Floating pressure head structure and sintering equipment

Abstract

The utility model belongs to the technical field of sintering equipment, and particularly relates to a floating pressure head structure and sintering equipment. The floating pressure head structure comprises a pressure head assembly which comprises a positioning seat fixedly arranged relative to a target object, a pressure head located between the positioning seat and the target object and arranged in a sliding mode, and a force transmission mechanism connected with the positioning seat, each force transmission mechanism comprises a pressing rod with one end slidably connected with the positioning seat, a first force transmission part connected with the other end of the pressing rod and a second force transmission part connected with the pressing heads, the first force transmission part and the second force transmission part abut against each other in a point-to-surface mode, the multiple pressing heads are arranged at intervals, and any pressing head is at least correspondingly provided with one force transmission mechanism; and the pressurizing assembly is connected with the positioning seat and is used for driving each pressing rod to move towards the target object, so that each pressing rod drives each pressing head to press different positions of the target object. The pressure head can float within a certain range so as to adapt to height differences of different semiconductor devices, and the stability and the consistency of contact between the pressure head and each semiconductor device are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of sintering equipment, and in particular relates to a floating pressure head structure and sintering equipment. Background Art

[0002] The silver sintering process is an advanced material connection and packaging technology that is widely used in electronic devices and semiconductor devices. The process uses nano-scale silver particles to sinter at a certain temperature and pressure to form a highly conductive and thermally conductive bonding interface. The silver sintering process is based on the formation of a continuous metal connection layer by sintering nano-silver particles at a relatively low temperature. Due to their extremely high surface area and high surface energy, nano-silver particles can be sintered at a temperature of 200-300°C. This property makes silver sintering an ideal choice for high-temperature sensitive devices and applications. Silver sintered materials have excellent electrical and thermal conductivity, which is unmatched by traditional solders (such as tin solder). Since nano-silver particles can be sintered at lower temperatures, this reduces thermal damage to devices and substrates, making them suitable for temperature-sensitive semiconductor devices.

[0003] However, during the silver sintering process, the semiconductor devices are placed on the material tray. In order to improve the connection effect and sintering effect, during the sintering process, the lower surface of the pressure head is pressed against each semiconductor device, thereby providing a downward pressure on each semiconductor device. However, there is a height difference between each semiconductor device, which will cause different pressures on each semiconductor device. Some semiconductor devices may not be properly pressurized, and some may be under too much pressure, resulting in the sintering quality of the semiconductor device not meeting the requirements. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a floating pressure head structure, aiming to solve the problem of how to improve the sintering quality of semiconductor devices.

[0005] To achieve the above objectives, the technical solution adopted in this application is:

[0006] In a first aspect, a floating pressure head structure is provided for applying pressure to a target object, wherein the target objects are spaced apart from each other, and the floating pressure head structure comprises:

[0007] A pressure head assembly includes a positioning seat fixedly arranged relative to the target object, a pressure head slidably arranged between the positioning seat and the target object, and a force transmission mechanism connected to the positioning seat, the force transmission mechanism including a pressure rod with one end slidably connected to the positioning seat, a first force transmission portion connected to the other end of the pressure rod, and a second force transmission portion connected to the pressure head, the first force transmission portion and the second force transmission portion being in point-to-surface contact, a plurality of the pressure heads being arranged at intervals, and at least one force transmission mechanism corresponding to each pressure head; and

[0008] The pressing assembly is connected to the positioning seat and is used to drive each of the pressing rods to move toward the target object, so that each of the pressing rods drives each of the pressing heads to press different positions of the target object.

[0009] In one embodiment, the abutting surface of the first force transmission part is a plane and the abutting surface of the second force transmission part is a convex arc surface, or the abutting surface of the second force transmission part is a plane and the abutting surface of the first force transmission part is a convex arc surface.

[0010] In one embodiment, the pressure head is provided with a pressure hole, one end of the pressure rod is slidably disposed in the pressure hole, the second force transmission portion is located at the bottom of the pressure hole, and the first force transmission portion is located in the pressure hole and connected to the pressure rod.

[0011] In one embodiment, the force transmission mechanism also includes a transverse compression spring located in the pressure hole, and the two ends of the transverse compression spring respectively abut the first force transmission part and the hole wall of the pressure hole. The transverse compression springs are arranged in pairs, and the two transverse compression springs in the same pair are symmetrical about the pressure rod.

