Semiconductor material surface cleaning treatment tool

Abstract

The utility model discloses a semiconductor material surface cleaning processing tool which comprises a placing frame, the upper surface of the placing frame is fixedly connected with a placing table top, the top of the placing frame is fixedly connected with an air cylinder, one end of the air cylinder is fixedly connected with an arc-shaped connecting block, one side of the arc-shaped connecting block is fixedly connected with a connecting rod, and the other side of the arc-shaped connecting block is fixedly connected with a connecting rod. Through the arrangement of the air cylinder, the connecting rod, the first motor and the clamping plate, the device can clamp and rotate a semiconductor, a cleaning tool can comprehensively clean the semiconductor, the air cylinder is pushed to drive the connecting rod downwards, the connecting rod clamps the semiconductor through the clamping plate according to the size of the semiconductor, and the semiconductor can be conveniently cleaned. And the semiconductor is cleaned through the cleaning rod after being clamped, and the first motor can be turned on during cleaning, so that the first motor drives the rotating block, the rotating block rotates the semiconductor, and the effect that the cleaning rod conveniently cleans the semiconductor in all directions is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of industrial automation, in particular to a tool for cleaning and processing the surface of semiconductor materials. Background Art

[0002] Common cleaning tools for semiconductor material surfaces include plasma cleaners, ultrasonic cleaners, vapor phase cleaners, rotary spray cleaners, and laser cleaners. Different cleaning tools can be used to remove organic matter, metals, and other impurities from the semiconductor surface, thereby improving the quality and stability of semiconductor devices. The working principles and applicable scenarios of these tools vary. In actual applications, appropriate cleaning tools are usually selected based on specific needs and pollutant types. At the same time, in order to ensure the cleaning effect and the integrity of semiconductor devices, the cleaning process also needs to be optimized and controlled.

[0003] According to the above device, the semiconductor can be cleaned more thoroughly through the dust cleaning and blowing settings. However, after the above device has been used for a long time, it is difficult to comprehensively clean the dust from the semiconductor. The semiconductor needs to be manually turned over to comprehensively clean the dust on the surface of the semiconductor, which is more cumbersome to use. Therefore, a semiconductor material surface cleaning tool is proposed for the above device. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract and title of the utility model to avoid obscuring the purpose of this section, the abstract and the title of the utility model, and such simplifications or omissions shall not be used to limit the scope of the present invention.

[0005] In view of the problems existing in the prior art, the present utility model is proposed.

[0006] Therefore, the technical problem to be solved by the present invention is to be able to comprehensively clean dust from semiconductors.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions: a semiconductor material surface cleaning processing tool, which includes a placement rack, the upper surface of the placement rack is fixedly connected to a shelf table, the top of the placement rack is fixedly connected to a cylinder, one end of the cylinder is fixedly connected to an arc-shaped connecting block, one side of the arc-shaped connecting block is fixedly connected to a connecting rod, one side of the connecting rod is rotatably connected to a retraction rod, one side of the retraction rod is fixedly connected to a retraction block, one side of the retraction block is fixedly connected to a splint, a first motor is provided on one side of the splint, and a pad is fixedly connected to the side of the splint away from the first motor.

[0008] As a preferred solution of the semiconductor material surface cleaning tool of the present invention, an electric push rod is fixedly connected to one side of the top of the placement rack close to the cylinder, and one end of the electric push rod is fixedly connected to a descending plate.

[0009] As a preferred solution of the semiconductor material surface cleaning tool of the present invention, a second motor is provided on the side of the descending plate away from the electric push rod, and the output shaft end of the second motor is rotatably connected to a gear.

[0010] As a preferred solution of the semiconductor material surface cleaning tool of the present invention, the gear is engaged with a large gear, and a cleaning rod is fixedly connected to the bottom of the large gear.

[0011] As a preferred solution of the semiconductor material surface cleaning tool of the present invention, the top of the large gear is fixedly connected to a clear liquid container, and the bottom of the clear liquid container is fixedly connected to a spray pipe.

[0012] As a preferred solution of the semiconductor material surface cleaning tool of the present invention, a slide groove is provided on the top of the placement rack, and a slide groove is provided on one side of the placement rack.

