the heat dissipation element;

[0007] The heat dissipation element is provided with a cavity, a refrigerant is provided in the cavity, and the refrigerant can exchange heat with the heating element.

[0008] In a possible implementation, the heat dissipation element includes a first heat dissipation core and / or a second heat dissipation core, and the first heat dissipation core and the second heat dissipation core are respectively connected to the corresponding heating element.

[0009] In a possible implementation, the first heat dissipation core has a first cavity, the second heat dissipation core has a second cavity, the first cavity and the second cavity are connected, and the first cavity and the second cavity together constitute the cavity.

[0010] In a possible implementation, the first heat dissipation core is provided with an inlet end and an outlet end.

[0011] In a possible implementation, the second heat dissipation core is provided with at least one groove.

[0012] In a possible implementation, the heat dissipation element includes a heat dissipation layer, which is provided on the first heat dissipation core and / or the second heat dissipation core, and is connected to the corresponding heating element.

[0013] In one possible implementation, the heat dissipation layer includes a connection layer and a plurality of heat dissipation fins, the plurality of heat dissipation fins are respectively connected to the connection layer, and the plurality of heat dissipation fins are sequentially spaced along a preset direction; the preset direction is parallel to a cross section of the first heat dissipation core;

[0014] Wherein, the heat dissipation fins are connected to the first heat dissipation core, and the connection layer is connected to the corresponding heating element.

[0015] In a possible implementation, the heat dissipation layer includes a first heat-conducting layer, which is sandwiched between the heating element and the connection layer.

[0016] In a possible implementation, the heat dissipation layer includes a second heat-conducting layer, and the second heat-conducting layer is sandwiched between the heating element and the second heat dissipation core.

[0017] In a possible implementation, the heat dissipation layer includes a heat dissipation pad, and the heat dissipation pad is arranged between the second heat conductive layer and the second heat dissipation core; and / or,

[0018] The heat dissipation pad is arranged between the second heat conducting layer and the heating element.

[0019] In a possible implementation, the second heat-conducting layer is provided with a receiving groove, and the heat dissipation pad is disposed in the receiving groove.

[0020] In a second aspect, the present application provides an air conditioner, comprising an inspection box, a junction box, and the electrical box as described in the first aspect, wherein the inspection box and the junction box are respectively connected to the electrical box.

[0021] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0022] The electrical box and air conditioner provided in the embodiment of the present application have a heat dissipation structure attached to the heating element, which has the characteristics of simple structure and good heat dissipation effect. The heat dissipation structure uses refrigerant for heat exchange, effectively avoiding heat accumulation, improving the temperature rise problem of the electrical box, improving the performance of the electrical box, and providing strong guarantee for the stable operation of the air conditioner. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0026] Figure 1 A schematic structural diagram of an air conditioner provided in an embodiment of the present application;

[0027] Figure 2 A schematic structural diagram of a heat dissipation structure provided in an embodiment of the present application;

[0028] Figure 3 A schematic cross-sectional view of a first heat dissipation core provided in an embodiment of the present application;

[0029] Figure 4 This is a cross-sectional schematic diagram of the second heat dissipation core provided in an embodiment of the present application.

[0030] Description of reference numerals:

[0031] A. Electrical box; 1. Heating element; 11. Driver board; 12. Circuit board; 13. Filter board; 14. Choke coil;

[0032] 2. Heat dissipation structure; 21. Heat dissipation element; 211. Cavity; 212. First heat dissipation core; 2121. First cavity; 2122. Inlet port; 2123. Outlet port; 213. Second heat dissipation core; 2131. Second cavity; 2132. Groove; 21321. First groove; 21322. Second groove; 2133. Compressor intelligent power module area; 214. First pipe; 215. Second pipe; 216. Inlet pipe; 217. Outlet pipe; 218. Heat dissipation layer; 2181. Connecting layer; 2182. Heat dissipation fins; 2183. First thermal conductive layer; 2184. Second thermal conductive layer; 21841. Accommodation groove; 21842. Fan intelligent power module area; 2185. Heat dissipation pad;

[0033] 3. Shell; 31. Air duct cavity; 4. Inspection box; 5. Junction box. DETAILED DESCRIPTION

[0034] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0035] The disclosure below provides many different embodiments or examples for implementing different configurations of the present invention. To simplify the disclosure of the present invention, the components and configurations of specific examples are described below. Of course, these are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or configurations discussed.

[0036] For ease of description, spatially relative terms may be used herein to describe the relative position or movement of one element or feature relative to another element or feature as shown in the figures, such as "inside," "outside," "inside," "outside," "below," "beneath," "above," "above," "front," "back," and the like. Such spatially relative terms are intended to include different orientations of the device in use or operation other than the orientation depicted in the figures. For example, if the device in the figures undergoes a positional flip or a change in posture or a change in motion, then these directional indications will also change accordingly. For example, an element described as "below" or "below" another element or feature will subsequently be oriented as "above" or "above" another element or feature. Thus, the example term "below" can include both above and below orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein will be interpreted accordingly.

