Ultrathin efficient heat dissipation electronic transformer circuit board based on multilayer composite dielectric structure

Abstract

The utility model discloses an ultrathin high-efficiency heat dissipation electronic transformer circuit board based on a multilayer composite dielectric structure, which comprises a circuit board, a micro circulating pump is fixedly arranged at one end of a heat absorption pipe, a water outlet of the micro circulating pump is fixedly communicated with a circulating pipe, and one end of the circulating pipe is fixedly communicated with the other end of the heat absorption pipe. The surface of the circulating pipe communicates with heat dissipation plates in an equidistant array mode, cooling liquid is arranged in the heat absorption pipes, and mounting grooves matched with the heat absorption pipes are formed in the insulating heat conduction plates. The insulation heat conduction plate absorbs heat generated by the circuit board, the heat is transmitted to the cooling liquid in the heat absorption pipe, the cooling liquid circulates in the heat absorption pipe under the action of the micro circulating pump, the cooling liquid after heat absorption flows into the circulating pipe and exchanges heat with air through the heat dissipation plate, the cooling liquid is cooled, and the cooling effect of the circuit board is improved. And the cooled cooling liquid flows back into the heat absorption pipe to continuously absorb the heat of the circuit board for recycling, so that the circuit board is cooled, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an ultra-thin high-efficiency heat dissipation electronic transformer circuit board based on a multi-layer composite dielectric structure. Background Art

[0002] Circuit boards are broadly categorized by the number of layers: single-sided, double-sided, and multi-layer. Circuit boards miniaturize and visualize circuits, playing a vital role in the mass production of fixed circuits and optimizing the layout of electrical appliances. Transformers are commonly used in electrical equipment and wireless circuits for voltage stepping, impedance matching, and safety isolation. Transformer operation requires a transformer controller to control the transformer. Existing circuit boards are typically secured within the transformer controller housing using multiple bolts.

[0003] Chinese patent publication number CN219107768U discloses a transformer circuit board that is easily replaceable. The circuit board comprises a circuit board body, which is disposed within a transformer controller housing. Support plates are fixed around the inner walls of the transformer controller housing, and the circuit board body is positioned above the support plates. Slots are defined around the circuit board body, and insert plates are fixed above each of the four support plates, with one end of the insert plates extending upward through the slots. The aforementioned device limits the horizontal position of the insert plates by inserting them into the slots of the circuit board body, and secures them by placing a stopper on the circuit board body.

[0004] In the above technical solution, the space at the bottom of the circuit board is small, the heat is not easy to dissipate, and the heat dissipation effect is poor. When the substrate heats up for a long time, the heat dissipation speed cannot keep up, which can easily cause the circuit board temperature to be too high, affecting the service life of the circuit board or causing damage to the circuit board. Utility Model Content

[0005] The purpose of the utility model is to provide an ultra-thin and efficient heat dissipation electronic transformer circuit board based on a multi-layer composite dielectric structure, so as to solve the technical problem that the existing transformer circuit board has poor heat dissipation, resulting in excessively high circuit board temperature, which affects the service life of the circuit board or causes damage to the circuit board.

[0006] To achieve the above objectives, the present invention provides the following technical solutions: an ultra-thin, high-efficiency heat dissipation electronic transformer circuit board based on a multi-layer composite dielectric structure, comprising a circuit board, an insulating heat-conducting plate is provided at the bottom of the circuit board, and a heat dissipation component is provided on the insulating heat-conducting plate.

[0007] The heat dissipation component includes a heat absorption tube arranged inside the insulating heat conducting plate, a micro-circulation pump is fixedly installed at one end of the heat absorption tube, a water outlet of the micro-circulation pump is fixedly connected to a circulation tube, one end of the circulation tube is fixedly connected to the other end of the heat absorption tube, and a heat dissipation plate is connected to an equidistant array on the surface of the circulation tube. Coolant is arranged in the heat absorption tube, and an installation groove matching the heat absorption tube is provided in the insulating heat conducting plate.

[0008] As a preferred solution of the present invention, a buffer assembly is provided at the bottom of the insulating heat conducting plate, and the buffer assembly includes a sliding rod symmetrically arranged at the bottom of the insulating heat conducting plate, a positioning rod is slidably connected to the bottom of the sliding rod, and a spring is provided between the top of the positioning rod and the insulating heat conducting plate.

[0009] As a preferred solution of the present invention, an air blowing assembly is provided on the insulating heat conducting plate, and the air blowing assembly includes a heat dissipation fan fixedly mounted on the surface of the insulating heat conducting plate, an air guide cover is provided on one side of the heat dissipation fan, an air supply plate is provided at the bottom of the heat dissipation plate, an air outlet is provided on the top of the air supply plate, and an air guide duct is fixedly connected between the air supply plate and the air guide cover.

[0010] As a further preferred embodiment of the present invention, an air cavity for air circulation is provided inside the air supply plate, and the air outlet is fixedly connected to the air cavity.

[0011] As a further solution of the present invention, the air outlet is arranged between the heat dissipation plates, and the air outlet is spaced apart from the heat dissipation plates.