[0013] As a preferred solution of the semiconductor material surface cleaning tool of the present invention, one side of the descending plate is fixedly connected to a slider, and the top of the electric push rod is fixedly connected to the slider.

[0014] As a preferred solution of the semiconductor material surface cleaning tool of the present invention, the connecting rod is rotatably connected to the retracting rod via a rotating shaft, and the connecting rod is in a diamond shape.

[0015] As a preferred solution of the semiconductor material surface cleaning tool of the present invention, the pad is square in shape and is made of rubber.

[0016] As a preferred solution of the semiconductor material surface cleaning tool of the present invention, the output shaft end of the first motor is rotatably connected to a rotating block, and the rotating block is fixedly connected to a cushion block.

[0017] The beneficial effects of the utility model are as follows: the utility model enables the device to clamp and rotate the semiconductor through the arrangement of the cylinder, the connecting rod, the first motor and the clamping plate, so that the cleaning tool can comprehensively clean the semiconductor. The cylinder is pushed downward to drive the connecting rod, so that the connecting rod clamps the semiconductor through the clamping plate according to the size of the semiconductor. After clamping, the semiconductor is cleaned by the cleaning rod. While cleaning, the first motor can be turned on to drive the rotating block to rotate the semiconductor, thereby achieving the effect of facilitating the cleaning rod to clean the semiconductor in all directions. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work. Among them:

[0019] Figure 1 It is a schematic diagram of the overall appearance of an embodiment of the present utility model.

[0020] Figure 2 This is a schematic diagram of the cleaning rod structure in an embodiment of the present utility model.

[0021] Figure 3 This is a schematic diagram of the cylinder structure in an embodiment of the present utility model.

[0022] Figure 4 It is a schematic diagram of the explosion structure in an embodiment of the present utility model.

[0023] In the figure: 100, placement rack; 101, shelf; 102, cylinder; 200, arc-shaped connecting block; 300, connecting rod; 400, retraction rod; 500, retraction block; 600, splint; 700, first motor; 800, pad; 900, electric push rod; 1000, descending plate; 1100, second motor; 1200, gear; 1300, large gear; 1400, cleaning rod. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0027] Example 1

[0028] Reference Figure 1 、 2 , is the first embodiment of the present utility model, which provides a semiconductor material surface cleaning tool, including a placement rack 100, the upper surface of the placement rack 100 is fixedly connected to a placement table 101, the top of the placement rack 100 is fixedly connected to a cylinder 102, one end of the cylinder 102 is fixedly connected to an arc-shaped connecting block 200, one side of the arc-shaped connecting block 200 is fixedly connected to a connecting rod 300, one side of the connecting rod 300 is rotatably connected to a retraction rod 400, one side of the retraction rod 400 is fixedly connected to a retraction block 500, one side of the retraction block 500 is fixedly connected to a splint 600, one side of the splint 600 is provided with a first motor 700, and the side of the splint 600 away from the first motor 700 is fixedly connected to a pad 800.

[0029] By placing the semiconductor on the shelf table 101, and then pushing the connecting rod 300 downward through the cylinder 102, the connecting rod 300 drives the retraction rod 400 and the retraction block 500 to clamp the semiconductor through the clamping plate 600 according to the size of the semiconductor. After clamping, the dust on the surface of the semiconductor is cleaned. At the same time, the first motor 700 can be turned on to drive the rotating block to rotate. While the rotating block rotates, the pad 800 drives the semiconductor to flip over, which is convenient for comprehensive cleaning of the semiconductor. Existing cleaning tools cannot achieve comprehensive cleaning of the semiconductor without manual intervention, and manual flipping is required for cleaning.

[0030] Example 2

[0031] Reference Figures 2-4 , which is the second embodiment of the present utility model. This embodiment is based on the previous embodiment. An electric push rod 900 is fixedly connected to the side of the top of the placement rack 100 close to the cylinder 102, and one end of the electric push rod 900 is fixedly connected to a descending plate 1000. A second motor 1100 is provided on the side of the descending plate 1000 away from the electric push rod 900, and the output shaft end of the second motor 1100 is rotatably connected to a gear 1200.

