Compact heat dissipation air duct structure of online capacity checking device
By adopting a space layout separated by upper, middle and lower stairs and a three-way cooling air duct design in the online core capacity device, the problem of difficulty in discharging heat is solved, ensuring the stability and life of the device.
Patent Information
- Application Number
- CN202422460996.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2034-10-11
AI Technical Summary
With the increasing number of functional devices and the demand for small-volume shells, the existing online core capacitance devices are difficult to effectively discharge heat, affecting the device life and operating stability.
The space layout is adopted with a separate space between upper, middle and lower stairs. The devices with large heat generation are arranged on the lower part of the chassis and the devices with small heat generation on the upper part. A cooling fan is installed in the middle of the chassis to form three upper, middle and lower heat dissipation air ducts, and heat is discharged through the front side of the chassis and the rear side.
It realizes timely discharge of heat, reduces the impact of temperature on the equipment, ensures the stable operation of the main control board module, and improves the service life and performance of the device.
Smart Images

Figure CN223207433U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an online nuclear capacity device, in particular to a compact heat dissipation air duct structure of an online nuclear capacity device. Background Art
[0002] In order to regularly or irregularly manage the capacity of the battery pack, the existing online capacity control device has multiple external communication terminals integrated on the main control board in addition to the conventional capacity control circuit. It is also necessary to add DC-DC rectifier circuits, constant current source circuits, display screens and other devices for monitoring and management.
[0003] With the increase in functional devices and the market's pursuit of small-volume housings, the installation space within the core capacity device has become very tight. For example, in the remote online core capacity management device for battery packs disclosed in Chinese patent CN202221887622.7, each functional module has many heating elements, high heat, and many temperature-sensitive devices. If the heat cannot be discharged out of the chassis in time, it will not only affect the service life of the device, but also the stability of the device's operation and the detection accuracy. Utility Model Content
[0004] This utility model proposes a compact online nuclear capacity device heat dissipation duct structure, the purpose of which is to design and implement an effective heat dissipation solution based on the compact layout of components in the chassis. The specific technical contents are as follows:
[0005] A compact online core capacity device heat dissipation duct structure includes a chassis, a main control board module is installed on the upper part of the chassis, a constant current source module and a DC-DC rectifier module are installed on the lower part of the chassis, a core capacity circuit is installed in the middle part of the chassis, a partition plate is provided at the lower part of the chassis, a chamber for accommodating the constant current source module and the DC-DC rectifier module is provided below the partition plate, the core capacity circuit is provided above the partition plate, and a cooling fan is installed on the partition plate. The chassis has an air inlet on the front panel and heat dissipation holes on the back of the back panel and the side panels.
[0006] In one or more embodiments of the present invention, the main control board module includes a power supply device, a main control board, and a module bracket for supporting the power supply device and the main control board. The module bracket is installed on the upper rear side of the chassis, and an air flow inlet facing the front is formed between the module bracket and the chassis.
[0007] In one or more embodiments of the present invention, support brackets connected to and supporting the main control board module are provided on both inner walls of the chassis, and the module bracket is overlapped on the support brackets.
[0008] In one or more embodiments of the present invention, a plurality of support members are provided at the bottom of the partition plate, and the support members divide the space below the partition plate into the receiving chamber, and a sinking cavity is formed between the rear end of the receiving chamber and the back plate of the chassis. There is a gap in the middle of the support member that runs through the front and back, and the gap is connected to the sinking cavity.
[0009] In one or more embodiments of the present invention, a radiator is installed on the partition plate, and the radiator is opposite to the air outlet surface of the cooling fan.
[0010] In one or more embodiments of the present invention, the heat dissipation holes are hexagonal heat dissipation holes.
[0011] In one or more embodiments of the present invention, the heat dissipation holes are arranged below the main control board module.
[0012] Compared with the prior art, the advantages of the present invention are: the present device adopts a spatial layout with upper, middle and lower tiers, and the constant current source module and DC-DC rectifier module with large heat generation are arranged in the lower part of the chassis, the core capacity circuit (diode, contactor, copper busbar, etc.) with second largest heat generation is arranged in the middle part of the chassis, and the main control board module with smaller heat generation is arranged in the upper part of the chassis. The cooling fan is then arranged in the middle part of the chassis and air is taken in from the front side of the chassis and discharged to the back side of the chassis (back panel and side panel), forming three-way heat dissipation ducts at the top, middle and bottom, so that heat can be discharged out of the equipment in time, effectively reducing the impact of temperature on the life of the equipment, and the middle air duct effectively separates the main control board module from the high-heat generation module below, so that the main control board runs stably and the performance of the device is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the overall structure of the online nuclear capacity device (the upper cover is omitted).
[0014] Figure 2 This is a schematic diagram of the disassembled structure of the online nuclear capacity device.
[0015] Figure 3 It is a schematic diagram of the transverse cross-sectional structure of the online nuclear capacity device.
[0016] Figure 4 It is a schematic diagram of the longitudinal cross-sectional structure of the online nuclear capacity device.
[0017] Figure 5 Schematic diagram of the heat dissipation duct of the online nuclear capacity device. DETAILED DESCRIPTION
[0018] The present application is further described below with reference to the accompanying drawings:
[0019] See attached Figures 1 to 5The heat dissipation duct structure of the compact online core capacity device includes a chassis 1, a main control board module 2 is installed on the upper part of the chassis 1, a constant current source module 3 and a DC-DC rectifier module 4 are installed on the lower part of the chassis 1, and a core capacity circuit 5 (including diodes, contactors, copper bars, etc.) is installed in the middle part of the chassis 1. A partition plate 11 is provided at the lower part of the chassis 1, and a chamber 10 for accommodating the constant current source module 3 and the DC-DC rectifier module 4 is provided below the partition plate 11. The core capacity circuit 5 is provided above the partition plate 11, and a cooling fan 6 is installed on the partition plate 11. The chassis 1 has an air inlet 12 on the front panel and a heat dissipation hole 13 on the back of the back panel and the side panels.