[0037] In the related art, in the design and manufacture of electronic equipment, especially air conditioners, the electrical box is the carrier of core components, and its internal temperature management is extremely important. With the continuous improvement of the integration of electronic components and the increase in power density, the heat generated inside the electrical box has also increased sharply. If it cannot be dissipated in a timely and effective manner, it will seriously affect the performance stability, service life and even the safe operation of the entire equipment of the electronic components. In order to cope with the temperature rise problem inside the electrical box, the industry generally adopts a heat dissipation design solution with a built-in fan. This solution accelerates the flow of air inside the electrical box through the forced convection effect of the fan, thereby achieving rapid transfer and dissipation of heat, ensuring uniform temperature distribution inside the electrical box, and avoiding local overheating. However, this fan-dependent heat dissipation method has gradually exposed many disadvantages in actual applications.

[0038] For example, fans have a limited lifespan. As mechanical components, fans rely on motors for their operation. Long-term operation can lead to increased wear and tear, shortening their lifespan. Furthermore, fan components like bearings and blades are susceptible to dust and foreign matter, further reducing their reliability and durability.

[0039] For example, after-sales repairs are difficult. Once a fan malfunctions, the electrical box often needs to be removed for replacement or repair. This not only increases the difficulty and cost of repairs, but can also lead to damage or performance degradation due to improper operation during the repair process. Furthermore, the fan replacement cycle increases maintenance costs and time.

[0040] For example, noise and energy consumption. Fans generate a certain amount of noise when running, affecting the user experience. At the same time, fan energy consumption is also a non-negligible part, especially when running for a long time, which has an adverse impact on the overall energy efficiency of the device.

[0041] Based on the above technical problems, the present application provides an electrical box with a heat dissipation structure attached to the heating element, which has the characteristics of simple structure and good heat dissipation effect. The heat dissipation structure uses refrigerant for heat exchange, effectively avoiding heat accumulation, improving the temperature rise problem of the electrical box, and improving the performance of the electrical box, providing strong guarantee for the stable operation of the air conditioner.

[0042] First embodiment

[0043] like Figure 1-Figure 4 As shown, an electrical box is used in electronic equipment, especially in the design and manufacture of household appliances and industrial control equipment. Electronic equipment, such as air conditioners and other equipment that require power supply, is used to ensure the normal operation of the electronic equipment and meet user needs.

[0044] The electrical box includes a heating element 1, which can be one, two, or more. Heating elements 1 are electronic components that support the performance of the electrical box. Heating elements 1 include, but are not limited to, driver boards 11, circuit boards 12, filter boards 13, chokes 14, sensors, and relays.

[0045] It should be noted that the aforementioned driver board 11, circuit board 12, filter board 13, choke 14, sensor, and relay are commonly used electronic components within an electrical box, and their functions and configurations are conventional. For example, the driver board 11 is one of the primary sources of heat generation. For example, the driver board 11 includes a compressor intelligent power module and a fan intelligent power module. The compressor intelligent power module (IPM) is an advanced power switching device that integrates IGBTs (insulated gate bipolar transistors), drive circuits, protection circuits, and control interfaces; the fan intelligent power module is an intelligent power module based on IPM technology, used to drive and control motors. The circuit board 12 integrates multiple control chips and electronic components for performing complex logic operations and control tasks, which also generates a certain amount of heat. The filter board 13 is used to filter out noise from the power supply or signal to ensure circuit stability, but components such as resistors and capacitors on it also generate heat during operation. The choke 14 is used to limit the rate of change of current to prevent sudden current changes from impacting the circuit, which also results in heat generation. Sensors monitor environmental parameters like temperature and humidity. Although they generate relatively little heat, they still require consideration for heat dissipation during extended operation. Relays control the on / off switching of circuits, and their contacts generate heat when they frequently switch. The specifics will vary depending on the actual situation, so we won't discuss them in detail here.

[0046] The electrical box includes a heat dissipation structure 2, which includes a heat dissipation element 21. This element is made of a highly thermally conductive material, such as aluminum alloy or copper alloy, to ensure good thermal conductivity. This element fits snugly against the back of a heating element 1 (such as the driver board 11 or circuit board 12). Heat from the heating element 1 is quickly transferred to the surface of the heat dissipation element 21 through thermal conduction, minimizing the temperature rise of the heating element 1.

[0047] The heat dissipation element 21 is provided with a cavity 211 inside, and the cavity 211 is filled with a refrigerant (not shown in the figure). The refrigerant is in liquid form, such as pure water, environmentally friendly refrigerant, etc. When the heating element 1 is in operation, a large amount of heat will be generated, which will affect the performance of the electrical box. The refrigerant in the heat dissipation element 21 can exchange heat with the heating element 1 to improve the temperature rise problem, avoid heat accumulation, and improve the performance of the electrical box. After absorbing the heat transferred by the heating element 1, the refrigerant exchanges heat with the external environment through evaporation or convection, thereby reducing the temperature of the heat dissipation element 21 and the heating element 1. The circulation of the refrigerant can be assisted by an external cooling system (such as the condenser of an air conditioner) to form a closed-loop heat dissipation system.

[0048] Through the above design, the electrical box in this embodiment can effectively reduce the temperature rise of internal electronic components during air conditioner operation, avoiding problems such as performance degradation, shortened lifespan, and even failure caused by high temperatures. Furthermore, the use of environmentally friendly refrigerant and efficient heat dissipation structure 2 not only improves the overall performance of the device but also meets environmental requirements for green energy conservation.

[0049] The electrical box provided in this embodiment integrates multiple heating elements 1 and is equipped with a heat dissipation structure 2. This heat dissipation structure 2 utilizes a liquid refrigerant for heat exchange, effectively dissipating heat from electronic components within electronic devices such as air conditioners, thereby ensuring the stable operation of these devices. This design offers advantages such as a simple structure, effective heat dissipation, and environmental protection and energy conservation, making it suitable for a wide range of electronic devices requiring efficient heat dissipation.

