Device for optimizing glue solidification of bonding piece

Abstract

The utility model discloses a device for optimizing glue solidification of a bonding piece, which comprises a supporting seat, a positioning bearing body is fixedly mounted at the top of the supporting seat, a heating press-fit body is arranged above the positioning bearing body in a matched manner, two sides of the top of the supporting seat are fixedly connected with supporting plates, and the heating press-fit body is sleeved on the two supporting plates in a sliding manner; the positioning bearing body comprises a bearing bottom plate fixedly connected to the top of the supporting base, and L-shaped limiting blocks are fixedly connected to the four sides of the top of the bearing bottom plate. The pressing block is directly heated, heat is directly conducted to the bonding assembly through the soft mold pressing head to be cured, the temperature conduction efficiency can be improved, the curing efficiency is improved, in addition, accurate positioning can be conducted through the L-shaped limiting block in the bonding process, the whole device is small in size, large space is not needed, and cost is low. In addition, the structure design is simple, the manufacturing cost is low, replacement is convenient, and the production circulation and curing requirements are met.

Description

Technical Field

[0001] The utility model relates to the technical field of adhesive part glue curing equipment, in particular to a device for optimizing adhesive part glue curing. Background Art

[0002] At present, oven baking and curing are generally used to cure adhesives. The oven baking and curing method used in the prior art has the following problems: 1. Low curing efficiency: Since baking and curing is to place the adhesive components in an oven and transfer the air temperature to the adhesive components, the temperature utilization rate of this process is too low, affecting the overall curing efficiency; 2. Complicated equipment: Taking into account the production flow rhythm and the needs of product curing, when baking and curing in the oven, in order to meet the production cycle and product curing requirements, the oven needs to add various sensors, conveyor belts, clamps and other devices, resulting in a high cost of the equipment; 3. Large space requirements: In order to meet the requirements of production efficiency and clamp position, it is necessary to provide sufficient space by increasing the oven so that enough clamps can be stored to meet production needs; Based on the above situation, a device for optimizing the curing of adhesive glue is proposed. Utility Model Content

[0003] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a device for optimizing the curing of glue for bonding parts.

[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A device for optimizing the curing of glue for bonding parts includes a support base, a positioning carrier fixedly mounted on the top of the support base, a heating and pressing body cooperatively arranged above the positioning carrier, support plates fixedly connected to both sides of the top of the support base, and the heating and pressing body slidably sleeved on the two support plates;

[0006] The positioning carrier includes a carrier base fixedly connected to the top of the support seat, and L-shaped limit blocks are fixedly connected to the four sides of the top of the carrier base, and two opposite L-shaped limit blocks are symmetrically arranged. The top of the carrier base is fixedly connected to the carrier located between the four L-shaped limit blocks, and the L-shaped limit blocks, the carrier base and the carrier are fixedly connected by bolts or other fixing methods;

[0007] The heating pressing body includes a movable plate slidably mounted on two supporting plates, the bottom of the movable plate is fixedly connected to a pressing base plate, the bottom of the pressing base plate is fixedly connected to an insulating block, the bottom of the insulating block is fixedly connected to a pressing block, a heating block is embedded and fixed on the left side of the pressing block, a soft mold pressing head is installed on the bottom of the pressing block, the soft mold pressing head is located above the carrier and cooperates with it, and the movable plate, the pressing base plate, the insulating block and the pressing block are all fixedly connected by bolts or other fixing methods.

[0008] Preferably, the carrier is processed by CNC, the top of the carrier is the bonding surface, and the L-shaped limit block is processed by CNC to limit the movement of the bonding component in the X and Y directions.

[0009] Preferably, the insulation block is made of high temperature resistant heat-resistant material and is processed by CNC.

[0010] Preferably, the pressing block is CNC machined, and the bottom of the pressing block is a pressing surface that matches the pressing surface of the adhesive part on the top of the carrier.

[0011] Preferably, the soft mold head is made of a high-temperature resistant thermoplastic elastic material, wraps the pressing surface at the bottom of the pressing block, and matches the pressing surface of the adhesive part at the top of the carrier.

