Electronic package and bearing structure thereof

Abstract

An electronic package and a bearing structure thereof are mainly provided with a filling material between two pairs of corresponding pads to support an electronic component, the filling material comprises a first section and a second section, the first section is connected with the pads, the second section intersects with the first section, and the second section is spaced from the pads by a distance. Therefore, the problem of electrical bridging caused when the electronic component is electrically connected to the welding pad through the soldering tin material is avoided.

Description

Technical Field

[0001] The present application relates to a semiconductor packaging structure, and more particularly to an electronic packaging component and a supporting structure thereof. Background Art

[0002] With the advancement of integrated circuit manufacturing technology, the design and production of electronic packages continue to develop towards miniaturization. Due to their larger scale and higher integration of electronic circuits, the functions of the application products are also more complete.

[0003] In this context, traditional electronic packages assembled on circuit boards using through-hole technology (THT) cannot be further reduced in size, thus occupying a large amount of space on the circuit board. Furthermore, THT requires drilling holes in the circuit board for each pin of the electronic package. Consequently, the pins of this type of electronic package actually occupy space on opposite sides of the circuit board, and the solder joints connecting the electronic package to the circuit board are also larger. Consequently, surface mount technology (SMT) has been widely adopted in the assembly process of current electronic devices to assemble electronic packages on circuit boards.

[0004] Electronic packages using SMT do not require drilling on the circuit board because each electrode terminal (or pin) is soldered to the same surface of the circuit board. In other words, using SMT allows for the simultaneous assembly of different electronic packages on opposite sides of the circuit board, significantly improving the space utilization of the circuit board. In addition, because electronic packages using SMT are smaller in size, they can be placed more densely on the circuit board compared to traditional THT electronic packages. This meets the requirements of electronic devices for being thin, light, short, multifunctional, high-speed, and high-frequency. Therefore, SMT assembly has become the mainstream assembly method.

[0005] Figure 1A and Figure 1B The figure shows a cross-sectional and partial top plan view of an electronic package 1 assembled using conventional SMT. The figure primarily provides a substrate body 10 having a surface covered with a solder mask 13. The substrate body 10 has a plurality of solder pads 100 exposed through openings 130 in the solder mask 13. Using screen printing technology, solder paste 12 is formed on the solder pads 100 exposed from the solder mask 13. Subsequently, the electrode terminals 110 of a passive component 11 are bonded to the solder paste 12 and reflowed, electrically connecting the passive component 11 to the solder pads 100 of the substrate body 10 via the electrode terminals 110. Subsequently, an adhesive 14 is filled into the space below the passive component 11 to secure the passive component 11 to the substrate body 10.

[0006] However, in the conventional electronic package 1, the glue injection machine is limited by the passive component 11, making it difficult to fill the space below the passive component 11 with the glue material 14 during the glue injection process. As a result, bubbles (voids) P are easily generated, or the solder paste 12 overflows due to the inability to fill the space below, resulting in solder bridging problems. Even if the glue material 14 fills the space below the passive component 11, the solder paste 12 will still overflow along the contact edge of the glue material 14 and the passive component 11, resulting in solder bridging.

[0007] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Utility Model Content

[0008] In view of the various deficiencies of the above-mentioned prior art, the present application provides a supporting structure, including: a substrate body, which has a plurality of welding pads; and an insulating protective layer, which is arranged on the substrate body and has a plurality of openings corresponding to the plurality of welding pads exposed and a groove connecting the plurality of openings, wherein the groove includes a first groove connecting two of the openings, and a second groove intersecting with the first groove, and the second groove is separated from the welding pad by a distance.

[0009] The present application also provides an electronic package, comprising: a supporting structure, which includes a substrate body and an insulating protective layer configured on the substrate body, the substrate body having a plurality of solder pads, the insulating protective layer having a plurality of openings corresponding to the plurality of solder pads exposed and a groove connecting the plurality of openings, wherein the groove includes a first groove connecting two of the openings, and a second groove intersecting with the first groove, and the second groove is spaced a distance from the solder pad; a filling material is provided in the groove and includes a first section corresponding to the first groove and a second section corresponding to the second groove, and the second section maintains a distance from the solder pad; and an electronic component, which is provided on the filling material and electrically connects the two solder pads through a solder material.

[0010] In the aforementioned electronic package and supporting structure, the slot is cross-shaped and includes the first slot and the second slot intersecting with each other.

[0011] In the aforementioned electronic package and supporting structure, the slot is in a string shape and includes two intersecting first slots and the second slot.

[0012] In the aforementioned electronic package and supporting structure, a portion of the insulating protection layer is spaced between the second slot and the welding pad.