[0050] Second embodiment

[0051] like Figure 1-Figure 4 As shown, the electrical box includes a heating element 1 and a heat dissipation structure 2. The structure and configuration of the heating element 1 are the same as those of the heating element 1 in the first embodiment described above, and are not repeated here. The heat dissipation structure 2 includes a heat dissipation element 21. The structure and configuration of the heat dissipation element 21 are the same as or similar to those of the heat dissipation element 21 in the first embodiment described above, except that the heat dissipation element 21 includes a first heat dissipation core 212, which implements a targeted heat dissipation system and effectively improves the heat dissipation capacity of the electrical box.

[0052] The first heat dissipation core 212 has a first cavity 2121. The first heat dissipation core 212 is connected to the corresponding heating element 1 to cool the corresponding heating element 1. For example, the filter plate 13 is connected to the choke 14, and the choke 14 is connected to the first heat dissipation core 212. There can be one or more first cavities 2121, and the multiple first cavities 2121 are interconnected to ensure the normal circulation of the refrigerant.

[0053] The first heat dissipation core 212 dissipates heat in a targeted manner, thereby optimizing the configuration of heat dissipation resources. For example, in an electronic device, the choke coil 14 operating at a high frequency may generate a large amount of heat, which is dissipated primarily through the first heat dissipation core 212 .

[0054] In this embodiment, if Figure 1-Figure 4As shown, the first heat dissipation core 212 is provided with an inlet end 2122 and an outlet end 2123 to realize the inflow and outflow of the refrigerant. Among them, the inlet end 2122 is provided with an inlet pipe 216, and the outlet end 2123 is provided with an outlet pipe 217. The inlet pipe 216 and the outlet pipe 217 are respectively connected to an external cooling system (such as the condenser of an air conditioner) to form a closed-loop heat dissipation system, so that the circulation flow continuously dissipates heat for the heating element 1, thereby improving the heat dissipation effect. Among them, the inlet end 2122 is responsible for introducing the cooled refrigerant, while the outlet end 2123 discharges the refrigerant after absorbing heat, thereby realizing effective heat transfer.

[0055] The refrigerant circulation process is, for example, that after the refrigerant is cooled by an external cooling system (such as an air conditioner condenser), it is fed into the inlet end 2122 of the first heat dissipation core 212 through the inlet pipe 216. The refrigerant flows within the first cavity 2121, absorbs heat from the heating element 1 (such as the choke 14 connected to the filter board 13) with which it comes into contact, and finally returns to the external cooling system through the outlet pipe 217, completing a complete cycle.

[0056] This embodiment uses the heat dissipation structure 2 in combination with an optimized refrigerant flow path and structural design to not only improve the heat dissipation efficiency but also achieve targeted heat dissipation of the heating element 1 .

[0057] Third embodiment

[0058] like Figure 1-Figure 4 As shown, the electrical box includes a heating element 1 and a heat dissipation structure 2. The structure and configuration of the heating element 1 are the same as those of the heating element 1 in the first embodiment described above, and are not repeated here. The heat dissipation structure 2 includes a heat dissipation element 21. The structure and configuration of the heat dissipation element 21 are the same or similar to those of the heat dissipation element 21 in the first embodiment described above, except that the heat dissipation element 21 includes a second heat dissipation core 213, which implements a targeted heat dissipation system and effectively improves the heat dissipation capacity of the electrical box.

[0059] The second heat dissipation core 213 has a second cavity 2131. The second heat dissipation core 213 is connected to the corresponding heating element 1 to cool different heating elements 1. The driver board 11 is connected to the circuit board 12, and the circuit board 12 is connected to the second heat dissipation core 213, achieving targeted heat dissipation and meeting heat dissipation requirements. The second cavity 2131 can be one or more, and multiple second cavities 2131 are connected to ensure the normal circulation of the refrigerant.

[0060] The second heat dissipation core 213 dissipates heat for different heating elements 1, achieving an optimized configuration of heat dissipation resources. For example, in an electronic device, other elements on the circuit board 12 dissipate heat through the second heat dissipation core 213, ensuring stable operation of the entire system.

[0061] In this embodiment, if Figure 1-Figure 4 As shown, the second heat dissipation core 213 is provided with an inlet end (not shown in the figure) and an outlet end (not shown in the figure). Its setting logic and heat dissipation logic are the same or similar to the setting logic and heat dissipation logic of the first heat dissipation core 212 in the second embodiment described above, and will not be repeated here. That is, the inlet end and the outlet end can realize the inflow and outflow of refrigerant, and are connected to an external cooling system (such as the condenser of an air conditioner) to form a closed-loop heat dissipation system, so that the circulation flow continues to dissipate heat for the heating element 1, thereby improving the heat dissipation effect. Among them, the inlet end is responsible for introducing the cooled refrigerant, while the outlet end discharges the refrigerant after absorbing heat, thereby realizing effective heat transfer.

[0062] The refrigerant circulation process is, for example, that after being cooled by an external cooling system (such as an air conditioner condenser), the refrigerant is fed into the inlet of the first heat dissipation core 212. The refrigerant flows within the second cavity 2131, absorbing heat from the heating element 1 (such as the circuit board 12) in contact with it, and then flows back to the external cooling system, completing a complete cycle.