[0012] Preferably, an embedding groove is opened on the left side of the pressing block, and the inner wall of the embedding groove is fixedly connected to the outer side of the heating block, and the heating block is one of a temperature-controllable heating block and a heating rod.

[0013] Compared with the existing technology, the beneficial effects of the utility model are:

[0014] The utility model directly heats the pressing block and conducts the heat directly to the bonding component for curing through the soft mold head, which can accelerate the temperature conduction efficiency and thus improve the curing efficiency. In addition, the L-shaped limit block can be used for precise positioning during the bonding process, and the entire device is small in size and does not require a large space. In addition, its structural design is simple, the cost is low, and it is easy to replace, and it meets the production cycle and curing requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a device for optimizing the curing of glue for bonding parts proposed in the present invention.

[0016] In the figure: 10, pressing base plate; 20, insulation block; 30, heating block; 40, pressing block; 50, soft mold pressing head; 60, carrier; 70, L-shaped limit block; 80, bearing base plate; 90, support seat; 100, support plate; 110, movable plate. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0018] Reference Figure 1A device for optimizing the curing of glue for bonding parts includes a support base 90, a positioning carrier is fixedly installed on the top of the support base 90, a heating and pressing body is arranged above the positioning carrier, and support plates 100 are fixedly connected to both sides of the top of the support base 90, and the heating and pressing body is slidably sleeved on the two support plates 100;

[0019] The positioning carrier includes a carrier base 80 fixedly connected to the top of the support seat 90, and L-shaped limit blocks 70 are fixedly connected to the four sides of the top of the carrier base 80. The two opposite L-shaped limit blocks 70 are symmetrically arranged, wherein the L-shaped limit blocks 70 are CNC-machined and are used to limit the movement of the bonding component in the X and Y directions. The top of the carrier base 80 is fixedly connected to the carrier 60 located between the four L-shaped limit blocks 70, wherein the carrier 60 is CNC-machined, and the top of the carrier 60 is a bonding surface. The L-shaped limit blocks 70, the carrier base 80 and the carrier 60 are fixedly connected by bolts or other fixing methods. The carrier 60 and the L-shaped limit blocks 70 can be processed according to different bonding components, including but not limited to metal materials, so as to ensure the assembly quality of the bonding component;

[0020] The heating pressing body includes a movable plate 110 slidably mounted on the two support plates 100, wherein both sides of the top of the movable plate 110 are provided with sliding holes, and the inner walls of the sliding holes are in movably contact with the outer sides of the corresponding support plates 100, and the two support plates 100 play a vertical guiding effect on the movable plate 110, and the top of the movable plate 110 can be connected to an external cylinder or servo motor or other driving device, and the movable plate 110 is driven by the driving device to move vertically, and the bottom of the movable plate 110 is fixedly connected to the pressing base plate 10, and the bottom of the pressing base plate 10 is fixedly connected to the heat insulation block 20, wherein the heat insulation block 20 is a high temperature resistant heat-resistant material, and is CNC-processed, and the bottom of the heat insulation block 20 is fixedly connected to the pressing block 40, and the heat insulation block 20 is processed and assembled between the pressing base plate 10 and the pressing block 40, which can isolate the heat conduction from flowing out, wherein the pressing block 40 is CNC-processed, and the bottom of the pressing block 40 is a pressing surface and matches the pressing surface of the adhesive part at the top of the carrier 60;

[0021] The left side of the pressing block 40 is fixed with a heating block 30, wherein the left side of the pressing block 40 is provided with an embedding groove, the inner wall of the embedding groove is fixedly connected to the outer side of the heating block 30, the heating block 30 is a temperature-controllable heating block or a heating rod, and the bottom of the pressing block 40 is installed with a soft mold pressing head 50, which is located above the carrier 60 and cooperates with it, wherein the soft mold pressing head 50 is a high-temperature resistant thermoplastic elastic material, which wraps the pressing surface of the bottom of the pressing block 40 and cooperates with the pressing surface of the adhesive on the top of the carrier 60 to ensure the pressing and fitting of the entire device, so that the temperature of the glue on the pressing surface is uniform. , to ensure the curing quality of the bonding assembly, the movable plate 110, the pressing base plate 10, the insulation block 20 and the pressing block 40 are fixedly connected by means of bolts or other fixing methods; the utility model directly heats the pressing block 40 and conducts the heat directly to the bonding assembly for curing through the soft mold head 50, which can speed up the temperature conduction efficiency and thus improve the curing efficiency. In addition, the L-shaped limit block 70 can be used for precise positioning during the bonding process, and the entire device is small in size and does not require a large space. In addition, its structural design is simple, the cost is low, the replacement is convenient, and it meets the production cycle and curing requirements.