[0012] In one embodiment, a limiting hole is formed in the first force transmission portion at a position corresponding to the transverse compression spring, and a portion of the transverse compression spring is located in the limiting hole.

[0013] In one embodiment, the force transmission mechanism also includes a longitudinal compression spring which is externally mounted on the pressure rod and located in the pressure hole, one end of the longitudinal compression spring abuts against the first force transmission part, and the other end of the longitudinal compression spring is fixedly arranged to keep the first force transmission part and the second force transmission part in abutment.

[0014] In one embodiment, any one of the pressure heads is provided with a plurality of the force transmission mechanisms, and the force transmission mechanisms are arranged at intervals.

[0015] In one embodiment, the pressurizing assembly includes a cylinder body and a plurality of piston rods connected to the cylinder body, the cylinder body has a plurality of piston chambers, each piston rod is respectively arranged in each piston chamber, and each piston rod is respectively used to drive each pressure rod.

[0016] In one embodiment, a plurality of pressurizing assemblies are stacked along the axial direction of the pressure rod, and the multiple piston rods on any cylinder body are respectively transmission-connected with the multiple piston rods on another adjacent cylinder body.

[0017] In a second aspect, a sintering device is provided, which includes the floating pressure head structure.

[0018] The beneficial effect of this application is that the floating pressure head structure, through the cooperation of the pressure head assembly and the pressure assembly, can achieve uniform downward pressure on multiple semiconductor devices. Because the first force transmission part and the second force transmission part are in point-to-surface contact, the pressure head can float within a certain range when the pressure rod drives the pressure head to press the material plate, thereby adapting to the height differences between different semiconductor devices, improving the stability and consistency of the contact between the pressure head and each semiconductor device, ensuring that each target object is evenly stressed, and thus improving the subsequent sintering quality and efficiency of the semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 This is a schematic diagram of the three-dimensional assembly of the floating pressure head structure and the heating structure provided in an embodiment of the present application;

[0021] Figure 2 yes Figure 1 A partial explosion diagram of the floating pressure head structure;

[0022] Figure 3 yes Figure 2 A partial explosion diagram of the power transmission mechanism;

[0023] Figure 4 yes Figure 2 Schematic cross-sectional view of a pressure head assembly of a floating pressure head structure.

[0024] Among them, the reference numerals in the figures are:

[0025] 60. Floating pressure head structure; 61. Pressurizing assembly; 70. Heating structure; 62. Pressure head assembly; 63. Force transmission mechanism; 64. Positioning seat; 65. Pressure head; 68. Heating rod; 641. Sliding hole; 67. Thermal insulation column; 631. Pressure rod; 632. First force transmission unit; 633. Second force transmission unit; 634. Transverse compression spring; 635. Longitudinal compression spring; 66. Pressure cover plate; 651. Pressure hole; 611. Cylinder body; 612. Piston rod; 613. Piston chamber; DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0027] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of description and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0028] See also Figures 1 to 3 The present invention provides a floating pressure head structure 60 and a sintering apparatus having the same. The floating pressure head structure 60 is used to apply pressure to a target object. Multiple targets are spaced apart. In this embodiment, the targets are semiconductor devices to be sintered. Multiple semiconductor devices are arranged on a tray. The floating pressure head structure 60 can vertically press each semiconductor device downward to improve the sintering quality of each semiconductor device.

[0029] See also Figures 2 to 4 The floating pressure head structure 60 includes a pressure head assembly 62 and a pressurizing assembly 61 .

[0030] See also Figures 2 to 4 The pressure head assembly 62 includes a positioning seat 64 fixed relative to the target object, a pressure head 65 slidably arranged between the positioning seat 64 and the target object, and a force transmission mechanism 63 connected to the positioning seat 64. The positioning seat 64 is located above the material tray, and the pressure head 65 is located below the positioning seat 64. The force transmission mechanism 63 includes a pressure rod 631 with one end slidably connected to the positioning seat 64, a first force transmission portion 632 connected to the other end of the pressure rod 631, and a second force transmission portion 633 connected to the pressure head 65. The first force transmission portion 632 and the second force transmission portion 633 are in point-to-surface contact with each other. Multiple pressure heads 65 are arranged at intervals, and each pressure head 65 is provided with at least one corresponding force transmission mechanism 63. In this embodiment, there are six pressure heads 65. Each force transmission mechanism 63 can transmit power to each pressure head 65 respectively, so that each pressure head 65 can apply pressure to different positions on the material tray.