[0063] In this embodiment, if Figure 1-Figure 4 As shown, the second heat dissipation core 213 is provided with a groove 2132 to reduce the size or volume of the second heat dissipation core 213 and reduce costs. It is understandable that one, two, or more grooves 2132 can be provided, depending on the actual situation.

[0064] For example, the grooves 2132 may include a first groove 21321, with the first groove 21321 provided on both opposing sidewalls of the second heat dissipation core 213, thereby reducing the cross-sectional dimensions of the second heat dissipation core 213. Alternatively, the grooves 2132 may include a second groove 21322, with the second groove 21322 provided on the bottom wall of the second heat dissipation core 213, thereby reducing the thickness of the second heat dissipation core 213. By modifying the local structure of the second heat dissipation core 213, the size and weight of the second heat dissipation core 213 can be reduced, maximizing cost-effectiveness while maintaining sufficient heat dissipation area.

[0065] This embodiment utilizes heat dissipation structure 2, combined with an optimized refrigerant flow path and structural design, to not only improve heat dissipation efficiency but also achieve targeted heat dissipation of heating element 1. Furthermore, the introduction of groove 2132 effectively reduces the size and cost of heat dissipation element 21, providing an efficient and economical solution to heat dissipation issues in electronic equipment, industrial control equipment, and other fields.

[0066] Fourth embodiment

[0067] like Figure 1-Figure 4 As shown, the electrical box includes a heating element 1 and a heat dissipation structure 2. The structure and configuration of the heating element 1 are the same as those of the heating element 1 in the first embodiment described above, and are not repeated here. The heat dissipation structure 2 includes a heat dissipation element 21. The structure and configuration of the heat dissipation element 21 are the same as or similar to those of the heat dissipation element 21 in the first embodiment described above, except that the heat dissipation element 21 includes a first heat dissipation core 212 and a second heat dissipation core 213, thereby realizing a high-efficiency dual-core heat dissipation system, effectively improving the heat dissipation capacity of the electrical box.

[0068] The first heat dissipation core 212 has a first cavity 2121 and is connected to the corresponding heating element 1 to cool the corresponding heating element 1. For example, the filter board 13 is connected to the choke coil 14, and the choke coil 14 is connected to the first heat dissipation core 212.

[0069] The second heat dissipation core 213 has a second cavity 2131 and is connected to corresponding heating elements 1 to cool different heating elements 1. The driver board 11 is connected to the circuit board 12, and the circuit board 12 is connected to the second heat dissipation core 213, achieving targeted heat dissipation and meeting heat dissipation requirements.

[0070] The first and second heat dissipation cores 212 and 213 dissipate heat for different heating components 1, optimizing the allocation of heat dissipation resources. For example, in electronic equipment, the high-frequency choke 14 may generate a large amount of heat, which is primarily dissipated through the first heat dissipation core 212. Other components on the circuit board 12, on the other hand, are cooled through the second heat dissipation core 213, ensuring stable operation of the entire system.

[0071] The first cavity 2121 and the second cavity 2131 are connected to form a two-way flow path for the refrigerant, and the first cavity 2121 and the second cavity 2131 together constitute the cavity 211 .

[0072] For example, a first pipe 214 and a second pipe 215 are provided between the first heat dissipation core 212 and the second heat dissipation core 213. The first pipe 214 is in communication with the first heat dissipation core 212 and the second heat dissipation core 213, respectively, while the second pipe 215 is in communication with the first heat dissipation core 212 and the second heat dissipation core 213, respectively, to enable the circulation of refrigerant between the first cavity 2121 and the second cavity 2131. For example, the first pipe 214 allows the refrigerant to flow from the first cavity 2121 into the second cavity 2131, while the second pipe 215 enables the reverse flow of the refrigerant, ensuring that the refrigerant is evenly distributed between the two cores and improving heat dissipation efficiency.

[0073] This embodiment aims to provide an efficient and flexible heat dissipation system, particularly suitable for applications requiring independent and efficient heat dissipation of multiple heating elements 1, such as chokes 14 and circuit boards 12. By employing a dual-core heat dissipation structure 2, combined with an optimized refrigerant flow path and structural design, heat dissipation performance is improved while costs are reasonably controlled.

[0074] In this embodiment, if Figure 1-Figure 4 As shown, the first heat dissipation core 212 is provided with an inlet end 2122 and an outlet end 2123 to realize the inflow and outflow of the refrigerant. Among them, the inlet end 2122 is provided with an inlet pipe 216, and the outlet end 2123 is provided with an outlet pipe 217. The inlet pipe 216 and the outlet pipe 217 are respectively connected to an external cooling system (such as the condenser of an air conditioner) to form a closed-loop heat dissipation system, so that the circulation flow continuously dissipates heat for the heating element 1, thereby improving the heat dissipation effect. Among them, the inlet end 2122 is responsible for introducing the cooled refrigerant, while the outlet end 2123 discharges the refrigerant after absorbing heat, thereby realizing effective heat transfer.

[0075] For example, the refrigerant circulation process involves cooling the refrigerant in an external cooling system (such as an air conditioner condenser) and then feeding it into the inlet port 2122 of the first heat dissipation core 212 through the inlet pipe 216. The refrigerant then flows within the first cavity 2121, absorbing heat from the heating element 1 (such as the choke 14 connected to the filter board 13) it contacts, and then enters the second cavity 2131 of the second heat dissipation core 213 through the first pipe 214. Within the second cavity 2131, the refrigerant continues to absorb heat from another group of heating elements 1 (such as the circuit board 12), then flows back to the first heat dissipation core 212 through the second pipe 215, and finally returns to the external cooling system through the outlet pipe 217, completing a complete cycle.