[0022] Working principle: When processing and using, the top of the movable plate 110 is pre-connected to an external cylinder or servo motor or other driving device, and then the pressing block 40 is heated to the required temperature by the heating block 30 according to the demand, and the component with glue is placed on the top of the carrier 60, and then the cover plate to be bonded is placed on the component with glue, and is limited by four L-shaped limit blocks 70, and the movable plate 110 is driven downward by a cylinder or servo motor or other driving device, and the movable plate 110 drives the pressing base plate 10 to move downward, and the pressing base plate 10 drives the pressing block 40 through the insulation block 20. The pressing block 40 moves downward, driving the soft mold pressing head 50 to move downward, squeezing the cover plate to be bonded so that the cover plate and the component with glue are tightly fitted. During the squeezing process, the heat on the pressing block 40 is used for curing. After a certain period of curing, the moving plate 110 is moved upward, so that the pressing block 40 drives the soft mold pressing head 50 to separate upward from the cover plate, releasing the fixation of the cover plate, and the cured bonding component can be taken out. This method directly heats the pressing block 40 and uses heat conduction to cure the bonding component, which can speed up the temperature conduction efficiency and thus improve the curing efficiency.

[0023] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A device for optimizing the curing of glue for bonding parts, comprising a support seat (90), characterized in that: A positioning carrier is fixedly installed on the top of the support seat (90), a heating and pressing body is arranged on the top of the positioning carrier, and support plates (100) are fixedly connected to both sides of the top of the support seat (90), and the heating and pressing body is slidably sleeved on the two support plates (100); The positioning carrier comprises a carrier base (80) fixedly connected to the top of the support seat (90), four sides of the top of the carrier base (80) are fixedly connected to L-shaped limit blocks (70), two opposite L-shaped limit blocks (70) are symmetrically arranged, and the top of the carrier base (80) is fixedly connected to a carrier (60) located between the four L-shaped limit blocks (70); The heating pressing body comprises a movable plate (110) slidably mounted on two support plates (100); the bottom of the movable plate (110) is fixedly connected to a pressing base plate (10); the bottom of the pressing base plate (10) is fixedly connected to a heat insulating block (20); the bottom of the heat insulating block (20) is fixedly connected to a pressing block (40); a heating block (30) is embedded and fixed on the left side of the pressing block (40); a soft mold pressing head (50) is installed at the bottom of the pressing block (40); the soft mold pressing head (50) is located above the carrier (60) and cooperates with it.

2. The device for optimizing the curing of glue for bonding parts according to claim 1, characterized in that: The carrier (60) is processed by CNC, the top of the carrier (60) is a bonding component pressing surface, and the L-shaped limit block (70) is processed by CNC and is used to limit the movement of the bonding component in the X and Y directions.

3. The device for optimizing the curing of glue for bonding parts according to claim 1, characterized in that: The heat insulating block (20) is made of high temperature resistant heat-resistant material and is processed by CNC.

4. The device for optimizing the curing of glue for bonding parts according to claim 1, characterized in that: The pressing block (40) is CNC machined, and the bottom of the pressing block (40) is a pressing surface that matches the pressing surface of the adhesive part on the top of the carrier (60).

5. The device for optimizing the curing of glue for bonding parts according to claim 1, characterized in that: The soft mold head (50) is made of a high-temperature resistant thermoplastic elastic material, wraps the pressing surface at the bottom of the pressing block (40), and matches the pressing surface of the adhesive part at the top of the carrier (60).

6. The device for optimizing the curing of glue for bonding parts according to claim 1, characterized in that: An embedding groove is provided on the left side of the pressing block (40), and the inner wall of the embedding groove is fixedly connected to the outer side of the heating block (30).

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