[0031] The pressure assembly 61 is connected to the positioning base 64 and is used to drive each pressure rod 631 toward the target object, so that each pressure rod 631 drives each pressure head 65 to press the target object at different locations. It can be understood that because the first force transmission portion 632 and the second force transmission portion 633 are in point-to-surface contact, the pressing surface of the pressure head 65 can float within a certain range relative to the horizontal plane, thereby evenly applying pressure to each semiconductor device.

[0032] See also Figures 2 to 4 The floating ram structure 60 provided in the embodiment of the present application, through the cooperation of the ram assembly 62 and the pressure assembly 61, can achieve uniform downward pressure on multiple semiconductor devices. Because the first force transmission portion 632 and the second force transmission portion 633 are in point-to-surface contact, the ram 65 can float within a certain range when the pressure rod 631 drives the ram 65 to press the material plate, thereby adapting to the height differences between different semiconductor devices. This improves the stability and consistency of the contact between the ram 65 and each semiconductor device, ensures that each target object is subjected to uniform force, and thus improves the quality and efficiency of the subsequent sintering of semiconductor devices.

[0033] Optionally, a plurality of sliding holes 641 are defined on the positioning seat 64 , and the upper ends of the pressing rods 631 are slidably disposed in the sliding holes 641 .

[0034] See also Figures 2 to 4 In some embodiments, the abutting surface of the first force transmission portion 632 is a plane and the abutting surface of the second force transmission portion 633 is a convex arc surface, which may be a spherical surface.

[0035] See also Figures 2 to 4 In some embodiments, the abutting surface of the second force transmission portion 633 is a plane and the abutting surface of the first force transmission portion 632 is a convex arc surface, which may be a spherical surface.

[0036] Optionally, by setting the abutting surfaces of the first force transmission part 632 and the second force transmission part 633 to be a plane and a convex arc surface respectively, or the abutting surfaces of the second force transmission part 633 and the first force transmission part 632 to be a plane and a convex arc surface respectively, the pressure head 65 can float within a certain range to adapt to the height difference of different semiconductor devices, and can also effectively reduce the friction between the first force transmission part 632 and the second force transmission part 633, thereby ensuring the smoothness and stability of force transmission.

[0037] See also Figures 2 to 4 In some embodiments, the pressure head 65 is provided with a pressure hole 651, one end of the pressure rod 631 is slidably set in the pressure hole 651, the second force transmission part 633 is located at the bottom of the pressure hole 651, and the first force transmission part 632 is located in the pressure hole 651 and connected to the pressure rod 631.

[0038] Optionally, a pressure hole 651 is provided on the pressure head 65, and one end of the pressure rod 631 is slidably disposed within the pressure hole 651, thereby ensuring a stable connection between the pressure rod 631 and the pressure head 65. The second force transmission portion 633 is located at the bottom of the pressure hole 651, making force transmission more direct and effective, improving force transmission efficiency, reducing losses in the force transmission path, and ensuring that the pressure applied by the pressure head 65 to the semiconductor device is uniform.

[0039] See also Figures 2 to 4 In some embodiments, the force transmission mechanism 63 further includes a transverse compression spring 634 located within the pressure hole 651. The ends of the transverse compression spring 634 abut the first force transmission portion 632 and the wall of the pressure hole 651, respectively. The transverse compression springs 634 are provided in pairs, and the two transverse compression springs 634 in the same pair are symmetrical about the pressure rod 631. In the present application, two pairs of transverse compression springs 634 are provided, with the four compression springs arranged in equal arcs around the circumference of the pressure rod 631.

[0040] Optionally, by providing a transverse compression spring 634 in the force transmission mechanism 63 and positioning it within the pressure hole 651, additional support and cushioning can be provided between the pressure head 65 and the pressure hole 651. The paired transverse compression springs 634 are symmetrically arranged about the pressure rod 631, ensuring that the pressure head 65 maintains a stable posture even when subjected to uneven pressure, improving the stability and accuracy of the downward pressure process and effectively preventing the pressure head 65 from deflecting or tilting due to lateral forces.

