Tool for flattening lead on electronic sealing structure

Abstract

The utility model discloses a tool for flattening a lead on an electronic sealing structure, which relates to the technical field of metal packaging and comprises a base, a flattening mechanism is arranged at the top of the base, a pressing mechanism is arranged outside the flattening mechanism, and the flattening mechanism comprises a lower die assembly, an upper die assembly and a lower die assembly. The lower die assembly comprises a lower die plate fixedly installed on the top of the base, and locating pins are symmetrically and fixedly installed on the top of the lower die plate. According to the tool for flattening the upper lead of the electronic sealing structure, the upper die plate part and the lower die plate part are matched through a positioning pin and a pin hole, guiding and positioning of movement are achieved, the consistency of die assembly is guaranteed, automatic die opening is achieved through a flat wire spiral spring, and the production efficiency is improved. The device has the advantages of being high in production efficiency, accurate in positioning, convenient to use, low in machining cost and high in yield, the product percent of pass can be effectively increased in the production process, the scrap cost caused by the fact that the quality of the flattened face of the lead is unqualified is reduced, and immeasurable economic benefits are brought to enterprises.

Description

Technical Field

[0001] The utility model relates to the technical field of metal packaging, in particular to a tool used for flattening leads on an electronic sealing structure. Background Art

[0002] With the development of society, the requirements for the stability and service life of various electronic components are becoming increasingly stringent. This requires providing protection for electronic components and creating an environment suitable for their normal and stable operation. Metal packaging enclosures have emerged as a result. Metal packaging enclosures are widely used in military and civilian fields and have huge market prospects. The interior of the metal enclosure is used to install electronic components, playing a role in supporting and protecting the electronic components. Electronic components are connected to the outside world through the leads on the metal enclosure. The connection between the internal chip and the external pins, as well as between the chips themselves, plays an important role in establishing the electrical connection between the chip and the outside world and ensuring smooth input / output between the chip and the outside world. It is the key to the entire back-end packaging process. Wire bonding dominates the connection method due to its simple process, low cost, and applicability to various packaging forms.

[0003] At present, the lead flattening tooling commonly used in China adopts an upper module + lower module + manual press structure, in which the upper module is fixed on the upper template of the manual press, and the lower module is fixed on the lower template of the manual press, and the lead flattening is achieved by closing the mold of the manual press. The structure is simple and the production cost is low, but there is no positioning between the upper module and the lower module, and the flattening operation is performed only by the up and down movement of the manual press. The quality of the lead flattening surface has relatively high requirements on the precision of the manual press. If the manual press is worn during use and the precision is reduced, it will cause abnormalities such as out-of-tolerance length, width, and thickness dimensions of the lead flattening surface, and cause irregular outer contours of the flattening surface, which poses a great risk to the quality of bonding. For this reason, the utility model provides a tooling for flattening the leads on an electronic sealing structure. Utility Model Content

[0004] In view of the shortcomings of the prior art, the utility model provides a tool for flattening the leads on an electronic sealing structure, which solves the problem of the lack of positioning between the upper module and the lower module in the prior art.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a tool for flattening the leads on an electronic sealing structure, comprising a base, a flattening mechanism is provided on the top of the base, a pressing mechanism is provided on the outside of the flattening mechanism, and the flattening mechanism comprises: a lower mold assembly, the lower mold assembly comprises a lower template fixedly mounted on the top of the base, a positioning pin is symmetrically fixedly mounted on the top of the lower template, and the top of the positioning pin is fixedly connected to a limiting block; an upper mold assembly, the upper mold assembly comprises an upper template, pin holes are symmetrically opened on the top of the upper template, and the positioning pin is movably arranged inside the pin hole.

[0006] Preferably, a lead positioning block is provided near the middle of the top of the lower template, a transverse groove is provided on the top of the lead positioning block, a plurality of longitudinal grooves are provided on the inner wall of the transverse groove, and a flat wire coil spring is fixedly connected between the inner walls of the longitudinal grooves.

[0007] Preferably, an upper mold insert is installed on the front side of the upper mold plate through hexagonal bolts.

[0008] Preferably, a reset spring is sleeved on the exterior of the positioning pin, and both ends of the reset spring are fixedly connected to the opposite side surfaces of the lower template and the upper template.

[0009] Preferably, the pressing mechanism includes two bearing seats fixedly mounted on the top of the lower template, a shaft is rotatably arranged between the axial holes of the two bearing seats, a rotating block is fixedly mounted on the outer wall of the shaft near the middle, a roller is rotatably arranged on the inner wall of the rotating block, and the roller is in contact with the upper template.

