Laminated chip inductor with anti-falling and stabilizing functions

Abstract

The utility model discloses a laminated chip inductor with anti-falling and stabilizing functions, relates to the technical field of laminated chip inductors, and aims to solve the problems that an existing laminated chip inductor performs external protection through an arranged protection frame strip structure, but the protection frame strip structure only can protect the middle section part of the inductor, and the protection frame strip structure cannot protect the middle section part of the inductor. The inductor comprises an inductor outer shell, an outer protective frame is arranged outside the inductor outer shell, a sleeving frame is arranged outside the outer protective frame, and connecting frames are arranged at the front end and the rear end of the sleeving frame respectively; the inductor further comprises a base cylinder and a supporting seat, the base cylinder and the supporting seat are arranged between the outer protective frame and the inductor shell and between the sleeving frame and the outer protective frame, a hollow cavity is formed in the base cylinder, a buffer spring is arranged in the hollow cavity, and a damping mechanism is arranged in the buffer spring; the guide sliding grooves are formed in the front end face and the rear end face of the sleeving frame.

Description

Technical Field

[0001] The utility model relates to the technical field of multilayer chip inductors, in particular to a multilayer chip inductor with anti-fall and stability functions. Background Art

[0002] Multilayer chip inductors are non-wire-wound inductors. They are classified according to their structure. They are widely used in notebook computers, digital TVs, digital video recorders, list players, and hard disk drives.

[0003] For example, the announcement number is: CN218004522U (named a laminated chip inductor), which includes a laminated chip inductor body, both ends of which are fixedly connected to electrodes, a flame retardant coating on the outer wall of the laminated chip inductor body, and an adhesive is applied to the outer wall of the flame retardant coating, a waterproof film is adhered to the outer wall of the adhesive, a heat dissipation layer is applied to the outer wall of the waterproof film, and a heat dissipation layer is fixedly connected to the outer wall of the heat conduction frame shell, the outer side of the heat conduction frame shell is provided with three protective frame strips arranged at equal intervals, and a buffer mechanism is fixedly connected between the side walls of the heat conduction frame shell and the inner walls of the protective frame strips at both ends, and the buffer mechanism is fixedly connected between the side walls of the heat conduction frame shell and the inner walls of the protective frame strips at both ends. The impact mechanism includes a fixed column vertically fixed to the outside of the heat-conducting frame shell, a sliding cavity is opened in the fixed column, and a slider is slidably connected in the sliding cavity, a buffer spring is fixedly connected between the inner bottom wall of the fixed column and the slider, and the end of the slider away from the buffer spring is fixedly connected to a moving rod, and the end of the moving rod away from the slider passes through the fixed column and is fixedly connected to the inner side wall of the protective frame strip. By providing a flame retardant coating on the outside of the laminated chip inductor body, the high temperature resistance of the device can be improved, a waterproof film is provided to play a waterproof protection role, a heat dissipation layer is provided to play a heat conductive role, and the heat-conducting frame shell is provided to improve the heat dissipation, thereby improving the heat dissipation protection of the laminated chip inductor body.

[0004] The above-mentioned multilayer chip mutual inductor is protected by a protective frame structure, but the protective frame structure can only protect the middle part of the mutual inductor, resulting in poor drop resistance of the mutual inductor. Therefore, we provide a multilayer chip inductor with drop resistance and stability function. Utility Model Content

[0005] The purpose of the present utility model is to provide a multilayer chip inductor with anti-drop stability function, so as to solve the problem proposed in the above background technology that the existing multilayer chip transformer is protected by a protective frame structure, but the protective frame structure can only protect the middle part of the transformer, resulting in poor anti-drop performance of the transformer.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a multilayer chip inductor with anti-drop stability, comprising an inductor housing, an outer protective frame disposed on the exterior of the inductor housing, a sleeve frame disposed on the exterior of the outer protective frame, and connecting frames disposed at the front and rear ends of the sleeve frame, respectively;

[0007] Also includes:

[0008] A base tube and a support seat are arranged between the outer protective frame and the inductor outer shell and between the sleeve frame and the outer protective frame, and a hollow cavity is arranged inside the base tube, a buffer spring is arranged inside the hollow cavity, and a damping mechanism is arranged inside the buffer spring;

[0009] The guide slide grooves are arranged on the front end surface and the rear end surface of the sleeve frame. There are four guide slide grooves, and connecting sliders are movably arranged inside the guide slide grooves.