[0041] See also Figures 2 to 4 In some embodiments, a limiting hole is opened in the first force transmission portion 632 corresponding to the position of the transverse compression spring 634, and a portion of the transverse compression spring 634 is located in the limiting hole.

[0042] Optionally, by providing a limiting hole on the first force transmission part 632 and making the transverse compression spring 634 partially located in the limiting hole, the transverse displacement of the transverse compression spring 634 can be limited, thereby ensuring the stability of the force transmission mechanism 63 and ensuring that the transverse compression spring 634 will not deviate from its set position during operation, thereby improving the reliability and service life of the force transmission mechanism 63.

[0043] See also Figures 2 to 4 In some embodiments, the force transmission mechanism 63 further includes a longitudinal compression spring 635 disposed over the pressure rod 631 and positioned within the pressure hole. One end of the longitudinal compression spring 635 abuts the first force transmission portion 632, while the other end of the longitudinal compression spring 635 is fixedly positioned to maintain abutment between the first force transmission portion 632 and the second force transmission portion 633. A pressure cover plate 66 is disposed at the opening of the pressure hole 651, with both ends of the longitudinal compression spring 635 abutting the pressure cover plate 66 and the first force transmission portion 632, respectively.

[0044] Optionally, additional longitudinal support can be provided by providing a longitudinal compression spring 635 disposed on the compression rod 631 in the force transmission mechanism 63. One end of the longitudinal compression spring 635 abuts the first force transmission portion 632, and the other end abuts the pressure cover 66, ensuring that the first force transmission portion 632 and the second force transmission portion 633 always maintain abutment.

[0045] See also Figures 2 to 4 In some embodiments, a plurality of force transmission mechanisms 63 are correspondingly provided for each pressing head 65, and the force transmission mechanisms 63 are arranged at intervals. In this embodiment, four force transmission mechanisms 63 are arranged at intervals for each pressing head 65.

[0046] Optionally, by providing multiple force transmission mechanisms 63 on any pressure head 65 and arranging them at intervals, multi-point support and uniform force transmission of the pressure head 65 can be achieved, ensuring that the pressure head 65 can remain stable when subjected to pressure in different directions, effectively avoiding tilting and deviation of the pressure head 65, and improving the uniformity and accuracy of the pressing process.

[0047] See also Figures 2 to 4 In some embodiments, the pressurizing assembly 61 includes a cylinder body 611 and multiple piston rods 612 connected to the cylinder body 611. The cylinder body 611 defines multiple piston chambers 613. Each piston rod 612 is disposed within a respective piston chamber 613, and each piston rod 612 is used to drive a respective pressure rod 631. Alternatively, the pressurizing assembly 61 may be a hydraulic cylinder. High-pressure oil is injected into the piston chamber 613, thereby pushing the piston rod 612 to move. The movement of the piston rod 612 drives the corresponding pressure rod 631 to move.

[0048] Optionally, multiple piston rods 612 can be used to independently drive multiple pressure rods 631, thereby improving the flexibility and accuracy of the pressurization process.

[0049] See also Figures 2 to 4 In some embodiments, multiple pressurizing assemblies 61 are stacked along the axial direction of the pressure rod 631 , and the multiple piston rods 612 on any cylinder body 611 are respectively connected to the multiple piston rods 612 on another adjacent cylinder body 611 in a transmission manner.

[0050] It can be understood that in this embodiment, three pressurizing assemblies 61 are stacked in the vertical direction, three cylinder bodies 611 are stacked in the vertical direction, and the piston rods 612 of each layer are connected in sequence in the vertical direction, that is, any pressure rod 631 is driven by three piston rods 612, thereby providing greater driving force to the pressure rod 631.

[0051] Optionally, by stacking multiple pressurizing assemblies 61 along the axial direction of the pressure rod 631, multiple piston rods 612 on any cylinder body 611 are transmission-connected with multiple piston rods 612 on adjacent cylinder bodies 611, thereby achieving multi-layer pressurization.

[0052] See also Figures 2 to 4 Optionally, a heating hole is provided on the positioning seat 64, and a heating rod 68 is provided in the heating hole, so that the pressing head 65 can heat the semiconductor device at the same time when pressing the semiconductor device.