[0012] As a further solution of the present invention, the insulating heat-conducting plate is fitted to the circuit board, and thermal paste is provided between the insulating heat-conducting plate and the circuit board.

[0013] As a preferred solution of the present invention, the circuit board is configured as a dielectric structure circuit board, and the insulating heat conducting plate has the same size as the circuit board.

[0014] Compared with the prior art, the ultra-thin, high-efficiency heat dissipation electronic transformer circuit board based on a multi-layer composite dielectric structure provided by the present invention has the following beneficial effects:

[0015] The insulating heat-conducting plate absorbs the heat generated by the circuit board and transfers the heat to the coolant in the heat-absorbing tube. Under the action of the micro-circulation pump, the coolant circulates in the heat-absorbing tube. The coolant after absorbing heat flows into the circulation tube, exchanges heat with the air through the heat dissipation plate, and cools the coolant. The cooled coolant flows back to the heat-absorbing tube and continues to absorb the heat of the circuit board. It is recycled to cool the circuit board and improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only examples of the embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0018] Figure 2 This is a schematic structural diagram of a buffer assembly in an embodiment of the present utility model;

[0019] Figure 3 This is a schematic structural diagram of the blowing assembly in an embodiment of the present utility model;

[0020] Figure 4 Schematic diagram of the structure of the heat dissipation component in the embodiment of the present utility model.

[0021] Reference numerals:

[0022] 1. Circuit board; 2. Insulated heat-conducting plate; 3. Buffer assembly; 301. Sliding rod; 302. Positioning rod; 303. Spring; 4. Heat dissipation assembly; 401. Heat absorption tube; 402. Micro-circulation pump; 403. Circulation tube; 404. Heat dissipation plate; 5. Blowing assembly; 501. Cooling fan; 502. Air guide cover; 503. Air guide duct; 504. Air supply plate; 505. Air outlet. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clear, the following is a further detailed description of the present invention in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0024] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the embodiments of the present invention.

[0025] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, an integral connection, or a detachable connection; it can be the internal connection of two components; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0026] like Figures 1-4 As shown, an embodiment of the present invention is an ultra-thin and efficient heat dissipation electronic transformer circuit board based on a multi-layer composite dielectric structure, comprising a circuit board 1, an insulating heat conducting plate 2 is provided at the bottom of the circuit board 1, and a heat dissipation component 4 is provided on the insulating heat conducting plate 2.

[0027] See also Figure 2 As shown, the heat dissipation component 4 includes a heat absorption tube 401 arranged inside the insulating heat conducting plate 2, a micro-circulation pump 402 is fixedly installed at one end of the heat absorption tube 401, and a circulation tube 403 is fixedly connected to the water outlet of the micro-circulation pump 402. One end of the circulation tube 403 is fixedly connected to the other end of the heat absorption tube 401, and the surface of the circulation tube 403 is connected to the heat dissipation plate 404 in an equidistant array. Cooling liquid is provided in the heat absorption tube 401, and a mounting groove matching the heat absorption tube 401 is provided in the insulating heat conducting plate 2.

[0028] In the above technical solution, the insulating heat-conducting plate 2 absorbs the heat generated by the circuit board 1 and transfers the heat to the coolant in the heat-absorbing tube 401. Under the action of the micro-circulation pump 402, the coolant circulates in the heat-absorbing tube 401. The coolant after absorbing heat flows into the circulation tube 403, exchanges heat with the air through the heat dissipation plate 404, and cools the coolant. The cooled coolant flows back into the heat-absorbing tube 401, continues to absorb the heat of the circuit board 1, and is recycled to cool the circuit board 1, thereby improving the heat dissipation effect.

[0029] See also Figure 2 As shown, to protect and secure circuit board 1, a buffer assembly 3 is provided at the bottom of insulating heat-conducting plate 2. Buffer assembly 3 includes sliding rods 301 symmetrically arranged at the bottom of insulating heat-conducting plate 2. Positioning rods 302 are slidably connected to the bottom of sliding rods 301. Springs 303 are provided between the top of positioning rods 302 and insulating heat-conducting plate 2. Springs 303 buffer vibrations and protect circuit board 1.

[0030] See also Figure 4As shown, to improve the heat exchange efficiency between the heat sink 404 and the air, an air blowing assembly 5 is provided on the insulating heat conducting plate 2. The air blowing assembly 5 includes a heat dissipation fan 501 fixedly mounted on the surface of the insulating heat conducting plate 2. An air guide hood 502 is provided on one side of the heat dissipation fan 501. An air supply plate 504 is provided at the bottom of the heat sink 404. An air outlet 505 is provided at the top of the air supply plate 504. An air guide duct 503 is fixedly connected between the air supply plate 504 and the air guide hood 502. The heat dissipation fan 501 blows air into the air guide hood 502, which then sends the air into the air supply plate 504 through the air guide hood 502. The air is then ejected from the air supply plate 504, accelerating the air flow rate around the heat sink 404 and improving the heat dissipation effect.