[0013] In the aforementioned electronic package and supporting structure, the plurality of solder pads are arranged in pairs in a row, and the slots between the two pairs of solder pads are also connected to each other and arranged in a row.

[0014] In the aforementioned electronic package and supporting structure, the soldering pads are in a convex shape, and the convex parts of the two pairs of soldering pads are opposite to each other.

[0015] In the aforementioned electronic package and supporting structure, the filling material contacts and combines the electronic component and the substrate body.

[0016] In the aforementioned electronic package and supporting structure, the electronic component is arranged on the two communicating openings and the first slot.

[0017] In the aforementioned electronic package and supporting structure, the filling material is in a cross shape or a string shape.

[0018] In the aforementioned electronic package and supporting structure, the first section of the filling material corresponds to the first groove and a portion of the opening.

[0019] In the aforementioned electronic package and supporting structure, a portion of the insulating protective layer is retained between the bottom of the filling material and the welding pad.

[0020] In the aforementioned electronic package and supporting structure, the plurality of solder pads are arranged in pairs in a row, and the filling material between the two pairs of solder pads is also connected to each other and arranged in a row.

[0021] From the above, it can be seen that in the electronic package and its supporting structure of the present application, the electronic components are mainly supported by providing a filling material between two pairs of corresponding solder pads. At the same time, the filling material includes a first section connecting the solder pads and a second section intersecting with the first section, and the second section is separated from the solder pads by a distance to avoid the solder material bridging along the edge of the electronic component or the filling material when the electronic component is electrically connected to the solder pad through the solder material, causing abnormalities or poor appearance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1A It is a cross-sectional schematic diagram of an existing electronic package.

[0023] Figure 1B for Figure 1A A partial top view plan diagram of .

[0024] Figure 2A This is a cross-sectional schematic diagram of the electronic package and the supporting structure of the present application.

[0025] Figure 2B for Figure 2A A partial top view plan diagram of .

[0026] Figure 3 It is a partial top plan view of a second embodiment of the electronic package of the present application.

[0027] Figure 4It is a partial top plan view of a third embodiment of the electronic package of the present application.

[0028] Figure 5 It is a partial top plan view of a fourth embodiment of the electronic package of the present application.

[0029] Main component symbols

[0030] 1,2,3,4,5 Electronic packaging

[0031] 10,20 Base body

[0032] 100,200,400 solder pads

[0033] 11 Passive Components

[0034] 110 electrode end

[0035] 12 Solder paste

[0036] 13 Solder mask

[0037] 130,230 openings

[0038] 14 Rubber

[0039] 2a Load-bearing structure

[0040] 21 Electronic components

[0041] 210a first electrode terminal

[0042] 210b second electrode terminal

[0043] 22 Solder materials

[0044] 23 Insulation protective layer

[0045] 231,431 slots

[0046] 231a, 431a First slot

[0047] 231b,431b Second slot

[0048] 24,44 Filling material

[0049] 24a,44a Section 1

[0050] 24b, 44b Second section

[0051] A, B, C, D, E, F dimensions

[0052] P bubbles. DETAILED DESCRIPTION

[0053] The following describes the implementation of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0054] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.

[0055] Figure 2A and Figure 2B The electronic package 2 and the supporting structure 2a of the present application are schematic cross-sectional views and partial top views. As shown in the figure, the electronic package 2 includes: a supporting structure 2a, an electronic component 21 disposed on the supporting structure 2a, and a filler material 24 disposed between the electronic component 21 and the supporting structure 2a.

[0056] The supporting structure 2a includes a substrate body 20, which may be, for example, a packaging substrate having a core layer and a substrate body, a packaging substrate with a coreless substrate body, a silicon interposer (TSI) with conductive through-silicon vias (TSV), or other board types, which includes at least one insulating layer and at least one circuit layer combined with the insulating layer, such as at least one fan-out redistribution layer (RDL), and the outermost circuit layer has multiple solder pads 200.

[0057] In this embodiment, the supporting structure 2a also includes an insulating protective layer 23 (for example, a solder-resistant material such as green paint or ink) configured on the substrate body 20, which has a plurality of openings 230 and a groove 231 connecting two of the openings 230, so that each of the solder pads 200 is correspondingly exposed in each of the openings 230, wherein the two connected openings 230 and the groove 231 serve as an opening area.

[0058] Furthermore, the slot 231 is approximately cross-shaped, and includes a first slot 231a (e.g., horizontally) and a second slot 231b (e.g., vertically) perpendicular to each other, wherein the first horizontal slot 231a connects the two openings 230, so that the electronic component 21 is disposed on the two openings 230 and the first slot 231a, and the second vertical slot 231b intersects with the first slot 231a to form a junction area, and the second vertical slot 231b and the opening 230 (solder pad 200) are separated by a dimension D and do not contact each other, for example, at Figure 2A As shown in FIG, a portion of the insulating protection layer 23 is still separated from the slot 231 (the second slot 231 b ) and the pad 200 .