[0010] Preferably, connecting rods are fixedly mounted on both ends of the shaft, handles are fixedly mounted on the outer surface of the connecting rods, and anti-slip particles are provided on the outer surface of the handles.

[0011] Beneficial effects

[0012] The utility model provides a tool for flattening leads on electronic sealing structures. Compared with the existing technology, it has the following advantages:

[0013] (1) The tooling for flattening the leads on the electronic sealing structure realizes the guidance and positioning of the movement to ensure the consistency of the mold by cooperating the upper template part and the lower template part through the positioning pins and pin holes, and realizes automatic mold opening through the flat wire coil spring. It has the characteristics of high production efficiency, accurate positioning, easy use, low processing cost and high yield rate. It can effectively improve the product qualification rate in the production process and reduce the scrap cost caused by the unqualified quality of the lead flattening surface, bringing immeasurable economic benefits to the enterprise.

[0014] (2) The tooling for flattening the leads on the electronic sealing structure rotates the shaft by operating the handle and pressing it, and then the roller on the rotating block makes a circular motion, pressing the upper template downward to apply pressure to the leads. After the operation is completed, the upper template moves upward and resets under the action of the reset spring tension. When the roller contacts and presses the upper template, the roller rolls, thereby reducing friction resistance, avoiding excessive wear of the contact part between the upper template and the roller, and improving service life. At the same time, pressing is more labor-saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the three-dimensional appearance of the utility model;

[0016] Figure 2 This is a schematic diagram of the three-dimensional appearance of the flattening mechanism of the present invention;

[0017] Figure 3 For this utility model Figure 2 A magnified view of point A in the figure;

[0018] Figure 4 It is the pressing mechanism of the utility model.

[0019] In the figure: 1. Base; 2. Flattening mechanism; 21. Lower mold assembly; 211. Lower mold plate; 212. Locating pin; 213. Return spring; 214. Lead positioning block; 215. Horizontal groove; 216. Longitudinal groove; 217. Flat wire coil spring; 218. Limit block; 22. Upper mold assembly; 221. Upper mold plate; 222. Hexagonal bolt; 223. Upper mold insert; 224. Pin hole; 3. Pressing mechanism; 31. Bearing seat; 32. Shaft; 33. Rotating block; 34. Roller; 35. Connecting rod; 36. Handle; 37. Anti-slip particles. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] This utility model provides two technical solutions:

[0022] Figure 1-Figure 4The first embodiment is shown: a tool for flattening the leads on an electronic sealing structure, comprising a base 1, a flattening mechanism 2 is provided on the top of the base 1, a pressing mechanism 3 is provided on the outside of the flattening mechanism 2, and the flattening mechanism 2 comprises: a lower mold assembly 21, the lower mold assembly 21 comprises a lower template 211 fixedly mounted on the top of the base 1, a positioning pin 212 is symmetrically fixedly mounted on the top of the lower template 211, and the top of the positioning pin 212 is fixedly connected to a limiting block 218; an upper mold assembly 22, the upper mold assembly 22 comprises an upper template 221, a pin hole 224 is symmetrically opened on the top of the upper template 221, the positioning pin 212 is movably arranged inside the pin hole 224, a lead positioning block 214 is provided near the middle of the top of the lower template 211, and a horizontal Towards the groove 215, the shape of the transverse groove 215 is opened according to the lead specifications, and the size is 0.05mm larger than the lead directly, so as to facilitate the installation of the lead and ensure the positioning effect of the lead. A plurality of longitudinal grooves 216 are opened on the inner wall of the transverse groove 215, and a flat wire coil spring 217 is fixedly connected between the inner walls of the longitudinal groove 216. The flat wire coil spring 217 uses a yellow extremely light load flat wire coil spring. The front side of the upper template 221 is installed with an upper mold insert 223 through a hexagonal bolt 222. The raw material of the upper mold insert 223 is Cr12 quenched at more than 60HRC to avoid wear during use, which is conducive to ensuring the stability of the tooling. The outer sleeve of the locating pin 212 is provided with a reset spring 213, and the two ends of the reset spring 213 are fixedly connected to the opposite side surfaces of the lower template 211 and the upper template 221.