[0010] Preferably, a limiting chassis is welded to the bottom of the support seat, and both ends of the buffer spring and the damping mechanism are fixedly connected to the hollow cavity and the limiting chassis respectively through nail-free glue.

[0011] Preferably, a movable through-hole is provided at the connecting position between the support seat and the hollow cavity, and the movable through-hole is communicated with the interior of the hollow cavity.

[0012] Preferably, extension blocks are welded on both side outer walls of the connecting slider, and anti-slip grooves are provided at the sliding connection position between the extension blocks and the guide grooves. The two anti-slip grooves and the guide grooves are an integrated structure.

[0013] Preferably, a connecting block is provided at the upper end of the connecting slider, and two ends of the connecting block are respectively welded to the connecting slider and the connecting frame.

[0014] Preferably, a bottom groove is provided at the bottom of the connecting slider, a roller is provided inside the bottom groove, and the connecting slider is rollingly connected to the guide groove through the roller.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. The outer shell of the inductor of the utility model is protected by an outer protective frame, a sleeve frame and two connecting frames. When the multilayer chip inductor falls, the connecting frame will slide downward due to its own weight, so that after the multilayer chip inductor falls to the ground, the connecting frame, the sleeve frame and the outer protective frame will replace the grounding, thereby avoiding the multilayer chip inductor from falling directly to the ground and being damaged, improving the stability of the multilayer chip inductor, and overcoming the problem that the existing multilayer chip mutual inductor is protected by a protective frame structure, but the protective frame structure can only protect the middle part of the mutual inductor, resulting in poor fall resistance of the mutual inductor.

[0017] 2. A shock-absorbing and buffering structure is formed between the base tube and the support seat through a buffer spring and a damping mechanism to buffer the impact force after landing, thereby avoiding damage to the internal components of the multilayer chip inductor due to the vibration of landing and improving the service life of the multilayer chip inductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of the multilayer chip inductor with anti-drop stability function of the utility model;

[0019] Figure 2 This is an enlarged schematic diagram of the structure of part A of the present utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure between the support seat and the base tube of the utility model;

[0021] Figure 4 This is a schematic diagram of the connection structure between the connecting frame and the socket frame of the utility model;

[0022] In the figure: 1. Inductor outer shell; 2. Outer protection frame; 3. Socket frame; 4. Connecting frame; 5. Guide slide; 6. Base tube; 7. Support seat; 8. Movable opening; 9. Hollow cavity; 10. Limiting chassis; 11. Buffer spring; 12. Damping mechanism; 13. Connecting slider; 14. Anti-slip slide; 15. Extension block; 16. Bottom groove; 17. Roller; 18. Connecting block. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0024] See also Figure 1-4 The present invention provides an embodiment of a multilayer chip inductor with anti-drop stability, comprising an inductor housing 1, an outer protective frame 2 disposed on the outside of the inductor housing 1, a sleeve frame 3 disposed on the outside of the outer protective frame 2, and connecting frames 4 disposed at the front and rear ends of the sleeve frame 3, respectively.

[0025] Also includes:

[0026] The base tube 6 and the support base 7 are arranged between the outer frame 2 and the inductor outer shell 1 and between the sleeve frame 3 and the outer frame 2. The base tube 6 has a hollow cavity 9 arranged inside, a buffer spring 11 is arranged inside the hollow cavity 9, and a damping mechanism 12 is arranged inside the buffer spring 11;

[0027] The guide slide grooves 5 are provided on the front and rear surfaces of the sleeve frame 3 . There are four guide slide grooves 5 , and connecting sliders 13 are movably provided inside the guide slide grooves 5 .

[0028] When in use, the outer shell of the inductor is protected by the outer protective frame, the sleeve frame and the two connecting frames. When the multilayer chip inductor falls, the connecting frame will slide downward due to its own weight, so that after the multilayer chip inductor falls to the ground, the connecting frame, the sleeve frame and the outer protective frame will replace the grounding, thus preventing the multilayer chip inductor from falling directly to the ground and being damaged.

[0029] See also Figure 3 A limiting chassis 10 is welded at the bottom of the support seat 7, and the two ends of the buffer spring 11 and the damping mechanism 12 are fixedly connected to the hollow cavity 9 and the limiting chassis 10 respectively through nail-free glue. The limiting chassis 10 welded at the bottom of the support seat 7 plays a role in limiting the support seat 7 and preventing it from falling off.

[0030] See also Figure 3 A movable through-hole 8 is provided at the connecting position between the support seat 7 and the hollow cavity 9. The movable through-hole 8 is connected to the interior of the hollow cavity 9. The movable through-hole 8 provided at the connecting position between the support seat 7 and the hollow cavity 9 plays the role of assisting the support seat 7 to movably penetrate into the interior of the hollow cavity 9.