[0076] In this embodiment, if Figure 1-Figure 4 As shown, the second heat dissipation core 213 is provided with a groove 2132 to reduce the size or volume of the second heat dissipation core 213 and reduce costs. It is understandable that one, two, or more grooves 2132 can be provided, depending on the actual situation.

[0077] For example, the grooves 2132 may include a first groove 21321, with the first groove 21321 provided on both opposing sidewalls of the second heat dissipation core 213, thereby reducing the cross-sectional dimensions of the second heat dissipation core 213. Alternatively, the grooves 2132 may include a second groove 21322, with the second groove 21322 provided on the bottom wall of the second heat dissipation core 213, thereby reducing the thickness of the second heat dissipation core 213. By modifying the local structure of the second heat dissipation core 213, the size and weight of the second heat dissipation core 213 can be reduced, maximizing cost-effectiveness while maintaining sufficient heat dissipation area.

[0078] This embodiment utilizes a dual-core heat dissipation structure 2, combined with an optimized refrigerant flow path and structural design, to not only improve heat dissipation efficiency but also achieve targeted heat dissipation for multiple heating elements 1. Furthermore, the introduction of grooves 2132 effectively reduces the size and cost of heat dissipation elements 21, providing an efficient and economical solution to heat dissipation issues in electronic equipment, industrial control equipment, and other fields.

[0079] Fifth embodiment

[0080] like Figure 1-Figure 4 As shown, the electrical box includes a heating element 1 and a heat dissipation structure 2. The structure and configuration of the heating element 1 are the same as those of the heating element 1 in the first embodiment described above, and are not repeated here. The heat dissipation structure 2 includes a heat dissipation element 21. The structure and configuration of the heat dissipation element 21 are the same as or similar to those of the heat dissipation element 21 in the fourth embodiment or the second embodiment described above, except that the heat dissipation element 21 further includes a heat dissipation layer 218 to enhance the heat dissipation effect.

[0081] First example

[0082] A heat dissipation layer 218 can be provided on the first heat dissipation core 212 to further enhance the heat dissipation capability of the electrical box. The heat dissipation layer 218 is connected to the corresponding heating element 1 to achieve rapid cooling of the heating element 1. The heat dissipation layer 218 is made of a high thermal conductivity material, such as aluminum, thermally conductive silicone, etc., to ensure good thermal conductivity.

[0083] During installation, the heat dissipation layer 218 is tightly attached to the first heat dissipation core 212 through thermal adhesive or mechanical fasteners, and is in direct contact with the heating element 1 (such as the choke 14) or indirectly connected through a thermal conductive medium.

[0084] When the heating element 1 is working, the heat generated can be quickly transferred to the heat dissipation layer 218 through the heat-conducting medium, and then efficiently diffused to the surrounding environment through the heat dissipation layer 218, thereby achieving rapid cooling of the heating element 1, effectively preventing the temperature inside the electrical box from being too high, and ensuring the stable operation of electronic components.

[0085] Second example

[0086] A heat dissipation layer 218 can be provided on the second heat dissipation core 213 to further enhance the heat dissipation capability of the electrical box. The heat dissipation layer 218 is connected to the corresponding heating element 1 to achieve rapid cooling of the heating element 1. The structure of the heat dissipation layer 218 is the same as or similar to that of the heat dissipation layer 218 in the first example described above, and a detailed description thereof will not be repeated here.

[0087] During installation, the heat dissipation layer 218 is tightly attached to the second heat dissipation core 213 through thermal adhesive or mechanical fasteners, and is in direct contact with the heating element 1 (such as the circuit board 12) or indirectly connected through a thermal conductive medium.

[0088] When the heating element 1 is working, the heat generated can be quickly transferred to the heat dissipation layer 218 through the heat-conducting medium, and then efficiently diffused to the surrounding environment through the heat dissipation layer 218, thereby achieving rapid cooling of the heating element 1, effectively preventing the temperature inside the electrical box from being too high, and ensuring the stable operation of electronic components.

[0089] Third example

[0090] Each of the first heat dissipation core 212 and the second heat dissipation core 213 is provided with a heat dissipation layer 218. The first heat dissipation core 212 and the second heat dissipation core 213 are independently configured with heat dissipation layers 218. The first heat dissipation core 212 and the second heat dissipation core 213 are optimized based on the layout and heat distribution of the heating element 1 within the electrical box, and each is responsible for heat dissipation in different areas. The structure of the heat dissipation layer 218 is the same or similar to that of the heat dissipation layer 218 in the first and second examples described above, and will not be repeated here.

[0091] Each heat dissipation layer 218 is connected directly or through a thermally conductive medium to its corresponding heating element 1, ensuring that heat is quickly and efficiently transferred from the heating element 1 to the heat dissipation layer 218 and dissipated into the surrounding environment through the surface of the heat dissipation layer 218. This dual heat dissipation core configuration combined with independent heat dissipation layers 218 further enhances the overall heat dissipation capacity of the electrical enclosure, making it particularly suitable for designs where the heating elements 1 are dispersed or generate a large amount of heat.