[0059] In this embodiment, the solder pad 200 exposed through the opening 230 is rectangular, with adjacent sides measured A and B. The adjacent sides of the second slot 231b (corresponding to the lengths A and B of the solder pad 200) are measured F and C. The adjacent sides of the first slot 231a (corresponding to the lengths A and B of the solder pad 200) are measured E and C + 2D. Dimension B is approximately 0.73 of Dimension A, Dimension C is approximately 0.4 of Dimension A, and Dimension D is approximately 0.08 to 0.17 of Dimension A. Dimension E can be designed based on actual needs but is smaller than Dimension A. Dimension F can be designed based on actual needs but is larger than Dimension E.

[0060] The filler material 24 is disposed within the slot 231 and a portion of the opening 230, contacting and bonding the substrate body 20 and a portion of the solder pad 200, such that a portion of the solder pad 200 is exposed to the filler material 24. Specifically, the filler material 24 has a shape similar to that of the opening and is slightly smaller than the opening, exposing a portion of the solder pad 200 to allow the electronic component 21 to electrically connect to the solder pad 200.

[0061] In this embodiment, the top view shape of the filling material 24 is similar to the shape of the opening area (cross shape, such as Figure 2B As shown in FIG, the first section 24a includes a first section 24a (e.g., in a transverse direction) corresponding to the first slot 231a and a portion of the opening 230, and a second section 24b (e.g., in a longitudinal direction) corresponding to the second slot 231b. The second section 24b of the filling material 24 and the solder pad 200 still maintain a spacing dimension D, so that the longitudinal section of the filling material 24 is T-shaped, and a portion of the insulating protective layer 23 is still retained between the bottom thereof and the solder pad 200.

[0062] The filling material 24 may be formed of an insulating material such as polyimide (PI), dry film, prepreg (PP), bismaleimide triazine (BT), or an encapsulating colloid or molding compound such as epoxy, but is not limited thereto.

[0063] The electronic component 21 is disposed on the filling material 24, such that the filling material 24 contacts and bonds the electronic component 21 to the substrate body 20. The electronic component 21 has a first electrode terminal 210a and a second electrode terminal 210b, and the first electrode terminal 210a and the second electrode terminal 210b are respectively bonded to the corresponding bonding pads 200. In this embodiment, the electronic component 21 is a passive component, such as a resistor, capacitor, or inductor.

[0064] Furthermore, the first electrode end 210a and the second electrode end 210b are connected to the corresponding pads 200 through the solder material 22. Therefore, during assembly, after the solder material 22 is reflowed, the electronic component 21 can be electrically connected to the pads 200 through its first electrode end 210a and the second electrode end 210b.

[0065] By virtue of the aforementioned design in which the second slot 231b in the longitudinal direction of the slot 231 is spaced apart from the opening 230 (solder pad 200) by a dimension D and does not contact each other (i.e., a portion of the insulating protective layer 23 is still retained between the second slot 231b and the solder pad 200), when the first electrode end 210a and the second electrode end 210b of the electronic component 21 are bonded to the corresponding solder pad 200 through the solder material 22, it is possible to avoid problems such as the solder material 22 bridging along the edge of the electronic component 21 or the filling material 24, causing abnormalities or poor appearance.

[0066] See also Figure 3 This is a partial top plan view of a second embodiment of the electronic package 3 of the present application. This embodiment is substantially similar to the previous embodiment, with the primary difference being that a plurality of solder pads 200 (roughly rectangular) are provided on the support structure. The solder pads 200 are arranged in pairs in a row, and the filler material 24 (or slots 231) between the pairs of solder pads 200 are also interconnected and arranged in a row.

[0067] Each of the filling materials 24 (slightly cross-shaped and including intersecting first and second sections 24a and 24b) located between the two pads 200 has its second section 24b connected to the second section 24b of the adjacent filling material 24, wherein the second section 24b maintains a gap with the pad 200.

[0068] See also Figure 4 This is a partial top plan view of a third embodiment of the electronic package 4 of the present application. This embodiment is substantially the same as the previous embodiment, with the main difference being that the solder pads 400 on the support structure, which are exposed from the insulating protective layer, are slightly convex in shape, and the convex portions of the two pairs of solder pads 400 face each other.

