Loadlock device for double-wafer position

Abstract

The utility model belongs to the technical field of electron beam wafer detection, and particularly discloses a dual-wafer position loadlock device, which comprises an equipment front-end module, a vacuum loading and unloading locking chamber and a process chamber, a first wafer placing position and a second wafer placing position are arranged on the vacuum loading and unloading locking chamber, and a vacuum manipulator is arranged in the process chamber; the number of the atmospheric mechanical gripper and the number of the vacuum manipulator are respectively one, the first wafer placing position is used for placing undetected wafers, and the second wafer placing position is used for placing detected wafers; locking chamber channels which are communicated with each other are arranged between the equipment front-end module and the vacuum loading and unloading locking chamber, and cavity channels which are communicated with each other are arranged between the vacuum loading and unloading locking chamber and the process cavity; the structure of the vacuum loading and unloading locking chamber is changed, so that the requirement for the atmosphere mechanical gripper is changed from two to one, the cost is reduced, and the wafer conveying efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electron beam wafer detection, in particular to a loadlock device with dual wafer positions. Background Art

[0002] The loadlock is a vacuum loading and unloading locking chamber used to store wafers. Currently, the loadlock only has space for one wafer. Therefore, after a wafer is inspected in the process chamber and transferred from the process chamber to the loadlock, it needs to be transferred from the loadlock to the front-end module of the EFEM equipment. The atmospheric robot generally has only one multi-degree-of-freedom arm. After transferring the inspected wafer from the loadlock to the EFEM, it then removes a new wafer to be inspected from the EFEM and transfers it to the loadlock. This wafer-removal and placement process is cumbersome and inefficient.

[0003] Prior art has improved the atmospheric robot between the EFEM and the loadlock, converting it from a single multi-DOF robot arm to two. Before transferring a completed wafer from the loadlock to the EFEM, the atmospheric robot arm stores the wafer to be inspected on one arm. Then, as the other free arm removes the inspected wafer from the loadlock, the other arm immediately places the prepared wafer into the loadlock. This reduces the time it takes for a single robot arm to deposit a completed wafer and retrieve a new one.

[0004] However, in order to improve the efficiency of film transfer between EFEM and loadlock, the atmospheric manipulator was changed into two robotic arms, which increased the cost of use. The coordinated movement between the two arms also became more complex and cumbersome, and also brought more maintenance risks. Utility Model Content

[0005] The purpose of the present invention is to provide a loadlock device with dual wafer positions to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a dual-wafer position loadlock device, comprising an equipment front-end module, a vacuum loading and unloading locking chamber and a process chamber, the equipment front-end module is provided with an atmospheric mechanical gripper, the vacuum loading and unloading locking chamber is provided with a first wafer placement position and a second wafer placement position, and the process chamber is provided with a vacuum manipulator; one atmospheric mechanical gripper and one vacuum manipulator are respectively provided, the first wafer placement position is used to place uninspected wafers, and the second wafer placement position is used to place inspected wafers.

[0007] A lock chamber passage is provided between the front-end module and the vacuum loading and unloading lock chamber, and a chamber passage is provided between the vacuum loading and unloading lock chamber and the process chamber. The lock chamber passage is provided to ensure communication between the front-end module and the vacuum loading and unloading lock chamber, allowing an atmospheric robot gripper to pick up or place wafers. The chamber passage is provided to connect the vacuum loading and unloading lock chamber and the process chamber, ensuring that a vacuum robot gripper can pick up or place wafers.

[0008] Preferably, a first valve is provided on the locking chamber channel, and the independence between the equipment front-end module and the vacuum loading and unloading locking chamber is ensured by setting the first valve. The connecting valve can be opened to realize the mutual communication between the equipment front-end module and the vacuum loading and unloading locking chamber.

[0009] Preferably, a second valve is provided on the chamber channel, and the second valve ensures the independence between the vacuum loading and unloading lock chamber and the process chamber. The connecting valve can be opened to realize the mutual communication between the vacuum loading and unloading lock chamber and the process chamber.

[0010] Preferably, the connection between the locking chamber channel and the equipment front-end module and the vacuum loading and unloading locking chamber is sealed to prevent external impurities from entering the locking chamber channel.

[0011] Preferably, the connection between the chamber channel and the vacuum loading and unloading lock chamber and the process chamber is sealed to prevent external impurities from entering the chamber channel.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] The utility model changes the structure of the vacuum loading and unloading locking chamber and sets a first wafer placement position and a second wafer placement position, so that two wafers can be stored in the chamber at the same time. The first wafer placement position and the second wafer placement position are respectively used to place uninspected wafers and inspected wafers. When the inspected wafer is taken out, the uninspected wafer can be directly added. Therefore, the number of atmospheric mechanical grippers required is reduced from two to one while the wafer transfer efficiency remains basically unchanged, thereby reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0015] In the figure: 1. Equipment front-end module; 2. Atmospheric mechanical gripper; 3. Locking chamber channel; 4. Vacuum loading and unloading locking chamber; 5. Chamber channel; 6. Process chamber; 7. First wafer placement position; 8. Second wafer placement position. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0017] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0018] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0019] See also Figure 1 The present invention provides a technical solution: a dual-wafer position loadlock device, comprising an equipment front-end module 1, a vacuum loading and unloading locking chamber 4, and a process chamber 6. The equipment front-end module 1 is provided with an atmospheric robot gripper 2, the vacuum loading and unloading locking chamber 4 is provided with a first wafer placement position 7 and a second wafer placement position 8, and the process chamber 6 is provided with a vacuum robot. The equipment front-end module EFEM refers to a wafer front-end transmission system that transfers single wafers to process and detection modules through a precision robot in a high-clean environment. EFEM belongs to semiconductor production equipment, of which the wafer loading system, wafer transport robot, and wafer aligner are the three most core components. The equipment front-end module is an indispensable key component of all semiconductor process / detection equipment.