[0092] The above three examples demonstrate different configurations of the heat dissipation layer 218 in the heat dissipation element 21 , all of which can effectively improve the heat dissipation capacity of the electrical box and ensure the stability and reliability of electronic components under long-term high-load operation.

[0093] Sixth embodiment

[0094] like Figure 1-Figure 4 As shown, in order to further improve the heat dissipation efficiency of the heating element 1 in the electrical box, this embodiment improves the heat dissipation structure 2 on the basis of the above-mentioned technology, especially optimizes the heat dissipation layer 218 of the heat dissipation element 21, and significantly improves the heat conduction and heat dissipation capabilities by adding heat dissipation fins 2182 and the first heat conductive layer 2183.

[0095] In this embodiment, if Figure 1-Figure 4 As shown, the electrical box includes a heating element 1 and a heat dissipation structure 2. The structure and configuration of the heating element 1 are the same or similar to those of the heating element 1 in the first embodiment described above, and are not repeated here. The heat dissipation structure 2 includes a heat dissipation element 21. The structure and configuration of the heat dissipation element 21 are the same or similar to those of the heat dissipation element 21 in the fifth embodiment described above, except that the heat dissipation layer 218 includes a connecting layer 2181 and a plurality of heat dissipation fins 2182.

[0096] Multiple heat dissipation fins 2182 are respectively connected to the connecting layer 2181. Multiple heat dissipation fins 2182 are vertically arranged and arranged in sequence at intervals in a preset direction (such as a direction parallel to the cross-section of the first heat dissipation core 212). This arrangement effectively increases the heat dissipation area, accelerates the convection and radiation of heat, and thus improves the heat dissipation efficiency.

[0097] It should be noted that the above-mentioned contents on the orientation are all illustrative based on the orientation in the figure and do not constitute a limitation to the present application. If the heating element 1 is placed in other ways, the heat dissipation layer 218 is placed synchronously, and the specific actual situation shall prevail.

[0098] The heat dissipation fins 2182 are connected to the first heat dissipation core 212, and the connection layer 2181 is connected to the corresponding heating element 1 to receive the heat of the heating element 1. The connection layer 2181 serves as a bridge between the heat dissipation fins 2182 and the heating element 1, and its shape is adaptively designed according to the specific form of the heating element 1. For example, when the heating element 1 is a choke 14, the connection layer 2181 is designed to be in a semi-arc shape to fit tightly against the choke 14, and the radius of the connection layer 2181 is greater than 1mm-5mm of the choke 14 to ensure that the connection layer 2181 can completely cover the choke 14. If the heating element 1 is a flat sensor or a filter plate 13 with a concave-convex surface, the connection layer 2181 is adjusted to be flat or concave-convex accordingly to ensure good thermal contact and conduction, and the specific shape shall be subject to actual conditions.

[0099] In this embodiment, if Figure 1-Figure 4As shown, the heat dissipation layer 218 further includes a first heat-conducting layer 2183, which is sandwiched between the heating element 1 and the connecting layer 2181. The first heat-conducting layer 2183 is, for example, a silicone thermal pad.

[0100] To further optimize the heat transfer path from the heating element 1 to the heat dissipation layer 218, this embodiment adds a first heat-conducting layer 2183 between the heating element 1 and the connecting layer 2181. First heat-conducting layer 2183 is made of a highly thermally conductive material, such as a silicone thermal pad, which exhibits excellent thermal conductivity. This significantly reduces heat loss during conduction, ensuring that heat is quickly and efficiently transferred to the heat dissipation layer 218, where it is subsequently dissipated to the surrounding environment through the heat dissipation fins 2182.

[0101] The heat dissipation structure 2 of the electrical box in this embodiment significantly improves heat dissipation performance while maintaining its original compact layout. The addition of heat dissipation fins 2182 and the introduction of first heat-conducting layer 2183 together form an efficient and flexible heat conduction and dissipation system, effectively reducing the operating temperature of heating element 1, extending its service life, and improving the stability and reliability of the entire electrical box.

[0102] Seventh embodiment

[0103] like Figure 1-Figure 4 As shown, to further improve the heat dissipation efficiency of the heating element 1 in the electrical box, especially the heat conduction efficiency between the heating element and the heat dissipation structure 2, this embodiment has been optimized and improved based on the above-mentioned technology. By introducing a second heat-conducting layer 2184 into the heat dissipation structure 2, the thermal coupling between the heating element 1 and the heat dissipation element 21 is effectively enhanced, thereby achieving more efficient heat transfer and dissipation.

[0104] In this embodiment, if Figure 1-Figure 4 As shown, the electrical box includes a heating element 1 and a heat dissipation structure 2. The structure and configuration of the heating element 1 are the same or similar to those of the heating element 1 in the first embodiment described above, and are not repeated here. The heat dissipation structure 2 includes a heat dissipation element 21. The structure and configuration of the heat dissipation element 21 are the same or similar to those of the heat dissipation element 21 in the third or fourth embodiment described above, except that the heat dissipation layer 218 includes a second heat conductive layer 2184.

[0105] The second heat-conducting layer 2184 serves as a bridge for heat transfer between the heating element 1 and the second heat dissipation core 213 and is sandwiched between the two. Among them, the second heat-conducting layer 2184 is made of a material with high thermal conductivity, such as a thermally conductive silicone pad. The thermally conductive silicone pad not only has good thermal conductivity, but also can fill the small gap between the heating element 1 and the second heat dissipation core 213 to form a close thermal contact interface. This design effectively reduces the thermal resistance of heat during the transfer process, so that the heat generated by the heating element 1 can be quickly and efficiently conducted to the second heat dissipation core 213, and then dissipated into the surrounding environment through the heat dissipation element 21.