[0031] In order to allow air to be ejected from around the heat sink 404 , an air cavity for air circulation is provided inside the air supply plate 504 , and the air outlet 505 is fixedly connected to the air cavity, thereby increasing the air flow rate around the heat sink 404 .

[0032] In order to increase the heat exchange rate between the heat dissipation plates 404 and the air, the air outlet holes 505 are disposed between the heat dissipation plates 404 , and the air outlet holes 505 are spaced apart from the heat dissipation plates 404 .

[0033] In order to better transfer the heat generated by the circuit board 1 to the insulating heat conducting plate 2 , the insulating heat conducting plate 2 is fitted to the circuit board 1 , and thermal paste is provided between the insulating heat conducting plate 2 and the circuit board 1 .

[0034] In order to improve the insulation effect, the circuit board 1 is set as a dielectric structure circuit board, and the insulating heat conductive plate 2 has the same size as the circuit board 1.

[0035] When the embodiment of the present utility model is used, the circuit board 1 is fixed on the surface of the insulating heat conducting plate 2, and the spring 303 cushions the vibration and protects the circuit board 1. The insulating heat conducting plate 2 absorbs the heat generated by the circuit board 1, and the heat is transferred to the coolant in the heat absorbing tube 401. Under the action of the micro-circulation pump 402, the coolant circulates in the heat absorbing tube 401. The coolant after absorbing heat flows into the circulation tube 403, and exchanges heat with the air through the heat dissipation plate 404 to cool the coolant. The cooled coolant flows back into the heat absorbing tube 401, continues to absorb the heat of the circuit board 1, and is recycled to cool the circuit board 1, thereby improving the heat dissipation effect. The heat dissipation fan 501 blows air into the air guide 502, and then sends the air into the air supply plate 504 through the air guide 502. The air is ejected from the air supply plate 504, accelerating the air flow rate around the heat dissipation plate 404, further improving the heat dissipation effect.

[0036] The above shows and describes the basic principles of the present invention. The above is only a preferred embodiment of the present invention and is not intended to limit the present invention. The above embodiments and descriptions in the specification are only to illustrate the principles of the present invention. Without departing from the scope of the present invention, any modifications, equivalent substitutions and improvements made within the spirit and scope of the present invention should be included in the scope of protection of the present invention.

Claims

1. An ultra-thin, high-efficiency heat dissipation electronic transformer circuit board based on a multi-layer composite dielectric structure, characterized by: It comprises a circuit board (1), an insulating heat-conducting plate (2) is provided at the bottom of the circuit board (1), and a heat dissipation component (4) is provided on the insulating heat-conducting plate (2); The heat dissipation assembly (4) comprises a heat absorbing tube (401) arranged inside the insulating heat conducting plate (2), a micro-circulating pump (402) being fixedly mounted on one end of the heat absorbing tube (401), a water outlet of the micro-circulating pump (402) being fixedly connected to a circulation tube (403), one end of the circulation tube (403) being fixedly connected to the other end of the heat absorbing tube (401), a heat dissipation plate (404) being connected in an equidistant array on the surface of the circulation tube (403), a coolant being arranged in the heat absorbing tube (401), and a mounting groove matching the heat absorbing tube (401) being arranged in the insulating heat conducting plate (2).

2. The electronic transformer circuit board according to claim 1, characterized in that: A buffer assembly (3) is provided at the bottom of the insulating heat conducting plate (2), and the buffer assembly (3) comprises a sliding rod (301) symmetrically arranged at the bottom of the insulating heat conducting plate (2), a positioning rod (302) is slidably connected to the bottom of the sliding rod (301), and a spring (303) is provided between the top of the positioning rod (302) and the insulating heat conducting plate (2).

3. The electronic transformer circuit board according to claim 1, characterized in that: The insulating heat conducting plate (2) is provided with an air blowing assembly (5), the air blowing assembly (5) comprising a heat dissipation fan (501) fixedly mounted on the surface of the insulating heat conducting plate (2), an air guide cover (502) being provided on one side of the heat dissipation fan (501), an air supply plate (504) being provided at the bottom of the heat dissipation plate (404), an air outlet hole (505) being provided at the top of the air supply plate (504), and an air guide pipe (503) being fixedly connected between the air supply plate (504) and the air guide cover (502).

4. The electronic transformer circuit board according to claim 3, characterized in that: An air cavity for air circulation is provided inside the air supply plate (504), and the air outlet hole (505) is fixedly connected to the air cavity.

5. The electronic transformer circuit board according to claim 4, characterized in that: The air outlet holes (505) are arranged between the heat dissipation plates (404), and the air outlet holes (505) and the heat dissipation plates (404) are arranged at intervals.

6. The electronic transformer circuit board according to claim 5, characterized in that: The insulating heat-conducting plate (2) is arranged in contact with the circuit board (1), and a heat-conducting paste is provided between the insulating heat-conducting plate (2) and the circuit board (1).

7. The electronic transformer circuit board according to any one of claims 1 to 6, characterized in that: The circuit board (1) is configured as a dielectric structure circuit board, and the insulating heat-conducting plate (2) has the same size as the circuit board (1).

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