[0031] See also Figure 4 Extension blocks 15 are welded on the outer walls on both sides of the connecting slider 13, and anti-slip grooves 14 are provided at the sliding connection position between the extension blocks 15 and the guide slide groove 5. The two anti-slip grooves 14 and the guide slide groove 5 are an integrated structure. The extension blocks 15 welded on the outer walls on both sides of the connecting slider 13 play a role in preventing the anti-slip grooves 14 from sliding.

[0032] See also Figure 4 A connecting block 18 is provided at the upper end of the connecting slider 13. The two ends of the connecting block 18 are respectively welded to the connecting slider 13 and the connecting frame 4. The connecting block 18 provided at the upper end of the connecting slider 13 plays a role in auxiliary welding connection.

[0033] See also Figure 4 A bottom groove 16 is provided at the bottom of the connecting slider 13, and a roller 17 is provided inside the bottom groove 16. The connecting slider 13 is rollingly connected to the guide slide 5 through the roller 17, and the bottom groove 16 provided at the bottom of the connecting slider 13 plays the role of bearing the roller.

[0034] Working principle: When in use, the outer shell 1 of the inductor is protected by the outer protective frame 2, the sleeve frame 3 and the two connecting frames 4. When the multilayer chip inductor falls, the connecting frame 4 will slide downward due to its own weight, so that after the multilayer chip inductor falls to the ground, the connecting frame 4, the sleeve frame 3 and the outer protective frame 2 are replaced by the ground, avoiding the multilayer chip inductor from falling directly to the ground and being damaged, thereby improving the stability of the multilayer chip inductor. The base tube 6 and the support seat 7 are connected by a buffer spring 11 and a damping mechanism 12 to form a shock-absorbing and buffering structure to buffer the impact force after falling to the ground, thereby avoiding damage to the internal components of the multilayer chip inductor due to the vibration of falling, thereby improving the service life of the multilayer chip inductor and completing the use of the multilayer chip inductor with anti-fall and stability functions.

[0035] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A multilayer chip inductor with anti-drop stability function, comprising an inductor housing (1), an outer protective frame (2) provided on the outside of the inductor housing (1), a sleeve frame (3) provided on the outside of the outer protective frame (2), and connecting frames (4) provided at the front and rear ends of the sleeve frame (3); Its characteristics are: Also includes: A base tube (6) and a support seat (7) are arranged between the outer protective frame (2) and the inductor outer shell (1) and between the sleeve frame (3) and the outer protective frame (2); a hollow cavity (9) is provided inside the base tube (6); a buffer spring (11) is provided inside the hollow cavity (9); and a damping mechanism (12) is provided inside the buffer spring (11); The guide slide grooves (5) are arranged on the front and rear surfaces of the sleeve frame (3). There are four guide slide grooves (5), and connecting sliders (13) are movably arranged inside the guide slide grooves (5).

2. The multilayer chip inductor with anti-drop stability function according to claim 1, characterized in that: A limiting chassis (10) is welded to the bottom of the support seat (7), and both ends of the buffer spring (11) and the damping mechanism (12) are fixedly connected to the hollow cavity (9) and the limiting chassis (10) respectively through nail-free glue.

3. The multilayer chip inductor with anti-drop stability function according to claim 2, characterized in that: A movable through-hole (8) is provided at the connecting position between the support seat (7) and the hollow cavity (9), and the movable through-hole (8) is connected to the interior of the hollow cavity (9).

4. The multilayer chip inductor with anti-drop stability function according to claim 1, characterized in that: Extension blocks (15) are welded on both side outer walls of the connecting slide block (13), and anti-slip grooves (14) are provided at the sliding connection position between the extension block (15) and the guide slide groove (5). The two anti-slip grooves (14) and the guide slide groove (5) are an integrated structure.

5. The multilayer chip inductor with anti-drop stability function according to claim 1, characterized in that: A connecting block (18) is provided at the upper end of the connecting slider (13), and both ends of the connecting block (18) are respectively welded to the connecting slider (13) and the connecting frame (4).

6. The multilayer chip inductor with anti-drop stability function according to claim 1, characterized in that: The bottom of the connecting slider (13) is provided with a bottom groove (16), the interior of the bottom groove (16) is provided with a roller (17), and the connecting slider (13) is rollingly connected to the guide slide groove (5) via the roller (17).

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