[0106] It should be noted that the second heat-conducting layer 2184 and the second heat-dissipating core 213 may be staggered to correspond to different heating elements 1 .

[0107] On the second heat dissipation core 213, a compressor intelligent power module area 2133 is divided. This area is optimized for the high heat generation characteristics of the compressor intelligent power module, so that it is directly connected to the second heat dissipation core 213 to ensure that the heat generated by the compressor intelligent power module can be quickly dissipated.

[0108] On the second heat-conducting layer 2184, a fan intelligent power module area 21842 is provided. Because the fan intelligent power module may generate relatively low heat or have different heat dissipation requirements than the compressor intelligent power module, the design of this area may focus more on precise heat conduction to achieve localized heat dissipation optimization. For example, this area may use a material with a higher thermal conductivity, or a specific thermal path design may be used to guide heat flow to other high-efficiency heat dissipation areas of the second heat dissipation core 213. The specific requirements will depend on the actual situation.

[0109] The heat dissipation layout optimization scheme proposed in this embodiment, in which the second heat-conducting layer 2184 and the second heat dissipation core 213 are staggered, is specifically designed according to the heat dissipation requirements of different heating elements 1, thereby improving the heat dissipation efficiency, reducing the temperature of the electronic equipment, and providing strong support for the reliable operation of the electrical box.

[0110] By introducing the second thermally conductive layer 2184, the heat dissipation structure 2 of the electrical box in this embodiment significantly improves the heat conduction efficiency between the heating element 1 and the heat dissipation element 21 while maintaining the original structural compactness. This not only helps to reduce the operating temperature of the heating element 1 and extend its service life, but also improves the heat dissipation performance and stability of the entire electrical box. Furthermore, since the addition of the second thermally conductive layer 2184 does not significantly increase manufacturing cost and complexity, this optimized solution is highly practical and economical.

[0111] Eighth embodiment

[0112] like Figure 1-Figure 4As shown, to further enhance the heat dissipation of the heating element 1 in the electrical box, particularly for high-power, high-heat-generating applications, this embodiment, based on the previous embodiments (such as the seventh embodiment), further optimizes and enhances the heat dissipation structure 2. By introducing heat dissipation pads 2185 into the heat dissipation layer 218, the heat transfer efficiency and heat dissipation area are effectively improved, thereby achieving more efficient heat dissipation performance.

[0113] In this embodiment, if Figure 1-Figure 4 As shown, the electrical box includes a heating element 1 and a heat dissipation structure 2. The structure and configuration of the heating element 1 are the same or similar to those of the heating element 1 in the first embodiment described above, and are not repeated here. The heat dissipation structure 2 includes a heat dissipation element 21. The structure and configuration of the heat dissipation element 21 are the same or similar to those of the heat dissipation element 21 in the seventh embodiment described above, except that the heat dissipation layer 218 also includes a heat dissipation pad 2185. The heat dissipation pad 2185 is made of a material with high thermal conductivity, such as aluminum, which is selected for its good thermal conductivity and workability.

[0114] The heat dissipation pad 2185 can be flexibly arranged between the second heat-conducting layer 2184 and the second heat dissipation core 213 to enhance the thermal coupling effect between the second heat-conducting layer 2184 and the second heat dissipation core 213, further reducing thermal resistance. At the same time, according to actual needs, the heat dissipation pad 2185 can also be arranged between the second heat-conducting layer 2184 and the heating element 1 to directly improve the heat transfer efficiency between the heating element 1 and the heat dissipation structure 2. The above two settings can be used alone or in combination to achieve the best heat dissipation effect. The heat dissipation pad 2185 can be used with heating elements 1 of different heights, improving the flexibility of the heat dissipation structure 2.

[0115] This embodiment further optimizes and enhances heat dissipation performance by introducing heat dissipation pads 2185 into the heat dissipation structure 2 of the electrical box. The high thermal conductivity of heat dissipation pads 2185 further reduces the thermal resistance encountered during heat transfer, improving heat transfer efficiency and increasing the heat dissipation area, effectively ensuring efficient heat dissipation from the electrical box. This optimized solution boasts a simple structure, easy implementation, and significant effectiveness, and is widely applicable to various electrical devices requiring efficient heat dissipation.

[0116] In this embodiment, if Figure 1-Figure 4 As shown, in order to more accurately control the position of the heat dissipation pad 2185 and ensure close contact between it and the second heat-conducting layer 2184, thereby further improving the heat dissipation efficiency, this embodiment designs a receiving groove 21841 on the second heat-conducting layer 2184 for accurately installing the heat dissipation pad 2185.

[0117] The shape, size and position of the receiving groove 21841 are carefully calculated to ensure that the heat dissipation pad 2185 can be perfectly embedded therein to achieve seamless docking.

[0118] Illustratively, the accommodating groove 21841 is arranged on the top surface of the second heat-conducting layer 2184, which simplifies the installation process of the heat dissipation pad 2185 and ensures a close fit between the heat dissipation pad 2185 and the second heat-conducting layer 2184, thereby minimizing thermal resistance and improving heat transfer efficiency.