[0032] The height of the cleaning tool can be adjusted up and down through the electric push rod 900 on the top side of the placement rack 100. The second motor 1100 at the bottom of the descending plate 1000 can drive the gear 1200 to rotate. The rotation of the gear 1200 can make the cleaning tool rotate in all directions.

[0033] Example 3

[0034] Reference Figures 2-4 , which is the third embodiment of the present utility model, and this embodiment is based on the previous embodiment. The gear 1200 is engaged with the large gear 1300, the bottom of the large gear 1300 is fixedly connected to the cleaning rod 1400, the top of the large gear 1300 is fixedly connected to the clear liquid container, and the bottom of the clear liquid container is fixedly connected to the nozzle.

[0035] The large gear 1300 engaged with the gear 1200 can enable the cleaning rod 1400 at the bottom of the large gear 1300 to rotate and clean the entire semiconductor material. The nozzle of the cleaning liquid container on the top of the large gear 1300 facilitates the rotational spraying of the cleaning solution onto the semiconductor, making the spraying more comprehensive. The semiconductor can be better cleaned through spraying and cleaning.

[0036] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, colors, directional changes, etc.) without departing substantially from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also an equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0037] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0038] It will be appreciated that in the development of any actual embodiment, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will, for those of ordinary skill having the benefit of this disclosure, be a routine undertaking of design, fabrication, and production without undue experimentation.

[0039] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, and all of these should be included in the scope of the claims of the present invention.

Claims

1. A semiconductor material surface cleaning tool, characterized in that: include, A placement rack (100), wherein the upper surface of the placement rack (100) is fixedly connected to a shelf table (101), the top of the placement rack (100) is fixedly connected to a cylinder (102), one end of the cylinder (102) is fixedly connected to an arc-shaped connecting block (200), one side of the arc-shaped connecting block (200) is fixedly connected to a connecting rod (300), one side of the connecting rod (300) is rotatably connected to a retraction rod (400), one side of the retraction rod (400) is fixedly connected to a retraction block (500), one side of the retraction block (500) is fixedly connected to a splint (600), one side of the splint (600) is provided with a first motor (700), and the side of the splint (600) away from the first motor (700) is fixedly connected to a cushion block (800).

2. The semiconductor material surface cleaning tool according to claim 1, wherein: An electric push rod (900) is fixedly connected to one side of the top of the placement rack (100) close to the cylinder (102), and one end of the electric push rod (900) is fixedly connected to a descending plate (1000).

3. The semiconductor material surface cleaning tool according to claim 2, wherein: A second motor (1100) is provided on a side of the descending plate (1000) away from the electric push rod (900), and an output shaft end of the second motor (1100) is rotatably connected to a gear (1200).

4. The semiconductor material surface cleaning tool according to claim 3, wherein: The gear (1200) is meshed with a large gear (1300), and a cleaning rod (1400) is fixedly connected to the bottom of the large gear (1300).

5. The semiconductor material surface cleaning tool according to claim 4, wherein: The top of the large gear (1300) is fixedly connected to a clear liquid container, and the bottom of the clear liquid container is fixedly connected to a spray pipe.

6. The semiconductor material surface cleaning tool according to claim 5, wherein: A slide groove is provided on the top of the placement rack (100), and a slide groove is provided on one side of the placement rack (100).

7. The semiconductor material surface cleaning tool according to claim 6, wherein: A slider is fixedly connected to one side of the descending plate (1000), and a slider is fixedly connected to the top of the electric push rod (900).

8. The semiconductor material surface cleaning tool according to claim 7, wherein: The connecting rod (300) is rotatably connected to the contraction rod (400) via a rotating shaft, and the connecting rod (300) is in a diamond shape.

9. The semiconductor material surface cleaning tool according to claim 8, wherein: The cushion block (800) is square in shape and is made of rubber.

10. The semiconductor material surface cleaning tool according to claim 9 or 8, characterized in that: The output shaft end of the first motor (700) is rotatably connected to a rotating block, and the rotating block is fixedly connected to a cushion block (800).

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