[0020] This device adopts a spatial layout with upper, middle and lower echelons. The constant current source module 3 and DC-DC rectifier module 4 with large heat generation are arranged at the lower part of the chassis 1, the core capacity circuit 5 (diode, contactor, copper busbar, etc.) with second largest heat generation is arranged in the middle part of the chassis 1, and the main control board module 2 with smaller heat generation is arranged at the upper part of the chassis 1. The cooling fan 6 is then set in the middle of the chassis 1 and air is taken in from the front side of the chassis 1 and discharged to the back side (back panel and side panel) of the chassis 1, forming three-way heat dissipation ducts at upper, middle and lower levels, so that heat can be discharged from the equipment in time, effectively reducing the impact of temperature on the life of the equipment, and the middle duct effectively separates the main control board module from the high-heat generation module below, so that the main control board runs stably and the performance of the device is guaranteed.
[0021] Specifically, the main control board module 2 includes a power supply device 21, a main control board 22, and a module bracket 23 for carrying the power supply device 21 and the main control board 22. The module bracket 23 is installed on the upper rear side of the chassis 1, and an air flow inlet 230 facing the front is formed between the module bracket 23 and the chassis 1. The air flow blown by the cooling fan 6 enters the space where the main control board module is located through the air flow inlet 230, forming an upper air flow duct (see attached Figure 5 Arrow A points to the main control board module 2 . Support brackets 14 for connecting and supporting the main control board module 2 are provided on both inner walls of the chassis 1 , and the module bracket 23 is overlapped on the support brackets 14 .
[0022] The bottom of the partition plate 11 is provided with a plurality of support members 15, which divide the space below the partition plate 11 into the chamber 10. A sinking cavity 16 is formed between the rear end of the chamber 10 and the back plate of the chassis 1. A gap 150 is provided in the middle of the support member 15, which is connected to the sinking cavity 16. The heat of the constant current source module 3 and the DC-DC rectifier module 4 will accumulate in the gap 150, and the heat will be extracted by the airflow blown by the cooling fan 6, forming a lower airflow duct (see attached). Figure 5 Arrow C) pointing to the sink cavity.
[0023] Furthermore, a radiator 7 is installed on the partition plate 6 , and the radiator 7 is opposite to the air outlet surface of the cooling fan 6 . The radiator 7 is used to connect to heating devices such as copper busbars in the core capacity circuit 2 .
[0024] Furthermore, the heat dissipation holes are all arranged below the main control board module, so that the hot air flow is concentrated in the lower middle part of the chassis for discharge, avoiding the hot air flow flowing through the main control board module to affect its operation; the heat dissipation holes are hexagonal heat dissipation holes, which are conducive to increasing the air flow rate and reducing the air flow noise.
[0025] The above preferred embodiments should be regarded as examples of the implementation methods of the present application scheme. Any technical deductions, replacements, improvements, etc. that are identical or similar to the present application scheme or made based on it should be regarded as within the scope of protection of this patent.
Claims
1. A compact online nuclear capacity device heat dissipation duct structure, including a chassis, characterized in that: The main control board module is installed on the upper part of the chassis, the constant current source module and the DC-DC rectifier module are installed on the lower part of the chassis, the core capacity circuit is installed in the middle part of the chassis, and a partition plate is provided at the lower part of the chassis. Below the partition plate is a chamber for accommodating the constant current source module and the DC-DC rectifier module, above the partition plate is the core capacity circuit, and a cooling fan is installed on the partition plate. The chassis has an air inlet on the front panel and heat dissipation holes on the back of the back panel and the side panels.
2. The heat dissipation duct structure of the compact online nuclear capacity device according to claim 1 is characterized in that: The main control board module includes a power supply device, a main control board and a module bracket for carrying the power supply device and the main control board. The module bracket is installed on the upper rear side of the chassis, and an air flow inlet facing the front is formed between the module bracket and the chassis.
3. The heat dissipation duct structure of the compact online nuclear capacity device according to claim 2 is characterized in that: Supporting frames connected to and supporting the main control board module are provided on the inner walls of both sides of the chassis, and the module bracket is overlapped on the supporting frames.
4. The heat dissipation duct structure of the compact online nuclear capacity device according to claim 1 is characterized in that: A plurality of support members are provided at the bottom of the partition plate, which divide the space below the partition plate into the accommodating chamber. A sinking cavity is formed between the rear end of the accommodating chamber and the back plate of the chassis. A gap is provided in the middle of the support member, which is connected to the sinking cavity.
5. The heat dissipation duct structure of the compact online nuclear capacity device according to claim 1 is characterized in that: A radiator is installed on the partition plate, and the radiator is opposite to the air outlet surface of the cooling fan.
6. The heat dissipation duct structure of the compact online nuclear capacity device according to claim 1 is characterized in that: The heat dissipation holes are hexagonal heat dissipation holes.
7. The heat dissipation duct structure of the compact online nuclear capacity device according to claim 1 is characterized in that: The heat dissipation holes are all arranged below the main control board module.
Citation Information
Patent Citations
Remote online capacity checking management device for storage battery pack
CN218771331U