[0020] The atmospheric robot gripper 2 and the vacuum robot gripper are respectively provided with one, the first wafer placement position 7 is used to place uninspected wafers, and the second wafer placement position 8 is used to place inspected wafers.

[0021] Furthermore, a mutually communicating locking chamber channel 3 is provided between the equipment front-end module 1 and the vacuum loading and unloading locking chamber 4 , and a mutually communicating chamber channel 5 is provided between the vacuum loading and unloading locking chamber 4 and the process chamber 6 .

[0022] The locking chamber channel 3 is provided to ensure communication between the equipment front-end module 1 and the vacuum loading and unloading locking chamber 4, and the wafer can be grasped or placed by the atmospheric mechanical gripper 2.

[0023] The chamber passage 5 is used to connect the vacuum loading and unloading lock chamber 4 and the process chamber 6 to ensure that the vacuum robot can grab or place the wafer.

[0024] Furthermore, a first valve is provided on the locking chamber channel 3, and the independence between the equipment front-end module 1 and the vacuum loading and unloading locking chamber 4 is ensured by setting the first valve. The connecting valve can be opened to realize the mutual communication between the equipment front-end module 1 and the vacuum loading and unloading locking chamber 4.

[0025] Furthermore, a second valve is provided on the chamber channel 5, which ensures the independence between the vacuum loading and unloading lock chamber 4 and the process chamber 6. The connecting valve can be opened to realize the mutual communication between the vacuum loading and unloading lock chamber 4 and the process chamber 6.

[0026] Furthermore, the connections between the locking chamber channel 3 and the equipment front-end module 1 and the vacuum loading and unloading locking chamber 4 are all sealed to prevent external impurities from entering the locking chamber channel 3.

[0027] Furthermore, the connections between the chamber channel 5 and the vacuum loading and unloading lock chamber 4 and the process chamber 6 are all sealed to prevent external impurities from entering the chamber channel 5.

[0028] The sealing connection between the locking chamber channel 3 and the cavity channel 5 can directly adopt the vacuum seal available on the market.

[0029] To sum up, when this device is in use, the atmospheric robotic gripper 2 grabs the uninspected wafer, then opens the locking chamber channel 3, places the uninspected wafer in the first wafer placement position 7, then closes the locking chamber channel 3, and then opens the chamber channel 5. The vacuum robotic gripper in the process chamber 6 can be used to grab the uninspected wafer into the vacuum chamber, and then close the chamber channel 5.

[0030] When the wafers in process chamber 6 are inspected, chamber access 5 is opened, and the completed wafers are transferred by the vacuum robot in process chamber 6 to the second wafer placement position 8 in vacuum load lock chamber 4. Chamber access 5 is then closed to isolate the two. This is followed by wafer transfer between the equipment front-end module 1 and the vacuum lock chamber.

[0031] First, the atmospheric robot gripper 2 has prepared a new uninspected wafer from the front-end module 1 of the equipment, waiting to be placed in the first wafer placement position 7. When the locking chamber channel 3 is opened, the atmospheric robot first transfers the uninspected wafer to the first wafer placement position 7, and then when the atmospheric robot is free, it takes out the inspected wafer transferred from the process chamber 6 in the second wafer placement position 8 and sends it back to the front-end module 1 of the equipment.

[0032] It is worth noting that the entire device is controlled by a master control button. Since the devices matched with the control button are commonly used devices and belong to existing mature technologies, their electrical connection relationships and specific circuit structures will not be described in detail here.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dual wafer position loadlock device, characterized by: The invention comprises a device front-end module (1), a vacuum loading and unloading locking chamber (4), and a process chamber (6); the device front-end module (1) is provided with an atmospheric mechanical gripper (2); the vacuum loading and unloading locking chamber (4) is provided with a first wafer placement position (7) and a second wafer placement position (8); and the process chamber (6) is provided with a vacuum mechanical gripper; A mutually communicating locking chamber channel (3) is provided between the equipment front-end module (1) and the vacuum loading and unloading locking chamber (4), and a mutually communicating chamber channel (5) is provided between the vacuum loading and unloading locking chamber (4) and the process chamber (6).

2. The dual wafer position loadlock device according to claim 1, wherein: The locking chamber channel (3) is provided with a first valve.

3. The dual wafer position loadlock device according to claim 1, wherein: A second valve is provided on the chamber channel (5).

4. The dual wafer position loadlock device according to claim 1, wherein: The connection points between the locking chamber channel (3), the equipment front-end module (1), and the vacuum loading and unloading locking chamber (4) are all sealed.

5. The dual wafer position loadlock device according to claim 1, wherein: The connection points between the chamber channel (5), the vacuum loading and unloading lock chamber (4), and the process chamber (6) are all sealed.

Images