[0023] Figure 1-Figure 4 The second embodiment is shown, and the main difference from the first embodiment is that the pressing mechanism 3 includes two bearing seats 31 fixedly mounted on the top of the lower template 211, and a shaft 32 is rotatably arranged between the axial holes of the two bearing seats 31, and a rotating block 33 is fixedly mounted on the outer wall of the shaft 32 near the middle position, and a roller 34 is rotatably arranged on the inner wall of the rotating block 33, and the roller 34 contacts the upper template 221. Connecting rods 35 are fixedly mounted at both ends of the shaft 32, and a handle 36 is fixedly mounted on the outer surface of the connecting rod 35. The outer surface of the handle 36 is provided with anti-slip particles 37. By operating and pressing the handle 36, the shaft 32 rotates, and then the roller 34 on the rotating block 33 performs a circular motion, pressing the upper template 221 downward and applying pressure to the lead. After the operation is completed, under the action of the tension of the reset spring 213, the upper template 221 moves upward and resets. By providing the anti-slip particles 37, the slippage caused by hand sweat can be effectively reduced, thereby improving safety.

[0024] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0025] During operation, by operating the handle 36 and pressing it, the shaft 32 rotates, and then the roller 34 on the rotating block 33 makes a circular motion, pressing the upper template 221 downward, and applying pressure to the lead. After the operation is completed, under the action of the tension of the reset spring 213, the upper template 221 moves upward and resets, and the limit block 218 plays a role in limiting the upper template 221. When the roller 34 contacts and presses the upper template 221, the roller 34 rolls, thereby reducing friction resistance and preventing the upper template 221 from being pressed against the roller 34. The contact parts do not suffer excessive wear, which increases the service life and saves effort when pressing. The upper template 221 and the lower template 211 cooperate with the positioning pin 212 and the pin hole 224 to achieve movement guidance and positioning to ensure the consistency of mold closing, and automatic mold opening is achieved through the flat wire coil spring 217. It has the characteristics of high production efficiency, precise positioning, easy use, low processing cost and high yield. It can effectively improve the product qualification rate in the production process and reduce the scrap cost caused by unqualified quality of the lead flattening surface, bringing immeasurable economic benefits to the enterprise.

[0026] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0027] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A tool for flattening leads on an electronic sealing structure, comprising a base (1), characterized in that: A flattening mechanism (2) is provided on the top of the base (1), a pressing mechanism (3) is provided on the outside of the flattening mechanism (2), and the flattening mechanism (2) comprises: A lower mold assembly (21), the lower mold assembly (21) comprising a lower mold plate (211) fixedly mounted on the top of the base (1), a positioning pin (212) symmetrically fixedly mounted on the top of the lower mold plate (211), and a top end of the positioning pin (212) fixedly connected to a limiting block (218); An upper mold assembly (22) includes an upper mold plate (221), a top of the upper mold plate (221) is symmetrically provided with pin holes (224), and the positioning pin (212) is movably arranged inside the pin hole (224).

2. The tool for flattening leads on an electronic sealing structure according to claim 1, characterized in that: A lead positioning block (214) is provided near the middle of the top of the lower template (211), a transverse groove (215) is provided on the top of the lead positioning block (214), a plurality of longitudinal grooves (216) are provided on the inner wall of the transverse groove (215), and a flat wire coil spring (217) is fixedly connected between the inner walls of the longitudinal grooves (216).

3. The tool for flattening leads on an electronic sealing structure according to claim 1, characterized in that: An upper mold insert (223) is installed on the front side of the upper mold plate (221) via a hexagonal bolt (222).

4. The tool for flattening leads on an electronic sealing structure according to claim 1, characterized in that: The outer sleeve of the positioning pin (212) is provided with a return spring (213), and the two ends of the return spring (213) are fixedly connected to the opposite side surfaces of the lower template (211) and the upper template (221).

5. The tool for flattening leads on an electronic sealing structure according to claim 1, characterized in that: The pressing mechanism (3) comprises two bearing seats (31) fixedly mounted on the top of the lower template (211); a shaft (32) is rotatably arranged between the axial holes of the two bearing seats (31); a rotating block (33) is fixedly mounted near the middle of the outer wall of the shaft (32); a roller (34) is rotatably arranged on the inner wall of the rotating block (33); and the roller (34) is in contact with the upper template (221).

6. The tool for flattening leads on an electronic sealing structure according to claim 5, characterized in that: Connecting rods (35) are fixedly mounted on both ends of the shaft (32), a handle (36) is fixedly mounted on the outer surface of the connecting rod (35), and anti-skid particles (37) are provided on the outer surface of the handle (36).

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