[0053] See also Figures 2 to 4 Optionally, a heat-insulating column 67 is provided between the bottom piston rod 612 and the pressure rod 631 to prevent heat from being transferred to the pressurizing assembly 61 .

[0054] The present invention also proposes a sintering device, which includes a floating pressure head structure 60. The specific structure of the floating pressure head structure 60 refers to the above embodiment. Since the present sintering device adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0055] See also Figure 1 In some embodiments, the sintering equipment further includes a heating structure 70, which is located below the floating pressure head structure 60. The material tray is placed between the floating pressure head structure 60 and the heating structure 70. The heating structure 70 is used to heat the semiconductor devices on the material tray for subsequent sintering.

[0056] By integrating the floating pressure head structure 60 into the sintering equipment, uniform pressing of the semiconductor devices on the tray and an integrated operation of the sintering process can be achieved.

[0057] The above are merely optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included within the scope of the claims of the present application.

Claims

1. A floating pressure head structure for applying pressure to a target object, wherein the target objects are spaced apart, characterized in that: The floating pressure head structure includes: A pressure head assembly includes a positioning seat fixedly arranged relative to the target object, a pressure head slidably arranged between the positioning seat and the target object, and a force transmission mechanism connected to the positioning seat, the force transmission mechanism including a pressure rod with one end slidably connected to the positioning seat, a first force transmission portion connected to the other end of the pressure rod, and a second force transmission portion connected to the pressure head, the first force transmission portion and the second force transmission portion being in point-to-surface contact, a plurality of the pressure heads being arranged at intervals, and at least one force transmission mechanism corresponding to each pressure head; and The pressing assembly is connected to the positioning seat and is used to drive each of the pressing rods to move toward the target object, so that each of the pressing rods drives each of the pressing heads to press different positions of the target object.

2. The floating pressure head structure according to claim 1, wherein: The abutting surface of the first force transmission part is a plane and the abutting surface of the second force transmission part is a convex arc surface, or the abutting surface of the second force transmission part is a plane and the abutting surface of the first force transmission part is a convex arc surface.

3. The floating pressure head structure according to claim 1, wherein: The pressure head is provided with a pressure hole, one end of the pressure rod is slidably arranged in the pressure hole, the second force transmission part is located at the bottom of the pressure hole, and the first force transmission part is located in the pressure hole and connected to the pressure rod.

4. The floating pressure head structure according to claim 3, wherein: The force transmission mechanism also includes a transverse compression spring located in the pressure hole, the two ends of the transverse compression spring respectively abutting the first force transmission part and the hole wall of the pressure hole, the transverse compression springs are arranged in pairs, and the two transverse compression springs in the same pair are symmetrical about the pressure rod.

5. The floating pressure head structure according to claim 4, wherein: The first force transmission portion is provided with a limiting hole at a position corresponding to the transverse compression spring, and a portion of the transverse compression spring is located in the limiting hole.

6. The floating pressure head structure according to claim 3, wherein: The force transmission mechanism also includes a longitudinal compression spring which is sleeved on the pressure rod and located in the pressure hole. One end of the longitudinal compression spring abuts the first force transmission part, and the other end of the longitudinal compression spring is fixedly arranged to keep the first force transmission part and the second force transmission part in abutment.

7. The floating pressure head structure according to any one of claims 1 to 6, characterized in that: Any of the pressure heads is correspondingly provided with a plurality of the force transmission mechanisms, and the force transmission mechanisms are arranged at intervals.

8. The floating pressure head structure according to any one of claims 1 to 6, characterized in that: The pressurizing assembly includes a cylinder body and a plurality of piston rods connected to the cylinder body. The cylinder body is provided with a plurality of piston cavities. Each of the piston rods is respectively arranged in each of the piston cavities, and each of the piston rods is respectively used to drive each of the pressure rods.

9. The floating pressure head structure according to claim 8, wherein: The pressurizing components are stacked in plurality along the axial direction of the pressure rod, and the multiple piston rods on any cylinder body are respectively connected in transmission with the multiple piston rods on another adjacent cylinder body.

10. A sintering device, characterized in that: The floating pressure head structure comprises the floating pressure head structure as described in any one of claims 1 to 9.

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