[0069] The slot 431 formed between the two paired solder pads 400 is roughly in the shape of a string and includes two intersecting first slots 431a and a second slot 431b. The filler material 44 may correspond to the shape of the slot 431. Specifically, the filler material 44 includes two first sections 44a connected to the paired solder pads 400 and a second section 44b intersecting the two first sections 44a. The second section 44b maintains a distance D from the solder pads 400.

[0070] See also Figure 5 This is a partial top plan view of a fourth embodiment of the electronic package 5 of the present application. This embodiment is substantially similar to the previous embodiments, with the primary difference being that a plurality of solder pads 400 (slightly in the shape of a convex triangle) are provided on the support structure. These solder pads 400 are arranged in pairs in a row, and the filler material 44 (slightly in the shape of a string) between the pairs of solder pads 400 is also interconnected and arranged in a row.

[0071] The second section 44 b of each of the filling materials 44 located between the two bonding pads 400 is connected to the second section 44 b of the adjacent filling material 44 , wherein a gap is maintained between the second section 44 b and the bonding pad 400 .

[0072] To summarize, the electronic package and its supporting structure of the present application mainly support electronic components by providing a filling material between two pairs of corresponding solder pads. At the same time, the filling material includes a first section connected to the solder pad and a second section intersecting with the first section, and the second section is separated from the solder pad by a distance to avoid the solder material bridging along the edge of the electronic component or the filling material when the electronic component is electrically connected to the solder pad through the solder material, causing abnormalities or poor appearance.

[0073] The above embodiments are intended to illustrate the principles and effects of this application and are not intended to limit this application. Those skilled in the art may modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be as set forth in the claims.

Claims

1. A bearing structure, characterized in that: include: a substrate body having a plurality of solder pads; as well as An insulating protective layer is configured on the substrate body and has a plurality of openings corresponding to the plurality of solder pads exposed and a groove connecting the plurality of openings, wherein the groove includes a first groove connecting two of the openings and a second groove intersecting with the first groove, and the second groove is separated from the solder pad by a distance.

2. The bearing structure according to claim 1, characterized in that: The slot is cross-shaped and includes the first slot and the second slot intersecting with each other.

3. The bearing structure according to claim 1, characterized in that: The slot is in a string shape and includes two intersecting first slots and the second slot.

4. The bearing structure according to claim 1, characterized in that: A portion of the insulating protection layer is spaced between the second slot and the welding pad.

5. The bearing structure according to claim 1, characterized in that: The plurality of welding pads are arranged in pairs in a row, and the slots between the two pairs of welding pads are also connected to each other and arranged in a row.

6. The bearing structure according to claim 1, characterized in that: The welding pad is in a convex shape, and the outer convex parts of the two pairs of welding pads are opposite to each other.

7. An electronic package, characterized in that: include: A supporting structure comprising a substrate body and an insulating protective layer disposed on the substrate body, the substrate body having a plurality of solder pads, the insulating protective layer having a plurality of openings corresponding to the plurality of solder pads exposed therefrom and a slot connecting the plurality of openings, wherein the slot comprises a first slot connecting two of the openings and a second slot intersecting the first slot, and the second slot is spaced a distance from the solder pads; A filling material is disposed in the slot and includes a first section corresponding to the first slot and a second section corresponding to the second slot, wherein the second section maintains a gap with the pad; and The electronic component is arranged on the filling material and electrically connects the two pads via solder material.

8. The electronic package according to claim 7, wherein: The filling material contacts and bonds the electronic component and the substrate body.

9. The electronic package according to claim 7, wherein: The electronic component is arranged on the two communicating openings and the first slot.

10. The electronic package according to claim 7, wherein: The filling material is in a cross shape or a string shape.

11. The electronic package according to claim 7, wherein: The first section of the filling material corresponds to the first groove and a portion of the opening.

12. The electronic package according to claim 7, wherein: A portion of the insulating protection layer is retained between the bottom of the filling material and the welding pad.

13. The electronic package according to claim 7, wherein: The plurality of welding pads are arranged in pairs in a row, and the filling material between the two pairs of welding pads is also connected to each other and arranged in a row.

14. The electronic package according to claim 7, wherein: The slot is cross-shaped and includes the first slot and the second slot intersecting with each other.

15. The electronic package according to claim 7, wherein: The slot is in a string shape and includes two intersecting first slots and the second slot.

16. The electronic package according to claim 7, wherein: A portion of the insulating protection layer is spaced between the second slot and the welding pad.

17. The electronic package according to claim 7, wherein: The plurality of welding pads are arranged in pairs in a row, and the slots between the two pairs of welding pads are also connected to each other and arranged in a row.

18. The electronic package according to claim 7, wherein: The welding pad is in a convex shape, and the outer convex parts of the two pairs of welding pads are opposite to each other.

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