[0119] The design of the accommodating groove 21841 allows the heat dissipation pad 2185 to operate more stably on the second heat-conducting layer 2184, avoiding the problem of reduced heat dissipation efficiency due to positional deviation or poor contact. At the same time, the high thermal conductivity of the heat dissipation pad 2185 is fully utilized, allowing heat to be quickly and efficiently transferred to other parts of the heat dissipation system, such as the second heat dissipation core 213, ultimately effectively reducing the overall temperature of the electrical box.

[0120] Among them, the accommodating groove 21841 can correspond to the fan intelligent power module area 21842, so that the fan intelligent power module can be set corresponding to the heat dissipation pad 2185, realizing precise heat conduction and optimizing local heat dissipation. Through a specific thermal path design, the heat is guided to flow to the second heat dissipation core 213 to achieve efficient heat dissipation.

[0121] Ninth embodiment

[0122] During the design and manufacturing process of the air conditioner, the electrical box A is one of the core components, responsible for functions such as power distribution, control, and protection. At the same time, in order to facilitate subsequent maintenance and repair work, and to ensure the safety and reliability of electrical connections, the inspection box 4 and the junction box 5 are also indispensable components. This embodiment proposes an air conditioner that integrates the inspection box 4, the junction box 5, and the electrical box A of any of the above embodiments, achieving compact connection and efficient collaborative operation between the components. The air conditioner is also provided with a housing 3, and the housing 3 is provided with an air duct cavity 31. The inspection box 4, the junction box 5, and the electrical box A are all arranged in the air duct cavity 31.

[0123] For example, electrical box A is fully sealed, meeting IP55 protection requirements, preventing dust, moisture, and other external factors from entering, ensuring the normal operation of electronic components. Heat from heating element 1 is transferred to heat dissipation structure 2, lowering its temperature and meeting the heat dissipation requirements of heating element 1, effectively improving the heat dissipation efficiency of electrical box A.

[0124] The inspection box 4 and the electrical box A can be connected by screws, buckles, etc. to improve the reliability of the connection.

[0125] Junction box 5 serves as the electrical connection hub, responsible for introducing external power and control signals into the electrical box. Junction box 5 and electrical box A also utilize easy-to-install and easy-to-remove connections, such as plug-in and threaded connections, to ensure a secure and reliable electrical connection. Junction box 5 also features a well-defined wiring space and marking system, facilitating wiring and troubleshooting by technicians.

[0126] By tightly integrating the inspection box 4, junction box 5, and electrical box A, the air conditioner in this embodiment achieves compact component connections, simplifying the air conditioner's internal structure and assembly process. This integrated design not only improves the air conditioner's overall aesthetics and reliability, but also reduces production costs and maintenance, providing users with a more convenient and comfortable experience.

[0127] It should be understood that the terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the specific order described or illustrated, unless the order of execution is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0128] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0129] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but is intended to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. An electrical box, comprising a heating element, characterized in that: The electrical box includes a heat dissipation structure, which includes a heat dissipation element. The heat dissipation element is arranged in contact with the heating element, and the heat of the heating element can be transferred to the heat dissipation element. The heat dissipation element is provided with a cavity, a refrigerant is provided in the cavity, and the refrigerant can exchange heat with the heating element.

2. The electrical box according to claim 1, characterized in that: The heat dissipation element includes a first heat dissipation core and / or a second heat dissipation core, and the first heat dissipation core and the second heat dissipation core are respectively connected to the corresponding heating element.

3. The electrical box according to claim 2, characterized in that: The first heat dissipation core has a first cavity, the second heat dissipation core has a second cavity, the first cavity and the second cavity are connected, and the first cavity and the second cavity together constitute the cavity.

4. The electrical appliance box according to claim 2, characterized in that: The first heat dissipation core is provided with an inlet end and an outlet end.

5. The electrical box according to claim 2, characterized in that: The second heat dissipation core is provided with at least one groove.

6. The electrical appliance box according to claim 2, characterized in that: The heat dissipation element includes a heat dissipation layer, which is arranged on the first heat dissipation core and / or the second heat dissipation core, and is connected to the corresponding heating element.

7. The electrical appliance box according to claim 6, characterized in that: The heat dissipation layer includes a connection layer and a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins are respectively connected to the connection layer and are sequentially spaced along a preset direction; the preset direction is parallel to the cross section of the first heat dissipation core; Wherein, the heat dissipation fins are connected to the first heat dissipation core, and the connection layer is connected to the corresponding heating element.

8. The electrical appliance box according to claim 7, characterized in that: The heat dissipation layer includes a first heat-conducting layer, which is sandwiched between the heating element and the connecting layer.

9. The electrical appliance box according to claim 6, characterized in that: The heat dissipation layer includes a second heat-conducting layer, and the second heat-conducting layer is sandwiched between the heating element and the second heat dissipation core.

10. The electrical appliance box according to claim 9, characterized in that: The heat dissipation layer includes a heat dissipation pad, and the heat dissipation pad is arranged between the second heat conductive layer and the second heat dissipation core; and / or, The heat dissipation pad is arranged between the second heat conducting layer and the heating element.

11. The electrical appliance box according to claim 10, characterized in that: The second heat-conducting layer is provided with a receiving groove, and the heat dissipation pad is arranged in the receiving groove.

12. An air conditioner, characterized in that: It comprises an inspection box, a junction box and the electrical appliance box according to any one of claims 1 to 11, wherein the inspection box and the junction box are respectively connected to the electrical appliance box.

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